| T.R | Title | User | Personal
Name | Date | Lines |
|---|
| 62.1 | Pex XA0233Q for high tox at incoming 3127 THK_CMP | ASDG::CULLEY | | Sun Nov 12 1995 06:57 | 18 |
| Subj: PEX for XL0305 at 3127 THK_CMP 14 THK_ILD3_PRE 3, MVOU 11/07/95
QUANTITY: 18
MACHINE: THICKNESS.A5
DATE: Nov 07 B-Shift
PROBLEM: Thickness a little high at incoming:
***UCL=33500
THK_ME 40336.000
THK_RG 978.000
DISPOSITION: Lot moved on.
***some lots will be coming in with a tox 39000.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.2 | PEX-XD0263 for high tox and range at 3127 THK_CMP | ASDG::CULLEY | | Sun Nov 12 1995 06:59 | 18 |
| Subj: PEX for XD0263 at 3053 THK_CMP, 10 THK_ILD2_PRE 3, MVOU 10/24/95 04:03
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: Oct 23 B-Shift
PROBLEM: Thickness and range high reading at 20119 and 1189
Thickness UCL = 19900 Range UCL = 1000
CL = 19000 CL = 500
LCL = 18100 LCL = 0
THK_ME XD0263 20119.000
THK_RG XD0263 1189.000
DISPOSITION: Lot moved on. Looks like these are coming in higher and higher.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.3 | PEX-XD0273 high tox at 2951 THK_CMP 2 | ASDG::CULLEY | | Sun Nov 12 1995 07:01 | 19 |
| Subj: PEX for XD0273 at 2951 THK_CMP 2, THK_PMD_PRE, 3 MVOU 10/21/95 22:12
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: Oct 21 B-Shift
PROBLEM: Thickness high reading at 11252
UCL=11150
CL=10500
LCL= 9850
THK_ME 11252.000
THK_RG 531.000
DISPOSITION: Lot moved on. Last few lots have been in this upper portion
of the SPC.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.4 | PEX-XD0280-XD0284 high tox at oper #3079 | ASDG::CULLEY | | Sun Nov 12 1995 07:02 | 21 |
| Subj: PEX for XD0280 and XD0284 at operation #3079
QUANTITY: 18 , 22
MACHINE: THICKNESS.A4
DATE: Oct 31 B-Shift
PROBLEM: Thickness high reading: XD0280=19990.000
Range reading: XD0280=976.000
Thickness high reading: XD0284=20157.000
Range reading: XD0284=644.000
Thickness UCL = 19900 Range UCL = 1000
CL = 19000 CL = 500
LCL = 18100 LCL = 0
DISPOSITION: Lot moved on. Looks like these are coming in a little high.
Checked 1050's with Eric and all looked ok.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.5 | PEX-XL0260 at 3120 THK_CMP 10 high uniformity | ASDG::CULLEY | | Sun Nov 12 1995 07:05 | 19 |
|
Subj: PEX for XD0260 at 3120 THK_CMP 10, THK_ILD2_PRE 3 MVOU 10/23/95 21:11
QUANTITY: 17
MACHINE: THICKNESS.A4
DATE: Oct 23 B-Shift
PROBLEM: Thickness uniformity reading at 1077
UCL=1000
CL=500
LCL=0
THK_ME XL0260 19200.000
THK_RG XL0260 1077.000
DISPOSITION: Lot moved on. Looks like these are coming in higher lately.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.6 | PEX-XL0297 high tox at incoming 3361 THK_L_CMP2 | ASDG::CULLEY | | Sun Nov 12 1995 07:08 | 19 |
| Subj: PEX for XL0297 at 3361 THK_L_CMP2 THK_L_PMDPRE 3, MVOU 11/06/95 04:49
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: Nov 06 B-Shift
PROBLEM: Thickness high at cmp incoming:
UCL=11150
CL=10500
LCL= 9850
THK_ME 11429.000
THK_RG 581.000
DISPOSITION: Lot moved on. Last few lots have been in this upper portion
of the SPC.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.7 | PEX-XL0305 high tox at 3361 THK_L_CMP2 | ASDG::CULLEY | | Sun Nov 12 1995 07:09 | 19 |
| Subj: PEX for XL0305 at 3361 THK_L_CMP2 THK_L_PMDPRE 3 , MVOU 11/06/95 00:22
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: Nov 06 B-Shift
PROBLEM: Thickness a little high at incoming:
UCL=11150
CL=10500
LCL= 9850
THK_ME 11345.000
THK_RG 500.000
DISPOSITION: Lot moved on. Last few lots have been in this upper portion
of the SPC.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.8 | XA0234Q for cmp visual at incoming | ASDG::CULLEY | | Sun Nov 12 1995 07:10 | 33 |
| Subj: CMP inspection at incoming @ 3127 THK_CMP 14, THK_ILD3_PRE
*************** PEX FOR CMP *************
PROCESS: Visual inspection
OPERATION #:3127
PROCESS DATE & TIME: 11/12/95 3:38 AM
SHIFT: B
LOT(S) AFFECTED: XA0234Q
DEVICE TYPE: TM0055-005-AA-8C
PROBLEM DESCRIPTION: Metal Spiking at edges of wafers.
CORRECTIVE ACTION: Sent lot to Wet Lab for SRD rinse.
DISPOSITION: Prior to this operation, TN spikes where noticed on the wafers
by ops techs. After inspecting the lot with Metals PSS, we
decided the best thing to do was to send the lot to wet-lab
for a SRD cycle.
When wet lab brought the lot back, ops inspected the lot again
and accepted it.
Good observation by CMP ops.
|
| 62.9 | PEX FOR INCOMING PMD ON PROFILER.A1 TOO LOW | SUBPAC::SMARTIN | | Wed Nov 15 1995 04:41 | 19 |
|
EQUIPMENT:INCOMING STEP HEIGHT
PROCESS DATE: 11/15/95
PROCESS LEVEL: PMD
OPERATION:1978
DEVICE TYPE: TM36
LOTS : XD0274
PROBLEMS:INCOMING STEP HEIGHT TOO LOW . READING 2000 LCL=3000
DISPOSITION:LOT WAS REMARKED.
CORRECTIVE ACTION:NONE
|
| 62.11 | PEX for Xd0299 at incoming | ASDG::CULLEY | | Mon Nov 20 1995 06:17 | 17 |
| Subj: PEX for XD0299 at 3023 THK_CMP 6, THK_ILD1_PRE 3
LOT: XD0299 TM3636
MACHINE: THICKNESS.A5
DATE: Nov 19 B-Shift
QUANTITY: 24
PROBLEM: Thickness high at cmp incoming:
UCL=19900
THK_ME 20017.000
THK_RG 469.000
DISPOSITION: Lot moved on. Lot slightly over spec.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.12 | pex for XL0314 at 3362, low step height but uniform | ASDG::CULLEY | | Tue Nov 21 1995 07:02 | 38 |
|
*************** PEX FOR CMP POST MEASUREMENT RANGE *************
(THICKNESS)
(STEP HEIGHT)
PROCESS: 3362 STP_L_CMP1 STEP_L_PMD 2 MVOU 11/21/95 06:16
OPERATION #:3362
POLISHER(CMP.A1, A2, B1, B2): NA
PROCESS DATE & TIME: 11/3/95 1:00PM
SHIFT: B
LOT(S) AFFECTED: XL0314
DEVICE TYPE: TM0055
PROBLEM DESCRIPTION: Step low, SPC LCL = 3000
HEIGHT_ME WAFER #1 CENTER 2708.000
WAFER #1 EDGE 2423.000 11/21/95 06:16:52
WAFER #2 CENTER 2605.000
WAFER #2 EDGE 2465.000
CORRECTIVE ACTION: none, low steps but uniformity reasonable.
DISPOSITION: Moved lot on to CMP.
|
| 62.13 | PEX ILD2 INCOMING THK HIGH | SUBPAC::SMARTIN | | Wed Nov 29 1995 03:27 | 18 |
| PEX for XD0299 at 3053 THK_ILD2_PRE 3
LOT: XD0299 TM3636
MACHINE: THICKNESS.A5
DATE: Nov 29 D-Shift
QUANTITY: 18
PROBLEM: Thickness high at cmp incoming:
UCL=19900
THK_ME 20000.000
DISPOSITION: Lot moved on. Lot slightly over spec.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.14 | PEX lot XD0301 Over Polish | SUBPAC::JWOOLSEY | | Fri Dec 01 1995 09:41 | 32 |
| *************** PEX FOR CMP POLISH ILD3 *************
PROCESS: CMP POLISH ILD3
POLISHER(CMP.A1, A2, B1, B2): CMP.B1
PROCESS DATE: 11/27/95
SHIFT: A and B
LOT(S) AFFECTED: XD0301
DEVICE TYPE: TM35
PROBLEM DESCRIPTION: Lot was over polished. 6 wafers polished down to metal.
These 6 wafers were scrapped out of lot
CORRECTIVE Rest of lot was depped to a extra 5000� to bring it to
ACTION: target thickness. No clear reason as to why lot was over
polished. Another lot was run supposedly in conjunction
with this lot and there was no mistakes made with this lot.
There may have been a confusion with passing the lot from
one shift to another.
DISPOSITION: When lots are passed to another shift a through passdown must
take place. If there are any questions on the lot the wafers
should all be measured. Person on off going shift should not
leave until they are sure on coming shift understands passdown
|
| 62.15 | PEX FOR LOT XA0162, WAFER BREAKAGE | SUBPAC::SMARTIN | | Sat Dec 02 1995 01:41 | 35 |
|
LOT: XA0162
MACHINE: CMP.B1
DATE: DEC 1 D-Shift
QUANTITY: 18
PROBLEM: Broke wafers twice tonight. No alarms.
Didn't know wafers broke until they were
unloading. First break was noticed when
tool alarmed because unload flipper could
not pick up wafer, chunk was missing.
Second break happened after running 50
break in wafers and the tool was about to
unload the last MQC wafer, it to was
missing a chunk in the unload cup.
BROKE 1 WAFER AND TOOK OUT 4
OTHER WAFERS. TOTAL LOSS 5 WAFERS
DISPOSITION: Lot moved on.
CORRECTIVE ACTION:
CMP.B1 WILL NOT BE TURNED OVER TO MFG UNTIL WE UNDERSTAND THE CAUSE OF
WAFER BREAKAGE. EEG WILL PERFORM THE FOLLOWING CHECKS AND CALS:
* Because the wafer crack had been polished, the crack must have
occurred early on in the polish step, maybe at touch down, or during
loading.
1) CHECK AND ADJUST AS REQUIRED ALL LOAD CUP SPEEDS.
2) CHECK AND ADJUST AS REQUIRED ALL LOAD CUP HEIGHTS AND ALIGNMENT.
3) CHECK ALL RECIPE FOR CENTER OF PAD TOUCH DOWN.
4) CHECK TOUCH DOWN SEQUENCE, IE VACUUM OFF, INITIAL RAMP, ETC.
|
| 62.16 | PEX FOR XD0318 THK_RG | SUBPAC::SMARTIN | | Sat Dec 02 1995 01:51 | 18 |
| PEX for XD0318 at 3023 THK_RG ILD1_PRE
LOT: XD0318
MACHINE: THICKNESS.A5
DATE: DEC 2 D-Shift
QUANTITY: 18
PROBLEM: Thickness RANGE high at cmp incoming:
UCL=1000
THK_RG= 1393
THK_ME= 19675
DISPOSITION: Lot moved on. Lot slightly over spec.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.17 | JDOO44 PRE CMP STEP HEIGHT AT PMD | SUBPAC::MCCALLIG | | Mon Dec 04 1995 04:33 | 40 |
|
*************** PEX FOR PRE CMP STEP HEIGHT AT PMD *************
PROCESS: PRE CMP STEP HEIGHT AT PMD
OPERATION #: 3078
POLISHER(CMP.A1, A2, B1, B2): PROFILER.A2
PROCESS DATE & TIME: 12/03/95 9:25 PM
SHIFT: B
LOT(S) AFFECTED: JD0044
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Average pre cmp step height for the pmd layer was below
the lcl.
Wafer 1 center 2574 Angstroms
Wafer 1 edge 2638
Wafer 2 center 2801
Wafer 2 edge 2988
4 point average 2750 Angstroms
lcl 3000
CORRECTIVE ACTION: None at this time. Pre cmp thickness measurements for
PMD were within spec.
DISPOSITION: Lot moved on for polish.
|
| 62.18 | JD0035 pre CMP thickness at PMD | SUBPAC::MCCALLIG | | Tue Dec 05 1995 06:46 | 32 |
| *************** PEX FOR PRE CMP THICKNESS AT PMD *************
PROCESS: PRE CMP THICKNESS AT PMD
OPERATION #: 2951
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A5
PROCESS DATE & TIME: 12/05/95 4:26 AM
SHIFT: B
LOT(S) AFFECTED: JD0035
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP thickness range out of spec at PMD.
THK_ME JD0035 12119.000
THK_RG JD0035 2061.000
Range UCL=1000 Angstroms
CORRECTIVE ACTION: None at this time. Pre CMP range is very far out of spec;
lot will need attention from first shift engineering
during polish.
DISPOSITION: Lot held for first shift engineering.
|
| 62.19 | PEX FOR JD0047 HEIGHT_ME INCOMING TO CMP | SUBPAC::SMARTIN | | Sat Dec 09 1995 06:21 | 17 |
| PEX for JD0047 HEIGHT_ME
LOT: JD0047
MACHINE: PPROFILER.A2
DATE: DEC 9 D-Shift
QUANTITY:
PROBLEM: HEIGHT MEAN TOO LOW at cmp incoming:
LCL=3000
HEIGHT=2415-2590
DISPOSITION: Lot moved on. Lot slightly under spec.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.20 | XA0215 pre-CMP thickness at PMD | SUBPAC::MCCALLIG | | Sun Dec 10 1995 06:28 | 37 |
| *************** PEX FOR PRE CMP THICKNESS AT PMD *************
PROCESS: PRE CMP THICKNESS AT PMD
OPERATION #: 3104
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A5
PROCESS DATE & TIME: 12/09/95 10:45 PM
SHIFT: B
LOT(S) AFFECTED: XA0215
DEVICE TYPE: TM55
PROBLEM DESCRIPTION: Pre CMP thickness out of spec low at PMD.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME XA0215 10130.000
THK_RG XA0215 571.000
THK_ME SPC limits:
LCL: 10850
CORRECTIVE ACTION: None at this time. Thickness was only slightly low, and
range and step height values looked good.
Step height pre CMP= 131 Angstroms.
Pre thickness problem may be related to the fact that we
haven't been running many TM55 lots lately.
DISPOSITION: Lot passed on.
|
| 62.21 | XD0275 pre CMP planarity at ILD3 | SUBPAC::MCCALLIG | | Tue Dec 12 1995 00:45 | 43 |
| *************** PEX FOR PRE CMP STEP HEIGHT AT ILD3 *************
PROCESS: PRE CMP STEP HEIGHT AT ILD3
OPERATION #: 3081
POLISHER(CMP.A1, A2, B1, B2): PROFILER A2
PROCESS DATE & TIME: 12/12/95 12:00 AM
SHIFT: B
LOT(S) AFFECTED: XD0275
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Pre CMP step height high at ILD3.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 XD0275 23
HEIGHT_ME WAFER #1 CENTER 22120.000
WAFER #1 EDGE 23910.000
WAFER #2 CENTER 21960.000
WAFER #2 EDGE 22260.000
UCL = 20000
CL = 18500
LCL = 17000
CORRECTIVE ACTION: None. ILD3 pre CMP thickness values for this lot:
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME XD0275 39741.000
THK_RG XD0275 1194.000
Thickness is within spec. Post CMP thickness target
is 10000A, so we should be able to polish 23000A step
height.
DISPOSITION: Lot passed on.
|
| 62.22 | PEX FOR JD0036 AT 3064/FOR RANGE | ASDG::CULLEY | | Thu Dec 14 1995 04:39 | 19 |
|
Subj: PEX for JD0036 at 3064 THK_ILD3_PST
QUANTITY: 12
MACHINE: CMP.B1
DATE: Dec.14/95 B-Shift
PROBLEM: Range high at operation 3064 THK_ILD3_PST
UCL=4500
ENTITY THICKNESS.A5
actual: THK_ME 10009.000
THK_RG 5465.000
DISPOSITION: Lot moved on. Mean and height where excellant.
CORRECTIVE
ACTION MQC was done to make sure machine was performing
in spec. MQC came out good.
|
| 62.23 | PEX FOR XD0323 AT THK_ILD2_PRE/RANGE | ASDG::CULLEY | | Thu Dec 14 1995 05:29 | 19 |
|
Subj: PEX for XD0323 at 3053 THK_ILD2_PRE
QUANTITY: 19
MACHINE: THICKNESS.A4
DATE: Dec.14/95 B-Shift
PROBLEM: Range high at operation 3053 THK_ILD2_PRE
UCL=1000
ENTITY THICKNESS.A4
actual: THK_ME 18749.000
THK_RG 1118.000
DISPOSITION: Lot moved on. Mean and height where good.
CORRECTIVE
ACTION None,118 over spec is workable. This lot also
had many splits at metal.
|
| 62.24 | PEX for JD0049 at 3023 THK_ILD1_PRE/low tox | ASDG::CULLEY | | Fri Dec 15 1995 06:08 | 18 |
|
Subj: PEX for JD0049 at 3023 THK_ILD1_PRE
QUANTITY: 12
MACHINE: THICKNESS.A4
DATE: Dec.15/95 D-Shift
PROBLEM: Low incoming tox, at operation 3023 THK_ILD1_PRE
LCL=18100
ENTITY THICKNESS.A4
actual: THK_ME 18081.000
THK_RG 711.000
DISPOSITION: Lot moved on. Mean only 19A' low
CORRECTIVE
ACTION none, note this is a hot lot.
|
| 62.25 | XL0338 pre CMP thickness at PMD | SUBPAC::MCCALLIG | | Sun Dec 17 1995 22:28 | 34 |
| *************** PEX FOR PRE CMP THICKNESS AT PMD *************
PROCESS: PRE CMP THICKNESS AT PMD
OPERATION #: 3361
POLISHER(CMP.A1, A2, B1, B2): THICKNESS A5
PROCESS DATE & TIME: 12/17/95 2:20 AM
SHIFT: B
LOT(S) AFFECTED: XL0338
DEVICE TYPE: TM55
PROBLEM DESCRIPTION: Pre CMP thickness low at PMD.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME XL0338 10790.000
THK_RG XL0338 657.000
UCL= 12150
CL= 11500
LCL= 10850
CORRECTIVE ACTION: None. Thickness only slightly low; step heights look
good. Lot should polish without a problem.
DISPOSITION: Lot passed on.
|
| 62.26 | Xd0316 high range pre CMP at ILD1 | SUBPAC::MCCALLIG | | Sun Dec 17 1995 22:47 | 35 |
| *************** PEX FOR PRE CMP RANGE AT ILD1 *************
PROCESS: PRE CMP RANGE AT ILD1
OPERATION #: 3023
POLISHER(CMP.A1, A2, B1, B2): THICKNESS A4
PROCESS DATE & TIME: 12/16/95 8:50 PM
SHIFT: B
LOT(S) AFFECTED: XD0316
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Pre CMP thickness range high at ILD1.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME XD0316 19675.000
THK_RG XD0316 1174.000
UCL= 1000
CL= 500
LCL= 0
CORRECTIVE ACTION: None. Thickness is within spec, and range is only
slightly high. Lot should polish without a problem.
High range could be a measurement problem.
DISPOSITION: Lot passed on.
|
| 62.27 | JD0055 pre CMP thickness at PMD | SUBPAC::MCCALLIG | | Mon Dec 18 1995 03:38 | 35 |
| *************** PEX FOR PRE CMP THICKNESS AT PMD *************
PROCESS: PRE CMP THICKNESS AT PMD
OPERATION #: 2951
POLISHER(CMP.A1, A2, B1, B2): THICKNESS A4
PROCESS DATE & TIME: 12/18/95 2:25 AM
SHIFT: B
LOT(S) AFFECTED: JD0055
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP thickness low at PMD.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0055 10625.000
THK_RG JD0055 623.000
UCL= 12150
CL= 11500
LCL= 10850
CORRECTIVE ACTION: None. Step heights are in spec, thickness is only
slightly low. Should have no trouble covering the
step height with this thickness.
Lot was remarked by films after dielectric deposition.
DISPOSITION: Lot passed on.
|
| 62.28 | JD0054 pre CMP planarity at PMD | SUBPAC::MCCALLIG | | Tue Dec 19 1995 00:28 | 34 |
| *************** PEX FOR PRE CMP STEP HEIGHT AT PMD *************
PROCESS: PRE CMP STEP HEIGHT AT PMD
OPERATION #: 3078
POLISHER(CMP.A1, A2, B1, B2): PROFILER A2
PROCESS DATE & TIME: 12/19/95 12:10 AM
SHIFT: B
LOT(S) AFFECTED: JD0054
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP step height low at PMD.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JD0054 12
HEIGHT_ME WAFER #1 CENTER 2534.000
WAFER #1 EDGE 2629.000
WAFER #2 CENTER 2456.000
WAFER #2 EDGE 2290.000
UCL= 4200
CL= 3600
LCL= 3000
CORRECTIVE ACTION: None.
DISPOSITION: Lot passed on.
|
| 62.29 | XL0338 thickness at ILD1 incoming | SUBPAC::MCCALLIG | | Tue Dec 19 1995 23:08 | 34 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD1 *************
PROCESS: PRE CMP THICKNESS AT ILD1
OPERATION #: 3112
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A4
PROCESS DATE & TIME: 12/19/95 10:00 PM
SHIFT: B
LOT(S) AFFECTED: XL0338
DEVICE TYPE: TM55
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD1.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME XL0338 17721.000
THK_RG XL0338 810.000
UCL= 19900
CL= 19000
LCL= 18100
CORRECTIVE ACTION: None. Step heights are OK. Thickness is only slightly
low; this lot should polish without a problem. Lot was
also slighlty thin at incoming PMD.
DISPOSITION: Lot passed on.
|
| 62.30 | PEX FOR XL0338 (SCRATCHES) | SUBPAC::SMARTIN | | Wed Dec 20 1995 16:57 | 33 |
|
LOT: XL0338
MACHINE: CMP.B1
OPER#:1992
PROCESS LEVEL: ILD1
DATE: 12/20/95
SHIFT: A-SHIFT
QUANTITY: 24
PROBLEM: SCRATCHES ON 4 WAFERS
DISPOSITION: DRG INSPECTED THE LOT AND FOUND 4 WAFERS THAT ARE
SCRATCHED. THEY HAVE DECIDED TO KEEP THE WAFERS WITH THE LOT DUE
TO ALL THE PREVIOUS SPLITS THAT THE LOT HAS BEEN THRU.
CORRECTIVE ACTION: LOT XL0338 HAD SCRATCHES OBSERVED ON IT.
PARTICLE CHECK PERFORMED/.B1 FAILED FOR
SCRATCHES/PARTICLES ALL INFO LOGED INTO WORK-
STREAM. CHANGING PAD AND CHECKING CARRIERS
1) CMP.B1,2 - PRIOR TO EVERY MQC, THE SYSTEMS NEED TO BE CLEANED OF DRIED
SLURRY. ON B2 MAKE SURE THE SLURRY DELIVERY FOUNTAIN IS SCRUBBED AND
THE SIDES OF THE CARRIERS. The current configuration does not scrub the
carriers. Dried slurry causes scratches.
|
| 62.31 | Pex for jd0051 at incoming ild1_pre | ASDG::CULLEY | | Sat Dec 23 1995 01:36 | 18 |
| Subj: PEX for JD0051 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 10
MACHINE: THICKNESS.A4
DATE: Dec 23 D-Shift
PROBLEM: Thickness high at cmp incoming:
UCL=19900
CL=19000
LCL=18100
THK_ME 17911.000 12/23/95 01:14:05
THK_RG 784.000
DISPOSITION: Lot moved on. Slightly low, which can be considered good.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.32 | XL0338 pre-CMP step height at ILD2 | SUBPAC::MCCALLIG | | Wed Jan 03 1996 05:47 | 37 |
| *************** PEX FOR PRE CMP STEP HEIGHT AT ILD2 *************
PROCESS: PRE CMP STEP HEIGHT AT ILD2
OPERATION #: 3194
POLISHER(CMP.A1, A2, B1, B2): PROFILER.A2
PROCESS DATE & TIME: 1/02/96 8:30 PM
SHIFT: B
LOT(S) AFFECTED: XL0338
DEVICE TYPE: TM55
PROBLEM DESCRIPTION: Pre CMP average planarity high at ILD 2.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 XL0338 20
HEIGHT_ME WAFER #1 CENTER 9521.000
WAFER #1 EDGE 9505.000
WAFER #2 CENTER 9983.000
WAFER #2 EDGE 9888.000
4 POINT AVERAGE 9724
UCL= 9600
CL= 8400
LCL= 7200
CORRECTIVE ACTION: None. Should be able to polish these steps without a
problem. This lot was thin at PMD and ILD1, these factors
could be contributing to the out of spec step heights.
DISPOSITION: Lot passed on.
|
| 62.33 | pre_3 tox low but ok for xd0315 | ASDG::CULLEY | | Thu Jan 04 1996 05:46 | 18 |
|
Subj: PEX for XD0315 at 3058 THK_ILD3_PRE
QUANTITY: 15
MACHINE: THICKNESS.A4
DATE: Jan. 04/96 B-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36875.000
THK_RG 2266.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None.
|
| 62.34 | JD0043 pre CMP thickness low at ILD3 | SUBPAC::MCCALLIG | | Mon Jan 08 1996 02:06 | 34 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD3 *************
PROCESS: PRE CMP THICKNESS AT ILD3
OPERATION #: 3058
POLISHER(CMP.A1, A2, B1, B2): THICKNESS A4
PROCESS DATE & TIME: 01/06/96 4:00 PM
SHIFT: C
LOT(S) AFFECTED: JD0043
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD3.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0043 35558.000
UCL= 40950
CL= 39000
LCL= 37050
CORRECTIVE ACTION: None. Step heights are in spec, thickness is only
slightly low. Should have no trouble covering the
step height with this thickness.
Lot was remarked in workstream.
DISPOSITION: Lot passed on.
|
| 62.35 | PEX JD0058 Incoming THK | SUBPAC::BODENSIECK | | Thu Jan 11 1996 08:41 | 31 |
|
*************** PEX FOR CMP PRE MEASUREMENT MEAN *************
PROCESS: PRE CMP THICKNESS MEAN ILD3
POLISHER(CMP.A1, A2, B1, B2): B1
PROCESS DATE: 1/10/96
SHIFT: C
LOT(S) AFFECTED: JD0058
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: INCOMINING THICKNESS 36,875 �. TARGET INCOMING THICKNESS
IS 39,000� +- (1950)
CORRECTIVE ACTION: LOT WILL BE POLISHED AS STANDARD PROCESS. ATTENTION WILL
BE PAID TO POST STEP HEIGHT TO VERIFY PLANAR WAFERS AFTER
POLISH.
DISPOSITION: CURVE FITTING WILL BE REDONE ON ILD3 LEVELS TO IMPROVE
THE MEASUREMENT CORRELATIONS BETWEEN FILMS AND CMP. CMP
USE A ENHANCED STANDARD THICKNESS AND FILMS USES A SCATTERING
ALGORITHIM TO CALCULATE THICKNESS. THESE MEASUREMENTS
DO NOT ALWAYS CORRESPOND.
|
| 62.36 | PEX JD0061 Incoming Step Height | SUBPAC::BODENSIECK | | Thu Jan 11 1996 08:42 | 25 |
|
*************** PEX FOR CMP PRE STEP HEIGHT *************
PROCESS: PRE STEP HEIGHT PMD
POLISHER(CMP.A1, A2, B1, B2): A1
PROCESS DATE: 1/10/96
SHIFT: C
LOT(S) AFFECTED: JD0061
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: MEAN STEP HEIGHT FOR LOT WAS 4263
CORRECTIVE ACTION: NO CORRECTIVE ACTION TAKEN
DISPOSITION: IN COMING STEP HEIGHT WAS OVER SPC CHART LIMITS. LOT WILL
BE CHECKED FOR POST STEP HEIGHTS. OPERATIONS WILL PAY SPECIAL
ATTENTION TO OUT GOING STEP HEIGHT TO ENSURE PLANARITY.
|
| 62.37 | pex for xd0344 at idl1_pre, high range | ASDG::CULLEY | | Sat Jan 13 1996 06:53 | 18 |
|
Subj: PEX for XD0344 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 19
MACHINE: THICKNESS.A4
DATE: 01/12/96 D-Shift
PROBLEM: Range high at operation 3023 THK_ILD1_PRE
UCL=1000
ENTITY THICKNESS.A4
actual: THK_ME 18492.000
THK_RG 1320.000
DISPOSITION: Hot Lot moved on. Mean and height where good.
CORRECTIVE
ACTION None.
|
| 62.38 | pex for jd0061 at ild1_pre, tox low,range high | ASDG::CULLEY | | Sat Jan 13 1996 07:11 | 20 |
| Subj: PEX for JD0061 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: 01/13/96 D-Shift
PROBLEM: Thickness low and range high at cmp incoming:
UCL=19900 UCL for range is 1000.000
CL=19000
LCL=18100
THK_ME 17335.000
THK_RG 1158.000
DISPOSITION: Hot Lot moved on. Slightly low tox ok,
which can be considered good.
Range is a litle high.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.39 | XL0327 pre-CMP thickness at ILD3 | SUBPAC::MCCALLIG | | Tue Jan 16 1996 03:52 | 35 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD3 *************
PROCESS: PRE CMP THICKNESS AT ILD3
OPERATION #: 3127
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A5
PROCESS DATE & TIME: 1/15/96 7:00 AM
SHIFT: B
LOT(S) AFFECTED: XL0327
DEVICE TYPE: TM55
PROBLEM DESCRIPTION: Pre CMP mean thickness high at ILD 3.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME XL0327 41424.000
THK_RG XL0327 3875.000
UCL= 40950
CL= 39000
LCL= 37050
CORRECTIVE ACTION: None. Pre-polish step heights are in spec. Should be
able to polish this lot without a problem.
Greater thickness will require more polish
time, but should not affect planarity.
DISPOSITION: Lot passed on.
|
| 62.40 | PEX JD0061 PRE STEP HIEGHT IS HIGH | SUBPAC::SMARTIN | | Wed Jan 17 1996 17:58 | 27 |
|
LOT:JD0061
MACHINE: PROFILER.A2
OPER#:3080
PROCESS LEVEL: ILD2
DATE: 1/17/96
SHIFT: A-SHIFT
QUANTITY: 24
PROBLEM: PRE STEP HIEGHT READING WAS HIGH.
RUN_ID_1 JD0061 N/A
HEIGHT_ME WAFER #1 CENTER 10900.000
WAFER #1 EDGE 10230.000
WAFER #2 CENTER 9875.000
WAFER #2 EDGE 9847.000
SPEC LIMIT=9600
DISPOSITION: LOT WAS REMARKED AND MOVED ON.
CORRECTIVE ACTION: NONE
|
| 62.41 | Pex for JD0061 at ild2_pst, wafers 1 & 10 low tox | ASDG::CULLEY | | Thu Jan 18 1996 04:00 | 19 |
| Subj: PEX for JD0061 at 3066 THK_CMP 11 THK_ILD2_PST
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: 01/17/96 D-Shift
PROBLEM: Two wafers, #1, and #10 where measured for tox and where low
at ILD2_PST. This prompted cmp ops to 100% measurements.
JD0061-01 AT 4591A'.
JD0061-10 AT 2545A'.
Rest of lot was middle of spec.
Spec is 5500A' +- 300A'
DISPOSITION: Hot Lot moved on WITH all wafers. Previous remark showed
that incoming was low out of spec.
CORRECTIVE
ACTION None, added remark to operation.
Note, this lot was started by day shift and finished on D.
|
| 62.42 | Pex for Xd0344 at il2_pre thickness, LOW | ASDG::CULLEY | | Thu Jan 18 1996 06:52 | 18 |
|
Subj: PEX for XD0344 at 3053 THK_CMP 10 THK_ILD2_PRE
QUANTITY: 19
MACHINE: THICKNESS.A5
DATE: 01/18/96 D-Shift
PROBLEM: Thickness low at operation 3053 THK_ILD2_PRE
LCL=18100
ENTITY THICKNESS.A5
actual: THK_ME 18003.000
THK_RG 462.000
DISPOSITION: Hot Lot moved on. Range and height where good.
CORRECTIVE
ACTION None.
|
| 62.43 | Pex for XD0334 at THK_ILD1_PRE | ASDG::CULLEY | | Sat Jan 20 1996 09:18 | 22 |
| Subj: PEX forXD0334 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 20
MACHINE: THICKNESS.A4
DATE: 01/20/96 D-Shift
PROBLEM: Thickness is very high and range is normal at incoming:
UCL=19900 UCL for range is 1000.000
CL=19000
LCL=18100
THK_ME 31266.000
THK_RG 713.000
DISPOSITION: Lot is still being worked on. Taking the better part of
8 hours to polish.
CORRECTIVE
ACTION None, added remark to operation.
Remark at metal told of the overdeped wafers but the
remark was put in 3019 and should of also been put in
3053..Ed.
|
| 62.44 | Pex for JD0062 at THK_PMD_PRE | ASDG::CULLEY | | Sat Jan 20 1996 09:19 | 20 |
|
Subj: PEX for JD0062 at 2951 THK_CMP 2 THK_PMD_PRE
QUANTITY: 21
MACHINE: THICKNESS.A4
DATE: 01-20-96 D-Shift
PROBLEM: Very high range at incoming.
ENTITY THICKNESS.A4
actual: THK_GM ok middle of spec.
THK_RG 4984.000 UCL=1000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION none.
Lately for this week, incoming lots have been all
over the place. Metal engs should be looking at
our pexs.
|
| 62.45 | Pex for JD0067 at THK_ILD1_PRE | ASDG::CULLEY | | Sat Jan 20 1996 09:19 | 20 |
| Subj: PEX for JD0067 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A2
DATE: 01/20/96 D-Shift
PROBLEM: Thickness low and range high at cmp incoming:
UCL=19900 UCL for range is 1000.000
CL=19000
LCL=18100
THK_ME 17100.000
THK_RG 1146.000
DISPOSITION: Hot Lot moved on. Slightly low tox ok,
which can be considered good.
Range is a litle high.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.46 | Pex for XD0335 at THK_ILD1_PRE | YIELD::PHESTER | | Sat Jan 20 1996 13:12 | 14 |
|
Subj: PEX forXD0335 at 3014 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: 01/17/96 A-Shift
PROBLEM: Low incoming thickness at 18004@�. LCL is 18100�
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None, comment entered in workstream.
|
| 62.47 | JD0065 high range at pre-CMP PMD | SUBPAC::MCCALLIG | | Sun Jan 21 1996 02:31 | 32 |
| *************** PEX FOR PRE CMP RANGE AT PMD *************
PROCESS: PRE CMP RANGE AT PMD
OPERATION #: 2951
POLISHER(CMP.A1, A2, B1, B2): THICKNESS A5
PROCESS DATE & TIME: 1/20/96 9:45 PM
SHIFT: B
LOT(S) AFFECTED: JD0065
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP range high at PMD.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0065 11291.000
THK_RG JD0065 1190.000
UCL= 1000
CL= 500
LCL= 0
CORRECTIVE ACTION: None. Thickness mean is in spec. Lot should polish OK.
DISPOSITION: Lot passed on.
|
| 62.48 | PEX FOR JD0061 INCOMMINGTHICKNESS TOO LOW FROM FILMS AGAIN | SUBPAC::SMARTIN | | Sun Jan 21 1996 14:30 | 28 |
|
LOT:JD0061
MACHINE: PROFILER.A2
OPER#:3058
PROCESS LEVEL: ILD3
DATE: 1/21/96
SHIFT: A-SHIFT
QUANTITY: 24
MACHINE: THICKNESS.A4
PROBLEM: INCOMMING PREREADINGS TOO LOW ON ILD3 FROM FILMS GROUP
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0061 36417.000
THK_RG " 1149.000
SPC LCL=37050.000
DISPOSITION: LOT WAS MOVED ON.
CORRECTIVE ACTION: NONE
|
| 62.49 | XL0346 pre thickness low at ILD1 | SUBPAC::MCCALLIG | | Sun Jan 21 1996 23:27 | 34 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD1 *************
PROCESS: PRE CMP THICKNESS AT ILD1
OPERATION #: 3112
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A4
PROCESS DATE & TIME: 1/21/96 4:00 AM
SHIFT: B
LOT(S) AFFECTED: XL0346
DEVICE TYPE: TM55
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD1.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME XL0346 17464.000
THK_RG XL0346 608.000
UCL= 19900
CL= 19000
LCL= 18100
CORRECTIVE ACTION: None. Range and step heights are OK, thickness is only
slightly low. Lot should polish without a problem.
Pre-CMP thicknesses at ILD1 have been trending down.
DISPOSITION: Lot passed on.
|
| 62.50 | XD0341 pre thickness low at ILD1 | SUBPAC::MCCALLIG | | Sun Jan 21 1996 23:38 | 35 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD1 *************
PROCESS: PRE CMP THICKNESS AT ILD1
OPERATION #: 3023
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A5
PROCESS DATE & TIME: 1/21/96 4:00 AM
SHIFT: B
LOT(S) AFFECTED: XD0341
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD1.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME XL0341 17884.000
THK_RG XL0341 675.000
UCL= 19900
CL= 19000
LCL= 18100
CORRECTIVE ACTION: None. Range and step heights are OK; thickness is only
slightly low. Lot should polish without a problem.
Pre-CMP CMOS 6 thicknesses at ILD1 have been trending down.
Could be a measurement issue between films and CMP.
DISPOSITION: Lot passed on.
|
| 62.51 | XD0356 pre CMP range at ILD1 | SUBPAC::MCCALLIG | | Mon Jan 22 1996 01:51 | 32 |
| *************** PEX FOR PRE CMP RANGE AT ILD1 *************
PROCESS: PRE CMP RANGE AT ILD1
OPERATION #: 3023
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A5
PROCESS DATE & TIME: 1/22/96 1:00 AM
SHIFT: B
LOT(S) AFFECTED: XD0356
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Pre CMP thickness range high at ILD1.
THK_ME XD0356 18464.000
THK_RG XD0356 1390.000
UCL= 1000
CL= 500
LCL= 0
CORRECTIVE ACTION: None. Thickness mean for this lot is in spec. Should
be able to polish.
DISPOSITION: Lot passed on.
|
| 62.52 | JD0070 overpolished at PMD | SUBPAC::MCCALLIG | | Mon Jan 22 1996 05:07 | 64 |
| *************** JD0070 OVERPOLISHED AT PMD *************
PROCESS: CMOS 6 CMP POLISH AT PMD
OPERATION #: 1978
POLISHER(CMP.A1, A2, B1, B2): B1
PROCESS DATE & TIME: 1/22/96 4:00 AM
SHIFT: B
LOT(S) AFFECTED: JD0070
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Post CMP average thickness low due to overpolish.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JD0070 24
THK_ME JD0070 6011.000
THK_RG JD0070 1571.000
UCL= 6800
CL= 6500
LCL= 6200
Lot was measured 100% for thickness:
SLOT THICKNESS (Angstroms)
2 6498
3 5993
4 5357
5 6155
6 5273
7 6135
8 6492
9 5816
10 4995
11 5995
12 6261
13 5859
14 4961
15 5779
16 6243
17 5996
18 4927
19 6009
20 6165
21 5813
22 5116
23 5939
24 6122
25 6132
DISPOSITION: Lot was passed on with a remark for films to deposit an extra
1000 Angstroms at DEP_PMD 2 (operation 2127) on the following
wafers: 4, 6, 10, 14, 18, 22. Other wafers look OK.
CORRECTIVE ACTION: May need to follow up with films when the lot reaches
DEP_PMD 2.
|
| 62.53 | JD0052 pre-thickness low at ILD3 | SUBPAC::MCCALLIG | | Mon Jan 22 1996 05:51 | 33 |
| *************** PEX FOR PRE THICKNESS AT ILD3 *************
PROCESS: PRE CMP THICKNESS AT ILD3
OPERATION #: 3058
POLISHER(CMP.A1, A2, B1, B2): THICKNESS A5
PROCESS DATE & TIME: 1/22/96 4:00 AM
SHIFT: B
LOT(S) AFFECTED: JD0052
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD3.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0052 36456.000
THK_RG JD0052 967.000
UCL= 40950
CL= 39000
LCL= 37050
CORRECTIVE ACTION: None. Lot should polish OK. Pre thicknesses are
trending down.
DISPOSITION: Lot passed on.
|
| 62.54 | XL0347 HIGH RANGE | SUBPAC::SMARTIN | | Mon Jan 22 1996 18:53 | 28 |
|
LOT:XL0347
MACHINE: THICKNESS.A5
OPER#:3114
PROCESS LEVEL: ILD1
DATE: 1/22/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT..TM0055-006-AD-8C
PROBLEM: HIGH RANGE ON POST CMP ILD1.
THK_ME 5380.000
THK_RG 3884.000 SPC UCL=34000.000
DISPOSITION: LOT WAS MOVED ON.
CORRECTIVE ACTION: NONE
|
| 62.55 | Pex for JD0073 at 3078 STEP_CMP 1 STEP_PMD | ASDG::CULLEY | | Wed Jan 24 1996 03:57 | 20 |
| Subj: PEX for JD0073 at 3078 STEP_CMP 1 STEP_PMD 2
QUANTITY: 24, DC1026-000-AC-8G
MACHINE: PROFILER.A2
DATE: 01/24/96 D-Shift
PROBLEM: STP_PMD_PRE low at cmp incoming:
LCL=3000 Ave 2683.25
HEIGHT_ME WAFER #1 CENTER 2428.000
WAFER #1 EDGE 3010.000
WAFER #2 CENTER 2413.000
WAFER #2 EDGE 2882.000
DISPOSITION: Lot moved on. Slightly low, ok.
CORRECTIVE
ACTION None, added remark to operation.
Graph and data sheet provided.
|
| 62.56 | Pex for Xd0352 at THK_ILD1_PRE, low reads | ASDG::CULLEY | | Wed Jan 24 1996 07:18 | 18 |
|
Subj: PEX for XD0352 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 19
MACHINE: THICKNESS.A5
DATE: 01/24/96 D-Shift
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A5
THK_ME 17914.000
THK_RG 514.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.57 | Pex for XD0342 at 3054 cmp ild1 pst, low tox | ASDG::CULLEY | | Thu Jan 25 1996 05:26 | 25 |
| Subj: PEX for XD0342 at 3054 THK_CMP 8 THK_ILD1_PST
QUANTITY: 21
MACHINE: THICKNESS.A4
DATE: 01/24/96 D-Shift
SYSTEM: B-2
PROBLEM: thickness low on 12 wafers, other 9 wafers in spec.
LCL = 5200A'
Post thickness measured on THICKNESS.A4:
# tox # tox
5 5056A' 18 5129A'
6 4429 19 5014
7 3351 20 3948
11 5008 22 4111
12 5101 24 4382
14 4038
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remarks added at operation 3054.
NOTE: This is the SOI lot for Grula.
|
| 62.58 | Lot JD0054 PEX @ILD3... | YIELD::PHESTER | | Thu Jan 25 1996 10:51 | 28 |
|
LOT:JD0054
MACHINE: THICKNESS.A5
OPER#: 3064
PROCESS LEVEL: ILD3
DATE: 1/24/96
SHIFT: C-SHIFT
QUANTITY: 12
PRODUCT..DC1026-000-AA-8G
PROBLEM: HIGH RANGE ON POST CMP ILD1.
THK_RG 7739� SPC UCL= 4500�
DISPOSITION: LOT WAS MOVED ON.
CORRECTIVE ACTION: NONE
|
| 62.59 | XD0334 PEX @ILD3 | YIELD::PHESTER | | Thu Jan 25 1996 18:42 | 19 |
|
Subj: PEX for XD0334 at 3024 THK_ILD3_PRE
QUANTITY: 6
MACHINE: THICKNESS.A4
DATE: 01/25/96 C-Shift
PROBLEM: thickness low at operation 3023 THK_ILD3_PRE
LCL = 37050�
ENTITY THICKNESS.A4
THK_ILD_PRE 36966�
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.60 | Xl0314 PEX at ILD2 | YIELD::PHESTER | | Thu Jan 25 1996 18:49 | 19 |
|
Subj: PEX for Xl0314 at 3120 THK_ILD2_PRE
QUANTITY: 17
MACHINE: THICKNESS.A5
DATE: 01/25/96 C-Shift
PROBLEM: thickness low at operation 3120 THK_ILD2_PRE
LCL = 18100�
ENTITY THICKNESS.A5
THK_ILD2_PRE 17519�
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.61 | Pex for JD0063B at cmp ild1 | ASDG::CULLEY | | Fri Jan 26 1996 05:21 | 19 |
|
Subj: PEX for JD0063B at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 11
MACHINE: THICKNESS.A4
DATE: 01-26-96 D-Shift
PROBLEM: high THK_ME at incoming.
LCL = 18100
ENTITY THICKNESS.A4
actual: THK_ME 17832.000
THK_RG 726.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION none.
|
| 62.62 | JD0063 pre thickness low at ILD2 | SUBPAC::MCCALLIG | | Sun Jan 28 1996 04:40 | 34 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD2 *************
PROCESS: PRE CMP THICKNESS AT ILD2
OPERATION #: 3053
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A5
PROCESS DATE & TIME: 1/28/96 1:00 AM
SHIFT: B
LOT(S) AFFECTED: JD0063
DEVICE TYPE: DC1035
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD 2.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0063 17851.000
THK_RG JD0063 573.000
UCL= 19900
CL= 19000
LCL= 18100
CORRECTIVE ACTION: None. Thickness is only slightly low, and range and
step heights are in spec. Lot should polish without
any problems.
DISPOSITION: Lot passed on.
|
| 62.63 | XD0356 post-CMP thickness low at ILD2 | SUBPAC::MCCALLIG | | Sun Jan 28 1996 22:38 | 44 |
| *************** PEX FOR POST CMP THICKNESS AT ILD2 *************
PROCESS: POST CMP THICKNESS AT ILD2
OPERATION #: 3066
POLISHER(CMP.A1, A2, B1, B2): B1
PROCESS DATE & TIME: 1/28/96 10:00 PM
SHIFT: B
LOT(S) AFFECTED: XD0356
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Post CMP thickness low at ILD2. Lot was polished on A
shift and measured on B shift.
THK_ME XD0356 4539.000
THK_RG XD0356 1209.000
UCL= 5800
CL= 5500
LCL= 5200
Post CMP range and step heights at this operation look
normal.
HEIGHT_ME WAFER #1 CENTER 115.000
WAFER #1 EDGE 106.000
WAFER #2 CENTER 116.000
WAFER #2 EDGE 138.000
CORRECTIVE ACTION: Thickness is only slightly low. Lot was remarked for
films to deposit an extra
1000 angstroms at the next ILD2 deposition operation;
1000 angstroms extra dielectric should bring the ILD2
thickness to within spec.
DISPOSITION: Lot passed on.
|
| 62.64 | JD0068 pre-CMP thickness at ILD1 | SUBPAC::MCCALLIG | | Mon Jan 29 1996 05:23 | 34 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD1 *************
PROCESS: PRE CMP THICKNESS AT ILD1
OPERATION #: 3023
POLISHER(CMP.A1, A2, B1, B2): A1
PROCESS DATE & TIME: 1/29/96 5:00 AM
SHIFT: B
LOT(S) AFFECTED: JD0068
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD1.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0068 17446.000
THK_RG JD0068 623.000
UCL= 19900
CL= 19000
LCL= 18100
CORRECTIVE ACTION: None. Range and step heights are OK, thickness is only
slightly low. Lot should polish without a problem.
Pre-CMP thicknesses at ILD1 have been trending down.
DISPOSITION: Lot passed on.
|
| 62.65 | YD0355 PEX AT ILD2 | YIELD::PHESTER | | Thu Feb 01 1996 16:07 | 18 |
|
Subj: PEX for YD0335 at 3053 THK_ILD2_PRE THK_RG
QUANTITY: 22
MACHINE: THICKNESS.A4
DATE: 02/01/96 C-Shift
PROBLEM: HIGH IMCOMING RANGE. UCL is 1000�
RANGE WAS 1411
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION NONE, LOT REMARKED
|
| 62.66 | PEX FOR JD0072 AT ILD1_PRE | ASDG::CULLEY | | Fri Feb 02 1996 20:27 | 17 |
|
Subj: PEX for JD0072 at 3023 THK_CMP 6 THK_ILD1_PRE 3 2/02/96 01:05
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: 02-02-96 D-Shift
PROBLEM: Low tox at incoming.
ENTITY THICKNESS.A4
actual: THK_GM 17432.000 LCL=18,100
THK_RG 535.000 UCL= 1,000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION none. Graph provided for eng.
|
| 62.67 | PEX FOR JD0070 AT ILD2_PRE, LOW THICKNESS | ASDG::CULLEY | | Fri Feb 02 1996 20:28 | 19 |
|
Subj: PEX for JD0070 at 3053 THK_CMP 10 THK_ILD2_PRE 3 2/02/96 04:31
QUANTITY: 23 Hot lot, DC1026-000-AC-8G
MACHINE: THICKNESS.A4
DATE: 02-02-96 D-Shift
PROBLEM: Low tox at incoming.
ENTITY THICKNESS.A4
actual: THK_GM 17632.000 LCL=18,100
THK_RG 855.000 UCL= 1,000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION none. Graph provided for eng.
|
| 62.68 | PEX JD0062 PRE ILD 2 READING WAS LOW | SUBPAC::SMARTIN | | Sun Feb 04 1996 18:27 | 30 |
|
LOT:JD0062
MACHINE: THICKNESS.A4
OPER#:3080
PROCESS LEVEL: ILD2
DATE: 2/4/96
SHIFT: A-SHIFT
QUANTITY: 10
PRODUCT..DC1026-000-AC-8G
PROBLEM: PRE ILD 2 THICKNESS WAS SLIGHTLY LOW.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0062 17880.000
THK_RG " 730.000
SPC LCL=18000
DISPOSITION: LOT WAS MOVED ON.
CORRECTIVE ACTION: NONE
|
| 62.69 | JD0063B LOW INCOMING THICKNESS | SUBPAC::SMARTIN | | Mon Feb 05 1996 11:57 | 37 |
|
LOT:JD0063b
MACHINE: THICKNESS.A5
OPER#:3053
PROCESS LEVEL: ILD2
DATE: 2/5/96
SHIFT: A-SHIFT
QUANTITY: 11
PRODUCT..DC1035-000-CA-8T
PROBLEM: PRE ILD 2 THICKNESS WAS SLIGHTLY LOW.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0063B 18010.000
THK_RG JD0063B 675.000
spc lcl=18100
Same wafers from films had the following readings:
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 19127.000
WAFER #2 19149.000
DISPOSITION: LOT WAS MOVED ON.
CORRECTIVE ACTION: NONE
|
| 62.70 | Pex for JD0082 at ILD1_pre, low thickness | ASDG::CULLEY | | Fri Feb 09 1996 06:54 | 18 |
|
Subj: PEX for JD0082 (hot lot) at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: 02-09-96 D-Shift
PROBLEM: Slightly low thickness at incoming.
ENTITY THICKNESS.A4
actual: THK_GM 17892.000 LCL = 18100
THK_RG 709.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Little lower thickness should be alright.
|
| 62.71 | pex for JD0075 for low thickness at ild1_pre | ASDG::CULLEY | | Sat Feb 10 1996 07:09 | 17 |
|
Subj: PEX for JD0075 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: 02-10-96 D-Shift
PROBLEM: Low tox at incoming.
ENTITY THICKNESS.A4
actual: THK_GM 18079.000 LCL=18,100
THK_RG 529.000 UCL= 1,000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION none. Graph provided for eng.
|
| 62.72 | XL0346 PEX AT ILD3 | YIELD::PHESTER | | Sat Feb 10 1996 13:44 | 18 |
|
Subj: PEX for XL0346 at 3127 THK_ILD3_PRE
QUANTITY: 21
MACHINE: THICKNESS.A4
DATE: 02/10/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS LCL IS 37050�
THICKNESS WAS 36589
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION NONE, LOT REMARKED
|
| 62.73 | XD0362 post-CMP thin at ILD1 | SUBPAC::MCCALLIG | | Sun Feb 11 1996 23:45 | 68 |
| *************** PEX FOR POST CMP THICKNESS AT ILD1 *************
PROCESS: POST CMP THICKNESS AT ILD1
OPERATION #: 3054
POLISHER(CMP.A1, A2, B1, B2): CMP.B2
PROCESS DATE & TIME: 2/11/96 10:30 AM
SHIFT: A
LOT(S) AFFECTED: XD0362
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Initial measurements indicated POST-CMP thickness low
on this lot at ILD1. As a result, lot was measured
100% for thickness on the UV1050 during B shift 2-11.
WAFER SLOT THICKNESS MEAN THICKNESS RANGE
1 3687 2022
2 3761 2522
3 2951 1426
4 4130 1407
5 2853 2365
6 4011 2106
7 2676 1317
8 3812 1338
9 2982 1359
10 2950 2004
11 3502 2433
12 2877 1449
13 3211 1093
14 3288 1245
15 2827 1308
16 3938 1627
17 3668 754
18 4107 1141
19 3415 1551
20 3721 2169
21 2734 1108
22 4860 1618
23 4693 903
24 3105 1489
UCL= 5800
CL= 5500
LCL= 5200
Thickness ranges are in spec.
CORRECTIVE ACTION: None at this time.
DISPOSITION: This is one of the lots designated for the CMP one pass
polishing study. Lot recieved original 240 second polish on
B shift 2-10. Touch up times were calculated after this
polish, and the lot was touched up on A shift 2-11.
While all wafers were thin after touch up, some were close
to spec while others were very thin. This data could suggest
that certain heads were removing much faster than others.
First shift engineering was notified of this data during A
shift 2-11, and the decision was made to place the lot on
hold until it could be evaluated by first shift.
|
| 62.74 | XD0348, JD0071 post CMP thickness low ILD2 | SUBPAC::MCCALLIG | | Mon Feb 12 1996 05:35 | 35 |
| *************** PEX FOR POST CMP THICKNESS AT ILD2 *************
PROCESS: POST CMP THICKNESS AT ILD2
OPERATION #: 3066
POLISHER(CMP.A1, A2, B1, B2): CMP.B1
PROCESS DATE & TIME: 2/12/96 4:00 AM
SHIFT: B
LOT(S) AFFECTED: XD0348, JD0071
DEVICE TYPE: TM3636, DC1026
PROBLEM DESCRIPTION: Post CMP thickness low at ILD1.
THK_ME JD0071 5153.000
THK_RG JD0071 1195.000
THK_ME XD0348 5086.000
THK_RG XD0348 1496.000
UCL= 5800
CL= 5500
LCL= 5200
CORRECTIVE ACTION: None. Range and step heights are OK, thickness is only
slightly low. Lots should continue without a problem.
DISPOSITION: Lots passed on.
|
| 62.75 | JD0072 OVER POLISH ON ILD2,5 WAFERS SCRAPED | SUBPAC::SMARTIN | | Mon Feb 12 1996 10:55 | 34 |
|
LOT:JD0072
MACHINE: CMP.B2
OPER#:1985
PROCESS LEVEL: ILD2
DATE: 2/12/96
SHIFT: B-SHIFT
QUANTITY: 20
PRODUCT....DC1026-000-AC-8G
LOT:JD0072
PROBLEM: OVER POLISH ON ILD2, 5 WAFERS FROM THE LOT WILL HAVE TO BE SCRAPED DUE
TO THE OVER POLISH. OPS USED POLISH TIME FOR ILD3 INSTEAD OF ILD2.
WAFER# THK READING
#6 = 675
#10 = 2235
#11 = 2233
#15 = 3041
#16 2036
DISPOSITION: THE REMAINING WAFERS WILL HAVE TO GET EXTRA DEP DUE TO THE OVER
POLISH
CORRECTIVE ACTION: OPS MUST BE AWARE OF WHAT LEVEL THEY ARE POLISHING.
|
| 62.76 | JD0080 | SUBPAC::SMARTIN | | Mon Feb 12 1996 11:08 | 31 |
|
LOT:JD0080
MACHINE: THICKNESS.A5
OPER#:1981
PROCESS LEVEL: ILD1
DATE: 2/12/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT..DC1026-000-AC-8G
PROBLEM: PRE ILD 1 THICKNESS WAS SLIGHTLY LOW.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0080 17431.000
THK_RG " 640.000
SPC LCL=18000
DISPOSITION: LOT WAS MOVED ON.
CORRECTIVE ACTION: NONE
|
| 62.77 | JD0074 pre-thickness low at ILD2 | SUBPAC::MCCALLIG | | Wed Feb 14 1996 07:01 | 33 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD2 *************
PROCESS: PRE CMP THICKNESS AT ILD2
OPERATION #: 3053
POLISHER(CMP.A1, A2, B1, B2): THICKNESS.A5
PROCESS DATE & TIME: 2/14/96 7:00 AM
SHIFT: B
LOT(S) AFFECTED: JD0074
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD2.
THK_ME JD0074 17500.000
THK_RG JD0074 351.000
UCL= 19900
CL= 19000
LCL= 18100
CORRECTIVE ACTION: None. Range and step heights are OK, thickness is only
slightly low. Lot should polish without a problem.
DISPOSITION: Lot passed on.
|
| 62.78 | Scubber up/down travel | FABSIX::R_GEE | | Wed Feb 14 1996 07:12 | 26 |
| * The scrubber up / down travel wasn't working properly.
Using Digital output #63 the scrubber would travel
up and down normally. In auto it would go up and
down at the beginning of the travel inward. It would
stay down during the clean step and go up after the
brushes stopped. An error would appear "timeout waiting
for scrubber at home".
Found the two air lines going to the up / down air
cylinder backwards. We swapped the lines and
verified the repair, it's working correctly now.
* The flex hose that houses the two air lines and the down travel
sensor line was full of water.
Removed the water and siliconed the hole.
Also, the pad was replaced.
B shift
|
| 62.79 | Pex for xd0368 at ild1_pre, 3023 high range | ASDG::CULLEY | | Thu Feb 15 1996 00:29 | 18 |
|
Subj: PEX for XD0368 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 23 eng
MACHINE: THICKNESS.A5
DATE: 02/14/96 D-Shift
PROBLEM: Range high at operation 3023 THK_ILD1_PRE
UCL = 1000
ENTITY THICKNESS.A5
THK_ME 18226.000
THK_RG 1086.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remark added at 3023.
|
| 62.80 | Pex for JD0065 at oper 3058, THK_ILD3_PRE, low thickness | ASDG::CULLEY | | Thu Feb 15 1996 01:07 | 18 |
|
Subj: PEX for JD0065 at 3058 THK_ILD3_PRE
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: FEB. 14/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A5
THK_ME 36320.000
THK_RG 978.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None.
|
| 62.81 | JD0065 HIGH OUTGOING RANGE AT ILD3 | YIELD::PHESTER | | Thu Feb 15 1996 18:58 | 20 |
|
Subj: PEX for JD0065 at 3385 THK_ILD3_POST
QUANTITY: 23
MACHINE: CMP.B1 THICKNESS.A5
DATE: 02/15/96 C-Shift
PROBLEM: HIGH OUTGOING RANGE UCL IS 4500�
RANGE WAS 5491
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION NONE, LOT REMARKED
|
| 62.82 | Pex for JD0081 at ILD1_Pst, high range | ASDG::CULLEY | | Fri Feb 16 1996 01:10 | 21 |
| Subj: PEX for JD0081 at 3054 THK_CMP 8 THK_ILD1_PST
QUANTITY: 24, DC1026-000-AC-8G
MACHINE: THICKNESS.A5
DATE: 02/15/96 D-Shift 2/15/96 22:09
SYSTEM: CMP.A1
PROBLEM: RANGE is high out of spec.
LCL = 3400A'
Post thickness measured on THICKNESS.A5:
THK_ME JD0081 5637.000
THK_RG JD0081 4108.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remarks added at operation 3054.
|
| 62.83 | Pex for XD0384 at 3078 STEP_CMP 1 STEP_PMD, low | ASDG::CULLEY | | Sat Feb 17 1996 04:16 | 18 |
| Subj: PEX for XD0384 at 3078 STEP_CMP 1 STEP_PMD
QUANTITY: 23
MACHINE: PROFILER.A2
DATE: Feb 16'96 D-Shift
PROBLEM: Step-height low reading at oper #3078
LCL= 3000
HEIGHT_ME WAFER #1 CENTER 2794.000
WAFER #1 EDGE 2747.000
WAFER #2 CENTER 2754.000
WAFER #2 EDGE 2802.000
DISPOSITION: Lot moved on. .
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.84 | JD0088 pre-thickness low at ILD1 | SUBPAC::MCCALLIG | | Tue Feb 20 1996 02:10 | 33 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD1 *************
PROCESS: PRE CMP THICKNESS AT ILD1
OPERATION #: 3023
POLISHER(CMP.A1, A2, B1, B2): CMP.A1
PROCESS DATE & TIME: 2/19/96 9:20 PM
SHIFT: B
LOT(S) AFFECTED: JD0088
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD1.
THK_ME JD0088 18013.000
THK_RG JD0088 360.000
UCL= 19900
CL= 19000
LCL= 18100
CORRECTIVE ACTION: None. Range and step heights are OK, thickness is only
slightly low. Lot should polish without a problem.
DISPOSITION: Lot passed on.
|
| 62.85 | JD0084 HIGH THK AND HIGH RG | SUBPAC::SMARTIN | | Tue Feb 20 1996 17:13 | 30 |
|
LOT:JD0084
MACHINE: CMP.A1
OPER#:1982
PROCESS LEVEL: ILD1
DATE: 2/20/96
SHIFT: A-SHIFT
QUANTITY: 23
PRODUCT..DC1026-000-AC-8G
PROBLEM: THICKNESS AND RANGE WERE OUT OF SPEC.
THK_ME JD0084 6600.000 2/20/96 16:38:12
THK_RG JD0084 5500.000
SPC THK_ME UCL=5800
SPC THK_RG UCL=3400
DISPOSITION: LOT WAS MOVED ON WITH REMARKS
CORRECTIVE ACTION: NONE
|
| 62.86 | pex for Xd0348, THK_ILD3_PRE, low | ASDG::CULLEY | | Wed Feb 21 1996 04:36 | 17 |
| Subj: PEX for XD0348 at 3058 THK_ILD3_PRE, low
QUANTITY: 21
MACHINE: THICKNESS.A5
DATE: 02/20/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36899.000
THK_RG 1870.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.87 | Pex for JD0103, STEP_PMD_PRE, low | ASDG::CULLEY | | Wed Feb 21 1996 04:37 | 20 |
| Subj: PEX for JD0103 at 3078 STEP_CMP 1 STEP_PMD 2
QUANTITY: 20, DC1026-000-AC-8G
MACHINE: PROFILER.A2
DATE: 02/20/96 D-Shift
PROBLEM: STP_PMD_PRE low at cmp incoming:
LCL=3000
HEIGHT_ME WAFER #1 CENTER 2772.000
WAFER #1 EDGE 2798.000
WAFER #2 CENTER 2744.000
WAFER #2 EDGE 2700.000
DISPOSITION: Lot moved on. Slightly low, ok.
CORRECTIVE
ACTION None, added remark to operation.
Graph and data sheet provided.
|
| 62.88 | Pex for XL0365 at cmp THK_ILD2_PST 2, high range | ASDG::CULLEY | | Thu Feb 22 1996 04:10 | 17 |
| Subj: PEX for XL0365 at 3274 THK_CMP 12 THK_ILD2_PST 2
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: 02/22/96 D-Shift
PROBLEM: Range is out of spec. high.
UCL=3400
THK_ME XL0365 5567.000
THK_RG XL0365 5671.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.89 | Pex for JD0087 at THK_ILD3_PRE, low thx | ASDG::CULLEY | | Thu Feb 22 1996 06:50 | 18 |
|
Subj: PEX for JD0087 at 3058 THK_ILD3_PRE
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: FEB. 22/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A5
THK_ME 36085.000
THK_RG 1063.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None.
|
| 62.90 | Pex for XD0403 at THK_ILD1_PST, scrapped wafer | ASDG::CULLEY | | Fri Feb 23 1996 05:36 | 17 |
| Subj: PEX for XD0403 at 3054 THK_CMP 8 THK_ILD1_PST
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: 02/23/96 D-Shift
SYSTEM: CMP-A2
PROBLEM: thickness low on wafer # 24 @1000A'
LCL = 5200A'
Wafer #24 Scrapped.
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remarks added at operation 3054.
Wafer was saved for CMP engineering.
|
| 62.91 | Pex for Xd0402 at STP_PMD_PRE, height low | ASDG::CULLEY | | Sat Feb 24 1996 08:21 | 18 |
| Subj: PEX for XD0402 at 3078 STEP_CMP 1 STEP_PMD
QUANTITY: 24
MACHINE: PROFILER.A2
DATE: Feb 23'96 D-Shift
PROBLEM: Step-height low reading at oper #3078
LCL= 3000
HEIGHT_ME WAFER #1 CENTER 2877.000
WAFER #1 EDGE 2802.000
WAFER #2 CENTER 2776.000
WAFER #2 EDGE 2810.000
DISPOSITION: Lot moved on. .
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.92 | JD0083 LOW INCOMING AT ILD3 | YIELD::PHESTER | | Sat Feb 24 1996 09:28 | 20 |
|
Subj: PEX for JD0083 at 3058 THK_ILD3_PRE
QUANTITY: 17
MACHINE: THICKNESS.A5
DATE: 02/24/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS LCL IS 37050
INCOMING THICKNESS WAS 36311
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION NONE, LOT REMARKED
|
| 62.93 | XD0380 PEX AT ILD1 OUTGOING | YIELD::PHESTER | | Sat Feb 24 1996 18:10 | 22 |
|
Subj: PEX for XD0380 at 3054 THK_ILD1_PST
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: 02/24/96 C-Shift
PROBLEM: LOW OUTGOING THICKNESS LCL IS 5200
OUTGOING THICKNESS WAS 5156
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION NONE, LOT REMARKED WITH PROPER OUTGOING THICKNESS FOR CAPPING
PURPOSES.
|
| 62.94 | XD0373 high range at ILD2 | SUBPAC::MCCALLIG | | Mon Feb 26 1996 03:24 | 51 |
| *************** PEX FOR POST CMP RANGE AT ILD2 *************
PROCESS: POST CMP RANGE AT ILD2
OPERATION #: 1985
POLISHER(CMP.A1, A2, B1, B2): CMP.A1
PROCESS DATE & TIME: 2/25/96 11:00 PM
SHIFT: B
LOT(S) AFFECTED: XD0373
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Lot held for high range at ILD2 polish. Lot was
measured 100% on Thickness.A5.
WAFER SLOT MEAN RANGE
1 5939 2625
2 6230 3376
3 7913 2939
4 7790 2393
5 8273 2659
6 7855 2337
7 8141 2740
8 7920 2998
9 5499 4399
10 6148 3342
11 4145 3845
12 3811 4975
13 4244 4266
14 4132 4143
15 4635 4165
16 4500 3857
17 4559 4268
18 4047 3869
19 4307 4241
20 4354 3945
21 5074 5372
CORRECTIVE ACTION: Based on the data above, the lot was released from hold.
We have successfully moved lots in the past with worse
uniformity than this.
DISPOSITION: Lot passed on.
|
| 62.95 | PEX FOR XD0358,RANGE SLIGHTLY HIGH | SUBPAC::SMARTIN | | Wed Feb 28 1996 18:49 | 29 |
|
LOT:XD0358
MACHINE: CMP.B2
OPER#:1989
PROCESS LEVEL: ILD3
DATE: 2/28/96
SHIFT: A-SHIFT
QUANTITY: 12
PRODUCT..TM3636-001-EA-8C
PROBLEM: RANGE WAS SLIGHTLY OUT OF SPEC.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 XD0358 N/A
THK_ME " 10207.000
THK_RG : 4282.000 SPC UCL=4000
DISPOSITION: LOT WAS MOVED ON
CORRECTIVE ACTION: NONE
|
| 62.96 | JD0085 PEX @ ILD2 | YIELD::PHESTER | | Fri Mar 01 1996 10:24 | 22 |
|
Subj: PEX for JD0085 at 3054 THK_ILD2_PST
QUANTITY: 24
MACHINE: CMP.A2 / THICKNESS.A5
DATE: 02/29/96 C-Shift
PROBLEM: HIGH RANGE/LOW THICKNESS POST CMP
POST THICKNESS WAS 4954 LCL IS 5200
POST RANGE WAS 6834 UCL IS 4000
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION NONE, LOT HAD SEVERE OVERPOLISH ON EDGE OF WAFERS.
POLISHER SUBSEQUENTLY WENT DOWN FOR A PAD CHANGE.
|
| 62.97 | JD0078 PEX @ILD3 | YIELD::PHESTER | | Fri Mar 01 1996 10:36 | 19 |
|
Subj: PEX for JD0078 at 3064 THK_ILD3_PST FOR ENTITY CMP.B2
QUANTITY: 21
MACHINE: THICKNESS.A5
DATE: 02/29/96 C-Shift
PROBLEM: HIGH OUTGOING RANGE @ILD3
OUTGOING RANGE WAS 4932 UCL IS 4500
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION LOT REMARKED
|
| 62.98 | JD0075 PEX @ILD3 | YIELD::PHESTER | | Fri Mar 01 1996 10:38 | 19 |
|
Subj: PEX for JD0075 at 3058 STP_ILD3_PRE
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: 02/29/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS @ILD3
INCOMING THICKNESS WAS 36425 LCL IS 37050
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION LOT REMARKED
|
| 62.99 | pex for xd0406 at STEP_PMD | ASDG::CULLEY | | Sat Mar 02 1996 03:10 | 18 |
| Subj: PEX for XD0406 at 3078 STEP_CMP 1 STEP_PMD
QUANTITY: 24
MACHINE: PROFILER.A2
DATE: Mar 02'96 D-Shift
PROBLEM: Step-height low reading at oper #3078
LCL= 3000
HEIGHT_ME WAFER #1 CENTER 2837.000
WAFER #1 EDGE 2921.000
WAFER #2 CENTER 2968.000
WAFER #2 EDGE 2875.000
DISPOSITION: Lot moved on. .
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.100 | YD0140 pre-thickness low at ILD3 | SUBPAC::MCCALLIG | | Sun Mar 03 1996 00:02 | 35 |
| *************** PEX FOR PRE CMP THICKNESS AT ILD3 *************
PROCESS: PRE CMP THICKNESS AT ILD3
OPERATION #: 3058
POLISHER(CMP.A1, A2, B1, B2): CMP.B1
PROCESS DATE & TIME: 3/02/96 10:00 PM
SHIFT: B
LOT(S) AFFECTED: YD0140
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Pre CMP thickness low at ILD3.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME YD0140 36889.000
THK_RG YD0140 1535.000
UCL= 40950
CL= 39000
LCL= 37050
CORRECTIVE ACTION: None. Range and step heights are OK, thickness is only
slightly low. Lot should polish without a problem.
According to remarks, all wafers should have gotten the
standard POR ILD3 dep.
DISPOSITION: Lot passed on.
|
| 62.101 | JD0080 PRE CMP THICKNESS LOW ILD3 | SUBPAC::SMARTIN | | Sun Mar 03 1996 12:37 | 37 |
|
LOT:JD0080
MACHINE: THICKNESS.A5
OPER#:3058
PROCESS LEVEL: ILD3
DATE: 3/3/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT.....DC1026-000-AC-8G
PROBLEM: Pre CMP thickness low at ILD3.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME JD0080 36550.000
THK_RG JD0080 855.000
UCL= 40950
CL= 39000
LCL= 37050
DISPOSITION: None. Range and step heights are OK, thickness is slightly
low. Lot should polish without a problem.
CORRECTIVE ACTION: NONE, LOT WAS MOVED ON.
|
| 62.102 | JD0102 range high at ILD1 | SUBPAC::MCCALLIG | | Mon Mar 04 1996 04:37 | 57 |
| *************** PEX FOR POST CMP RANGE AT ILD1 *************
PROCESS: POST CMP RANGE AT ILD1
OPERATION #: 3054
POLISHER(CMP.A1, A2, B1, B2): A2
PROCESS DATE & TIME: 3/04/96 1:00 AM
SHIFT: B
LOT(S) AFFECTED: JD0102
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Post CMP range slightly high at ILD1.
THK_ME JD0102 5763.000
THK_RG JD0102 3606.000
UCL= 3400
CL= 1500
LCL= 0
CORRECTIVE ACTION: The lot was measured 100% for thickness/range.
SLOT # THICK/RANGE
1 5215/3604
2 5640/3491
3 5894/3362
4 5889/4614
5 5929/3373
6 5747/3606
7 5946/2997
8 5726/4575
9 5990/3526
10 5782/3519
11 5250/3827
12 5554/5172
13 5945/3434
14 5925/3929
15 5993/3215
16 5728/3064
17 5839/4402
18 5765/3247
19 5900/4021
20 5543/3616
Step heights were in spec.
DISPOSITION: Based on the above data, decision was made to pass the lot
on. Although the thickness is slightly high, no further
polish will be done because of the high range.
|
| 62.103 | JD0111 pre step height at pmd | SUBPAC::MCCALLIG | | Tue Mar 05 1996 05:41 | 35 |
| *************** PEX FOR PRE CMP STEP HEIGHT AT PMD *************
PROCESS: PRE CMP STEP HEIGHT AT PMD
OPERATION #: 3078
POLISHER(CMP.A1, A2, B1, B2): A2
PROCESS DATE & TIME: 3/05/96 4:00 AM
SHIFT: B
LOT(S) AFFECTED: JD0111
DEVICE TYPE: DC1035
PROBLEM DESCRIPTION: Pre CMP step height low at PMD.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JD0111 11
HEIGHT_ME WAFER #1 CENTER 3023.000
WAFER #1 EDGE 2831.000
WAFER #2 CENTER 3069.000
WAFER #2 EDGE 2842.000
UCL= 4200
CL= 3600
LCL= 3000
CORRECTIVE ACTION: None. Thickness in spec.
DISPOSITION: Lot passed on.
|
| 62.104 | pex for XL0365, wafer 15 scrapped | ASDG::CULLEY | | Wed Mar 06 1996 07:34 | 26 |
| Subj: CMP inspection at incoming @ 3127 THK_CMP 14, THK_ILD3_PRE
*************** PEX FOR CMP *************
PROCESS: Visual inspection
OPERATION #:3127
PROCESS DATE & TIME: 3/06/96 @3 AM
SHIFT: D
LOT(S) AFFECTED: XL0365
DEVICE TYPE:
PROBLEM DESCRIPTION: wafer 15 looks to be either oxidized or half-deped.
When measuring this wafer it showed to be in the 50K's.
CORRECTIVE ACTION: Scrapped wafer 15.
DISPOSITION: Remarks did not show anything hear, so we scrapped.
|
| 62.105 | LOT XD0409 PEX @ STEP PMD | YIELD::PHESTER | | Wed Mar 06 1996 19:02 | 24 |
| CMP PEX REPORT
LOT # XD0409
QUANTITY: 23
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 03/6/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG= 2844� LCL@ 3000�
DISPOSITION: MOVED LOT ON
CORRECTIVE NONE
ACTION
|
| 62.106 | LOT JD0076 LOW INCOMING THICKNESS A ILD3 | YIELD::PHESTER | | Thu Mar 07 1996 13:34 | 27 |
|
PE PEX NOTIFICATION
LOT # JD0076
QUANTITY: 23
OPERATION # 3058 THK_ILD3_PRE
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: Thickness.A4
DATE: 03/7/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD_3
LOT INCOMING THICKNESS 36072�
LCL@ 37105�
DISPOSITION: LOT MOVE ON
CORRECTIVE ADDED REMARK AT OPERATION 3058
ACTION:
|
| 62.107 | Pex @3078 step height, low | ASDG::CULLEY | | Fri Mar 08 1996 01:22 | 18 |
| Subj: PEX for XD0408 at 3078 STEP_CMP 1 STEP_PMD
QUANTITY: 24
MACHINE: PROFILER.A2
DATE: Mar 08'96 D-Shift
PROBLEM: Step-height low reading at oper #3078
LCL= 3000
HEIGHT_ME WAFER #1 CENTER 2616.000
WAFER #1 EDGE 2556.000
WAFER #2 CENTER 2603.000
WAFER #2 EDGE 2659.000
DISPOSITION: Lot moved on. .
CORRECTIVE
ACTION None, did pex, reported to eng.
|
| 62.108 | Pex for XD0381 @3053 Range high. | ASDG::CULLEY | | Fri Mar 08 1996 01:23 | 17 |
| Subj: PEX for XD0381 at 3053 THK_ILD2_PRE
QUANTITY: 20
MACHINE: THICKNESS.A4
DATE: 03/08/96 D-Shift
PROBLEM: Range high at operation 3053 THK_ILD2_PRE
UCL=1000
ENTITY THICKNESS.A4
THK_ME 19674.000 In spec
THK_RG 3329.000 out of spec
DISPOSITION: Problem at dep, can still be polished.
CORRECTIVE
ACTION None, pex written.
|
| 62.109 | JD0106 LOW INCOMING @ILD3 | YIELD::PHESTER | | Fri Mar 08 1996 17:13 | 25 |
|
CMP PEX
LOT # JD0106
QUANTITY: 23
OPERATION # 3058 THK_ILD3_PRE
/DESC R.
POLISHER: N/A
EVAL TOOL: THICKNESS.A5
DATE: 03/08/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS @ILD3
INCOMING THICKNESS WAS 36237 UCL IS 37050
DISPOSITION: LOT MOVED ON FOR POLISHING
CORRECTIVE NONE. LOT REMARKED
ACTION
|
| 62.110 | pex for XD0402 Thickness low at operation 3058 | ASDG::CULLEY | | Sat Mar 09 1996 08:55 | 17 |
| Subj: PEX for XD0402 at 3058 THK_ILD3_PRE, low
QUANTITY: 23
MACHINE: THICKNESS.A5
DATE: 03/08/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36912.000 *out low
THK_RG 1189.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.111 | XD0375 LOW INCOMING THICKNESS ILD3 | YIELD::PHESTER | | Sat Mar 09 1996 17:31 | 23 |
| CMP PEX
LOT # XD0375
QUANTITY: 24
OPERATION # 3058 THICK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 03/9/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS....ILD3
LOT INCOMING THICKNESS AVG= 36699� LCL@ 37050�
DISPOSITION: LOT REMARKED AND MOVED ON
CORRECTIVE NONE
ACTION
|
| 62.112 | XD0357 LOW INCOMING @ILD3 | YIELD::PHESTER | | Sat Mar 09 1996 17:37 | 23 |
| CMP PEX
LOT # XD0357
QUANTITY: 18
OPERATION # 3058 THK_ILD3_PRE
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 03/9/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS....ILD3
LOW INCOMING THICKNESS AVG= 36905� LCL@ 37050�
DISPOSITION: LOT REMARKED AND MOVED ON
CORRECTIVE NONE
ACTION
|
| 62.113 | Pex for Xd0414 at 3078 STEP_CMP, low | ASDG::CULLEY | | Thu Mar 14 1996 04:56 | 18 |
| Subj: PEX for XD0414 at 3078 STEP_CMP 1 STEP_PMD
QUANTITY: 23
MACHINE: PROFILER.A2
DATE: Mar 13'96 D-Shift
PROBLEM: Step-height low reading at oper #3078
LCL= 3000
HEIGHT_ME WAFER #1 CENTER 2972.000
WAFER #1 EDGE 2791.000
WAFER #2 CENTER 2941.000
WAFER #2 EDGE 2836.000
DISPOSITION: Lot moved on. .
CORRECTIVE
ACTION None, did pex, reported to eng.
|
| 62.114 | JD0091 LOW INCOMING @ILD3 | YIELD::PHESTER | | Thu Mar 14 1996 18:16 | 25 |
|
CMP PEX
LOT # JD0091
QUANTITY: 20
OPERATION # 3058 THICK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 03/14/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS....ILD3
LOT INCOMING THICKNESS AVG= 36485� LCL@ 37050�
DISPOSITION: LOT POLISHED AND MOVED ON
CORRECTIVE NONE. LOT REMARKED
ACTION
|
| 62.115 | JD0133 Low incoming step height @PMD | YIELD::SHONG | | Fri Mar 15 1996 01:40 | 25 |
|
CMP PEX
LOT # JD0133
QUANTITY: 20
OPERATION # 3078 STEP_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 03/14/96 D-Shift
PROBLEM: LOW INCOMING STEP HEIGHT....PMD
LOT INCOMING STEP HEIGHT= ~2850� LCL@ 3000�
DISPOSITION: LOT REMARKED AT THAT OPERATION AND MOVED ON.
CORRECTIVE NONE. LOT REMARKED
ACTION
|
| 62.116 | LOT JD0089 LOW INCOMING @ILD3 | YIELD::PHESTER | | Fri Mar 15 1996 19:13 | 27 |
|
CMP PEX
LOT #: JD0089
QUANTITY: 24
OPERATION #/ 3058 THK_ILD3_PRE
DESCRIPTION
POLISHER: N/A
EVAL TOOL: THICKNESS.A4
DATE: 5/1596
PROBLEM: LOW INCOMING THICKNESS
MEAN THICKNESS WAS 36378
LCL IS 37050
DISPOSITION: LOT REMARKED AND MOVED TO POLISH
CORRECTIVE NONE
ACTION:
|
| 62.117 | XD0396 LOW INCOMING | YIELD::PHESTER | | Sat Mar 16 1996 18:15 | 26 |
| PE PEX NOTIFICATION
LOT # XD03 96
QUANTITY: 22
OPERATION # 3058 THICK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 03/16/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS....ILD3
LOT INCOMING THICKNESS AVG= 36898� LCL@ 37050�
TM3636
DISPOSITION: REMARK WAS ADDED TO WORKSTREAM AND LOT WAS PASSED ON.
CORRECTIVE NONE
ACTION
|
| 62.118 | | YIELD::PHESTER | | Sat Mar 16 1996 18:59 | 24 |
| CMP PEX
LOT # YD0152
QUANTITY: 23
OPERATION # 3066 ILD2
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: PROFILER.A2
DATE: 03/16/96 C-Shift
PROBLEM: LOW POST THICKNESS
LOT THICKNESS MEAN..5103� LCL...5200�
DISPOSITION: LOT REMARKED AND MOVED ON
CORRECTIVE NONE
ACTION
|
| 62.119 | YD0152 Low outgoing At ILD2 | YIELD::PHESTER | | Sat Mar 16 1996 19:03 | 24 |
| CMP PEX
LOT # YD0152
QUANTITY: 23
OPERATION # 3066 ILD2
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: PROFILER.A2
DATE: 03/16/96 C-Shift
PROBLEM: LOW POST THICKNESS
LOT THICKNESS MEAN..5103� LCL...5200�
DISPOSITION: LOT REMARKED AND MOVED ON
CORRECTIVE NONE
ACTION
|
| 62.120 | PEX for JD0102 at 3058 THK_ILD3_PRE, low thk | ASDG::CULLEY | | Wed Mar 20 1996 05:00 | 17 |
| Subj: PEX for JD0102 at 3058 THK_ILD3_PRE, low
QUANTITY: 22
MACHINE: THICKNESS.A4
DATE: 03/20/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36327.000 *out low
THK_RG 1531.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.121 | PEX for XD0390 at 3058 THK_ILD3_PRE, low thickness | ASDG::CULLEY | | Thu Mar 21 1996 04:25 | 17 |
| Subj: PEX for XD0390 at 3058 THK_ILD3_PRE, low
QUANTITY: 20
MACHINE: THICKNESS.A5
DATE: 03/20/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36947.000 *out low
THK_RG 1585.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.122 | Thickness low at operation 3058 THK_ILD3_PRE | ASDG::CULLEY | | Fri Mar 22 1996 07:01 | 17 |
| Subj: PEX for JD0135 at 3058 THK_ILD3_PRE, low
QUANTITY: 19
MACHINE: THICKNESS.A5
DATE: 03/22/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36125.000 *out low
THK_RG 1157.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.123 | Thickness low at operation 3058 THK_ILD3_PRE | ASDG::CULLEY | | Fri Mar 22 1996 07:11 | 17 |
| Subj: PEX for JD01304 at 3058 THK_ILD3_PRE, low
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: 03/22/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36060.000 *out low
THK_RG 1007.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.124 | XD0410 LOW INCOMING AT ILD3 | YIELD::PHESTER | | Sat Mar 23 1996 18:34 | 26 |
|
CMP PEX
LOT #: XD0410
QUANTITY: 22
OPERATION # 3058 THK_ILD3_PRE
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 3/23/96
PROBLEM: LOW INCOMING THICKNESS
INCOMING THICKNESS MEAN 37044�
LCL IS 37050�
DISPOSITION: LOT REMARKED AND MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.125 | XD0423 OVER POLISHED AT ILD1 | SUBPAC::SMARTIN | | Mon Mar 25 1996 18:14 | 34 |
|
LOT: XD0423
MACHINE: THICKNESS.A5
OPER#: 3054
PROCESS LEVEL: ILD1
DATE: 3/25/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT.....TM3636-032-KA-8C
PROBLEM: 15 wafers were over polished in this lot.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 XD0423 N/A
THK_ME " 5036.000 3/25/96 17:20:33
THK_RG " 1477.000
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 XD0423 N/A
HEIGHT_ME WAFER #1 CENTER 33.000
WAFER #1 EDGE 31.000
WAFER #2 CENTER 43.000
WAFER #2 EDGE 26.000
DISPOSITION: Note: |
Wafers #'s 1- 3- 4- 5- 10- 13- 20- 22- and 23 hit the desired target
at CMP. The remaining wafer need and additional deposition of 700�
at operation 2130.
Lot was remarked and moved on
CORRECTIVE ACTION: NONE, LOT WAS MOVED ON.
|
| 62.126 | XD0395 low thickness at ILD2 | SUBPAC::MCCALLIG | | Wed Mar 27 1996 04:36 | 33 |
| *************** PEX FOR POST CMP THICKNESS AT ILD2 *************
PROCESS: POST CMP THICKNESS AT ILD2
OPERATION #: 3384
POLISHER(CMP.A1, A2, B1, B2): CMP.A2
PROCESS DATE & TIME: 3/26/96 B SHIFT
SHIFT: B
LOT(S) AFFECTED: XD0395
DEVICE TYPE: TM3636
PROBLEM DESCRIPTION: Post CMP thickness low on three wafers.
WAFER # THICKNESS
06 2701
03 2914
17 2836
UCL= 5800
CL= 5500
LCL= 5200
CORRECTIVE ACTION: None. Rest of lot was polished to spec.
DISPOSITION: These three wafers were scrapped from the lot.
|
| 62.127 | thickness low at operation 3023 THK_ILD1_PRE | ASDG::CULLEY | | Thu Mar 28 1996 00:08 | 17 |
| Subj: PEX for JD0150 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: 03/27/96 D-Shift
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A5
THK_ME 18097.000
THK_RG 445.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.128 | JD0114 High incoming @ILD3 | YIELD::PHESTER | | Fri Mar 29 1996 19:29 | 29 |
|
CMP PEX
LOT # JD0114
QUANTITY: 22
OPERATION # 3058 THK-CMP 14
/DESCR.
POLISHER: PRE THICKNESS
EVAL TOOL: THICKNESS.A5
DATE: 03/29/96 C-Shift
PROBLEM: HIGH INCOMING THICKNESS
HIGH INCOMING THICKNESS UCL=33500 LCL=30500
LOT MEASURED 36477
DISPOSITION: LOT WAS POLISHED AND MOVED ON.
CORRECTIVE NONE
ACTION
|
| 62.129 | JD0110 low incoming @ILD3 | YIELD::PHESTER | | Fri Mar 29 1996 19:37 | 25 |
|
CMP PEX
LOT #: JD0110
QUANTITY: 20
OPERATION # 3058 thickness before ILD3
POLISHER: cmp.b2
EVAL TOOL: Thickness.a4
DATE: 3/29/96
PROBLEM: Low incoming thickness
Thickness: 36426�
LCL 37050�
DISPOSITION: Lot moved to polish.
CORRECTIVE None
ACTION:
|
| 62.130 | XD0440 LOW STEP INCOMING @PMD | YIELD::PHESTER | | Sat Mar 30 1996 17:49 | 24 |
|
CMP PEX
LOT #: XD0440
QUANTITY: 23
OPERATION # 3078 STEP HEIGHT BEFORE PMD
POLISHER: CMP.A2
EVAL TOOL: PROFILER.A2
DATE: 3/30/96
PROBLEM: STEP HEIGHT WAS 2808
LCL IS 3000
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.131 | LOW INCOMING THICKNESS XD0395 | SUBPAC::SMARTIN | | Mon Apr 01 1996 16:13 | 19 |
|
LOT: XD0395
MACHINE: THICKNESS.A4
OPER#: 3058
PROCESS LEVEL: ILD3
DATE: 4/1/96
SHIFT: A-SHIFT
QUANTITY: 17
PRODUCT.....TM3636-004-KA-8C
PROBLEM: PRETHICKNESS LOW INCOMING TO CMP
THK_ME XD0395 37020.000 4/01/96 14:04:38
THK_RG " 1648.000
LCL=37050.0
DISPOSITION: Lot was remarked and moved on
CORRECTIVE ACTION: NONE, LOT WAS MOVED ON.
|
| 62.132 | Step-height low reading at oper #3078 | ASDG::CULLEY | | Wed Apr 03 1996 07:17 | 18 |
| Subj: PEX for XD044 at 3078 STEP_CMP 1 STEP_PMD
QUANTITY: 24
MACHINE: PROFILER.A2 4/02/96 21:39:41
DATE: Apr 02'96 D-Shift
PROBLEM: Step-height low reading at oper #3078
LCL= 3000
HEIGHT_ME WAFER #1 CENTER 2967.000
WAFER #1 EDGE 2933.000
WAFER #2 CENTER 2989.000
WAFER #2 EDGE 2952.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None, did pex, reported to eng.
|
| 62.133 | JD0144A1 LOW INCOMING @ILD2 | YIELD::PHESTER | | Wed Apr 03 1996 20:34 | 27 |
|
CMP PEX
LOT # JD0144A1
QUANTITY: 9
OPERATION # 3023 PRE THICKNESS ILD2
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS .A4
DATE: 04/03/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS
LOT INCOMING THICKNESS AVG=18001 @
UCL=19900�
LCL=18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE NONE
ACTION
|
| 62.134 | Pex for JD0139, low thickness at THK_ILD3_PRE | ASDG::CULLEY | | Thu Apr 04 1996 07:39 | 17 |
| Subj: PEX for JD0139 at 3058 THK_ILD3_PRE, low thickness.
QUANTITY: 20
MACHINE: THICKNESS.A5
DATE: 04/04/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36769.000 *out low
THK_RG 1186.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.135 | YDO154 LOW OUTGOING @ILD3 | YIELD::PHESTER | | Thu Apr 04 1996 14:26 | 25 |
|
CMP PEX
LOT # YD0154
QUANTITY: 21
OPERATION # 3442 THICK_CMP
/DESCR.
POLISHER: POST READINGS CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 04/04/96 C-Shift
PROBLEM: LOW OUTGOING THICKNESS....ILD3
LOT OUTGOING THICKNESS AVG= 8873� LCL@ 9500�
DISPOSITION: LOT WAS MOVED ON
CORRECTIVE
ACTION: LOT WAS REMARKED FOR EXTRA 1300� DEP. AT OPER#2244 DP_ILD25 3
|
| 62.136 | XD0406 LOW OUTGOING @ILD3 | YIELD::PHESTER | | Thu Apr 04 1996 14:26 | 25 |
|
CMP PEX
LOT # XD0406
QUANTITY: 21
OPERATION # 3064 THICK_CMP
/DESCR.
POLISHER: POST READINGS CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 04/04/96 C-Shift
PROBLEM: LOW OUTGOING THICKNESS....ILD3
LOT OUTGOING THICKNESS AVG= 9163� LCL@ 9500�
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: LOT WAS REMARKED FOR EXTRA 1000� DEP. AT OPER#2136 DEP_ILD3 3
|
| 62.137 | JD0158 low incoming @PMD | YIELD::PHESTER | | Thu Apr 04 1996 20:08 | 27 |
|
CMP PEX
LOT #: JD0158
QUANTITY: 24
OPERATION # 2951 THK_CMP 2 PMD
POLISHER: INCOMING
EVAL TOOL: THICKNESS.A4
DATE: 04/04/96
PROBLEM: LOW INCOMING THICKNESS
INCOMING THICKNESS WAS 10833�
LCL IS 10850�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE. LOT POLISHED ACCORDINGLY.
|
| 62.138 | THK_ILD1_PST, thickness low on whole lot @5100A' | ASDG::CULLEY | | Fri Apr 05 1996 06:13 | 17 |
| Subj: PEX for JD0111A at 3054 THK_CMP 8 THK_ILD1_PST
QUANTITY: 13
MACHINE: THICKNESS.A4
DATE: 04/05/96 D-Shift
SYSTEM: CMP-A2
PROBLEM: thickness low on whole lot @5100A'
LCL = 5200A'
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remarks added at operation 2130.
Add on 300A'.
|
| 62.139 | JL0162 High Incoming Step @PMD | YIELD::PHESTER | | Fri Apr 05 1996 19:31 | 27 |
|
CMP PEX
LOT #: JL0162
QUANTITY: 12
OPERATION # 3362 STEP_L_PMD
POLISHER: INCOMING
EVAL TOOL: Profiler.A2
DATE: 04/05/96
PROBLEM: HIGH STEP HEIGHT ABOVE UCL.
STEP HEIGHT WAS 4257�
UCL IS 4200�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE. LOT POLISHED ACCORDINGLY.
|
| 62.140 | XD0442 Low incoming step @PMD | YIELD::PHESTER | | Fri Apr 05 1996 19:42 | 27 |
|
CMP PEX
LOT #: XD0442
QUANTITY: 24
OPERATION # 3078 STEP_CMP 1 (PMD)
POLISHER: INCOMING
EVAL TOOL: Profiler.A2
DATE: 04/05/96
PROBLEM: LOW INCOMING STEP HEIGHT
INCOMING STEP HEIGHT WAS 2852�
LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE. LOT POLISHED ACCORDINGLY.
|
| 62.141 | JD0127 Low incoming @ILD3 | YIELD::PHESTER | | Fri Apr 05 1996 19:45 | 27 |
|
CMP PEX
LOT # JD0127
QUANTITY: 23
OPERATION # 3058 PRE THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS .A4
DATE: 04/5/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD-3
LOT INCOMING THICKNESS 36715�
LCL@ 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE LOT POLISHED ACCORDINGLY
ACTION
|
| 62.142 | LD0150 low incoming @ILD3 | YIELD::PHESTER | | Sat Apr 06 1996 15:36 | 25 |
|
CMP PEX
LOT # JD0150
QUANTITY: 22
OPERATION # 3058 THICK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/06/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS....ILD3
LOT INCOMING THICKNESS AVG= 36532� LCL@ 37050�
DISPOSITION: REMARKED ADD TO LOT OPER# 3058 AND PASSED ON.
CORRECTIVE NONE. LOT POLISHED ACCORDINGLY.
ACTION
|
| 62.143 | Pex for XL0428 | FABSIX::S_SHONG | | Sat Apr 13 1996 05:12 | 25 |
|
CMP PEX
LOT # XL0428
QUANTITY: 18
OPERATION # 3120 THICK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/13/96 D-Shift
PROBLEM: LOW INCOMING THICKNESS....ILD2
LOT INCOMING THICKNESS AVG= 17902� LCL@ 18200�
DISPOSITION: REMARKED ADD TO LOT OPER# 3120 AND PASSED ON.
CORRECTIVE NONE. LOT POLISHED ACCORDINGLY.
ACTION
|
| 62.144 | JD0142 high range outgoing @ILD2 | YIELD::PHESTER | | Sat Apr 13 1996 10:30 | 23 |
|
CMP PEX
LOT #: JD0142
QUANTITY: 21
OPERATION # 3066 THK_ILD2_PST
POLISHER: CMP.A1
EVAL TOOL: THICKNESS A4
DATE: 04/11/96
PROBLEM: RANGE WAS 3638� UCL IS 3400
DISPOSITION: LOT MOVED TO DIFF
CORRECTIVE
ACTION: NONE
|
| 62.145 | XD0443 low incoming @ILD1 | YIELD::PHESTER | | Sat Apr 13 1996 10:45 | 23 |
|
CMP PEX
LOT #: XD0443
QUANTITY: 24
OPERATION # 3023 THICK11 PRE THICKNESS
POLISHER: INCOMING
EVAL TOOL: THICKNESS.A4
DATE: 04/12/96
PROBLEM: THICKNESS WAS 18090� LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE NONE
ACTION:
|
| 62.146 | JD0144A1 Low incoming @ILD2 | YIELD::PHESTER | | Sat Apr 13 1996 10:53 | 26 |
|
CMP PEX
LOT # JD0144A1
QUANTITY: 9
OPERATION # 3053 PRE THICKNESS ILD2
/DESCR.
POLISHER: PRE THCKNESS
EVAL TOOL: THICKNESS .A4
DATE: 04/12/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS
LOT INCOMING THICKNESS AVG-18092� LCL=18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE NONE
ACTION
|
| 62.147 | XD0443 low outgoing @ILD1 | YIELD::PHESTER | | Sat Apr 13 1996 11:08 | 24 |
|
CMP PEX
LOT #: XD0443
QUANTITY: 24
OPERATION # 3054 POST THICKNESS ILD1
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A5
DATE: 04/12/96
PROBLEM: THICKNESS WAS 5165�. LCL IS 5200�
DISPOSITION: LOT MOVED TO furnace.
CORRECTIVE NONE
ACTION:
|
| 62.148 | JD0166 low incoming @ILD2 | YIELD::PHESTER | | Sat Apr 13 1996 11:20 | 25 |
|
CMP PEX
LOT # JD0166
QUANTITY: 20
OPERATION # 3053 THICKNESS PRE ILD2
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 04/12/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD-2
LOT INCOMING THICKNESS AVG=17644� LCL=18100�
DISPOSITION: LOT POLISHED ACCORDINGLY
CORRECTIVE NONE
ACTION
|
| 62.149 | XD0410 LOW INCOMING @ILD3 an old PEX I missed | YIELD::PHESTER | | Sun Apr 14 1996 16:17 | 24 |
|
CMP PEX
LOT #: XD0410
QUANTITY: 22
OPERATION # 3058 THICKNESS BEFORE ILD3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 3/23/96
PROBLEM: INCOMING THICKNESS WAS 37044�
LCL IS 37050A
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.150 | JD0160 LOW INCOMING @ILD1 | YIELD::PHESTER | | Sun Apr 14 1996 16:50 | 26 |
|
CMP PEX
LOT # JD0160
QUANTITY: 24
OPERATION # 3023 PRE THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 04/13/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1
LOT INCOMING THICKNESS 17369� LCL@ 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.151 | JD0146 was over polished at IDL3 | FABSIX::P_POZORSKI | | Tue Apr 16 1996 17:36 | 21 |
|
LOT: XD0146
MACHINE: CMP.B2
OPER#: 1989
PROCESS LEVEL: ILD3
DATE: 4/16/96
SHIFT: A-SHIFT
QUANTITY: 23
PRODUCT.....DC1026-000-AC-8G
PROBLEM: Wafers 2,3,5,6,7,8,9,10,12,13,14,15,16,17,18,20,21,22,23,24 were
over polished at CMP IDL3.
DISPOSITION: Lot was remarked at operation 2136 DEP_IDLE3 3 to receive an extra
dep due to the over polish.
CORRECTIVE ACTION: Ops must be aware of the touch up times and if there is
any questions about this then they need to contact
Engineering.
|
| 62.152 | Thickness low at 3120 | ASDG::CULLEY | | Wed Apr 17 1996 01:59 | 17 |
| Subj: PEX for XD0432A at 3120 THK_CMP 10, THK_ILD2_PRE 3
QUANTITY: 12
MACHINE: THICKNESS.A4
DATE: 4/16/96 D-Shift 4/16/96 20:28:42
PROBLEM: Thickness low at 3120
ME_LCL=18100
RG_UCL= 1000
THK_ME XL0432A 17936.000*low
THK_RG XL0432A 414.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.153 | thickness low at operation 3023 | ASDG::CULLEY | | Wed Apr 17 1996 07:07 | 18 |
| Subj: PEX for JD0161 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 23
MACHINE: THICKNESS.A3
DATE: 04/17/96 D-Shift 4/17/96 03:18:29
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL_ME = 18100
UCL_RG = 1000
ENTITY THICKNESS.A5
THK_ME 17706.000
THK_RG 677.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.154 | Thickness low at operation 3053 | ASDG::CULLEY | | Wed Apr 17 1996 07:13 | 17 |
| Subj: PEX for JD0155 at 3053 THK_CMP 10 THK_ILD2_PRE
QUANTITY: 19
MACHINE: THICKNESS.A4
DATE: 04/17/96 D-Shift 4/17/96 04:23:08
PROBLEM: Thickness low at operation 3053 THK_ILD2_PRE
LCL=18100
ENTITY THICKNESS.A4
actual: THK_ME 17802.000
THK_RG 651.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remark added.
|
| 62.155 | ZD0111 High incoming @ILD3 | YIELD::PHESTER | | Wed Apr 17 1996 20:22 | 25 |
|
CMP PEX
LOT # ZD0111
QUANTITY: 24
OPERATION # 3058 PRE THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/17/96 C-Shift
PROBLEM: HIGH INCOMING THICKNESS..ILD3
LOT INCOMING THICKNESS AVG=36683� UCL=33500�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.156 | Thickness low at 3120 | ASDG::CULLEY | | Thu Apr 18 1996 03:54 | 17 |
| Subj: PEX for XL0427A at 3120 THK_CMP 10, THK_ILD2_PRE 3
QUANTITY: 05
MACHINE: THICKNESS.A4
DATE: 4/17/96 D-Shift 4/17/96 21:56:58
PROBLEM: Thickness low at 3120
ME_LCL=18100
RG_UCL= 1000
THK_ME XL0427A 17792.000*low
THK_RG XL0427A 387.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.157 | Thickness low at 3120 | ASDG::CULLEY | | Thu Apr 18 1996 04:14 | 17 |
| Subj: PEX for XL0433A at 3120 THK_CMP 10, THK_ILD2_PRE 3
QUANTITY: 12
MACHINE: THICKNESS.A4
DATE: 4/18/96 D-Shift 4/18/96 00:30:58
PROBLEM: Thickness low at 3120
ME_LCL=18100
RG_UCL= 1000
THK_ME XL0433A 17932.000*low
THK_RG XL0433A 475.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.158 | Thickness low at operation 3023 | ASDG::CULLEY | | Thu Apr 18 1996 04:28 | 17 |
| Subj: PEX for JD0170 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: 04/18/96 D-Shift 4/18/96 00:10:32
PROBLEM: Thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4
THK_ME 17711.000
THK_RG 626.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.159 | thickness low at operation 3023 | ASDG::CULLEY | | Thu Apr 18 1996 07:54 | 17 |
| Subj: PEX for hot lot XD0452 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 20
MACHINE: THICKNESS.A4
DATE: 4/18/96 D-Shift 4/18/96 06:32:26
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4
THK_ME 17923.000
THK_RG 659.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.160 | Thickness low at operation 3058 | ASDG::CULLEY | | Fri Apr 19 1996 02:01 | 17 |
| Subj: PEX for XD0451 at 3058 THK_ILD3_PRE, low
QUANTITY: 22
MACHINE: THICKNESS.A4
DATE: 04/19/96 D-Shift 4/19/96 00:42:50
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36850.000
THK_RG 1618.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.161 | Thickness low at operation 3053 | ASDG::CULLEY | | Fri Apr 19 1996 07:33 | 17 |
| Subj: PEX for JD0156 at 3053 THK_CMP 10 THK_ILD2_PRE
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: 04/19/96 D-Shift 4/19/96 06:15:02
PROBLEM: Thickness low at operation 3053 THK_ILD2_PRE
LCL=18100
ENTITY THICKNESS.A4
actual: THK_ME 17797.000
THK_RG 547.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remark added.
|
| 62.162 | JD0207 LOW INCOMING @ILD1 | YIELD::PHESTER | | Fri Apr 19 1996 12:25 | 23 |
|
CMP PEX
LOT #: JD0207
QUANTITY: 10
OPERATION # 3023 PRE THICKNESS ILD1
POLISHER:
EVAL TOOL: THICKNESS.A4
DATE: 04/17/96
PROBLEM: INCOMING THICKNESS WAS 17472�
LCL IS 1810�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.163 | JD0145 LOW INCOMING @ILD1 | YIELD::PHESTER | | Fri Apr 19 1996 12:26 | 24 |
|
CMP PEX
LOT #: JD0145
QUANTITY: 16
OPERATION # 3053 PRE THICKNESS ILD1
POLISHER:
EVAL TOOL: THICKNESS.A4
DATE: 04/18/96
PROBLEM: INCOMING THICKNESS WAS 17896�
LCL IS 1810�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.164 | XL0433 LOW INCOMING ILD2 | YIELD::PHESTER | | Fri Apr 19 1996 12:27 | 25 |
|
CMP PEX
LOT # XL0433
QUANTITY: 12
OPERATION # 3121 THICK_CMP PRE THICKNESS ILD2
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/18/96 C-Shift
PROBLEM: LOT INCOMING THICKNESS AVG = 17951�
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.165 | JL0162 LOW INCOMING @ILD1 | YIELD::PHESTER | | Fri Apr 19 1996 12:27 | 26 |
|
CMP PEX
LOT # JL0162
QUANTITY: 11
OPERATION # 3112 PRE THICKNESS ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/18/96 C-Shift
PROBLEM: LOT INCOMING THICKNESS AVG WAS 17668�
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.166 | JD0173 LOW INCOMING @ILD3 | YIELD::PHESTER | | Fri Apr 19 1996 12:28 | 27 |
|
CMP PEX
LOT # JD0173
QUANTITY: 23
OPERATION # 3058 PRE THICKNESS ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/18/96 C-Shift
PROBLEM: LOT INCOMING THICKNESS WAS 36175�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.167 | JD0142 LOW INCOMING @ILD3 | YIELD::PHESTER | | Fri Apr 19 1996 12:28 | 25 |
|
CMP PEX
LOT # JD0142
QUANTITY: 21
OPERATION # 3058 PRE THICKNESS ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/19/96 C-Shift
PROBLEM: LOT INCOMING THICKNESS WAS 36683�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.168 | XL0428 LOW INCOMING @ILD3 | YIELD::PHESTER | | Fri Apr 19 1996 12:29 | 26 |
|
CMP PEX
LOT # XL0428
QUANTITY: 18
OPERATION # 3127 PRE-THICKNESS ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/19/96 C-Shift
PROBLEM: INCOMING THICKINESS WAS 36937�
LCL 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.169 | 5 wafers over polished at IDLE2 | STRATA::POZORSKI | | Sun Apr 21 1996 11:24 | 17 |
| LOT: XD0440
MACHINE: CMP.B2
OPER#: 1985
PROCESS LEVEL: ILD2
DATE: 4/16/96
SHIFT: B-SHIFT
QUANTITY: 23
PRODUCT.....TM3636-032-KA-8C
PROBLEM: Wafers 7,8,9,16,24 were over polished at CMP IDL2.
DISPOSITION: Lot was remarked at operation 2133 DEP_IDLE2 3 to receive an extra
dep due to the over polish.
CORRECTIVE ACTION: The wafers will receive and extra dep at operation 2133
DEP_IDLE2 3. Lot moved on and remark was entered.
|
| 62.170 | Wafer breakage for JD0190 at cmp | ASDG::CULLEY | | Thu Apr 25 1996 08:14 | 12 |
| Subj: PEX for JD0190 at 1978 CMP_PMD CMP
QUANTITY: 22
MACHINE: CMP.A1
DATE: 4/25/96 D-Shift
PROBLEM: Wafer breakage for wafers #3 and #20.
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.171 | JD0155 Low incoming @ILD3..... | YIELD::PHESTER | | Thu Apr 25 1996 17:13 | 27 |
|
CMP PEX
LOT # JD0155
QUANTITY: 22
OPERATION # 3058 PRE-THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/25/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3
LOT INCOMING THICKNESS 36644�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.172 | JD0191 Low outgoing @PMD...... | YIELD::PHESTER | | Thu Apr 25 1996 17:20 | 25 |
|
CMP PEX
LOT # JD0191
QUANTITY: 24
OPERATION # 2957 THK_CMP 4
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 04/025/96 C-Shift
PROBLEM: LOW OUTGOING THICKNESS....PMD
LOT OUTGOING THICKNESS AVG= 6047� LCL@ 6200�
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION LOT WAS REMARKED FOR EXTRA 500� DEP. AT OPER# 2127 DEP_PMD 2
|
| 62.173 | XD0449 Low incoming step @PMD.... | YIELD::PHESTER | | Thu Apr 25 1996 17:26 | 28 |
|
CMP PEX
LOT # XD0449
QUANTITY: 23
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 04/25/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 2801�
LCL IS 3000�
DISPOSITION: LOT WAS PASSED ON
CORRECTIVE
ACTION: NONE. LOT REMARKED
|
| 62.174 | JL0162 Low incoming step @ILD2..... | YIELD::PHESTER | | Thu Apr 25 1996 17:36 | 28 |
|
CMP PEX
LOT # JL0162
QUANTITY: 11
OPERATION # 3194 STEP_ILD2
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 04/25/96 C-Shift
PROBLEM: LOW INCOMING STEP ....ILD3
LOT INCOMING STEP AVG = 9800�
UCL IS 9600�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.175 | XL0429 low outgoing @ILD3 | YIELD::PHESTER | | Fri Apr 26 1996 20:24 | 27 |
|
CMP PEX
LOT #: XL0429
QUANTITY: 17
OPERATION # POST THICKNESS
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 04/26/96
PROBLEM: OUTGOING MEAN WAS LOW - 8156�
LCL IS 9500�
DISPOSITION: SOME WAFERS WERE OVER-POLISHED BUT NOT DAMAGED.
CORRECTIVE
ACTION: OVER-POLISHED WAFERS WERE GROUPED INTO BINS AND A REMARK
WAS ENTERED AT OPERATION 2178 DEP_ILD3 3 FOR EXTRA DEP ON
THESE WAFERS.
|
| 62.176 | JD0145 low incoming @ILD3 | YIELD::PHESTER | | Sat Apr 27 1996 13:42 | 27 |
|
CMP PEX
LOT # JD0145
QUANTITY: 15
OPERATION # 3058 PRE-THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 04/27/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS...ILD3 NEWPRODUCT
LOT INCOMING THICKNESS AVG..36495�
LCL...37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.177 | JD0145 High incoming step @ILD3 | YIELD::PHESTER | | Sat Apr 27 1996 13:52 | 27 |
|
CMP PEX
LOT # JD0145
QUANTITY: 15
OPERATION # 3385 STEP_ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 04/27/96 C-Shift
PROBLEM: HIGH INCOMING STEP ....ILD3
LOT INCOMING STEP AVG= 20225�
UCL@ 20000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.178 | JD0182 THK_ILD1_PST "Mean" low | YIELD::MANDREOLI | | Sun Apr 28 1996 04:17 | 40 |
| Subj: PEX for JD0182 at 3054 THK_CMP 8 THK_ILD1_PST
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: 04/28/96 B-Shift
SYSTEM: CMP.A1
PROBLEM: THK_ILD1_PST "Mean" low, 4906�
LCL = 5200�
Post thickness measured on THICKNESS.A4
Wfrs < 5000� Wfrs > 5000�
Wafer# Thickness Wafer# Thickness
------------------------------------------
11 4849 18 5157
08 4502 04 5031
14 4923 01 5018
20 4905 16 5205
02 4860 22 5452
09 4913 19 5104
07 4953
05 4864
03 4850
17 4558
21 4824
10 4872
06 4811
24 4838
12 4795
13 4963
15 4596
DISPOSITION: Lot moved on. Added REMARK at Oper# 2130 DEP_ILD1 with
request to notify Films Engr of the low tox, and may need
extra dep. Included Post CMP measurements.
CORRECTIVE
ACTION REMARK at DEP_ILD1 to notify Films of low tox wafers.
|
| 62.179 | JD0191 Low incoming @ILD1..... | YIELD::PHESTER | | Wed May 01 1996 15:38 | 29 |
|
CMP PEX
LOT # JD0191
QUANTITY: 24
OPERATION # 3023 THK_CMP 6 THK_ILD1_PRE
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/01/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1
THICKNESS WAS 17846�
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.180 | JD0211 low incoming step @PMD | YIELD::PHESTER | | Wed May 01 1996 16:11 | 25 |
|
CMP PEX
LOT # JD0211
QUANTITY: 24
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 05/01/96 C-SHIFT
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG= 2844� LCL@ 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.181 | JD0203 two wafers scrapped due to crash... | YIELD::PHESTER | | Wed May 01 1996 20:42 | 23 |
|
CMP PEX
LOT # JD0203
QUANTITY: 22
OPERATION # 1978 CMP_PMD CMP
/DESCR.
POLISHER: CMP.A1
EVAL TOOL: N/A
DATE: 05/01/96 C-SHIFT
PROBLEM: TWO WAFERS SCRAPPED WHEN THEY CRASHED ON THIS TOOL.
DISPOSITION: LOT FINISHED POLISHING AFTER TOOL RECOVERED.
CORRECTIVE
ACTION: NONE
|
| 62.182 | thickness low at operation 3023 | ASDG::CULLEY | | Thu May 02 1996 07:52 | 17 |
| Subj: PEX for hot lot JD0259 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A4
DATE: 5/02/96 D-Shift
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4
THK_ME 17903.000
THK_RG 620.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.183 | XD0443 high outgoing range @ILD3 | YIELD::PHESTER | | Fri May 03 1996 15:17 | 25 |
|
CMP PEX
LOT #: XD0443
QUANTITY: 24
OPERATION # 3064 POST THICKNESS
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 05/02/96
PROBLEM: HIGH OUTGOING RANGE 5115�
UCL IS 4500�
DISPOSITION: LOT MOVED TO FURNACE.
CORRECTIVE
ACTION: NONE
|
| 62.184 | YD0160 low outgoing @ILD3 | YIELD::PHESTER | | Fri May 03 1996 15:27 | 25 |
|
CMP PEX
LOT #: YD0160
QUANTITY: 24
OPERATION # 3064 POST THICKNESS ILD3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 05/02/96
PROBLEM: LOW OUTGOING MEAN - 9321�
LCL IS 9500�
DISPOSITION: MOVED TO FURNACE
CORRECTIVE
ACTION: NONE
|
| 62.185 | PEX for JD0211 and JD0192 at 3023 THK_ILD1_PRE | ASDG::CULLEY | | Sat May 04 1996 05:52 | 16 |
| Subj: PEX for hot lot JD0211 and lot JD0192 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: JD0211-23, JD0192-23
MACHINE: THICKNESS.A4
DATE: 5/3/96 D-Shift
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4 JD0211 JD0192
THK_ME 17916 17899
THK_RG 737 732
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.186 | JD0194 low incoming @ILD1 | YIELD::PHESTER | | Sat May 04 1996 14:15 | 27 |
|
CMP PEX
LOT # JD0194
QUANTITY: 22
OPERATION # 3023 THICKNESS.A4
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/04/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1 DC1026
LOT INCOMING THICKNESS = 17972�
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.187 | JD0174 high outgoing range @ILD2 | YIELD::PHESTER | | Sat May 04 1996 17:17 | 28 |
|
PE PEX NOTIFICATION
LOT # JD0174
QUANTITY: 23
OPERATION # 3066 POST THICKNESS
/DESCR.
POLISHER: POLISHED ON CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 05/04/96 C-Shift
PROBLEM: HIGH POST RANGE ILD2 DC1026
POST RANGE..3793 UCL..3400
DISPOSITION: LOT SENT ON
CORRECTIVE
ACTION: NONE MEAN THICKNESS WAS GOOD.
|
| 62.188 | JD0197 Low incoming @ILD1 | YIELD::PHESTER | | Sat May 04 1996 17:32 | 29 |
|
PE PEX NOTIFICATION
LOT # JD0197
QUANTITY: 24
OPERATION # 3023 THICKNESS PRE
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/04/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1 DC1026
LOT INCOMING THICKNESS..17966�
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH ON CMP.B2
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.189 | JD0170 LOW INCOMING ILD3 THICKNESS | YIELD::MANDREOLI | | Mon May 06 1996 06:21 | 27 |
| PE PEX NOTIFICATION
LOT # JD0170
QUANTITY: 24
OPERATION # 3058 THICKNESS PRE ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/06/96 B-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3 DC1026
LOT INCOMING THICKNESS.. 36473�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH ON CMP.B2
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY, Mean for this chart is < LCL.
|
| 62.190 | JD0226 2 WAFERS CRASHED AT PMD on CMP.A2 | YIELD::MANDREOLI | | Mon May 06 1996 06:37 | 23 |
| PE PEX NOTIFICATION
LOT # JD0226
QUANTITY: 24 - 2 crashed = 22
OPERATION # Polish PMD
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: NA
DATE: 05/06/96 B-Shift
PROBLEM: 2 Product wafers crashed and broke.
DISPOSITION: scrapped 2 wafers.
CORRECTIVE
ACTION: CMP.A2 getting a pad and carrier change.
|
| 62.191 | JD0198 THK_ILD1_PRE below LCL | YIELD::MANDREOLI | | Tue May 07 1996 07:39 | 23 |
| PE PEX NOTIFICATION
LOT # JD0198
QUANTITY: 24
OPERATION # 3023 THK_ILD1_PRE
/DESCR.
POLISHER: NA
EVAL TOOL: THICKNESS.A5
DATE: 05/07/96 B-Shift
PROBLEM: CMP incoming ILD1 thickness below LCL
DISPOSITION: Polished accordingly
CORRECTIVE
ACTION: ""
|
| 62.192 | JD0171 THK_ILD3_PRE below LCL | YIELD::MANDREOLI | | Tue May 07 1996 07:43 | 23 |
| PE PEX NOTIFICATION
LOT # JD0171
QUANTITY: 21
OPERATION # 3058 THK_ILD3_PRE
/DESCR.
POLISHER: NA
EVAL TOOL: THICKNESS.A4
DATE: 05/07/96 B-Shift
PROBLEM: CMP incoming ILD3 thickness below LCL
DISPOSITION: Polished accordingly
CORRECTIVE
ACTION: ""
|
| 62.193 | JD0169 3 wafers broken | YIELD::MANDREOLI | | Wed May 08 1996 05:40 | 26 |
| PE PEX NOTIFICATION
LOT # JD0169
QUANTITY: 22 - 3 (dropped) = 19
OPERATION # 3058 THK_ILD3_PRE
/DESCR.
POLISHER: NA
EVAL TOOL: NA
DATE: 05/08/96 B-Shift
PROBLEM: Three wafers were dropped out of the cassette and broken when
cassette was nearly dropped. It's better than losing the whole
thing! THIS WAS NOT A CRASH, it was an accident.
DISPOSITION: Move on
CORRECTIVE
ACTION: Gave CPR to the tech as this was a M3 hotlot. Very fortunate
that it wasn't a total loss.
|
| 62.194 | thickness low at operation 3023 THK_ILD1_PRE | ASDG::CULLEY | | Thu May 09 1996 07:24 | 17 |
| Subj: PEX for hot lot JD0204 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: 5/08/96 D-Shift 5/08/96 20:09:58
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4
THK_ME 17890.000
THK_RG 543.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.195 | thickness low at operation 3023 THK_ILD1_PRE | ASDG::CULLEY | | Thu May 09 1996 07:24 | 17 |
| Subj: PEX for hot lot JD0220 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: D-Shift 5/09/96 02:21:41
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4
THK_ME 17878.000
THK_RG 421.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.196 | JD0208 low incoming @ILD1 | YIELD::PHESTER | | Thu May 09 1996 16:23 | 28 |
|
CMP PEX
LOT # JD0208
QUANTITY: 24
OPERATION # 3023 THICKNESS ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/09/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1
LOT INCOMING THICKNESS = 17890
LCL = 18100
DISPOSITION: LOT MOVED AND POLISHED ON CMP.B1
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.197 | JD0202 low incoming @ILD1 | YIELD::PHESTER | | Thu May 09 1996 16:35 | 27 |
|
CMP PEX
LOT # JD0202
QUANTITY: 24
OPERATION # 3023 THICKNESS PRE ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/09/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1
LOT INCOMING THICKNESS = 17839
LCL = 18100
DISPOSITION: LOT MOVE AND POLISHED ON CMP.B1
CORRECTIVE LOT POLISHED ACCORDINGLY
ACTION
|
| 62.198 | JD0215 low incoming @ILD1 | YIELD::PHESTER | | Thu May 09 1996 16:38 | 28 |
|
CMP PEX
LOT # JD0215
QUANTITY: 23
OPERATION # 3023 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/09/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1 DC1026
LOT INCOMING THICKNESS = 17888�
LCL IS 18100�
DISPOSITION: LOT WAS REMARKED @OP #3023 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.199 | STP_PMD_PRE high at cmp incoming | ASDG::CULLEY | | Fri May 10 1996 03:58 | 20 |
| Subj: PEX for JD0230 at 3078 STEP_CMP 1 STEP_PMD 2
QUANTITY: 24 DC1026-000-AE-8G
MACHINE: PROFILER.A2
DATE: 05/10/96 D-Shift
PROBLEM: STP_PMD_PRE high at cmp incoming:
UCL=4200
HEIGHT_ME WAFER #1 CENTER 4242.000
WAFER #1 EDGE 4383.000
WAFER #2 CENTER 4241.000
WAFER #2 EDGE 4360.000
DISPOSITION: Lot moved on. Slightly high, ok.
CORRECTIVE
ACTION None, added remark to operation.
Graph and data sheet provided.
|
| 62.200 | PEX for JD0188 at 3066 THK_CMP 11 THK_ILD2_PST 2 | ASDG::CULLEY | | Fri May 10 1996 04:15 | 15 |
| Subj: PEX for JD0188 at 3066 THK_CMP 11 THK_ILD2_PST 2
QUANTITY: 23 DC1026-000-AE-8G
MACHINE: THICKNESS.A5
DATE: 5/10/96 D-Shift
PROBLEM: 5 wafers are thin and need extra thickness,
09,11,12,13,17
Please add 2000 angstroms extra.
CCL=5200
DISPOSITION: Lot moved on and remark added at oper #2133.
CORRECTIVE
ACTION None.
|
| 62.201 | thickness low at operation 3023 THK_ILD1_PRE | ASDG::CULLEY | | Fri May 10 1996 05:06 | 17 |
| Subj: PEX for hot lot JD0200 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: D-Shift 5/10/96 03:24:01
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4
THK_ME 17906.000
THK_RG 417.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.202 | thickness low at operation 3023 THK_ILD1_PRE | ASDG::CULLEY | | Fri May 10 1996 05:07 | 17 |
| Subj: PEX for hot lot JD0205 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: D-Shift 5/10/96 03:39:19
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4
THK_ME 17885.000
THK_RG 658.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.203 | JD0233 high incoming step @PMD.... | YIELD::PHESTER | | Fri May 10 1996 18:04 | 27 |
|
CMP PEX
LOT # JD0233
QUANTITY: 24
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 05/10/96 C-Shift
PROBLEM: HIGH INCOMING STEP ....PMD
HIGH INCOMING STEP AVG = 4339�
LCL = 4100�
DISPOSITION: LOT WAS PASSED ON....REMARK ADDED TO WORKSTREAM...
CORRECTIVE
ACTION: NONE
|
| 62.204 | JD0234 high incoming avg step @PMD | YIELD::PHESTER | | Fri May 10 1996 19:56 | 27 |
|
CMP PEX
LOT # JD0234
QUANTITY: 24
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 05/10/96 C-Shift
PROBLEM: HIGH INCOMING STEP AVG ....PMD
HIGH INCOMING STEP AVG = 4434�
LCL = 4200�
DISPOSITION: LOT WAS PASSED ON....REMARK ADDED TO WORKSTREAM...
CORRECTIVE
ACTION: NONE
|
| 62.205 | JD0214 at cmp_pmd, 1 broken wafer | ASDG::CULLEY | | Sat May 11 1996 08:06 | 26 |
| Subj: JD0214 OPEN PEX @CMP
CMP PEX
LOT # JD0214
QUANTITY: 24
OPERATION # 1981 CMP_ILD1
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: 05/10/96 C-Shift
PROBLEM: ONE WAFER WAS SCRAPPED. IT WAS BROKEN WHEN IT FELL OFF THE
CARRIER DURING LIFTOFF.
DISPOSITION: LOT STILL AT POLISH AS CMP.B2 IS DOWN
CORRECTIVE
ACTION: NONE Lot finished without any more problems.
|
| 62.206 | thickness low at operation 3023 THK_ILD1_PRE | ASDG::CULLEY | | Sat May 11 1996 09:22 | 17 |
| Subj: PEX for lot JD0213 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: D-Shift 5/10/96 23:24:25
PROBLEM: thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A4
THK_ME 17857.000
THK_RG 456.000
DISPOSITION: Lot moved on, range on center.
CORRECTIVE
ACTION None. Remarks added.
|
| 62.207 | PEX at 3054 ILD1_pst, low post reading | ASDG::CULLEY | | Sat May 11 1996 09:31 | 24 |
| Subj: JD0214 PEX at 3054 ILD1_pst
LOT # JD0214
QUANTITY: 24
OPERATION # 3054
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: 05/11/96 D-Shift
PROBLEM: low post thickness
LCL = 5200
THK_ME = 4961
DISPOSITION: LOT moved
CORRECTIVE
ACTION: NONE
|
| 62.208 | THK_ILD3_PRE, low | ASDG::CULLEY | | Sat May 11 1996 09:35 | 17 |
| Subj: PEX for JD0174 at 3058 THK_ILD3_PRE, low
QUANTITY: 22
MACHINE: THICKNESS.A5
DATE: D-Shift 5/11/96 06:03:20
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36341.000
THK_RG 1061.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None.
|
| 62.209 | high thickness at incoming | ASDG::CULLEY | | Sat May 11 1996 09:43 | 16 |
| Subj: PEX for JD0235 at 2951 THK_CMP 2 THK_PMD_PRE
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: D-Shift 5/11/96 07:03:35
PROBLEM: high thickness at incoming.
THK_GM 12214.000
UCL=1000 12150.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION none. Lot was processed with no problems.
|
| 62.210 | JD0183 low incoming @ILD3 | YIELD::PHESTER | | Sat May 11 1996 16:24 | 30 |
|
CMP PEX
LOT # JD0183
QUANTITY: 16
OPERATION # 3058 THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/11/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD-3
LOT INCOMING THICKNESS = 36705
LCL = 37050
DISPOSITION: LOT MOVED TO POLISH ON CMP.B2
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.211 | JD0211 low incoming @ILD3 | YIELD::PHESTER | | Sat May 11 1996 19:32 | 28 |
|
CMP PEX
LOT # JD0211
QUANTITY: 16
OPERATION # 3058 THK_CMP 14
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/11/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3 DC1026
LOT INCOMING THICKNESS = 36404�
LCL IS 37050�
DISPOSITION: LOT WAS REMARKED @OP #3058 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.212 | JD0218 low incoming tox at ILD1 | YIELD::MANDREOLI | | Mon May 13 1996 02:57 | 22 |
| PE PEX NOTIFICATION
LOT # JD0218
QUANTITY: 22
OPERATION # 3023 THK_ILD1_PRE
/DESCR.
POLISHER: NA
EVAL TOOL: THICKNESS.A4
DATE: 05/13/96 B-Shift
PROBLEM: Incoming ILD1 thickness measured low, 17761� the LCL=18100
DISPOSITION: Polished accordingly
CORRECTIVE
ACTION: none
|
| 62.213 | JD0220 high THK_RG incoming ILD2 | YIELD::MANDREOLI | | Mon May 13 1996 03:04 | 22 |
| PE PEX NOTIFICATION
LOT # JD0220
QUANTITY: 24
OPERATION # 3053 THK_RG at ILD2
/DESCR.
POLISHER: NA
EVAL TOOL: THICKNESS.A5
DATE: 05/13/96 B-Shift
PROBLEM: Incoming ILD2 RANGE measured high, 1090� the UCL=1000�
DISPOSITION: Polished accordingly
CORRECTIVE
ACTION: none
|
| 62.214 | JD0180 JD0184 - Low incoming thickness ILD3 | YIELD::MANDREOLI | | Tue May 14 1996 01:51 | 22 |
| PE PEX NOTIFICATION
LOT # JD0180 / JD0184
QUANTITY: 24 / 22
OPERATION # [3058.THK_ILD3_PRE]THK_ME /incoming ILD3 Thickness low
/DESCR.
POLISHER: NA
EVAL TOOL: THICKNESS.A5 for both lots
DATE: 05/13/96 B-Shift
PROBLEM: Incoming ILD3 Thickness measured low, 36471 / 36681 (LCL=37050)
DISPOSITION: Polished accordingly
CORRECTIVE
ACTION: None, SPC Chart Mean is running low for most of the points.
|
| 62.215 | JD0179 POST ILD3 RANGE HIGH | YIELD::MANDREOLI | | Tue May 14 1996 04:02 | 27 |
| PE PEX NOTIFICATION
LOT # JD0179
QUANTITY: 24
OPERATION # 3064 [CMP_B2.THK_ILD3_PST]THK_RG
/DESCR. Post CMP ILD3 Thickness RANGE high
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 05/14/96 B-Shift
PROBLEM: Post ILD3 Thickness RANGE measured high, 6549� (UCL=4500�)
This lot was initially polished yesterday, without compensated
ID/OD offsets. CMP Engr requested using adjusted ID/OD for the
touch-ups which was done, although the outgoing range was still
high.
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION: Incoming ILD3 lots are currently using adjusted ID/OD offsets to
minimize outgoing CMP Tox range excursions.
|
| 62.216 | JD0181 low incoming @ILD3 | YIELD::PHESTER | | Wed May 15 1996 20:17 | 31 |
|
CMP PEX
LOT # JD0181
QUANTITY: 23
OPERATION # 3058 PRE THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/15/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS...ILD3
LOT INCOMING THICKNESS AVG = 36623 �
LCL = 37050�
DISPOSITION: LOT TO RUN ON CMP.B1
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY.
|
| 62.217 | JD0182 low incoming @ILD3 | YIELD::PHESTER | | Wed May 15 1996 20:21 | 28 |
|
CMP PEX
LOT # JD0182
QUANTITY: 24
OPERATION # 3058 THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/15/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3
LOT INCOMING THICKNESS = 36534
LCL = 37050
DISPOSITION: POLISH ON CMP.B1
CORRECTIVE LOT POLISHED ACCORDINGLY
ACTION
|
| 62.218 | Broken and scratched wafers at B2, crash. | ASDG::CULLEY | | Thu May 16 1996 08:19 | 14 |
| Subj: PEX for JD0212, hot lot, at 1985 CMP_ILD2.
QUANTITY: 19
MACHINE: THICKNESS.A4
DATE: 5/15/96 D-Shift
PROBLEM: Broken and scratched wafers at B2, crash.
DISPOSITION: 5 wafers scrapped, lot moved on.
#'s 9,11,13,21,23
CORRECTIVE
ACTION None. Inspected scratches which where deep and severe.
Dark field revealed tremendous damage.
|
| 62.219 | Severe lifting on one alignment mark. @ 1 inch dia. | ASDG::CULLEY | | Thu May 16 1996 09:36 | 14 |
| Subj: PEX for JD0181, at 1989 CMP_ILD3.
QUANTITY: 23
MACHINE:
DATE: 5/15/96 D-Shift
PROBLEM: Severe lifting on one alignment mark. @ 1 inch dia.
DISPOSITION: 1 wafer scrapped, moved on.
#23
CORRECTIVE
ACTION None. This was here at incoming so we decided to scrap it
before polishing.
|
| 62.220 | JD0212 low incoming @ILD2 | YIELD::PHESTER | | Thu May 16 1996 09:50 | 25 |
|
CMP PEX
LOT #: JD0212
QUANTITY: 24
OPERATION # 3053 PRE THICKNESS ILD2
POLISHER: PRE
EVAL TOOL: THICKNESS.A5
DATE: 05/015/96
PROBLEM: MEAN BELOW LCL AT 17955�
LCL IS 1818�
DISPOSITION: LOT MOVED POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.221 | XD0449 high incoming range @ILD2 | YIELD::PHESTER | | Thu May 16 1996 09:55 | 26 |
|
CMP PEX
LOT # XD0449
QUANTITY: 23
OPERATION # 3053 RANGE PRE
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/16/96 C-Shift
PROBLEM: HIGH INCOMING RANGE ILD2
TO BE RUN ON CMP.B1
LOT INCOMING RANGE=1085� UCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE NONE
ACTION
|
| 62.222 | JD0181 high outgoing range.... | YIELD::PHESTER | | Thu May 16 1996 16:05 | 34 |
|
CMP PEX
LOT # JD0181
QUANTITY: 22
OPERATION # 3064 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/16/96 C-Shift
PROBLEM: HIGH OUT GOING RANGE ILD3 DC1026
LOT OUTGOING RANGE = 6485�
UCL IS 4500�
DISPOSITION: LOT WAS REMARKED @OP #3064 FOR HIGH OUTGOING
RANGE...LOT HIGH RANGE WAS DUE TO HEAVY CENTER
REMOVAL...ie....6200� IN THE CENTER AND 12500�
ON THE EDGE.
LOT MOVED ON.
CORRECTIVE
ACTION: RECIPE WAS CORRUPTED. THIS WAS CORECTED AND A PAD CHANGE WAS
PERFORMED.
|
| 62.223 | JD0223 low incoming @ILD1 | YIELD::PHESTER | | Thu May 16 1996 16:12 | 28 |
|
CMP PEX
LOT # JD0223
QUANTITY: 23
OPERATION # 3023 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/16/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1 DC1026
LOT INCOMING THICKNESS = 17942�
LCL IS 18100�
DISPOSITION: LOT WAS REMARKED @OP #3023 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.224 | JD0230 low incoming @ILD1 | YIELD::PHESTER | | Thu May 16 1996 16:20 | 27 |
|
CMP PEX
LOT #: JD0230
QUANTITY: 23
OPERATION # 3023 PRE THICKNESS ILD1
POLISHER: PRE THICKNESS
EVAL TOOL: THICKNESS.A5
DATE: 05/16/96
PROBLEM: MEAN BELOW LCL AT 17815�
LCL is 18100�
DISPOSITION: LOT MOVED POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.225 | JD0182 high outgoing range @ILD3 | YIELD::PHESTER | | Thu May 16 1996 16:28 | 32 |
|
CMP PEX
LOT # JD0182
QUANTITY: 24
OPERATION # 3064 THK_CMP 16
/DESCR.
POLISHER: CMP.B1 PST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/16/96 C-Shift
PROBLEM: HIGH OUT GOING RANGE ILD3 DC1026
LOT OUTGOING RANGE = 6046�
UCL IS 4500�
DISPOSITION: LOT WAS REMARKED @OP #3064 FOR HIGH OUTGOING
RANGE...LOT HIGH RANGE WAS DUE TO HEAVY EDGE
REMOVAL.
CORRECTIVE
ACTION: ICORRECT ID/OD ENTERED AFTER AN MQC. ID/OD CORRECTED.
|
| 62.226 | JD0225 low incoming @ILD1 | YIELD::PHESTER | | Thu May 16 1996 16:32 | 25 |
|
CMP PEX
LOT #: JD0225
QUANTITY: 23
OPERATION # 3023 PRE THICKNESS ILD1
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 05/16/96
PROBLEM: MEAN BELOW LCL AT 18015�
LCL IS 18100�
DISPOSITION: MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.227 | JD0220 5 wafers scrapped | YIELD::PHESTER | | Fri May 17 1996 17:02 | 27 |
|
CMP PEX
LOT # JD0220
QUANTITY: 19...(24)
OPERATION # 1989 CMP_ILD 3
/DESCR.
POLISHER: RAN ON CMP.B1
EVAL TOOL: NA
DATE: 05/17/96 C-Shift
PROBLEM: LOT WAS NOTICED TO HAVE 5 WAFERS W/MASSIVE SCRATCHES (D-SHFT).
WAFERS WERE PULLED OUT BY CMP ENG/KW. FOR XSEC. ON THE
SEM...SUSPECTED SCRATCHES ARE OR MAYBE AT ONE OF THE
PREVIOUS LAYERS.
DISPOSITION: LOT WAS REMARKED @OP #1989 FOR THE SCRAP.
CORRECTIVE
ACTION: NONE. BALANCE OF LOT PROCESSED NORMALLY.
|
| 62.228 | JD0186 low incoming @ILD3 | YIELD::PHESTER | | Fri May 17 1996 17:13 | 28 |
|
CMP PEX
LOT # JD0186
QUANTITY: 24
OPERATION # 3058 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/17/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3 DC1026
LOT INCOMING THICKNESS = 36657�
LCL IS 37050�
DISPOSITION: LOT WAS REMARKED @OP #3058 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.229 | JD0229 low incoming @ILD1 | YIELD::PHESTER | | Fri May 17 1996 17:18 | 25 |
|
CMP PEX
LOT #: JD0229
QUANTITY: 24
OPERATION # 3023 PRE THICKNESS ILD1
POLISHER:
EVAL TOOL: THICKNESS.A5
DATE: 05/17/96
PROBLEM: MEAN BELOW LCL AT 17908�
LCL IS 18100�
DISPOSITION: MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY.
|
| 62.230 | JD0246 one wafer over-polished @PMD | YIELD::PHESTER | | Fri May 17 1996 17:25 | 29 |
|
CMP PEX
LOT # JD0246
QUANTITY: 22
OPERATION # 2957 THK_CMP 4
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/17/96 C-Shift
PROBLEM: LOW OUTGOING THICKNESS PMD DC1026
LOT OUTGOING THICKNESS = 6176�
LCL IS 6200�
ONLY ONE WAFER HAD LOW OUTGOING THICKNESS.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: THIS WAFER WAS REMARKED @OP#2127 FOR EXTRA DEP.
|
| 62.231 | JD0220 low incoming @ILD3 | YIELD::PHESTER | | Fri May 17 1996 17:41 | 30 |
|
CMP PEX
LOT # JD0220
QUANTITY: 24
OPERATION # 3058 THICKNESS ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/16/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3
LOT INCOMING THICKNESS = 36337�
LCL IS 337050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.232 | JD0191 low incoming @ILD3 | YIELD::PHESTER | | Fri May 17 1996 20:30 | 32 |
|
PE PEX NOTIFICATION
LOT # JD0191
QUANTITY: 24
OPERATION # 3058 THICKNESS ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/17/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS
LOT TO RUN ON CMP.B2
LOT INCOMING THICKNESS = 36583�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH.
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY.
|
| 62.233 | JD0190 low incoming @ILD3 | YIELD::PHESTER | | Sat May 18 1996 16:29 | 29 |
|
CMP PEX
LOT # JD0190
QUANTITY: 22
OPERATION # 3058 THICKNESS ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/18/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS
LOT INCOMING THICKNESS = 36378�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.234 | XD0460 Low incoming step @PMD | YIELD::PHESTER | | Sat May 18 1996 16:32 | 28 |
|
CMP PEX
LOT # XD0460
QUANTITY: 21
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 05/18/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 2976�
LCL IS 3000�
DISPOSITION: LOT WAS PASSED ON....REMARK ADDED TO WORKSTREAM...
CORRECTIVE
ACTION NONE
|
| 62.235 | JD0227 ILD1 - 1 wafer crash on CMP.A2 | YIELD::MANDREOLI | | Sun May 19 1996 07:18 | 23 |
| PE PEX NOTIFICATION
LOT # JD0227
QUANTITY: 22 - 1 (broken) = 21
OPERATION # 1981 CMP AFTER ILD1
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: NA
DATE: 05/19/96 B-Shift
PROBLEM: 1 wafer crashed and broke during polish. This lot also flagged
for low incoming ILD1 thickness, 17906�, LCL = 18100.
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION: Rebuilding carrier.
|
| 62.236 | JD0200 -> High Range out going @IDLE2 | YIELD::POZORSKI | | Tue May 21 1996 18:32 | 25 |
|
CMP PEX
LOT #: JD0200
QUANTITY: 24
OPERATION # 3066 THK_ILD2_PST
POLISHER: CMP.A2
EVAL TOOL: THICKNESS A5
DATE: 05/21/96
PROBLEM: RANGE WAS 3700� UCL IS 3400
DISPOSITION: Lot was remarked and moved on to the next operation.
CORRECTIVE
ACTION: No futher action required.
|
| 62.237 | PEX for lots JD0194, JD0203 at 3058 THK_ILD3_PRE, low thickness. | ASDG::CULLEY | | Thu May 23 1996 07:57 | 17 |
| Subj: PEX for lots JD0194, JD0203 at 3058 THK_ILD3_PRE, low thickness.
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: 05/22/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4 JD0194 JD0203
THK_ME 36260.000 36518.000
THK_RG 855.000 845.000
DISPOSITION: Lots moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.238 | PEX for JD0265 at 3023 THK_CMP 6 THK_ILD1_PRE | ASDG::CULLEY | | Thu May 23 1996 08:04 | 17 |
| Subj: PEX for JD0265 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 12 eng
MACHINE: THICKNESS.A5
DATE: 05/22/96 D-Shift
PROBLEM: Range high at operation 3023 THK_ILD1_PRE
UCL = 18100
ENTITY THICKNESS.A5
THK_ME 17935.000
THK_RG 702.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remark added at 3023.
|
| 62.239 | JD0263 high incoming step @PMD | YIELD::PHESTER | | Thu May 23 1996 20:34 | 26 |
|
CMP PEX
LOT # JD0263
QUANTITY: 24
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 05/23/96 C-Shift
PROBLEM: HIGH INCOMING STEP ....PMD
HIGH INCOMING STEP AVG = 4352�
LCL IS 4100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.240 | PEX for JD0204 at 3058 THK_ILD3_PRE, low thickness. | ASDG::CULLEY | | Fri May 24 1996 04:17 | 17 |
| Subj: PEX for JD0204 at 3058 THK_ILD3_PRE, low thickness.
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: 05/23/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36687.000 *out low
THK_RG 1067.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.241 | PEX for JD0223 at 3053 THK_CMP 10 THK_ILD2_PRE | ASDG::CULLEY | | Fri May 24 1996 04:18 | 17 |
| Subj: PEX for JD0223 at 3053 THK_CMP 10 THK_ILD2_PRE
QUANTITY: 23
MACHINE: THICKNESS.A4
DATE: 05/23/96 D-Shift
PROBLEM: Thickness low at operation 3053 THK_ILD2_PRE
LCL=18100
ENTITY THICKNESS.A4
actual: THK_ME 18013.000
THK_RG 493.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remark added.
|
| 62.242 | PEX for JD0237 at 3023 THK_CMP 6 THK_ILD1_PRE | ASDG::CULLEY | | Fri May 24 1996 04:19 | 17 |
| Subj: PEX for JD0237 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 23
MACHINE: THICKNESS.A5
DATE: 05/23/96 D-Shift
PROBLEM: Thickness high at operation 3023 THK_ILD1_PRE
UCL = 18100
ENTITY THICKNESS.A5
THK_ME 17796.000
THK_RG 599.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remark added at 3023.
|
| 62.243 | PEX for JD0238 at 3023 THK_CMP 6 THK_ILD1_PRE | ASDG::CULLEY | | Fri May 24 1996 04:19 | 17 |
| Subj: PEX for JD0238 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 23
MACHINE: THICKNESS.A5
DATE: 05/23/96 D-Shift
PROBLEM: Thickness low at operation 3023 THK_ILD1_PRE
LCL = 18100
ENTITY THICKNESS.A5
THK_ME 17832.000
THK_RG 488.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remark added at 3023.
|
| 62.244 | PEX for JD0197 at 3064 THK_ILD3_PST, high range. | ASDG::CULLEY | | Fri May 24 1996 04:20 | 17 |
| Subj: PEX for JD0197 at 3064 THK_ILD3_PST
QUANTITY: 24
MACHINE: CMP.B1
DATE: 05/24/96 D-Shift
PROBLEM: Range high at operation 3064 THK_ILD3_PST
UCL=4500
ENTITY THICKNESS.A5
actual: THK_ME 10292.000
THK_RG 4642.000
DISPOSITION: Lot moved on. Mean and height where excellant.
CORRECTIVE
ACTION None, extra polish time ran the range out higher.
|
| 62.245 | JD0240 low incoming @ILD1 | YIELD::PHESTER | | Fri May 24 1996 16:34 | 28 |
|
CMP PEX
LOT #: JD0240
QUANTITY: 24
OPERATION # 3023 PRE THICKNESS ILD1
POLISHER: N/A
EVAL TOOL: THICKNESS.A5
DATE: 05/24/96
PROBLEM: LOT HAD LOW INCOMING THICKNESS OF 17832�.
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.246 | THK_ILD3_PRE, low thickness | ASDG::CULLEY | | Sat May 25 1996 06:15 | 17 |
| Subj: PEX for JD0202 at 3058 THK_ILD3_PRE, low thickness.
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: 05/25/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36395.000
THK_RG 976.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Graph and data to eng.
|
| 62.247 | JD0266 low incoming step @PMD | YIELD::PHESTER | | Sat May 25 1996 14:04 | 28 |
|
CMP PEX
LOT # JD0266
QUANTITY: 24
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 05/25/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 3333�
LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.248 | XD0469 one wafer scrapped due to over-polish.. | YIELD::PHESTER | | Sat May 25 1996 16:39 | 24 |
|
PE PEX NOTIFICATION
LOT # XD0469
QUANTITY: 15 (16)
OPERATION # 1989 CMP_ILD3
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 05/25/96 C-Shift
PROBLEM: LOT WAS PASSDOWN FROM D-SHIFT....WAFER #3 WAS SCRAPPED.
WAFER HAD AVG THICKNESS OF 2794�....LCL @ 9500.
DISPOSITION:
CORRECTIVE LOT MOVED ON. NO DEFINATIVE EXPLANATION FOR WHY THIS ONE WAFER
ACTION WAS OVER POLISHED. IT IS POSSIBLE THAT IT WAS RUN WITH 4 MONITOR
WAFERS. THIS COULD HAVE AFFECTED THE REMOVAL RATE.
|
| 62.249 | YD0169, low incoming ILD3 | FABSIX::K_KULP | | Sun May 26 1996 08:22 | 21 |
| CMP PEX
Lot # YD0169
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: 05/26/96 B-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36587.000 *out low
THK_RG 1603.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None
|
| 62.250 | XD0472, low incoming PMD | FABSIX::K_KULP | | Sun May 26 1996 08:23 | 34 |
| CMP PEX
LOT # XD0472
QUANTITY: 24
OPERATION # 3078 STEP_CMP 1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 05/26/96 B-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 2983.75 �
LCL IS 3000�
WFR DATA
PARAMETER UNIT ID/PROMPT VALUE
RUN_ID_1 XD0472 24
HEIGHT_ME WAFER #1 CENTER 2958.000
WAFER #1 EDGE 3003.000
WAFER #2 CENTER 2951.000
WAFER #2 EDGE 3023.000
DISPOSITION: LOT WAS PASSED ON
CORRECTIVE
ACTION NONE
|
| 62.251 | JD0252 Low incoming @ILD1 | YIELD::PHESTER | | Wed May 29 1996 19:31 | 29 |
|
CMP PEX
LOT # JD0252
QUANTITY: 23
OPERATION # 3023 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/29/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1 DC1026
LOT INCOMING THICKNESS = 17748�
LCL IS 18100�
DISPOSITION: LOT WAS REMARKED @OP #3023 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.252 | PEX for JD0256 at 3023 THK_CMP 6 THK_ILD3_PRE | ASDG::CULLEY | | Thu May 30 1996 07:30 | 17 |
| Subj: PEX for JD0256 at 3023 THK_CMP 6 THK_ILD3_PRE
QUANTITY: 20
MACHINE: THICKNESS.A5
DATE: 05/29/96 D-Shift
PROBLEM: thickness at operation 3023 THK_ILD3_PRE
UCL = 18100
ENTITY THICKNESS.A5
THK_ME 18012.000
THK_RG 624.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None. Remark added at 3023.
|
| 62.253 | JD0215 low incoming @ILD3 | YIELD::PHESTER | | Thu May 30 1996 15:17 | 29 |
|
CMP PEX
LOT # JD0215
QUANTITY: 23
OPERATION # 3058 THICKNESS-PRE ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS .A4
DATE: 05/29/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS
LOT INCOMING THICKNESS = 36687�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.254 | JD0205 low incoming @ILD3 | YIELD::PHESTER | | Thu May 30 1996 15:30 | 29 |
|
CMP PEX
LOT # JD0205
QUANTITY: 24
OPERATION # 3058 THICKNESS ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 05/30/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS
LOT INCOMING THICKNESS = 36980�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH ON CMP.B2
CORRECTIVE
ACTION NONE
|
| 62.255 | JD0259 low incoming @ILD1 | YIELD::PHESTER | | Fri May 31 1996 09:50 | 29 |
|
CMP PEX
LOT # JD0259
QUANTITY: 21
OPERATION # 3023 PRE_THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A5
DATE: 05/31/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1
LOT INCOMING THICKNESS = 17974�
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.256 | JD0276 low incoming @ILD1 | YIELD::PHESTER | | Fri May 31 1996 19:16 | 29 |
|
CMP PEX
LOT # JD0276
QUANTITY: 24
OPERATION # 3023 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/31/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1 DC1026
LOT INCOMING THICKNESS = 17448�
LCL IS 18100�
DISPOSITION: LOT WAS REMARKED @OP #3023 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.257 | JD0276 low incoming @ILD1 | YIELD::PHESTER | | Fri May 31 1996 19:27 | 30 |
|
CMP PEX
LOT # JD0276
QUANTITY: 24
OPERATION # 3023 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 05/31/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1 DC1026
LOT INCOMING THICKNESS = 17448�
LCL IS 18100�
DISPOSITION: LOT WAS REMARKED @OP #3023 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.258 | JD0276 low outgoing @ILD1 | YIELD::PHESTER | | Fri May 31 1996 19:55 | 31 |
|
CMP PEX
LOT # JD0259
QUANTITY: 21
OPERATION # 3054 POST THICKNESS
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 05/31/96 C-Shift
PROBLEM: POST THICKNESS ILD1
LOT POST THICKNESS = 5025�
LCL IS 5200�
LOT WAS REMARKED AT DEP OPERATION 2130
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION LOT WAS REMARKED AT DEP OPERATION 2130 WITH INSTRUCTIONS FOR
EXTRA DEP.
|
| 62.259 | PEX for JD0226 at 3058 THK_ILD3_PRE, low | ASDG::CULLEY | | Sat Jun 01 1996 09:57 | 17 |
| Subj: PEX for JD0226 at 3058 THK_ILD3_PRE, low
QUANTITY: 22
MACHINE: THICKNESS.A4
DATE: 06/01/96 D-Shift
PROBLEM: Thickness low at operation 3058 THK_ILD3_PRE
LCL=37050
ENTITY THICKNESS.A4
THK_ME 36535.000
THK_RG 1027.000
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION None.
|
| 62.260 | Wafers 4 and 6 scrapped | ASDG::CULLEY | | Sat Jun 01 1996 10:24 | 13 |
| Subj: PEX for lot JD0278 at CMP
QUANTITY: 22
MACHINE: CMP.A1
DATE: 6/01/96 D-Shift
PROBLEM: Wafers 4 and 6 scrapped for scratches. Slurry was leaking
on prep table.
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION Slurry lines and pressure was fixed, scratches gone.
|
| 62.261 | JD0257 low incoming @ILD1 | YIELD::PHESTER | | Sat Jun 01 1996 16:59 | 28 |
|
CMP PEX
LOT #: JD0257
QUANTITY: 24
OPERATION # 3023 PRE THICKNESS @ILD1
POLISHER: N/A
EVAL TOOL: THICKNESS.A4
DATE: 06/01/96
PROBLEM: INCOMING THICKNESS AVERAGE WAS 17892�.
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.262 | JD0233 high outgoing range @ILD3 | YIELD::PHESTER | | Sat Jun 01 1996 20:41 | 30 |
|
PE PEX NOTIFICATION
LOT # JD0233
QUANTITY: 23
OPERATION # 3064 POST THICKNESS
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS .A5
DATE: 06/01/96 C-Shift
PROBLEM: HIGH POST RANGE ILD3
LOT RAN ON CMP.B2
POST RANGE WAS 4839@
UCL IS 4500�
DISPOSITION: HIGH RANGE WAS WITHIN WAFER.
CORRECTIVE NONE
ACTION
|
| 62.263 | 3 WAFERS SCRAPPED FROM LOT JD0223 DUE TO CRASH | SUBPAC::SMARTIN | | Mon Jun 03 1996 18:43 | 24 |
|
LOT: JD0223
MACHINE: CMP.B1
OPER#: 1986
PROCESS LEVEL: ILD3
DATE: 6/3/96
SHIFT: A-SHIFT
QUANTITY: 23
PRODUCT.....DC1026-000-DA-8G
PROBLEM: DUMMY WAFER CAME FROM UNDER CARRIER #4 AND
CRASHED ON #5. THREE PRODUCT WAFERS WERE
SCRATCHED BAD. TOOL NEEDS NEW PAD AND SOME
CARRIERS.
DISPOSITION: TOTAL OF THREE WAFERS WERE SCRAPPED FROM THE LOT.
THE REST OF THE LOT WAS MOVED ON.
CORRECTIVE ACTION: TOOL NEEDS NEW PAD AND SOME CARRIERS.
|
| 62.264 | JD0240 PEX ILD2 4 wafers low thickness. | YIELD::MANDREOLI | | Mon Jun 03 1996 23:01 | 29 |
| PE PEX NOTIFICATION
LOT # JD0240 (DC1026)
QUANTITY: 24
OPERATION # 1985 CMP ILD2
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: NA
DATE: 06/03/96 B-Shift
PROBLEM: 4 wafers had low Post CMP ILD2 thickness after polish.
Wafer# Post CMP ILD2 Thick
--------------------------------
17 4087 �
16 4255 �
20 4192 �
08 4700 �
DISPOSITION: Lot moved on with a REMARK at Oper# 2133 DEP ILD2 for Engr to
determine if these 4 wafers should get extra Oxide Dep.
CORRECTIVE
ACTION: None.
|
| 62.265 | PEX FOR CMP.A1 CRASH ON LOT JD0267 | SUBPAC::SMARTIN | | Wed Jun 05 1996 19:12 | 20 |
|
LOT: JD0267
MACHINE: CMP.A1
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 6/5/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT.....DC1026-000-DA-8G
PROBLEM: TOOL CRASHED WITH TWO PRODUCT WAFERS ON THE TOOL.
DISPOSITION: TOTAL OF TWO WAFERS WERE SCRAPPED FROM THE LOT.
THE REST OF THE LOT WAS MOVED ON.
CORRECTIVE ACTION: TOOL NEEDS NEW PAD AND SOME CARRIERS.
|
| 62.266 | PEX for lot JD0290 at 1978 CMP_PMD, 5 broken wafers | ASDG::CULLEY | | Thu Jun 06 1996 07:55 | 13 |
| Subj: PEX for lot JD0290 at 1978 CMP_PMD CMP.
QUANTITY: 24 to 19
MACHINE: Cmp-B2
DATE: 6/06/96 D-Shift
PROBLEM: System crashed pulverizing 5 wafers.
Lot JD0290, wafers 5,6,11,12,15.
DISPOSITION: Lot finished on B1 for a 1 second touch up.
CORRECTIVE
ACTION System being worked on by EE's.
|
| 62.267 | JD0264 low incoming @ILD1 | YIELD::PHESTER | | Fri Jun 07 1996 12:09 | 29 |
|
CMP PEX
LOT # JD0264
QUANTITY: 24
OPERATION # 3023 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 06/07/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1 DC1026
LOT INCOMING THICKNESS = 17859�
LCL IS 18100�
DISPOSITION: LOT WAS REMARKED @OP #3023 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.268 | JD0228 low incoming @ILD3 | YIELD::PHESTER | | Fri Jun 07 1996 12:20 | 29 |
|
CMP PEX
LOT # JD0228
QUANTITY: 18
OPERATION # 3058 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 06/07/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3 DC1026
LOT INCOMING THICKNESS = 36813�
LCL IS 37100�
DISPOSITION: LOT WAS REMARKED @OP #3058 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.269 | JD0270 low incoming @ILD1 | YIELD::PHESTER | | Sat Jun 08 1996 12:00 | 27 |
|
CMP PEX
LOT # JD0270
QUANTITY: 24
OPERATION # 3023 THICKNESS ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS .A4
DATE: 06/08/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD1
LOT INCOMING THICKNESS AVG WAS 17950�
LCL IS 18100�
DISPOSITION: LOT MOVED TO CMP.B1 AND POLISHED ACCORDINGLY
CORRECTIVE
ACTION NONE
|
| 62.270 | JD0239 low incoming @ILD3 | YIELD::PHESTER | | Sat Jun 08 1996 12:04 | 28 |
|
CMP PEX
LOT # JD0239
QUANTITY: 22
OPERATION # 3058 THICKNESS ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 06/08/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3
LOT INCOMING THICKNESS AVG WAS 36131�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.271 | JD0229 low incomiung @ILD3 | YIELD::PHESTER | | Sat Jun 08 1996 16:07 | 29 |
|
CMP PEX
LOT # JD0229
QUANTITY: 23
OPERATION # 3058 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 06/07/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3 DC1026
LOT INCOMING THICKNESS = 36724�
LCL IS 37100�
DISPOSITION: LOT WAS REMARKED @OP #3058 FOR LOW INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.272 | JD0292 incoming thickness low for ILD1 | YIELD::MANDREOLI | | Mon Jun 10 1996 23:35 | 22 |
| PE PEX NOTIFICATION
LOT # JD0292 (DC1026)
QUANTITY: 24
OPERATION # 3023 CMP ILD1 PRE CMP THICKNESS
/DESCR.
POLISHER: NA
EVAL TOOL: THICKNESS.A4
DATE: 06/10/96 B-Shift
PROBLEM: Low incoming ILD1 Thickness.
DISPOSITION: Polished accordingly
CORRECTIVE
ACTION: None
|
| 62.273 | JD0298 1 wfr crash from CMP.A1 - scrapped (Wfr 08) | YIELD::MANDREOLI | | Tue Jun 11 1996 04:49 | 23 |
| PE PEX NOTIFICATION
LOT # JD0298 (DC1026)
QUANTITY: 14 - 1 = 13
OPERATION # 1978 CMP AFTER PMD DEP1
/DESCR.
POLISHER: CMP.A1
EVAL TOOL: NA
DATE: 06/10/96 B-Shift
PROBLEM: 1 Wafer {#08} was severely scratched over most die, after .A1
crash.
DISPOSITION: Wafer is scrapped.
CORRECTIVE
ACTION: Carrier and Pad change. MQCs
|
| 62.274 | JD0248 High outgoing range @ILD3 | YIELD::PHESTER | | Wed Jun 12 1996 15:29 | 28 |
|
CMP PEX
LOT # JD0248
QUANTITY: 24
OPERATION # 3064 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 06/11/96 C-Shift
PROBLEM: HIGH OUT GOING RANGE ILD3 DC1026
LOT OUTGOING RANGE = 4685�
UCL IS 4500�
DISPOSITION: LOT WAS REMARKED @OP #3064 FOR HIGH OUTGOING
RANGE.
CORRECTIVE: LOT WAS MOVED ON.
|
| 62.275 | JD0289 low incoming @ILD1 | YIELD::PHESTER | | Thu Jun 13 1996 20:10 | 27 |
|
CMP PEX
LOT #: JD0289
QUANTITY: 24
OPERATION # 3023 PRE THICKNESS ILD1
POLISHER: N/A
EVAL TOOL: THICKNESS.A5
DATE: 06/13/96
PROBLEM: INCOMING THICKNESS AVERAGE IS 18017�.
LCL IS 18100�
DISPOSITION: LOT MOVED TO POLISH.
CORRECTIVE
ACTION: LOT WILL BE POLISHED ACCORDINGLY.
|
| 62.276 | PEX for JD0276 at 3023 THK_CMP 6 THK_ILD1_PRE | ASDG::CULLEY | | Fri Jun 14 1996 07:01 | 19 |
| Subj: PEX for JD0276 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 22
MACHINE: THICKNESS.A5
DATE: 06/14/96 D-Shift
PROBLEM: Thickness low at cmp incoming:
UCL=19900
CL=19000
LCL=18100
THK_ME 17921.000
THK_RG 509.000
DISPOSITION: Lot moved on. Slightly low tox ok,
which can be considered good.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.277 | PEX for JD0286 at 3023 THK_CMP 6 THK_ILD1_PRE | ASDG::CULLEY | | Fri Jun 14 1996 07:02 | 19 |
| Subj: PEX for JD0286 at 3023 THK_CMP 6 THK_ILD1_PRE
QUANTITY: 24
MACHINE: THICKNESS.A5
DATE: 06/13/96 D-Shift
PROBLEM: Thickness low at cmp incoming:
UCL=19900
CL=19000
LCL=18100
THK_ME 17817.000
THK_RG 427.000
DISPOSITION: Lot moved on. Slightly low tox ok,
which can be considered good.
CORRECTIVE
ACTION None, added remark to operation.
|
| 62.278 | JD0293 low incoming @ILD1 | YIELD::PHESTER | | Fri Jun 14 1996 17:59 | 26 |
|
CMP PEX
LOT #: JD0293
QUANTITY: 24
OPERATION # 3023 PRE THICKNESS ILD1
POLISHER: N/A
EVAL TOOL: THICKNESS.A4
DATE: 06/14/96
PROBLEM: LOT HAD INCOMING THICKNESS AVG OF 17910�
LCL IS 18100�.
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.279 | JD0266 LOW INCOMING/HIGH RANGE @ILD2 | YIELD::PHESTER | | Fri Jun 14 1996 18:54 | 31 |
|
CMP PEX
LOT # JD0266
QUANTITY: 24
OPERATION # 3058 THICKNESS ILD2
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A5
DATE: 06/14/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS/HIGH RANGE ILD2
LOT INCOMING THICKNESS AVG = 18035�
LCL IS 18100�
INCOMING RANGE = 845
UCL IS 500
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.280 | JD0251 low incoming @ILD3 | YIELD::PHESTER | | Sat Jun 15 1996 10:12 | 28 |
|
PE PEX NOTIFICATION
LOT # JD0251
QUANTITY: 22
OPERATION # 3058 PRE-THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 06/14/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS-ILD3
LOT INCOMING THICKNESS = 36090�
LCL is 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE LOT POLISHED ACCORDINGLY
ACTION
|
| 62.281 | XD0482 low incoming step @PMD | YIELD::PHESTER | | Sat Jun 15 1996 19:52 | 29 |
|
PE PEX NOTIFICATION
LOT # XD0482
QUANTITY: 23
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 06/15/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 2865�
LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.282 | JD0240 low incoming @ILD3 | YIELD::PHESTER | | Sat Jun 15 1996 20:37 | 29 |
|
PE PEX NOTIFICATION
LOT # JD0240
QUANTITY: 24
OPERATION # 3058 THICKNESS
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 06/15/96 C-Shift
PROBLEM: LOW INCOMING THICKNESS ILD3
LOT INCOMING THICKNESS = 36062�
LCL IS 37050�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.283 | JD0301 LOW ILD1 PRE / JD0247 LOW ILD3 PRE | YIELD::MANDREOLI | | Mon Jun 17 1996 07:12 | 24 |
| PE PEX NOTIFICATION
LOT # JD0301 (DC1026)
JD0247 " "
QUANTITY: 24 for both lots
OPERATION # 3023 CMP ILD1 PRE CMP THICKNESS
/DESCR. 3058 CMP ILD3 PRE CMP THICKNESS
POLISHER: NA
EVAL TOOL: THICKNESS.A4
DATE: 06/17/96 B-Shift
PROBLEM: Low incoming ILD1 Thickness for JD0301, 18033 (LCL=18100)
Low incoming ILD3 Thickness for JD0247, 36956 (LCL=37050)
DISPOSITION: Polished accordingly
CORRECTIVE
ACTION: none
|
| 62.284 | LOT JD0325 SCRAPPED FOR SEVERLY OVER POLISH AT PMD | SUBPAC::SMARTIN | | Wed Jun 19 1996 15:55 | 27 |
|
LOT: JD0325
MACHINE: CMP.B1
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 6/19/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT..DC1026-032-DA-8G
PROBLEM: LOT WAS SEVERLY OVER POLISHED. IT WAS BURNT RIGHT DOWN TO THE SILICON
DISPOSITION: LOT WILL BE SCRAPPED
CORRECTIVE ACTION: RECIPES SHOULD NOT BE CHANGED. SOMEONE CHANGED THE POLISH
TIME TO 210 SEC.ON THE PMD RECIPE. THE RECIPES ARE NOT
LOCKED OUT, SO ANYONE CAN CHANGE THE TIME IN THE RECIPE.
THE ONLY WAY TO REALLY BE SURE OF THE POLISH TIME IS TO
CHECK IT BEFORE THE RECIPE IS RAN. THIS PARTICULAR RECIPE
WAS NOT CHECKED PRIOR TO RUNNING.
|
| 62.285 | JD0327 - two wafers scrapped @PMD due to crash. | YIELD::PHESTER | | Thu Jun 20 1996 16:26 | 27 |
|
CMP PEX
LOT # JD0327
QUANTITY: 20
OPERATION # 1978 CMP_PMD
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: 06/20/96 D-Shift
PROBLEM: SYSTEM CRASHED WHILE POLISHING LOT. WAFERS #9 & #10 WERE
SCRAPPED DUE TO BREAKAGE.
DISPOSITION: REMAINDER OF LOT POLISHED SUCCESSFULLY. SYSTEM REPAIRED.
CORRECTIVE
ACTION NONE
|
| 62.286 | JL0356 High incoming range @PMD | YIELD::PHESTER | | Fri Jun 21 1996 15:54 | 26 |
|
CMP PEX
LOT #: JL0356
QUANTITY: 12
OPERATION # 3361 PRE THICKNESS RANGE - PMD
POLISHER: N/A
EVAL TOOL: THICKNESS.A5
DATE: 06/21/96
PROBLEM: INCOMING RANGE WAS 1017�.
UCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH.
CORRECTIVE
ACTION: NONE.
|
| 62.287 | JL0321 High incoming range @PMD | SUBPAC::KULP | | Sun Jun 23 1996 06:55 | 26 |
|
CMP PEX
LOT #: JL0321
QUANTITY: 12
OPERATION # 3361 PRE THICKNESS RANGE - PMD
POLISHER: N/A
EVAL TOOL: THICKNESS.A4
DATE: 06/23/96
PROBLEM: INCOMING RANGE WAS 1405�
UCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH.
CORRECTIVE
ACTION: NONE.
|
| 62.288 | Data entry error CMP.B2_ILD3_PST_THK_RG | SUBPAC::KULP | | Tue Jun 25 1996 04:51 | 25 |
|
CMP PEX
LOT #: XD0447
QUANTITY: 19
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST_THK_RG
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 06/24/96
PROBLEM: Data entry error. The range had the wrong data put in
should be 2710 instead of 10267. Popped chart.
DISPOSITION: Lot moved on.
CORRECTIVE
ACTION: NONE.
|
| 62.289 | High range CMP.B3 3064 THK_ILD3_PST | SUBPAC::KULP | | Tue Jun 25 1996 05:20 | 45 |
|
CMP PEX
LOT #: XD0472
QUANTITY: 21
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 06/24/96
PROBLEM: Range popped chart. High out going range ILD3 TM3636
Lot outgoing range = 5006�
UCL IS 4500�
LOG AN EVENT EVENT THK_ILD3_PST FOR ENTITY CMP.B3 6/24/96 23:49:33
THIS TRANSACTION WAS LOGGED BY M_PROVENCHER
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 8857.000
WAFER #2 8799.000
WAFER #3 9458.000 6/24/96 23:49:33
WAFER #4 7619.000
WAFER #5 6789.000
THK_RG XD0472 5006.000
THK_%SD_5 WAFER #1 15.200
WAFER #2 10.700
WAFER #3 3.800
WAFER #4 23.900
WAFER #5 20.600
LOG AN EVENT EVENT END_RUN FOR ENTITY THICKNESS.A5 6/24/96 23:47:27
DISPOSITION: 100% measured lot, remarked low thickness wafers for
additonal dep at oper# 2136 DEP_ILD3 3 FILMS_4
DISPOSITION: Lot moved on.
|
| 62.290 | JD0281 high incoming step height @ILD3 | YIELD::PHESTER | | Wed Jun 26 1996 14:32 | 30 |
|
CMP PEX
LOT # JD0281
QUANTITY: 23
OPERATION # 3078 STEP_ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 07/26/96 C-Shift
PROBLEM: LOW INCOMING STEP ....ILD3
LOT INCOMING STEP AVG = 20035�
UCL IS 20000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.291 | XD0485 low incoming range @PMD | YIELD::PHESTER | | Wed Jun 26 1996 17:24 | 30 |
|
CMP PEX
LOT # XD0485
QUANTITY: 24
OPERATION # 2951 RANGE PRE-PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.5
DATE: 06/26/96 C-Shift
PROBLEM: LOW INCOMING RANGE....PMD
LOT INCOMING RANGE = 1135�
LCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.292 | JD0324 high incoming thickness @ILD2 | YIELD::PHESTER | | Thu Jun 27 1996 14:32 | 28 |
|
CMP PEX
LOT #: JD0324
QUANTITY: 24
OPERATION # 3053 PRE THICKNESS ILD2
POLISHER: N/A
EVAL TOOL: THICKNESS.A5
DATE: 06/27/96
PROBLEM: LOT INCOMING THICKNESS AVG WAS 19026�.
UCL IS 19000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.293 | JD0298 HIGH SD @ILD2 POST | YIELD::PHESTER | | Fri Jun 28 1996 11:18 | 29 |
|
CMP PEX
LOT #: JD0298
QUANTITY: 13
OPERATION # 3066 THK_CMP 11 THK_ILD2_PST
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 06/28/96
PROBLEM: LOT THICKNESS STD DEV WAS 17.3
UCL IS 10.0
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: NONE. ONE LOW DIE READING OUT OF NINE ON ONE WAFER CAUSED
THE SD TO BE HIGH.
|
| 62.294 | JD0343 high incoming range @PMD | YIELD::PHESTER | | Fri Jun 28 1996 18:21 | 28 |
|
CMP PEX
LOT # JD0343
QUANTITY: 24
OPERATION # 2951 RANGE-PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 06/28/96 C-Shift
PROBLEM: HIGH INCOMING RANGE....PMD
LOT INCOMING RANGE AVG-1406� UCL@ 1000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.295 | JD0277 highg incoming step @ILD3 | YIELD::PHESTER | | Sat Jun 29 1996 16:15 | 29 |
|
CMP PEX
LOT # JD0277
QUANTITY: 22
OPERATION # 3081 STEP_ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 06/29/96 C-Shift
PROBLEM: HIGH INCOMING STEP ....ILD3
INCOMING STEP AVG = 20017�
UCL IS 20000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.296 | XD0481 CMP PEX - High incoming thickness @ILD2 | YIELD::PHESTER | | Sat Jun 29 1996 16:17 | 28 |
|
CMP PEX
LOT # XD0481
QUANTITY: 24
OPERATION # 3053 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 06/29/96 C-Shift
PROBLEM: HIGH INCOMING THICKNESS ILD2 TM36
LOT INCOMING THICKNESS = 19213�
LCL IS 19000�
DISPOSITION: LOT WAS REMARKED @OP #3053 FOR HIGH INCOMING
THICKNESS AND MOVED ON.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.297 | Popped chart 2957 RATE_TM36 (high) | SUBPAC::KULP | | Sun Jun 30 1996 08:37 | 56 |
| CMP PEX
LOT # XD0493
Quantity: 23
Product: TM3636-032-KA-8C
OPERATION # 2957 THK_CMP 4 THK_PMD_PST 8
/DESCR.
Polisher: CMP.B3
Eval tool: THICKNESS.A4
Date: 05/29/96 B-Shift
Problem: Popped chart 2957 RATE_TM36 (high) and
CMP_B3 THK_PMD_PST THK_ME_5 [range] (high)
COL ENG DATA PARAMETER UNIT ID/PROMPT VALUE FG LT
RATE_TM36 10650.000
TIME_TM36 28.000
SET LOT ATTR LOT ATTRIBUTES MODIFIED 6/29/96 21:37:41
UCL = 7000
CL = 3500
------------------------------------------------------------------------------
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 6782.000
WAFER #2 6094.000
LOG AN EVENT WAFER #3 6450.000 6/29/96 21:37:17
WAFER #4 6386.000
WAFER #5 6800.000
THK_RG XD0493 1631.000
THK_SD_5 WAFER #1 3.100
WAFER #2 4.700
WAFER #3 3.500
WAFER #4 5.000
WAFER #5 4.600
LOG AN EVENT EVENT END_RUN FOR ENTITY THICKNESS.A4 6/29/96 21:18:37
Range = 706 UCL = 650
CL = 325
706 was the reading in the data for the graph. It is the range of the 5
numbers not the sigma of X bar stated in the y-axis.
DISPOSITION: LOT WAS PASSED ON
CORRECTIVE
ACTION Verify the graph labels and the data to be entered are correct.
Monitor removal rates for CMP.B3, rates seem fast.
|
| 62.298 | JD0292 low outgoing thickness @ILD3 | YIELD::PHESTER | | Sun Jun 30 1996 14:58 | 29 |
|
CMP PEX
LOT # JD0292
QUANTITY: 23
OPERATION # 3064 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 06/29/96 C-Shift
PROBLEM: LOW OUT GOING THICKNESS ILD3 DC1026
LOT OUTGOING THICKNESS = 8458�
LCL IS 9500�
DISPOSITION: LOT WAS REMARKED @OP #3064 FOR LOW OUTGOING
THICKNESS. LOT WAS ALSO 100% ON THICKNESS.A5
AND REMARKED FOR EXTRA DEPOSITION AT OP# 2136.
CORRECTIVE
ACTION: LOT WILL RECIEVE EXTRA DEP AT DEP ILD3.
|
| 62.299 | High range post ILD3 thickness | SUBPAC::KULP | | Mon Jul 01 1996 02:11 | 41 |
| CMP PEX
LOT # JD0288
Quantity: 24
Product: DC1026-032-DA-8G
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST 3
/DESCR.
Polisher: CMP.B3
Eval tool: THICKNESS.A5
Date: 07/01/96 B-Shift
Problem: Popped chart 3064, CMP_B3 THK_ILD3_PST THK_ME_5 [range] (high)
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 10285.000 6/30/96 20:47:25
WAFER #2 9696.000
WAFER #3 9714.000
WAFER #4 10714.000
WAFER #5 10273.000
THK_RG JD0288 2902.000
THK_SD_5 WAFER #1 9.770
WAFER #2 5.270
WAFER #3 6.140
WAFER #4 10.300
WAFER #5 9.910
Range = 1018 UCL = 1000
CL = 500
DISPOSITION: LOT WAS PASSED ON
CORRECTIVE : None
ACTION
|
| 62.300 | High range post ILD1 thickness | SUBPAC::KULP | | Tue Jul 02 1996 03:24 | 39 |
| CMP PEX
LOT # XD0486
Quantity: 19
Product: TM3636-032-KA-8C
OPERATION # 3054 THK_CMP 8 THK_ILD1_PST 3
/DESCR.
Polisher: CMP.B3
Eval tool: THICKNESS.A5
Date: 07/01/96 B-Shift
Problem: Popped chart 3054, CMP_B3 THK_ILD1_PST THK_ME_5 [range] (high)
THK_ME_5 WAFER #1 5759.000
WAFER #2 5217.000
WAFER #3 5781.000
WAFER #4 5771.000
WAFER #5 5590.000
THK_RG XD0486 2881.000
LOG AN EVENT THK_SD_5 WAFER #1 5.150 7/02/96 00:01:50
WAFER #2 10.400
WAFER #3 5.700
WAFER #4 6.800
WAFER #5 6.100
UCL: 550 Data point: 564
Cl: 275
DISPOSITION: LOT WAS PASSED ON
CORRECTIVE : None
ACTION
|
| 62.301 | 3 wfrs broken cmp.b1 | SUBPAC::KULP | | Wed Jul 03 1996 08:35 | 27 |
|
CMP PEX
LOT # JD0339
QUANTITY: 24 - 3 = 21
OPERATION # 1978 CMP_PMD
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: N/A
DATE: 07/03/96 B-Shift
PROBLEM: System crashed while polishing lot. 3 wafers were
scrapped due to breakage.
DISPOSITION: Remainder of lot polished on CMP.A2.
CMP.B1, full break-in and MQC's.
CORRECTIVE
ACTION NONE
|
| 62.302 | CMP PEX FOR WAFER CRASH ON LOT YD0184 | SUBPAC::SMARTIN | | Tue Jul 09 1996 11:09 | 28 |
|
LOT: YD0184
MACHINE: CMP.A1
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 7/9/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT..TM3636-042-KA-0D
PROBLEM: TWO WAFERS CRASHED ON TABLE.
DISPOSITION: LOT WILL MOVED LESS TWO WAFERS.
CORRECTIVE ACTION: REPLACING PAD AND BOTH CARRIERS.
|
| 62.303 | CMP PEX FOR TWO MORE WAFERS BROKE FROM LOT YD0184 | SUBPAC::SMARTIN | | Tue Jul 09 1996 17:06 | 32 |
|
LOT: YD0184
MACHINE: CMP.A1
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 7/9/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 20
PRODUCT..TM3636-042-KA-0D
PROBLEM: TWO MORE WAFERS CRASHED ON TABLE.
DISPOSITION: LOT WILL MOVED LESS FOUR WAFERS THIS TIME.
CORRECTIVE ACTION: REPLACING PAD AND BOTH CARRIERS AND ALSO
DOWN FOR BLACK PARTICLES COMING OUT OF LEFT
SPINDLE (SEEN DURING SPINDLE FLUSH AND DURING
WAFER UNLOAD).
|
| 62.304 | XD0492 high incoming range @ILD2 | YIELD::PHESTER | | Wed Jul 10 1996 11:29 | 29 |
|
PE PEX NOTIFICATION
LOT # XD0492
QUANTITY: 24
OPERATION # 3053 RANGE ILD2
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 07/10/96 C-Shift
PROBLEM: HIGH INCOMING RANGE ILD2
HIGH INCOMING RANGE AVG = 1089�
UCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.305 | JD0357 high removal rate @PMD | YIELD::PHESTER | | Wed Jul 10 1996 12:44 | 29 |
|
CMP PEX
LOT #: JD0357
QUANTITY: 24
OPERATION # 2957 POST THICKNESS @PMD
POLISHER: CMP.B2
EVAL TOOL: TKHICKNESS.A4
DATE: 07/10/96
PROBLEM: REMOVAL RATE ABOVE UCL 8233�.
DISPOSITION: LOT MOVED OUT.
CORRECTIVE
ACTION: NONE. THIS LOT WAS POLISHED ON A SPEEDFAM TOOL WHICH HAS
A MUCH HIGHER REMOVAL RATE THAN THE STRAUSBAUGH, WHERE MOST
PMD LOTS ARE POLISHED.
|
| 62.306 | XD0441B high incoming thickness & range @ILD1 | YIELD::PHESTER | | Wed Jul 10 1996 12:51 | 33 |
|
CMP PEX
LOT # XD0441B
QUANTITY: 8
OPERATION # 3023 THK_CMP
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 07/10/96 C-Shift
PROBLEM: HIGH INCOMING THICKNESS ILD1 TM36
LOT INCOMING THICKNESS = 19533�
UCL IS 19000�
LOT INCOMING RANGE = 1187
UCL = 1000
DISPOSITION: LOT WAS REMARKED @OP #3023 FOR HIGH INCOMING
THICKNESS AND RANGE.
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY.
|
| 62.307 | JD0354 LOW INCOMING STEP HEIGHT @PMD | YIELD::PHESTER | | Wed Jul 10 1996 18:27 | 29 |
|
CMP PEX
LOT #: JD0354
QUANTITY: 24
OPERATION # 3078 PRE PROFILER - PMD
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: 07/10/96
PROBLEM: LOW INCOMING STEP HEIGHT AVERAGE AT 2997�
LCL IS 3000�..
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.308 | CMP STP_ILD3_PRE FOR JD0295 | ASDG::CULLEY | | Thu Jul 11 1996 07:15 | 31 |
| Subj: CMP Polish PEX
*************** PEX FOR CMP POST MEASUREMENT RANGE *************
(THICKNESS)
(STEP HEIGHT)
PROCESS: Pre CMP STEP HEIGHT ILD3
OPERATION #:3081
POLISHER(CMP.A1, A2, B1, B2): B2
PROCESS DATE & TIME: 7/11/96 02:09:21
SHIFT: D
LOT(S) AFFECTED: JD0295
DEVICE TYPE: DC1026
PROBLEM DESCRIPTION: Step-height ON Pre MEASUREMENT WAS over 20K.
HEIGHT_ME WAFER #1 CENTER 19830.000
WAFER #1 EDGE 20290.000
WAFER #2 CENTER 20190.000
WAFER #2 EDGE 20860.000
CORRECTIVE ACTION: None
DISPOSITION: lot was polished with above data under consideration.
|
| 62.309 | CMP STEP_PMD_pre FOR XM0479 | ASDG::CULLEY | | Thu Jul 11 1996 07:16 | 32 |
| Subj: CMP Polish PEX
*************** PEX FOR CMP POST MEASUREMENT RANGE *************
(THICKNESS)
(STEP HEIGHT)
PROCESS: Pre CMP STEP_PMD_pre.
OPERATION #:3078
POLISHER(CMP.A1, A2, B1, B2): B2
PROCESS DATE & TIME: 7/11/96 02:02:53
SHIFT: D
LOT(S) AFFECTED: XM0479
DEVICE TYPE: TM0069
PROBLEM DESCRIPTION: Step-height ON Pre MEASUREMENT WAS under 3000 A.
HEIGHT_ME WAFER #1 CENTER 2836.000
WAFER #1 EDGE 2905.000
WAFER #2 CENTER 2956.000
WAFER #2 EDGE 3072.000
CORRECTIVE ACTION: None
DISPOSITION: lot was polished with above data under consideration.
Spc printed and delivered.
|
| 62.310 | JD0363 high incoming range @PMD | YIELD::PHESTER | | Fri Jul 12 1996 17:39 | 28 |
|
CMP PEX
LOT #: JD0363
QUANTITY: 24
OPERATION # 2951 PRE THICKNESS @PMD
POLISHER: N/A
EVAL TOOL: THICKNESS.A4
DATE: 07/12/96
PROBLEM: RANGE WAS 3063�.
UCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE.
|
| 62.311 | JD0364 high incoming range @PMD | YIELD::PHESTER | | Fri Jul 12 1996 17:45 | 27 |
|
CMP PEX
LOT #: JD0364
QUANTITY: 22
OPERATION # 2951 PRE THICKNESS @ PMD
POLISHER: N/A
EVAL TOOL: THICKNESS.A4
DATE: 07/12/96
PROBLEM: INCOMING RANGE WAS 1133�.
UCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.312 | JDO364 LOW INCOMING STEP @PMD | YIELD::PHESTER | | Fri Jul 12 1996 17:51 | 28 |
|
CMP PEX
LOT #: JD0364
QUANTITY: 22
OPERATION # 3078 pre profiler @ PMD
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: 07/12/96
PROBLEM: INCOMING STEP HEIGHT WAS 2957�
LCL IS 3000�
DISPOSITION: MOVED TO POLISH
CORRECTIVE NONE
ACTION:
|
| 62.313 | High thickness at M1. | FABSIX::S_SHONG | | Fri Jul 19 1996 00:40 | 28 |
|
CMP PEX
LOT #: JD0358
QUANTITY: 21
OPERATION # 1026 pre thickness @ M1
POLISHER: N/A
EVAL TOOL: Thickness.A5
DATE: 07/18/96
PROBLEM: Incoming Thickness was high at 9712� and 9753�
UCL IS 9600�
DISPOSITION: Moved on.
CORRECTIVE NONE
ACTION:
|
| 62.314 | Pre Thickness for XD0490 | FABSIX::S_SHONG | | Fri Jul 19 1996 07:16 | 28 |
|
CMP PEX
LOT #: XD0490
QUANTITY: 23
OPERATION # 3023 pre thickness @ M1
POLISHER: N/A
EVAL TOOL: Thickness.A4
DATE: 07/19/96
PROBLEM: Incoming Range for thickness was high at 1175�.
UCL IS 1000�
DISPOSITION: Moved on.
CORRECTIVE NONE
ACTION:
|
| 62.315 | Overpolish on JD0358C | FABSIX::S_SHONG | | Sat Jul 20 1996 08:44 | 29 |
|
CMP PEX
LOT #: JL0358C
QUANTITY: 11
OPERATION # 1992 CMP_ILD1
POLISHER: CMP.B2
EVAL TOOL: Thickness.A4
DATE: 07/19/96
PROBLEM: Lot was over polished by ~700�. LCL is 5200� the average
for the lot was ~4500�.
DISPOSITION: Added a remark at operation 2166 ILD_Dep to add an extra
1000�.
CORRECTIVE Informed the operators that if the step height is high
ACTION: (Which it was) to reduce the pre set time by 30 seconds.
|
| 62.316 | CMP.B1 JD0334, STEP_ILD3 over 20K | SUBPAC::KULP | | Sun Jul 21 1996 05:41 | 33 |
| CMP PEX
LOT # JD0334
QUANTITY: 19
OPERATION # 3081 STEP_CMP 4 STEP_ILD3
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: PROFILER.A2
DATE: 07/21/96 B-Shift
PROBLEM: Popped chart: HEIGHT_ME (high)
mean = 20302.5
UCL: 20,000
CL: 18,500
RUN_ID_1 JD0334 4 20
HEIGHT_ME WAFER #1 CENTER 20890.000
WAFER #1 EDGE 19700.000
WAFER #2 CENTER 20960.000
WAFER #2 EDGE 19660.000
DISPOSITION: None
CORRECTIVE lot was polished with above data under consideration.
ACTION:
|
| 62.317 | JD0333 THK_ILD3_PST STdev (high) and data entry | SUBPAC::KULP | | Sun Jul 21 1996 06:43 | 29 |
| CMP PEX
LOT # JD0333
QUANTITY: 19
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 07/21/96 B-Shift
PROBLEM: Popped chart: STdev (high) and data entry error Range.
mean = 10.4
UCL: 10
CL: 5
Range should be 3295 instead of 19.
DISPOSITION: None
CORRECTIVE range chart needs to be corrected.
ACTION:
|
| 62.318 | JD0369 THK_ILD1_PST STdev (high) | SUBPAC::KULP | | Mon Jul 22 1996 07:12 | 38 |
| CMP PEX
LOT # JD0369
QUANTITY: 24
OPERATION # 3054 THK_CMP 8 THK_ILD1_PST
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 07/22/96 B-Shift
PROBLEM: Popped chart: STdev (high)
mean = 15.06
UCL: 10
CL: 5
THK_ME_5 WAFER #1 5473.000
WAFER #2 5234.000
WAFER #3 5713.000
WAFER #4 5329.000
WAFER #5 5796.000
THK_RG JD0369 2672.000
LOG AN EVENT THK_SD_5 WAFER #1 13.900 7/22/96 03:59:24
WAFER #2 15.000
WAFER #3 10.600
WAFER #4 19.600
WAFER #5 16.200
DISPOSITION: Lot moved on.
CORRECTIVE None
ACTION:
|
| 62.319 | JD0342 - two wafers scrapped @IDLE2 over polish | STRATA::POZORSKI | | Mon Jul 22 1996 15:31 | 24 |
| CMP PEX
LOT # JD0342
QUANTITY: 20
OPERATION # 1985 IDL2
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: 06/22/96 A-Shift
PROBLEM: Last lot had 22 wafers, last 2 wafers ran only with 3 dummies
for some reason the removal rate was higher than the rest of
the lot. Dummies had 50k oxide on them.
DISPOSITION: Two wafers were scraped from the lot.
CORRECTIVE Discussed problem with tech, will run with shorter run times when
ACTION filler wafers are used.
|
| 62.321 | jd0379 scrap 5 WAFERS- B1 | STRATA::WOOLDRIDGE | Pleasure, Spiked With Pain | Fri Jul 26 1996 13:05 | 19 |
| Subject: PEX Jd0379 - correction to lot#
ENTERED Kyle Wooldridge
RECIPE: PMD
OPER#: 861
POLISHER: CMP.B1
PROCESS DATE: 07/26/96
PROBLEM: 5 wafers scrap (19 wafer lot)
Tool errored. Table kept spinning, carriers stopped. Wafers
were over polished.
DISPOSITION: Scrap 5
CORRECTIVE Correct equipment issue.
|
| 62.320 | JL0418C high SD on one wafer POST @ILD2 | YIELD::PHESTER | | Sat Jul 27 1996 17:41 | 26 |
|
CMP PEX
LOT #: JL0418C ILD2
QUANTITY: 5
OPERATION # 3274 POST THICKNESS
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 07/27/96
PROBLEM: STD DEV ON SLOT 1 WAFER WAS 10.6
UCL IS 10.0%
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: NONE
|
| 62.322 | 2 WAFERS SCRAPPED AT PMD SYSTEM CRASHED... | STRATA::POZORSKI | | Wed Jul 31 1996 20:01 | 25 |
|
LOT: JD0395
MACHINE: CMP.A1
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 7/31/96
SHIFT: A-SHIFT
QUANTITY: 19 DOWN TO 17
PRODUCT..DC1026-00-DJ-8G
PROBLEM: Two wafers crashed on the system for some unknown reason.
DISPOSITION: The lot will be moved on with 2 less wafers.
CORRECTIVE ACTION: The pad and Carriers will be replaced followed by full
by MQC's.
|
| 62.323 | JD0354 High outgoing range @ILD3 | YIELD::PHESTER | | Thu Aug 01 1996 20:11 | 28 |
|
CMP PEX
LOT # JD0354
QUANTITY: 24
OPERATION # 3064 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 08/1/96 C-Shift
PROBLEM: HIGH OUT GOING RANGE ILD3 DC1026
LOT OUTGOING RANGE = 4985�
UCL IS 4500�
DISPOSITION: LOT WAS REMARKED @OP #3064 FOR HIGH OUTGOING
RANGE.
CORRECTIVE: LOT WAS MOVED ON.
|
| 62.324 | JD0408 SLIGHTLY OVER-POLISHED @ILD2 | YIELD::PHESTER | | Thu Aug 01 1996 20:16 | 27 |
|
CMP PEX
LOT #: JD0408 ILD2
QUANTITY: 24
OPERATION # 3066 POST THICKNESS ILD2
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 08/01/96
PROBLEM: LOT SLIGHTLY OVER POLISHED AT 4963�
LCL IS 5200�
DISPOSITION: LOT REMARKED AND MOVED OUT.
CORRECTIVE NONE.
|
| 62.325 | JL0404 low outgoing thickness @ILD1 | YIELD::PHESTER | | Sat Aug 03 1996 15:57 | 29 |
|
CMP PEX
LOT #: JL0404
QUANTITY: 12
OPERATION # 3114 POST THICKNESS ILD1
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 08/03/96
PROBLEM: OUTGOING THICKNESS WAS 5019�
LCL IS 5200�
DISPOSITION: LOT MOVED OUT.
CORRECTIVE LOT WAS REMARKED AT 2166 DEP_ILD1 3
ACTION:
|
| 62.326 | JD0394 THK_ILD1_PST - slight overpolish | YIELD::MANDREOLI | | Sun Aug 04 1996 07:17 | 25 |
| PE PEX NOTIFICATION
LOT # JD0394 (DC1026)
QUANTITY: 24
OPERATION # 3054 CMP THK_ILD1_PST THICKNESS
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 08/04/96 B-Shift
PROBLEM: Low POST CMP ILD1 Thickness, LCL is 5200�, the 5 wafer Mean for
this lot was 4727�.
DISPOSITION: Measured lot 100% for thickness. REMARKed the lot with thickness
data at DEP ILD1 3 (Oper# 2130) requesting the films folks to
deposit ~1000� thicker oxide.
CORRECTIVE
ACTION: none
|
| 62.327 | Pex for JD0398. | YIELD::SHONG | | Wed Aug 07 1996 07:32 | 23 |
| PE PEX NOTIFICATION
LOT # JD0398 (DC1026)
QUANTITY: 24
OPERATION # 3054 CMP THK_ILD1_PST THICKNESS
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 08/07/96 D-Shift
PROBLEM: Low POST CMP ILD1 Thickness, LCL is 5200�, the 5 wafer Mean for
this lot was 5139�.
DISPOSITION: Lot was OK'ed to move on to Diffusion.
CORRECTIVE
ACTION: none
|
| 62.328 | XD0502 OVER-POLISHED @ILD2 | YIELD::PHESTER | | Fri Aug 09 1996 11:16 | 27 |
|
CMP PEX
LOT #: XD0502 ILD2
QUANTITY: 23
OPERATION # 3066 pst thickness.a5
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 08/08/96
PROBLEM: LOT OVER POLISHED(4964�). SOME WAFERS WERE POLISHED 1000�
BELOW TARGET.
LCL = 5200�
DISPOSITION: LOT MOVED OUT
CORRECTIVE LOT REMARKED AT CAP FOR EXTRA DEPOSITION.
ACTION:
|
| 62.329 | JD0371 HIGH OUTGOING RANGE @ILD2 | YIELD::PHESTER | | Fri Aug 09 1996 11:17 | 28 |
|
CMP PEX
LOT #: JD0371 ILD3
QUANTITY: 12
OPERATION # 3064 POST THICKNESS ILD3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 08/08/96
PROBLEM: HIGH OUTGOING RANGE @ILD2
OUTGOING RANGE WAS 6740�
UCL =4900 �
DISPOSITION: LOT MOVED OUT
CORRECTIVE
ACTION: NONE
|
| 62.330 | High Std.Dev for JD0397 | YIELD::SHONG | | Fri Aug 09 1996 23:21 | 40 |
| CMP PEX
LOT # JD0397
QUANTITY: 24
OPERATION # 3384 THK_CMP 11 THK_ILD2_PST
/DESCR.
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A5
DATE: 08/09/96 D-Shift
PROBLEM: Popped chart: STdev (high)
mean = 22.38
UCL: 10
CL: 5
THK_ME_5 WAFER #1 5550.000
WAFER #2 5414.000
WAFER #3 5457.000
WAFER #4 5536.000
WAFER #5 5730.000
THK_RG 5 3362.000
THK_SD_5 WAFER #1 22.200
WAFER #2 24.400
WAFER #3 21.000
WAFER #4 23.100
WAFER #5 21.200
DISPOSITION: Lot moved on.
CORRECTIVE System was at 300 wafers. Pad was changed. MQC's are being done.
ACTION:
|
| 62.331 | XD0498 LOW INCOMING STEP @PMD | YIELD::PHESTER | | Thu Aug 15 1996 14:55 | 28 |
|
CMP PEX
LOT #: XD0498
QUANTITY: 24
OPERATION # 3078 pre profiler.a2 PMD
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: 07/18/96
PROBLEM: INCOMING STEP HEIGHT AVG WAS 2938.5�
LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.332 | JL0410 HIGH OUTGOING RANGE @PMD | YIELD::PHESTER | | Thu Aug 15 1996 15:35 | 28 |
|
CMP PEX
LOT #: JL0410 PMD
QUANTITY: 18
OPERATION # 3106 POST THICKNESS
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A5
DDATE: 07/25/96
PROBLEM:
OUTGOING RANGE WAS 3791�
UCL IS 3000�
DISPOSITION: LOT MOVED OUT
CORRECTIVE
ACTION: NONE
|
| 62.333 | XD0499 HIGH INCOMING RANGE @ILD1 | YIELD::PHESTER | | Thu Aug 15 1996 15:39 | 26 |
|
CMP PEX
LOT #: XD0499 ILD1
QUANTITY: 21
OPERATION # 3023 PRE THICKNESS
POLISHER: N/A
EVAL TOOL: THICKNESS.A4
DATE: 07/25/96
PROBLEM: INCOMING RANGE WAS 1079�
UCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.334 | XD0354 LOW OUTGOING THICKNESS @ILD1 | YIELD::PHESTER | | Thu Aug 15 1996 15:51 | 29 |
|
CMP PEX
LOT #: XD0354
QUANTITY: 24
OPERATION # 3054 THK_CMP 16
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 07/18/96
PROBLEM: OUTGOING THICKNESS AVG WAS 4902�
LCL IS 5200�
DISPOSITION: LOT MOVED OUT
CORRECTIVE
ACTION: LOT WAS REMARKED @ OPERATION 3054 FOR LOW OUTGOING THICKNESS.
LOT WAS GIVEN A 100% THICKNESS EVALUATION AND REMARKED FOR
EXTRA DEP @ OPERATION 2130.
|
| 62.335 | JD0358 LOW OUTGOING @ILD1 | YIELD::PHESTER | | Thu Aug 15 1996 15:56 | 29 |
|
CMP PEX
LOT #: JD0358
QUANTITY: 21
OPERATION # 3054 THK_CMP 16
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 07/18/96 C-SHIFT
PROBLEM: OUTGOING THICKNESS AVG WAS @ILD1 WAS 3932�
LCL IS 5200�
DISPOSITION: LOT MOVED OUT
CORRECTIVE
ACTION: LOT WAS REMARKED @ OPERATION 3054 FOR LOW OUTGOING THICKNESS.
LOT WAS GIVEN A 100% THICKNESS EVALUATION AND REMARKED FOR
EXTRA DEP @ OPERATION 2130.
|
| 62.336 | JD0368 LOW INCOMING STEP @ILD1 | YIELD::PHESTER | | Thu Aug 15 1996 16:00 | 27 |
|
CMP PEX
LOT #: JD0368
QUANTITY: 24
OPERATION # 3079 STEP_ILD1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: 07/20/96 C-SHIFT
PROBLEM: INCOMING STEP HEIGHT WAS 9603�
LCL IS 9600�
DISPOSITION: LOT MOVED OUT
CORRECTIVE
ACTION: NONE
|
| 62.337 | PEX for JD0396 | YIELD::SHONG | | Fri Aug 16 1996 04:54 | 25 |
| PE PEX NOTIFICATION
LOT # JD0396 (DC1026)
QUANTITY: 10
OPERATION # 3081 Step_CMP 4
/DESCR.
POLISHER:
EVAL TOOL: Profiler.A2
DATE: 08/16/96 D-Shift
PROBLEM: High incoming step height. The UCL is 20,000� . We had an average
of ~20,500�.
DISPOSITION: None.
CORRECTIVE Informed the operators to reduce the initial center heads down
ACTION: time. Center heads came out fine and the lot moved on with no
other problems.
|
| 62.338 | Pex for JD0382 | YIELD::SHONG | | Fri Aug 16 1996 04:54 | 26 |
| PE PEX NOTIFICATION
LOT # JD0382 (DC1026)
QUANTITY: 22
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 08/16/96 D-Shift
PROBLEM: High uniformity after final touch up(~13%). There appears to be
a problem with the UV1050. It's not measuring all of the points
correctly.
DISPOSITION: Moved the lot on.
CORRECTIVE Beth and I noticed that there was allot of discrepance with the
ACTION: recipes in the UV1050's. There's a plan in place to try and
standardise all of the recipes so we read the same amount of
die for each wafer.
|
| 62.339 | PEX for JD0414 | YIELD::SHONG | | Fri Aug 16 1996 04:55 | 26 |
| PE PEX NOTIFICATION
LOT # JD0414 (DC1035)
QUANTITY: 24
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 08/16/96 D-Shift
PROBLEM: High uniformity after final touch up(~13%). There appears to be
a problem with the UV1050. It's not measuring all of the points
correctly.
DISPOSITION: Moved the lot on.
CORRECTIVE Beth and I noticed that there was allot of discrepance with the
ACTION: recipes in the UV1050's. There's a plan in place to try and
standardise all of the recipes so we read the same amount of
die for each wafer.
|
| 62.340 | PEX for JD0423 | YIELD::SHONG | | Fri Aug 16 1996 04:55 | 26 |
| PE PEX NOTIFICATION
LOT # JD0423 (DC1035)
QUANTITY: 23
OPERATION # 1981 CMP_ILD1
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 08/16/96 D-Shift
PROBLEM: High uniformity after final touch up(~12%). There appears to be
a problem with the UV1050. It's not measuring all of the points
correctly.
DISPOSITION: Moved the lot on.
CORRECTIVE Beth and I noticed that there was allot of discrepance with the
ACTION: recipes in the UV1050's. There's a plan in place to try and
standardise all of the recipes so we read the same amount of
die for each wafer.
|
| 62.341 | JL0477A low incoming step @PMD | YIELD::PHESTER | | Fri Aug 16 1996 09:27 | 25 |
|
CMP PEX
LOT # JL0477A
QUANTITY: 12
OPERATION # 3362 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 08/16/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 4396� LCL IS 4000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.342 | JL0437 high incoming range @ILD1 | YIELD::PHESTER | | Fri Aug 16 1996 17:51 | 28 |
|
CMP PEX
LOT # JL0437
QUANTITY: 21
OPERATION # 3112 THK_CMP 6
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: THICKNESS.A4
DATE: 08/16/96 C-Shift
PROBLEM: HIGH INCOMING THICKNESS RANGE @ILD1
AVG = 2229�
UCL IS 1000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.343 | JD0377 - 3441 popped chart for low thickness and high range. | SUBPAC::KULP | | Sun Aug 18 1996 08:31 | 32 |
|
CMP PEX
LOT #: JD0377
QUANTITY: 16
OPERATION # 3441 STP_CMP 25 STEP_ILD25
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 08/18/96 b-SHIFT
PROBLEM: Outgoing thickness mean was 8495�
LCL: 9500�
Outgoing thickness range was 5568�
UCL: 4500�
DISPOSITION: Lot moved out
CORRECTIVE
ACTION:
Lot was given a 100% thickness evaluation and remarked for
extra dep @ operation 2244.
|
| 62.344 | PEX JD0386 | SUBPAC::KULP | | Mon Aug 19 1996 05:21 | 31 |
|
CMP PEX
LOT #: JD0386
QUANTITY: 24
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 08/19/96 B-SHIFT
PROBLEM: Outgoing thickness STD was 11.158
UCL: 10
Outgoing thickness range was 6690�
UCL: 4500�
DISPOSITION: Lot moved out
CORRECTIVE None
ACTION:
|
| 62.345 | PEX jd0393 | SUBPAC::KULP | | Mon Aug 19 1996 05:33 | 31 |
|
CMP PEX
LOT #: JD0393
QUANTITY: 24
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 08/19/96 B-SHIFT
PROBLEM: Outgoing thickness MEAN was 10521�
UCL: 10500�
DISPOSITION: 100% thickness measurement, touched up wafers above
10500 Ang. Lot moved out, remark added of results at
oper 3064.
CORRECTIVE None
ACTION:
|
| 62.346 | CMP PEX XD0521 2 WAFERS BROKEN | SUBPAC::SMARTIN | | Mon Aug 19 1996 18:32 | 24 |
|
LOT: XD0521
MACHINE: CMP.A2
OPER#: 1978 CMP AFTER PMD DEP1
PROCESS LEVEL: PMD
DATE: 8/19/96
SHIFT: B-SHIFT
QUANTITY: 24 DOWN TO 22
PRODUCT..TM0069-032-BA-8C
PROBLEM: Two wafers crashed on the system.
DISPOSITION: The lot will be moved on with 2 less wafers.
CORRECTIVE ACTION: The pad and Carriers will be replaced followed by full
by MQC's.
|
| 62.347 | CMP.b1 JL0438 over polish 1st 5 wfrs | SUBPAC::KULP | | Tue Aug 20 1996 05:54 | 38 |
|
LOT: JL0438
MACHINE: CMP.B1
OPER#: 3114 THK_CMP 8 THK_ILD1_PST
PROCESS LEVEL: ILD1
DATE: 8/19/96
SHIFT: B-SHIFT
QUANTITY: 24
PRODUCT.. DC1044-002-EB-8P
PROBLEM: 5 send ahead wafers polished below 3500 LCL: 5200
did not pop chart.
DISPOSITION: Remark entered at Dep. oper# 2166 needs extra dep.
wfr 23 3674
wfr 11 3212
wfr 18 2422
wfr 10 2839
wfr 15 3877
Step 5 ran for 220 seconds, changed to 180 for the rest of lot.
Also UV1050 could not read all die on wafers with low readings.
THICKNESS.A4
CORRECTIVE ACTION: Moved lot on. Possible need another recipe for small
die for ILD1. small die may have different removal
rates.
|
| 62.348 | cmp.b1 broke 2 wfrs | SUBPAC::KULP | | Tue Aug 20 1996 08:14 | 26 |
|
LOT: JL0428
MACHINE: CMP.B1
OPER#: 1994 CMP_ILD2 CMP
PROCESS LEVEL: ILD2
DATE: 8/20/96
SHIFT: B-SHIFT
QUANTITY: 24 DOWN TO 22
PRODUCT..DC1044-002-EB-8P
PROBLEM: Two wafers crashed on the system. During 1 sec. touch up broke
at step 7.
DISPOSITION: The lot will be moved on with 2 less wafers.
CORRECTIVE ACTION: The pad and Carriers will be replaced followed by full
by MQC's.
|
| 62.349 | JD0444 high incoming step @ILD1 | YIELD::PHESTER | | Wed Aug 21 1996 15:12 | 27 |
|
CMP PEX
LOT # JD0444
QUANTITY: 23
OPERATION # 3079 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 08/21/96 C-Shift
PROBLEM: HIGH INCOMING STEP HEIGHT....ILD1
LOT INCOMING STEP AVG = 9685�
UCL IS 9600�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.350 | JD0441 LOW INCOMING STEP @PMD | YIELD::PHESTER | | Fri Aug 23 1996 18:55 | 28 |
|
CMP PEX
LOT #: JD0441 PMD
QUANTITY: 23
OPERATION # 3078 PRE PROFILE
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: 08/23/96
PROBLEM: INCOMING STEP HEIGHT MEAN WAS 2981�
LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.351 | CMP PEX FOR TWO BROKEN WAFERS FROM LOT YD0172 | SUBPAC::SMARTIN | | Sun Aug 25 1996 15:30 | 28 |
|
LOT: YD0172
MACHINE: CMP.A2
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 8/25/96
SHIFT: A-SHIFT
QUANTITY: 16 DOWN TO 14
PRODUCT..TM3636-092-KA-0D
PROBLEM: TWO WAFERS CRASHED ON TABLE.
DISPOSITION: LOT WILL MOVED LESS TWO WAFERS.
CORRECTIVE ACTION: REPLACING PAD AND BOTH CARRIERS.
|
| 62.352 | CMP PEX FOR OVER POLISH ON LOT JL0525 | SUBPAC::SMARTIN | | Sun Aug 25 1996 15:51 | 47 |
|
LOT: JL0525
MACHINE: CMP.A2
OPER#: 3106 THK_CMP 4 THK_PMD_PST
PROCESS LEVEL: PMD
DATE: 8/25/96
SHIFT: B-SHIFT
QUANTITY: 24
PRODUCT..TM0073-000-AA-8P
PROBLEM: Over polish, popped chart CMP.A2 THK_PMD_PST THK_ME_5
LCL: 6200, DATA POINT 6087.200
THK_ME_5 WAFER #1 6053.000
WAFER #2 6018.000
WAFER #3 6278.000
WAFER #4 5978.000
WAFER #5 6109.000
DISPOSITION: The lot will need 100% UV1050, over to A shift.
Nothing unusual during processing.
CORRECTIVE ACTION: Additional dep on selected wafers has been requested by
CMP. Please proceed as follows:
1) In Ox-Dep.E2 run a monitor using recipe peteos 3000
2) Measure monitor thickness. If it is within 150A of target value,
go to step 3
3) Split lot up into groups by wafer # and process as follows:
Wafers# 1,14,6,21,12,16,10,22,13,9,20 use recipe peteos 3000
Wafer # 19 use recipe Op 2166 (for dep of 3500A)
All other wafers get std process (2500A dep)
|
| 62.353 | CMP PEX FOR SEVERLY OVER POLISH-5 WAFERS SCRAPPED | SUBPAC::SMARTIN | | Sun Aug 25 1996 18:49 | 30 |
|
LOT: JD0466
MACHINE: CMP.B2
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 8/25/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 19
PRODUCT..DC1026-000-DJ-8G
PROBLEM: 5 WAFERS WERE SEVERLY OVER POLISHED AT PMD. OPERATOR GRABBED WRONG LOT
FOR POLISHING BY MISTAKE.
DISPOSITION: LOT WILL MOVED LESS FIVE WAFERS.
CORRECTIVE ACTION: DOUBLE CHECK LOTS AND #'S BEFORE POLISHING.
|
| 62.354 | DATA MIS-ENTRY JD0467 @ THK_PMD_PST | YIELD::MANDREOLI | | Mon Aug 26 1996 07:41 | 33 |
| PE PEX NOTIFICATION
LOT # JD0467 (DC1026)
QUANTITY: 23
OPERATION # [FAB6.CMP_A1.THK_PMD_PST]THK_ME_5.GRF
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 08/26/96 B-Shift
PROBLEM: SPC Chart flagged due to data mis-entry for POST PMD thickness.
Entered 4 values (one of them mis-entered);
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 6293.000
WAFER #2 62474.000 ***
WAFER #3 6495.000
WAFER #4 6550.000
WAFER #5 N/A
DISPOSITION: Corrected WAFER #2 value to 6247 with WorkStream UNPH function,
The SPC Chart still needs to be corrected. The Mean for correct
values is 6396.
CORRECTIVE
ACTION: none
|
| 62.355 | JL0458 2 broken wfrs | SUBPAC::KULP | | Wed Aug 28 1996 08:37 | 26 |
|
LOT: JL0458
MACHINE: CMP.B1
OPER#: 1992 CMP_ILD1 CMP
PROCESS LEVEL: ILD1
DATE: 8/28/96
SHIFT: B-SHIFT
QUANTITY: 24-2 = 22
PRODUCT..DC1044-002-EB-8P
PROBLEM: 2 wfrs broke during processing touch down, carrier mis-alignment
Table to head 3 alignment was found to be out, need Field service.
DISPOSITION: last run of lot, 2 other product wafers that were running
were inspected for scratches. 2 wafers placed on another
polisher finished polish, placed with rest of lot for touch up.
CORRECTIVE ACTION: Table head alignment need to be performed.
|
| 62.356 | Incoming step height | YIELD::SHONG | | Thu Aug 29 1996 05:35 | 25 |
| PE PEX NOTIFICATION
LOT # XE0529
QUANTITY: 24
OPERATION # 3078 Incoming_Step_Height
/DESCR.
POLISHER: N/A
EVAL TOOL: Profiler.A2
DATE: 08/29/96 D-Shift
PROBLEM: Incoming step height was low for 2 out of 4 sites. The LCL
for incoming step height is 3000�. The actual for 2 measurement
points was 2940� and 2976�. The other two points were above the
LCL(~3020�).
DISPOSITION: Sent the lot on.
CORRECTIVE None.
ACTION:
|
| 62.357 | JL0435 OVER-POLISHED @ILD2 | YIELD::PHESTER | | Thu Aug 29 1996 20:15 | 45 |
|
CMP PEX
LOT #: JL0435
QUANTITY: 24
OPERATION # 3274 POST THICKNESS ILD2
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 08/29/96
PROBLEM: LOT OVERPOLISHED @ILD2
OUTGOING THICKNESS WAS 5106�.
LOWER CONTROL LIMIT IS 5200�
DISPOSITION: LOT INCOMING MEAN THICKNESS WAS GOOD AT 17996�. RANGE WAS
WITHIN CONTROL LIMITS BUT SOMEWHAT HIGHER THAN USUAL AT 792�.
NOTHING ABNORMAL FOUND IN PROCESSING. SEND AHEAD WAFERS
WERE POLISHED AND MFG TECH ADVISED THAT ONE WAS A BIT LOW.
REMAINDER OF LOT WAS POLISHED NORMALLY. AFTER POLISHING
OF THE FIVE WAFERS READ TWO WERE IN SPEC AND THREE WERE
BELOW THE LCL (SEE BELOW). THIS IS ATTRIBUTED TO HIGHER
THAN NORMAL INCOMING RANGE ON THE LOT. THE AVERAGE INCOMING
RANGE FOR THIS OPERATION IS 439� FROM THE CHART.
THK_ME_5 WAFER #1 5282.000
WAFER #2 4844.000
WAFER #3 5157.000
WAFER #4 4809.000
WAFER #5 5442.000
LOT WAS MOVED ON.
CORRECTIVE
ACTION: LOT WAS REMARKED AT 2172 DEP_ILD2 FOR POSSIBLE EXTRA DEP.
|
| 62.358 | JL0457 LOW INCOMING STEP @ILD1 | YIELD::PHESTER | | Fri Aug 30 1996 18:22 | 27 |
|
PE PEX NOTIFICATION
LOT # JL0457
QUANTITY: 24
OPERATION # 3193 STEP_ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 08/30/96 C-Shift
PROBLEM: LOW INCOMING STEP ....ILD1
LOT INCOMING STEP AVG = 9612�
LCL IS 9600�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.359 | Pex for high range. | YIELD::SHONG | | Sat Aug 31 1996 06:20 | 22 |
| PE PEX NOTIFICATION
LOT # JD0482
QUANTITY: 23
OPERATION # 2951 THK_CMP 2 THK_PMD_PRE
/DESCR.
POLISHER: N/A
EVAL TOOL: Thickness.A5
DATE: 08/31/96 D-Shift
PROBLEM: Incoming range was high at 1117. The LCL is 1000.
DISPOSITION: Sent the lot on.
CORRECTIVE Sorted wafers to specific thickness at touch-up.
ACTION:
|
| 62.360 | XD0536 LOW INCOMING STEP @PMD | YIELD::PHESTER | | Thu Sep 05 1996 15:55 | 27 |
|
CMP PEX
LOT # XD0536
QUANTITY: 20
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 09/04/96 C-Shift
PROBLEM: LOW INCOMING STEP HEIGHT @PMD
LOT INCOMING STEP AVG = 3229�
LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.361 | Low incoming step height. | YIELD::SHONG | | Sat Sep 07 1996 03:36 | 23 |
| PE PEX NOTIFICATION
LOT # XD0531
QUANTITY: 22
OPERATION # 3078 STEP_CMP 1
/DESCR.
POLISHER: N/A
EVAL TOOL: Profiler.A2
DATE: 09/06/96 D-Shift
PROBLEM: Incoming step height for PMD was low. The LCL is 3000�. The lot
came in at ~2900�.
DISPOSITION: Sent the lot on.
CORRECTIVE None.
ACTION:
|
| 62.362 | Low incoming step height. | YIELD::SHONG | | Sat Sep 07 1996 03:37 | 23 |
| PE PEX NOTIFICATION
LOT # XD0538
QUANTITY: 22
OPERATION # 3078 STEP_CMP 1
/DESCR.
POLISHER: N/A
EVAL TOOL: Profiler.A2
DATE: 09/06/96 D-Shift
PROBLEM: Incoming step height for PMD was low. The LCL is 3000�. The lot
came in at ~2900�.
DISPOSITION: Sent the lot on.
CORRECTIVE None.
ACTION:
|
| 62.363 | JL0474 OVER POLISH ILD1 | SUBPAC::KULP | | Sun Sep 08 1996 07:23 | 36 |
|
LOT: JL0474
MACHINE: CMP.B3
OPER#: 3114 THK_CMP 8 THK_ILD1_PST
PROCESS LEVEL: ILD1
DATE: 9/08/96
SHIFT: B-SHIFT
QUANTITY: 24
PRODUCT..DC1044-003-EB-8P
EVAL TOOL: THICKNESS.A5
PROBLEM: Lot overpolished @ILD1
Lower control limit is 5200�
DISPOSITION: Lot incoming mean thickness was good at 18312�. Range was good
also at 536. Nothing abnormal found in processing.
THK_ME_5 WAFER #1 5222.000
WAFER #2 5663.000
WAFER #3 5238.000 9/08/96 03:17:24
WAFER #4 5021.000
WAFER #5 5089.000
THK_RG JL0474 1414.000
CORRECTIVE ACTION: Lot was remarked at 2166 DEP_ILD2 for possible extra dep.
|
| 62.364 | xd0520, high stdev | SUBPAC::KULP | | Sun Sep 08 1996 07:39 | 36 |
|
CMP PEX
LOT #: XD0520
QUANTITY: 24
OPERATION # 3066 THK_CMP 11 THK_ILD2_PST
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 09/08/96 B-SHIFT
PROBLEM: Outgoing thickness STD was 12.3
UCL: 10
THK_SD_5 WAFER #1 10.200
WAFER #2 14.400
WAFER #3 12.800
WAFER #4 N/A 9/07/96 23:29:33
WAFER #5 11.800
DISPOSITION: Lot moved out, mean and range chart center of spec.
CORRECTIVE None
ACTION:
|
| 62.365 | JL0493 1 broken wafer | SUBPAC::KULP | | Tue Sep 10 1996 07:42 | 24 |
|
CMP PEX
LOT #: JL0493
QUANTITY: 24-1= 23
OPERATION # 1984 CMP_L_PMD CMP
POLISHER: CMP.B2
EVAL TOOL:
DATE: 09/10/96 B-SHIFT
PROBLEM: 1 wafer broke when endload flipper dropped a wafer.
DISPOSITION: Lot moved out, with 1 less wafer.
CORRECTIVE EE checked system, nothing unusual
ACTION:
|
| 62.366 | JD0497 High INCOMING STEP ....ILD1 9680� | SUBPAC::KULP | | Tue Sep 10 1996 08:05 | 27 |
|
PE PEX NOTIFICATION
LOT # JD0497
QUANTITY: 6
OPERATION # 3079 STEP_CMP 2 STP_ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 09/10/96 B-Shift
PROBLEM: High INCOMING STEP ....ILD1
LOT INCOMING STEP AVG = 9680�
LCL IS 9600�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.367 | XD0516, 3066 THK_ILD2_PST Popped chart thickness STD | SUBPAC::KULP | | Wed Sep 11 1996 05:10 | 38 |
|
CMP PEX
LOT #: XD0516 TM0069-032-BA-8C
QUANTITY: 19
OPERATION # 3066 THK_CMP 11 THK_ILD2_PST 3
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 09/11/96 B-SHIFT
PROBLEM: Popped chart thickness STD was 12.34, UCL: 10
THK_ME_5 WAFER #1 5100.000
WAFER #2 6206.000
WAFER #3 5288.000
WAFER #4 5509.000
WAFER #5 5095.000
THK_RG XD0516 1442.000
LOG AN EVENT THK_SD_5 WAFER #1 13.200 9/11/96 02:32:10
WAFER #2 10.900
WAFER #3 10.900
WAFER #4 12.900
WAFER #5 13.800
DISPOSITION: Lot moved out, mean and range chart in spec.
CORRECTIVE None
ACTION:
|
| 62.368 | XM0515, 3066 THK_ILD2_PST Popped chart thickness STD | SUBPAC::KULP | | Wed Sep 11 1996 05:37 | 36 |
|
CMP PEX
LOT #: XM0515 TM0069-000-CA-8C
QUANTITY: 20
OPERATION # 3066 THK_CMP 11 THK_ILD2_PST 3
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 09/11/96 B-SHIFT
PROBLEM: Popped chart thickness STD was 13.96, UCL: 10
THK_ME_5 WAFER #1 5747.000
WAFER #2 5408.000
LOG AN EVENT WAFER #3 5490.000 9/11/96 00:56:30
WAFER #4 4977.000
WAFER #5 5101.000
THK_RG NA 2612.000
THK_SD_5 WAFER #1 13.200
WAFER #2 13.700
WAFER #3 12.900
WAFER #4 16.800
WAFER #5 13.200
DISPOSITION: Lot moved out, mean and range chart in spec.
CORRECTIVE None
ACTION:
|
| 62.369 | over polish | SUBPAC::KULP | | Wed Sep 11 1996 08:19 | 167 |
|
CMP PEX
LOT #: JD0482 DC1026-000-DJ-8G
QUANTITY: 21
OPERATION # 1981 CMP_ILD1 CMP 2
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 09/11/96 B-SHIFT
PROBLEM: 1 wafer over polished. wafer # 5 had 801 Ang.
It appears that the lot was over dep'd. Lot was split at
CMP on 2 systems to run two different thickness.
Below is the remark from 2129 DEP_ILD1 2 and on the
next page a description from the operation tech.
Current Remark : Lot = JD0482 Rte = N/A Oper = 3014
User = R_LAAKKO Pro = DC1026-000-DJ-8G Op Des = THK_ILD1 2
Start Date/Time = 10-SEP-1996 18:08 End Date/Time = ....perpetual....
Ignore previous remark in which a lot split was proposed. Instead,
we will send lot on for CMP with a warning that 9 wafers appear to
be much thicker than normal and request that they polish back as needed.
Normal on-product thk reading at this level (Op 3014) is 18kA +/- 1k
NCM #618.01has been Entr'd and Disp'd.
Wafer thicknesses by wafer # are:
Wafer# Thickness
1 18033
2 33071
3 17915
4 17916
5 33198
6 33172
7 33184
8 17908
9 17931
10 33135
13 17940
14 17953
15 17965
16 33209
17 17956
18 17915
19 33118
20 33029
21 17929
22 33091
23 17954
DISPOSITION: Lot moved out 1 less wafer.
CORRECTIVE Need to to pre readings.
ACTION:
Ken,
I would like to bring to your attention lot JD0482. There is a remark
to this lot (ILD1-JD0482-DC1026) at operation #3023.
Wafers #3,4,8,9,13,14,15,17,18,21,23, are at normal thickness (@18k)
Wafers #2,5,6,7,10,16,19,20,22, are at abnormal thickness (@33k)
Now we were told that this was brought to the attention of pss.
We had done the following steps:
1, Verified the lot to make sure the wafers numbers were in its
equal in slot number, (wafer #1 in slot #1, wafer #2 in slot #2 etc...). This
was done using the barcoder.a4, in the cmp room.
2, Separated the lot, wafers at 18k were picked out and
measured 100% on thickness.a5. the results verified that the note was correct
on thickness with these wafers.
3, The wafers @ 33k were not measured on thickness prior to
running on CMP.B2.
4. The mean thickness, and range were entered as data for this
lot by me. I used the data from the 18k wafers. P2 measurements were entered by
me. Also using the data from the 18k wafers.
5. It was decided by me, to run the 18k wafers at 10 seconds
less than normally issued by spec, due to the need of spacers needed to fill up
the voided increments of 5 wafers per run, needed to run on B2. If spacers are
used, this will increase the removal rate, of the particular set of wafers that
run with a spacer.Spec called for an XD_ILD1 lot to run for 140 sec. these
wafers were run for 130 sec. I ran this particular run on B2, and I placed
spacers in the first slot of each run (3 seperate runs).
I had asked a fellow operator to take care of the second part of the
split. and I had told him to run the lot at 300 second to try to take it down
to touch up parameters. Apparently he had taken these requests too literally,
because there was no pre thickness measurment, p2 measurment taken, and the lot
was run for 300 seconds. This was after I had instructed checking the remark,
and treating the two set of wafers like two different lots. And to keep an
careful eye on the thickness range.
Five breakin wafers were used prior to each run, thus taking up the
first five slots.
The two sets were run. here are the thickness per wafer:
SET #1 33k ran for 300 sec
SLOT# WAFER # MEAN RANGE GOF PRE MEAS.(per note only)
#6 #5 801 1191 .20 33198
#7 #6 15522 1844 .24 33172
#8 #7 16119 788 .23 33184
#9 #10 16447 1158 .23 33135
#10 #16 16522 2298 .24 33209
#11 #2 15936 1154 .24 33071
#12 #19 15333 1384 .24 33118
#13 #20 15974 1055 .22 33029
#14 #22 15998 1141 .21 33091
#15 spacer n/a n/a n/a n/a
SET #2 18K ran for 130 sec
SLOT# WAFER # MEAN RANGE GOF PRE MEAS.(per not only)
#6 spacer n/a n/a n/a n/a
#7 #3 6799 616 .23 17915
#8 #4 7167 700 .23 17916
#9 #8 7092 728 .25 17908
#10 #9 7291 411 .26 17931
#11 spacer n/a n/a n/a n/a
#12 #14 6950 646 .25 17953
#13 #15 7386 752 .25 17965
#14 #17 7299 1167 .25 17956
#15 #18 7125 1596 .24 17915
#16 spacer n/a n/a n/a n/a
#17 #23 6878 785 .23 17954
#18 #1 7100 656 .26 18033
#19 #21 7104 688 .24 17929
#20 #13 7301 1004 .24 17940
Looking this over, everything looks ok, and it is, with the exception
of wafer #5. I cannot explain why this wafer either:
1, took off an extreme amount of oxide off ( if prior thk is right).
2, the thickness for this wafer is wrong, (but due to not
having the pre measurement data available, this cannot be proved).
3, other.. let me know because I don't know.
The main reason this is even being considered to be manfactured, is to
let you know the extreme situation with this lot, what was done, what was
issued to be done, and of course, what wasn't done, which forces me to write
this to begin with.
Wafer # 5 needs to be scrapped out. the rest of the lot is
going to touch up and barring any problems, should complete quickly.
Thank you and call me if you need anymore info.
Mark R. Provencher
|
| 62.370 | XE0450 LOW INCOMING STEP @PMD | YIELD::PHESTER | | Sat Sep 14 1996 13:06 | 31 |
|
PE PEX NOTIFICATION
LOT # XE0450
QUANTITY: 24
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 09/14/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 2746�
LCL IS 3000�
DISPOSITION: LOT RUNNING ON CMP.A2
CORRECTIVE
ACTION NONE
|
| 62.371 | oper# 3053 THK_ILD2_PRE THK_RG high reading | SUBPAC::KULP | | Sun Sep 15 1996 07:47 | 29 |
|
CMP PEX
LOT #: XE0530 TM0069-032-BA-8C
QUANTITY: 24
OPERATION # 3053 THK_CMP 10 THK_ILD2_PRE
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 09/11/96 B-SHIFT
PROBLEM: Popped chart 3053 THK_ILD2_PRE THK_RG UCL:1000
THK_ME N/A 18016.000
THK_RG N/A 1020.000 <---
LOG AN EVENT EVENT END_RUN FOR ENTITY THICKNESS.A4 9/15/96 02:01:53
DISPOSITION: Lot moved on and polished.
CORRECTIVE None
ACTION:
|
| 62.372 | oper# 3053 THK_ILD2_PRE THK_RG high reading | SUBPAC::KULP | | Sun Sep 15 1996 07:48 | 30 |
|
CMP PEX
LOT #: XE0524 TM0069-032-BA-8C
QUANTITY: 24
OPERATION # 3053 THK_CMP 10 THK_ILD2_PRE
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 09/11/96 B-SHIFT
PROBLEM: Popped chart 3053 THK_ILD2_PRE THK_RG UCL:1000
THK_ME XE0524 18097.000
THK_RG XE0524 1333.000 <----
LOG AN EVENT EVENT END_RUN FOR ENTITY THICKNESS.A4 9/14/96 20:57:13
DISPOSITION: Lot moved on and polished.
CORRECTIVE None
ACTION:
|
| 62.373 | oper# 3120 THK_ILD2_PRE THK_RG high reading | SUBPAC::KULP | | Sun Sep 15 1996 07:56 | 26 |
|
CMP PEX
LOT #: XL0476 DC1044-003-EB-8P
QUANTITY: 24
OPERATION # 3120 THK_CMP 10 THK_ILD2_PRE 3
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 09/11/96 B-SHIFT
PROBLEM: Popped chart 3120 THK_ILD2_PRE THK_RG UCL:1000
THK_ME JL0476 17670.000
COL ENG DATA THK_RG JL0476 1101.000 9/14/96 21:11:10
DISPOSITION: Lot moved on and polished.
CORRECTIVE None
ACTION:
|
| 62.374 | CMP PEX, TWO WAFERS TOASTED FROM XE0530 | SUBPAC::SMARTIN | | Sun Sep 15 1996 17:35 | 31 |
|
LOT: XE0530
MACHINE: CMP.B3
OPER#: 1980
PROCESS LEVEL: ILD-2
DATE: 9/15/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 22
PRODUCT..TM0069-032-BA-8C
PROBLEM: 2 WAFERS WERE SEVERLY OVER POLISHED AT ILD-2. WE BELIEVE THIS WAS A
SHIFT CHANGE PROBLEM ACCORDING TO ART EDTL. TOUCHUP TIME WAS TOO LONG.
DISPOSITION: LOT WILL MOVED LESS TWO WAFERS.
CORRECTIVE ACTION:
|
| 62.375 | oper# 3023 THK_ILD1_PRE high range | SUBPAC::KULP | | Mon Sep 16 1996 02:17 | 28 |
|
CMP PEX
LOT #: JD0498 DC1026-000-DJ-8G
QUANTITY: 24
OPERATION # 3023 THK_CMP 6 THK_ILD1_PRE 3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 09/16/96 B-SHIFT
PROBLEM: Popped chart 3023 THK_ILD1_PRE THK_RG UCL: 1000
THK_ME JD0498 17393.000
THK_RG JD0498 1315.000
LOG AN EVENT EVENT END_RUN FOR ENTITY THICKNESS.A5 9/15/96 21:11:52
DISPOSITION: Lot moved on and polished.
CORRECTIVE None
ACTION:
|
| 62.376 | CMP PEX, 15 WAFERS SCRAPPED DUE TO OVER POLISH FROM LOTXD0542 | SUBPAC::SMARTIN | | Mon Sep 16 1996 12:52 | 34 |
|
LOT: XD0542
MACHINE: CMP.B1
OPER#: 1981
PROCESS LEVEL: ILD-1
DATE: 9/16/96
SHIFT: A-SHIFT
QUANTITY: 20 DOWN TO 5
PRODUCT..TM0069-032-BA-8C
PROBLEM: 15 WAFERS WERE SEVERLY OVER POLISHED AT ILD-1.
THIS WAS AN OPERATOR ERROR. HE SHOULD HAVE DONE JUST A TOUCH UP
BUT INSTEAD HE DID A FULL POLISH TIME FOR THE TOUCH UP.
DISPOSITION: LOT WILL MOVED LESS 15 WAFERS.
CORRECTIVE ACTION: PLEASE TRY TO BE VERY CAREFULL AND DOUBLE CHECK WHAT STEP
YOU ARE POLISHING AND ALSO POLISH TIMES FOR THAT STEP
BEFORE RUNNING PRODUCT.
|
| 62.377 | CMP PEX, 5 WAFERS SCRAPPED ON LOT JD0412 | SUBPAC::SMARTIN | | Tue Sep 17 1996 18:25 | 28 |
|
LOT: JD0412
MACHINE: CMP.B1
OPER#: 1987
PROCESS LEVEL: ILD_25
DATE: 9/17/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 19
PRODUCT..DC1026-012-DA-0D
PROBLEM: 5 WAFERS WERE SCRAPPED DUE TO POSSIBLE LOW SLURRY FLOW. ONE WAFER BROKE
AND SCRATCHED THE OTHER FOUR TO DEATH.
DISPOSITION: LOT WILL MOVED LESS 15 WAFERS.
CORRECTIVE ACTION: EE IS LOOKING INTO THE PROBLEM OF THE POSSIBLE LOW SLURRY
FLOW.
|
| 62.378 | JL0514 LOW STEP - INCOMING PMD | YIELD::PHESTER | | Wed Sep 18 1996 12:09 | 29 |
|
CMP PEX
LOT # JL0514
QUANTITY: 24
OPERATION # 3362 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 09/18/96 C-Shift
PROBLEM: LOW INCOMING STEP @PMD
LOT INCOMING STEP AVG B = 4701�
LCL IS 3000�
DISPOSITION: LOT MOVED TO RUN ON CMP.A2
CORRECTIVE
ACTION NONE
|
| 62.379 | Pex for lot JL0510 | YIELD::SHONG | | Thu Sep 19 1996 07:41 | 24 |
| PE PEX NOTIFICATION
LOT # JL0510
QUANTITY: 22
OPERATION # 3362 STP_L_CMP1
/DESCR.
POLISHER: N/A
EVAL TOOL: Profiler.A2
DATE: 09/19/96 D-Shift
PROBLEM: Incoming step height for PMD was high. The UCL is 4200�. The lot
came in at ~4300� for an average.
DISPOSITION: I checked through the remarks but didn't find anything that would
indicate the problem. I sent the lot on.
CORRECTIVE None.
ACTION:
|
| 62.380 | Pex for lot JD0482 | YIELD::SHONG | | Thu Sep 19 1996 08:14 | 23 |
| PE PEX NOTIFICATION
LOT # JL0482
QUANTITY: 20
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: Both (Thickness.A4/A5)
DATE: 09/19/96 D-Shift
PROBLEM: During the initial polish wafer # 14 was over polished.
DISPOSITION: Add a remark at operation 2135 DEP_ILD3 to add an extra 2000�
to wafer #14.
CORRECTIVE None.
ACTION:
|
| 62.381 | JD0377 one wafer scrapped - over polish @ILD4 | YIELD::PHESTER | | Thu Sep 19 1996 16:06 | 36 |
|
CMP PEX
LOT # JD0377 DC1026-012-DA-0D
QUANTITY: 10 (11)
OPERATION # 2001 CMP_ILD4
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5..."NAKED EYE"
DATE: 09/18/96 C-SHIFT
PROBLEM: WAFER RECEIVED HEAVY CENTER POLISH. LOT RAN AT 97/133 (ID/OD) TO
TRY AND AVOID "EDGE HEAVY" REMOVAL. METAL IN THE CENTER OF THE
WAFER WAS TAPPED. ALL OTHER WAFERS CHECKED OUT FINE.
INITIAL POLISH TIME WAS 400 SEC. INCOMING THICKNESS AVERAGE WAS
36,560. IT COULD NOT BE DETERMINED WHAT THE THICKNESS WAS AFTER
THE INITIAL POLISH AS THE GROUPING THAT THE WAFER WAS IN FOR TOUCH
UP COULD NOT BE IDENTIFIED.
DISPOSITION: LOT MOVED ON. WAFER #9 SCRAPPED.
CORRECTIVE: PRODUCTION AGREES THAT A MORE CAREFUL CHECK OF CENTER SITE
ACTION: MEASUREMENTS MAY BE NEEDED PRIOR TO TO TOUCH UP. HAD THIS BEEN
DONE IN THIS CASE, LOW CENTER THICKESS ON THIS PARTICULAR WAFER
MAY HAVE BEEN SPOTTED. THIS IS ONLY THE SECOND LOT OF THIS DEVICE
THAT HAS BEEN POLISHED. SECONDARY POLISH TIMES ON SUBSEQUENT LOTS
OF THIS DEVICE WILL BE MORE CAREFULLY DETERMINED.
|
| 62.382 | JD0501 OVER-POLISH @ILD1 | YIELD::PHESTER | | Fri Sep 20 1996 12:50 | 31 |
|
PE PEX NOTIFICATION
LOT # JD0501
QUANTITY: 24
OPERATION # 3954 THICK CMP
/DESCR.
POLISHER: POST READINGS CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 09/18/96 C-Shift
PROBLEM: LOW POST THICKNESS....ILD1
LOW POST THICKNESS AVG = 5071�
LCL IS 5200�
INITIAL POLISH TIME BROUGHT MOST OF THE LOT TO WITHIN 1000�
OF TARGET. TOUCH UP WAS DONE WITH 1 SEC POLISH USING DIFFERENT
DOWNFORCES PER SPEC.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION NONE. NOT ENOUGH OVER-POLISH FOR EXTRA DEP AT CAP.
|
| 62.383 | JD0481 LOW INCOMING STEP @ILD3 | YIELD::PHESTER | | Sat Sep 21 1996 14:36 | 30 |
|
CMP PEX NOTIFICATION
LOT # JD0481
QUANTITY: 24
OPERATION # 3081 STEP_ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 09/21/96 C-Shift
PROBLEM: LOW INCOMING STEP ....ILD3
LOT INCOMING STEP AVG = 19680�
LCL IS 20000�
DISPOSITION: LOT MOVED ON - RUNNING ON CMP.B2
CORRECTIVE
ACTION NONE
|
| 62.384 | jd0501 4 wfrs scrap overpolish | SUBPAC::KULP | | Sun Sep 22 1996 09:06 | 115 |
|
CMP PEX
LOT #: JD0501 DC1026-000-EA-8G
QUANTITY: 24
OPERATION # 1985 CMP_ILD2 CMP
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 09/22/96 B-SHIFT
PROBLEM: 4 wafer over polish
DISPOSITION: Wafers still need touch up. 4 scrapped wafers
CORRECTIVE None
ACTION:
Ken,
This is regarding lot JD0501, ILD2,1026ea, HOT lot, 24 wafers. The
following items are what had transpired:
1. Lot was checked for remarks, no remarks found.
2, Lot was measured for thickness, on thickness.A5, using the folder
1026. This folder rejected the pattern, so I tried using the folder
1026 ea. This produced good thickness readings, with a proper
goodness of fit. The results were averaged, and range was
calculated.
They were:
AVG - 17600�
RNG.- 754�
3, P2 measurements were taken on profiler.A2. Results are:
C - 9288 e - 9631
C - 9147 e - 9077
4. The wafers that were used for thickness (slots #1,6,13,20,and 23),
were used as send aheads for the lot. They were run on CMP.B1. Five
Fresh "out of the pod" 50k wafers were used as breakin wafers, before
the send aheads were polished. Product was polished for 150 seconds.
5, The send aheads were scrubbed, and remeasured on thickness A5.here
are the results and calculation for removal rate for the lot:
slot # pre_avg_thk post thk removal rate g.o.f
1 17600 9110 3396 .22
2 " " 9175 3369 .22
3 " " 9973 3050 .28
4 " " 9010 3435 .26
5 " " 10142 2983 .27
avg r/r - 3246 calculated run time for the lot - 223 seconds
Note - Normally we would use this time to run the lot. When I run 4
product wafers with a spacer, I will deduct 10 seconds for the
accelerated removal rate that we will get when we use a spacer.
6. I changed the time from 150 second, to 213 seconds on recipe ILD2,
saved it, and double checked it.*note* Notice that I used 213 sec.
instead of the calculated 223 sec.. I had taken 10 second off the
time, for the entire lot.
7. The lot was run for 213 seconds, with the same breakin wafers in the
first five slots. and a new 50k breakin wafer was used as a Spacer,
or dummy wafer, placed in slot #23. upon completion the lot was
scrubbed, and lot 100% measurement was taken on thickness.A5.
The results are as follows:
slot # thk slot # thk slot # thk
1 breakin 9 7859 17 6717
2 breakin 10 8166 18 5610
3 breakin 11 7125 19 6597
4 breakin 12 6685 20 6609
5 breakin 13 6990 21 815
6 8246 14 6839 22 353
7 8411 15 7198 23 breakin/spacer
8 8209 16 6062 24 975
25 1382
* goodness of fit on entire lot was acceptable *
Now if there was an issue of wafers being thin , wouldn't they show up
thin intermittently throughout the lot?
Or if there was a certain carrier taking off too much, they would be
showing up every fifth wafer. The data does show that the removal
rate was creeping up, and we expect the removal rate to typically jump
up somewhat, when we use a spacer wafer to fill out a run. But
not like this.
I even used the time designated, for this set of circumstances, for the
entire lot.
If you have an answer to this please let me know.
wafers #4, #14, #2, and #17 will have to be scrapped out.
Thank you
Mark R. Provencher
|
| 62.385 | JL0487 2 scrapped wfrs over polish | SUBPAC::KULP | | Sun Sep 22 1996 09:19 | 105 |
|
CMP PEX
LOT #: JL0487 DC1044-003-EB-8P
QUANTITY: 24
OPERATION # 1994 CMP_ILD2 CMP
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 09/22/96 B-SHIFT
PROBLEM: 2 wafers over polish
DISPOSITION: Wafers still need touch up. 2 scrapped wafers
CORRECTIVE None
ACTION:
Ken,
This is regaurding lot JL0487, ILD2, DC1044, 24 wafers. The
following items are what had transpired:
1. Lot was checked for remarks, no remarks found.
2. Lot was measured for thickness, on thickness.A4, using the folder
1044. This produced good thickness readings, with a proper
goodness of fit. The results were averaged, and range was
calculated.
They are:
AVG - 18112�
RNG.- 430�
3. P2 measurments were taken on profiler.A2. Results are:
c - 9180 e - 9576
c - 9075 e - 9428
4. The wafers that were used for thickness (slots #1,6,13,20,and 23),
were used as send aheads for the lot. They were run on cmp.B1. Five
decent 50k wafers were used as breakin wafers, before
the send aheads were polished. Product was polished for 150 seconds.
5, The send aheads were scrubbed, and remeasured on thickness A5.here
are the results and calculation for removal rate for the lot:
slot # pre_avg_thk post thk removal rate g.o.f
1 18112 7586 4210 pass
2 " " 7638 4189 pass
3 " " 7957 4062 pass
4 " " 7694 4167 pass
5 " " 7939 4069 pass
avg r/r - 4139 calculated run time for the lot - 182 seconds
Note - Normally we would use this time to run the lot. And when I run 4
product wafers with a spacer, I will deduct 10 seconds for the
excellerated removal rate that we will get when we use a spacer.
6. I changed the time from 150 sec, to 165 seconds on recipe ILD2,
saved it, and double checked it (minus 17 sec.). This time for wafer
slot #11 - #15 I used the ILD1 recipe, with a time of 150 seconds,
(minus 32 seconds of calculated time). and double checked that time.
7. The lot was run for the alotted times,with the same breakin wafers
in the first five slots. and a decent 50k breakin wafer was used
as a Spacer, or dummy wafer, placed in slot #13. upon completion
the lot was scrubbed, and lot 100% measument was taken on thickness.
A4.
The results are as follows:
slot # thk slot # thk slot # thk
1 breakin 9 7395 17 7954
2 breakin 10 7841 18 8028
3 breakin 11 2681 19 7759
4 breakin 12 1673 20 7740
5 breakin 13 breakin/spacer 21 7184
6 7835 14 3410 22 7273
7 7805 15 3503 23 7401
8 7880 16 7621 24 7206
25 7294
Now, this has happened a second time in a row, wafers that were
grouped together with a spacer,(slots #11,12,13,14,15) was run at
less than the time, on the same tool, that was calculated. This
time the time taken off was over 30 seconds.
Thank you
Mark R. Provencher
ex 4774
|
| 62.387 | xd0528 thk_ILD3_PST, popped chart stdv 16.1 | SUBPAC::KULP | | Wed Sep 25 1996 06:51 | 25 |
|
CMP PEX
LOT #: XD0528 TM0069-032-BA-8C
QUANTITY: 24
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST 3
POLISHER: CMP.B3 actually run on B2
EVAL TOOL: THICKNESS.A4
DATE: 09/25/96 B-SHIFT
PROBLEM: Popped chart CMP.B3 THK_ILD3_PST THK_SD_5
UCL: 10 , data point 16.1 Mean and range chart fine.
CMP.B2 had a carrier # 2 and pad changed.
DISPOSITION: Moved lot on
CORRECTIVE Told ops tech to be careful entering data into the right
ACTION: entity
|
| 62.388 | JL0514 - 3114 THK_ILD1_PST 3, popped chart stdv 13.78 UCL:10 | SUBPAC::KULP | | Wed Sep 25 1996 06:56 | 26 |
|
CMP PEX
LOT #: JL0514 DC1044-003-EB-8P
QUANTITY: 24
OPERATION # 3114 THK_CMP 8 THK_ILD1_PST 3
POLISHER: CMP.A2
EVAL TOOL: THICKNESS.A5
DATE: 09/25/96 B-SHIFT
PROBLEM: Popped chart CMP.A2 THK_ILD1_PST THK_SD_5
UCL: 10 , data point 13.78. Mean and range chart fine.
DISPOSITION: Moved lot on
CORRECTIVE None
ACTION:
|
| 62.389 | XEO552 LOW INCOMING STEP @PMD | YIELD::PHESTER | | Thu Sep 26 1996 20:45 | 28 |
|
PE PEX NOTIFICATION
LOT # XE0552
QUANTITY: 17
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 09/26/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 2425�
LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.390 | JD0468 HIGH OUTGOING SD @ILD3 | YIELD::PHESTER | | Fri Sep 27 1996 18:49 | 45 |
|
CMP PEX
LOT #: JD0468
QUANTITY: 24
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 08/21/96
PROBLEM: HIGH SD AVERAGE ON OUTGOING THICKNESS.
RANGE
THK_ME_5 WAFER #1 9303.000 * 5787 .129 gof
WAFER #2 9961.000
WAFER #3 9325.000
WAFER #4 9757.000
WAFER #5 9653.000
THK_RG JD0468 6052.000
THK_SD_5 WAFER #1 26.100
WAFER #2 12.200
WAFER #3 7.790
WAFER #4 9.680
WAFER #5 17.500
* HIGH RANGE ON THIS WAFER WAS CAUSED BY ONE POINT
OUT OF THE NORM. THE GOODNESS OF FIT FOR THIS
POINT WAS LOW. THIS WAS NOT A 1050 RECIPE PROBLEM
AS ALL SUBSEQUENT READINGS IN THIS FOLDER HAD GOOD
FIT.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: CONCLUDED PROCESS EXCURSION WAS DUE TO A POOR READING FOR THE ONE
POINT DISCUSSED ABOVE. NO FURTHER ACTION TAKEN.
|
| 62.391 | XD0554 Popped chart CMP.B3 THK_ILD3_PST THK_SD_5 | SUBPAC::KULP | | Sat Sep 28 1996 07:27 | 26 |
|
CMP PEX
LOT #: XD0554 TM0069-032-BA-8C
QUANTITY: 23
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST 3
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 09/28/96 D-SHIFT
PROBLEM: Popped chart CMP.B3 THK_ILD3_PST THK_SD_5
UCL: 10 , data point 14.080 Mean and range chart fine.
CMP.B3 was running with an older pad, was touched up
on CMP.b2 which had a newer pad to bring in uniformity.
DISPOSITION: Moved lot on
CORRECTIVE None
ACTION:
|
| 62.392 | JL0488 LOW INCOMING STEP @ILD1 | YIELD::PHESTER | | Sat Sep 28 1996 09:17 | 29 |
|
PE PEX NOTIFICATION
LOT # JL0488
QUANTITY: 23
OPERATION # 3193 STEP_ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 09/27/96 C-Shift
PROBLEM: LOW INCOMING STEP ....ILD1
LOT INCOMING STEP AVG = 9632�
LCL IS 9600�
DISPOSITION: LOT MOVED TO POLISH ON CMP.B2
CORRECTIVE
ACTION NONE
|
| 62.393 | JD0500 OPEN PEX - 1 WAFER SCRAPPED | YIELD::PHESTER | | Sat Sep 28 1996 17:06 | 35 |
|
CMP PEX
LOT #: JD0500 DC1026-000-DJ-8G
QUANTITY: 24
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST
POLISHER: SCRUB.A3
EVAL TOOL: N/A
DATE: 09/27/96 06:46 AM D Shift
PROBLEM: One wafer broken on scrubber.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: Unknown. There was no PSS on duty this shift. This
incident was not documented in Notesfile. The EE Tech who
handled the situation left the following morning for vacation
and will not be back until 10/3. Secondhand information
reveals that EE felt is was an operator error in that the
cassette was not properly placed in the recieving platform.
However this is the extent of the information available. No
corrective action to verify the tool is known or verified
although it is assumed that it was thouroughly checked out
before returning to production. This PEX will be completed
when the EE tech can be interviewed.
|
| 62.394 | XE0530 high outgoing range/SD @ILD3.... | YIELD::PHESTER | | Sat Sep 28 1996 17:12 | 64 |
|
CMP PEX
LOT # XE0530 TM69
QUANTITY: 22
OPERATION # 3064 THK_CMP 16 PST READINGS ILD3
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 09/28/96 C-Shift
PROBLEM: HIGH OUT GOING RANGE/SD @ILD3
LOT OUTGOING RANGE = 4741� UCL IS 4500�
LOT OUTGOING STD DEV AVG WAS 13.012 UCL IS 10
THK_ME_5 THK_SD_5 W/W RANGE MIN/MAX GOF
WAFER #1 9958.000 13.400 3093 8201/11,293 >.293
WAFER #2 9507.000 7.960 1922 8540/10462 >.293
WAFER #3 10297.000 13.400 3627 8357/11,984 >.313
WAFER #4 10349.000 15.700 4669 8273/12,942 >.306 *
WAFER #5 9977.000 14.600 3575 8697/12,272 >.285
----------------------------------
THK_RG XE0530 4741.000
STD DEV AVG XE0530 13.012
* Test point 2,7 had the highest thickness at 12,942. Test point 7,2 had
the second lowest thickness at 9086. Both of these coordinates are toward
the edge. Rules out heavy center/edge polish.
Wafer #20 was evaluated on THICKNESS.A4 and again on THICKNESS.A5 with the
folowing results:
THK.A5 (1) THK.A4 THK.A5(2)
COORDINATE 2,7 12,942 12,467 12,940
3,4 11,054 11,598 11,054
5,6 10,142 9,153 10,142
6,4 8,273 8,900 8,276
7,2 9,086 11,047 9,089
7,8 10,595 10,491 10,594
MEAN 10,348 10,639 10,349
RANGE 4,669 3,747 4,665
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: NONE. MAJORITY OF RANGE/SD PROBLEM IS WITHIN WAFER (W/W). ALSO
THERE IS A LARGE DISCREPANCY BETWEEN EVALUATION TOOLS.
|
| 62.395 | JD0506 2 broke wfrs slurry loss | SUBPAC::KULP | | Sun Sep 29 1996 07:32 | 36 |
|
CMP PEX
LOT #: JD0506 DC1026-000-DJ-8G
QUANTITY: 24-2= 22
OPERATION # 1981 CMP_ILD1 CMP
POLISHER: CMP.A1
EVAL TOOL: n/a
DATE: 09/29/96 B-SHIFT
PROBLEM: Broke 2 wafers, lost slurry.
DISPOSITION: Wafers have not complete polish waiting on MQC's
CORRECTIVE None
ACTION:
Note 15.1 STRASBAUGH GENERAL ISSUES 1 of 1
LUDWIG::RIDLON "Eliminate the oblivious" 11 lines 29-SEP-1996
03:59
-< slurry loss >-
Both tools crashed tonight (A1 @1, A2 @1:30) as a result of loosing slurry
to the room. Ahsland was called and responded in a timely manner. His
report was that the filter had clogged (which was changed on Friday).
Two product wafers were lost per tool.
B-shift
|
| 62.396 | xe0541 2 broke wfrs slurry loss | SUBPAC::KULP | | Sun Sep 29 1996 07:36 | 36 |
|
CMP PEX
LOT #: XE0541 TM0069-007-BA-8C
QUANTITY: 16-2 = 14
OPERATION # 1981 CMP_ILD1 CMP
POLISHER: CMP.A2
EVAL TOOL: n/a
DATE: 09/29/96 B-SHIFT
PROBLEM: Broke 2 wafers, lost slurry.
DISPOSITION: Wafers have not complete polish waiting on MQC's
CORRECTIVE None
ACTION:
Note 15.1 STRASBAUGH GENERAL ISSUES 1 of 1
LUDWIG::RIDLON "Eliminate the oblivious" 11 lines 29-SEP-1996
03:59
-< slurry loss >-
Both tools crashed tonight (A1 @1, A2 @1:30) as a result of loosing slurry
to the room. Ahsland was called and responded in a timely manner. His
report was that the filter had clogged (which was changed on Friday).
Two product wafers were lost per tool.
B-shift
|
| 62.397 | CMP PEX,2 WAFERS CRASHED FROM LOT JD0524 | SUBPAC::SMARTIN | | Mon Sep 30 1996 15:55 | 46 |
|
LOT: JD0524
MACHINE: CMP.A2
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 9/30/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 22
PRODUCT..DC1026-041-DJ-8G
PROBLEM: 2 CRASHED WAFERS ON THE PAD. NEEDS PAD/CARRIER
CHANGE.....
DISPOSITION: LOT WILL MOVED LESS 2 WAFERS.
CORRECTIVE ACTION: PAD AND CARRIER CHANGE.
PARAMETERS:
1) System: A2
2) Recipe: PMD
3) Step #: #3
4) Time into step: 10 SEC.
5) Type of wafers that broke: PRODUCT
6) Carrier which wafer slid out of: RIGHT
7) Other carriers that were damaged: BOTH
8) Alarms displayed by polisher: RIGHT SPINDLE NOT ARRIVING UP.
9) Did any other polisher error for slurry or crash: NO, systems____________
10) Did wafer detect work: N/A
11) # of wafers on pad: 300
12) # of wafers on carrier: 150
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: YES
15) Check step hight of the carrier from question #6: TRASHED
16) Please note any other unusual circumstances: NONE
|
| 62.398 | CMP PEX,4 WAFERS OVER POLISHED ON LOT JL0509 | SUBPAC::SMARTIN | | Tue Oct 01 1996 17:25 | 26 |
|
LOT: JL0509
MACHINE: CMP.B1
OPER#: 1994
PROCESS LEVEL: ILD-2
DATE: 10/1/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 20
PRODUCT...DC1040-001-DB-8P
PROBLEM: 4 WAFERS WERE OVER POLISHED DUE TO THE FACT THAT THE CARRIERS STOPPED
ROTATING DURING THE POLISH. TOOL IS DOWN FOR CARRIERS NOT ROTATING.
DISPOSITION: LOT WILL BE MOVED LESS 4 WAFERS.
CORRECTIVE ACTION: EE IS LOOKING INTO WHAT THE PROBLEM MIGHT BE
|
| 62.399 | JD0526 SLIGHT OVER-POLISH @PMD | YIELD::PHESTER | | Thu Oct 03 1996 11:16 | 47 |
|
CMP PEX
LOT #: JD0526 DC1026-000-DJ-8G
QUANTITY: 24
OPERATION # THK_PMD_PST
POLISHER: CMP.A1
EVAL TOOL: N/A
DATE: 10/02/96 C Shift
PROBLEM: LOT OUTGOING THICKNESS AVERAGE WAS 6197�. LCL IS 6200�.
THICKNESS RANGE GOF
THK_ME_5 WAFER #1 6210.000 1162 .215
WAFER #2 6032.000 961 .259
WAFER #3 6258.000 483 .191
WAFER #4 6576.000 743 .190
WAFER #5 5912.000 696 .252
THK_RG JD0526 1468.000
THK_SD_5 WAFER #1 6.200
WAFER #2 5.300
WAFER #3 2.900
WAFER #4 4.000
WAFER #5 4.300
REMOVAL RATE FOR SEND AHEAD WAFERS WAS LEFT: 1300 �PM
RIGHT: 1200 �PM
TOUCH-UP PERFORMED USING ABOVE RATES.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: MFG. HAS REPORTED CONTROL PROBLEMS SINCE A SLURRY FLUSH/CHANGE
ON 9/27. THIS HAS BEEN PRIMARILY DUE TO LOW REMOVAL RATES.
HOWEVER REMOVAL RATES ON THIS TOOL ARE ABOVE THE CONTROL LIMIT AND
WELL IN SPEC. GOODNESS OF FIT FOR THICKNESS READINGS WAS HIGH
AND CONSISTENT. THIS WAS A MINOR OVER-POLISH AND NO ACTION WAS
TAKEN.
|
| 62.400 | JD0533 HIGH OUTGOING SD @ILD2 | YIELD::PHESTER | | Thu Oct 03 1996 18:38 | 42 |
|
CMP PEX
LOT # JD0533 DC1026 EA
QUANTITY: 24
OPERATION # 3054 THK_CMP 16
/DESCR.
POLISHER: CMP.B3 PST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 10/3/96 C-Shift
PROBLEM: HIGH OUT GOING RANGE ILD2
LOT OUTGOING STD % = 10% ~ UCL IS 10%
*** LOT OUTGOING RANGE WAS W/IN SPEC AT 2658�. ***
- FINAL MEASUREMENTS WERE,
THICKNESS SD RANGE
WAFER# 1 5854 8.54
2 5184 6.87
3 5857 10.0
4 5570 11.0
5 4916 13.8
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: NONE. ATTEMPT TO CHECK GOF AND RANGE FOR THIS LOT UNSUCCESSFUL.
ENGINEERING WAS PERFORMING AN OPTIMIZATION ON THE UV1050 AND
THIS DATA WAS OVER WRITTEN. THE PROBLEM BEING WORKED ON WAS
THAT THE TOOL WAS NOT THROWING OUT DATA POINTS WITH BAD GOF.
THIS WOULD CAUSE RANGE AND SD TO BE ARTIFICIALLY HIGH IN SOME
CASES. THIS WAS POSSIBLY THE CASE HERE.
|
| 62.401 | JD0557 LOW INCOMING STEP HEIGHT | YIELD::PHESTER | | Sat Oct 05 1996 20:01 | 30 |
|
CMP PEX
LOT #:JD0557
QUANTITY: 24
OPERATION # 3078
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: 10/5/96
PROBLEM: LOW INCOMING STEP HEIGH AVERAGE AT 2922� PMD
LCL (LCL=3000�)
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: NONE
|
| 62.402 | JD0548 two wafers scrapped | YIELD::PHESTER | | Sat Oct 05 1996 20:06 | 27 |
|
CMP PEX
LOT #: JD0548
QUANTITY: 20
OPERATION # 2957
POLISHER: N/A
EVAL TOOL: N/A
DATE: 10/5/96
PROBLEM: TWO WAFERS SCRAPPED WHEN THEY SLIPPED OUT OF CASSETTE WHILE MFG
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: NONE
|
| 62.403 | XE0541 HIGH OUTGOING SD @ILD2 | YIELD::PHESTER | | Sat Oct 05 1996 20:11 | 37 |
|
CMP PEX
LOT # XE0541
QUANTITY: 14
OPERATION # 3066 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 10/5/96 C-Shift
PROBLEM:
LOT OUTGOING STD % = 12.5%~ UCL IS 10% ILD2
- FINAL MEASUREMENTS -
SLT MEAN STD%
1- 5651 12.9
6- 5837 12.3
13- 5640 12.4
20- NA
23- NA
LOT LOOKED GOOD R=1657
DISPOSITION: LOT MOVED ON
CORRECTIVE ACTION: LOW REMOVAL RATES HAVE BEEN CAUSING POLISHING PROBLEMS
THIS IS BEING ADDRESSED.
|
| 62.404 | JL0517 high outgoing SD @ILD2 | YIELD::PHESTER | | Sat Oct 05 1996 20:15 | 35 |
|
CMP PEX
LOT # JL0517
QUANTITY: 12
OPERATION # 3274 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 10/5/96 C-Shift
PROBLEM:
LOT OUTGOING STD % = 11.3%~ UCL IS 10% ILD2
- FINAL MEASUREMENTS -
SLT MEAN STD%
1- 5849 8.93
6- 5679 14.3
13- 5850 12.3
20- NA
23- NA
LOT LOOKED GOOD R=1643,
DISPOSITION: LOT MOVED ON
CORRECTIVE ACTION: LOW REMOVAL RATES HAVE BEEN CAUSING POLISHING PROBLEMS
THIS IS BEING ADDRESSED.
|
| 62.405 | jd0557 2 wfrs broke cmp.a1 | SUBPAC::KULP | | Sun Oct 06 1996 08:41 | 33 |
|
CMP PEX
LOT #: JD0557 DC1026-000-EA-8G
QUANTITY: 24-2 = 22
OPERATION # 864 FURN_PMD
POLISHER: CMP.A1
EVAL TOOL: n/a
DATE: 10/06/96 B-SHIFT
PROBLEM: Broke 2 wafers, unknown
DISPOSITION: happened @ 19:30 no information left at passdown
CORRECTIVE None
ACTION:
Note 5.263
Tool had crashed just before passdown. Did a visual and could find no
evidence for a reason. Pad was flat, it was product, slurry in lines,
and no way to tell if it was the carriers or not. Changed everything
except for the conditioner disk. Pad cond x10. Gave back for
bkin/mqc's.
B-shift
|
| 62.406 | cmp.a2 2 broken wfrs | SUBPAC::KULP | | Mon Oct 07 1996 08:32 | 34 |
|
CMP PEX
LOT #: JD0559 DC1026-000-EA-8G
QUANTITY: 24-2 = 22
OPERATION # 1978 CMP_PMD CMP
POLISHER: CMP.A2
EVAL TOOL: n/a
DATE: 10/07/96 B-SHIFT
PROBLEM: Broke 2 wafers, loss of slurry
DISPOSITION: wafers finished polish, then sent to touch up
CORRECTIVE None
ACTION:
Note 7.239
CRASH, and just like that two product wafers turned to sand. Root cause
for crash suspected to be slurry flow. Air bubbles found in supply line
in rear vmb. CDU in slurry room pumping very slowly. Called ashland.
Filters switched and flow came back to normal.
New pad, carriers, cond disk. Needs mqc's.
B-shift
|
| 62.407 | xe0557 broke 1 wfr CMP_SCRUB1.a1 | SUBPAC::KULP | | Tue Oct 08 1996 10:36 | 32 |
|
CMP PEX
LOT #: XE0557 PRODUCT...TM0069-007-BA-8C
QUANTITY: 24-1 = 23
OPERATION # 1979 CMP_SCRUB1
POLISHER: n/a
EVAL TOOL: n/a
DATE: 10/08/96 05:39:43
PROBLEM: Broke 1 wafer
DISPOSITION: wafers moved on
CORRECTIVE EE fixed CMP-SCRUB.A1
ACTION:
Note 36.143
Dropped and broke a product a wafer. Found that the robot was too high
over the lifter and the wafers were dropping into the blade. Increased
the "robot at rcv" calibration by 5 counts. Observed several wafers
unload and all looked good.
B-shift
|
| 62.408 | 4 wafer overpolish 3 scrap JD0533 | SUBPAC::KULP | | Wed Oct 09 1996 09:25 | 28 |
|
CMP PEX
LOT #: JD0533 PRODUCT...DC1026-000-EA-8G
QUANTITY: 24-3 = 21
OPERATION # 1979 CMP_SCRUB1
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 10-9-96 b shift
PROBLEM: 4 wafers were over polished at touch up. Breakin wafer
was used and times were not reduced for using breaakin.
wfr10: 3159
wfr 9: 3150
wfr12: 3408
wfr 7: 2770
DISPOSITION: wafers 10, 9 and 7 were scrapped out < 3400
wfr 12 was remarked for additional dep.
CORRECTIVE Reminded ops tech to reduce time when using dummy wafer
|
| 62.409 | CMP PEX, TWO WAFERS OVER POLISHED ON LOT JD0523 | SUBPAC::SMARTIN | | Wed Oct 09 1996 18:29 | 28 |
|
LOT: JD0523
MACHINE: CMP.B3
OPER#: 1985
PROCESS LEVEL: ILD-2
DATE: 10/9/96
SHIFT: A-SHIFT
QUANTITY: 23 DOWN TO 21
PRODUCT...DC1026-041-DJ-8G
PROBLEM: 2 WAFERS WERE OVER POLISHED. OPERATOR BELIEVES THAT THEY CAME INTO
THE AREA TOO THIN. PROBLEM WAS FOUND WHEN A 100% WAS DONE ON THE LOT.
DISPOSITION: LOT WILL BE MOVED LESS 2 WAFERS.
CORRECTIVE ACTION: NONE
|
| 62.410 | XD0534 LOW OUTGOING THICKNESS @PMD | YIELD::PHESTER | | Sat Oct 12 1996 18:12 | 28 |
|
PE PEX NOTIFICATION
LOT # XD0534
QUANTITY: 22
OPERATION # 2957 POST THICKNESS-PMD
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 10/10/96 C-Shift
PROBLEM: LOW POST THICKNESS....PMD
LOT POST THICKNESS AVG = 6187�
LCL IS 6200�
DISPOSITION: LOT POLISHED ON CMP.B3, RAN FOR 15 SECONDS.
CORRECTIVE
ACTION LOT MOVED ON
|
| 62.411 | JL0531 HIGH OUTGOING SD @ ILD2 | YIELD::PHESTER | | Sat Oct 12 1996 18:15 | 38 |
|
CMP PEX
LOT # JL0531
QUANTITY: 23
OPERATION # 3274 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 10/10/96 C-Shift
PROBLEM:
LOT OUTGOING STD % = 10.93%~ UCL IS 10%
- FINAL MEASUREMENTS -
SLT MEAN STD%
1- 5820 10.7
6- 5590 10.8
13- 5387 11.0
20- 5064 11.7
23- NA
LOT LOOKED GOOD R=2645
DISPOSITION: LOT MOVED ON. MANY LOTS WITH HIGH SD RECENTLY. THERE HAVE BEEN
PROBLEMS WITH SLURRY COMPOSITION BUT THESE ARE BELIEVED TO HAVE
BEEN RESOLVED. PE IS AWARE.
CORRECTIVE
ACTION: NONE
|
| 62.412 | JD0548 HIGH OUTGOING SD @ILD1 | YIELD::PHESTER | | Sat Oct 12 1996 18:17 | 33 |
|
CMP PEX
LOT # JD0548
QUANTITY: 20
OPERATION # 3054 POST THICKNESS-ILD1
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 10/11/96 C-Shift
PROBLEM: HIGH % DEV. POST
POST % DEV. AVG= 18.2�
LCL IS 10.0�
LOT POLISHED ON CMP.B3
DISPOSITION: LOT MOVED ON. MANY LOTS WITH HIGH SD RECENTLY. THERE HAVE BEEN
PROBLEMS WITH SLURRY COMPOSITION BUT THESE ARE BELIEVED TO HAVE
BEEN RESOLVED. PE IS AWARE.
CORRECTIVE
ACTION NONE
|
| 62.413 | XD0558 HIGH OUTGOING SD @ILD2 | YIELD::PHESTER | | Sat Oct 12 1996 18:19 | 39 |
|
CMP PEX
LOT # XD0558
QUANTITY: 21
OPERATION # 3066 POST THICKNESS.A5
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 10/12/96 C-Shift
PROBLEM: HIGH % DEV POST THICKNESS ILD-2
POST % DEV AVG=11.4� UCL@ 10.0�
LOT POLISHED ON CMP.B3
DISPOSITION: WAFER # % DEV
1 9.5
2 11.3
3 13.0
4 11.3
5 12.3
RANGE WAS GOOD.
LOT MOVED ON. MANY LOTS WITH HIGH SD RECENTLY. THERE HAVE BEEN
PROBLEMS WITH SLURRY COMPOSITION BUT THESE ARE BELIEVED TO HAVE
BEEN RESOLVED. PE IS AWARE.
CORRECTIVE
ACTION NONE
|
| 62.414 | CMP PEX, A1 CRASHED, TWO WAFERS BROKEN ON JD0576 | SUBPAC::SMARTIN | | Sun Oct 13 1996 17:43 | 56 |
|
LOT: JD0576
MACHINE: CMP.A1
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 10/13/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 22
PRODUCT...DC1026-000-JA-8G
PROBLEM: TWO PRODUCT WAFERS CRASHED ON PAD.
DISPOSITION: LOT WILL BE MOVED LESS 2 WAFERS.
SYSTEM STATUS:
1) System __CMP.A1___
2) Recipe __PMD______
3) Step # _3___
4) Time into step __25__
5) Type of wafers that broke _PRODUCT (PMD LOT AT TOUCHUP).
6) Carrier which wafer slid out of _LEFT_
7) Other carriers that were damaged _BOTH___
8) Alarms displayed by polisher _ROTATE AXIS ERROR
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _NO_, sysytems____________
10) # of wafers on pad __58__
11) # of wafers on carrier __43__
12) Was there any vibration prior to the crash __NO__
13) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table __YES____
14) Check step height of the carrier from question #6 _ 7.0 (SEE
QUESTION#15)
15) Please note any other unusual circumstances:
FOUND SCREW MISSING FROM WHITE RETAINER RING ON LEFT CARRIER. STEP HEIGHT
AT THIS POINT WAS 2.0MIL VS 7.0MIL AROUND THE REST OF THE CARRIER. IT'S
VERY POSSIBLE THIS CONTRIBUTED TO THE WAFER LOSS.
16) Put this check sheet in CMP note #9 - DONE
CORRECTIVE ACTION: NEW PAD AND CARRIERS.
|
| 62.415 | CMP PEX,2 WAFERS SCRATCHED TO DEATH ON JD0580 | SUBPAC::SMARTIN | | Sun Oct 13 1996 19:48 | 56 |
|
LOT: JD0580
MACHINE: CMP.A2
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 10/13/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 22
PRODUCT...DC1026-000-JA-8G
PROBLEM: WITNESSED WAFER SLIP OUT FROM LEFT CARRIER AND SLIDE UNDER RIGHT
CARRIER. EMO'D TOOL BEFORE WAFERS BROKE, BUT BOTH WERE SCRATCHED BEYOND
SAVING. REPLACING PAD/CARRIERS.
DISPOSITION: LOT WILL BE MOVED LESS 2 WAFERS.
SYSTEM STATUS:
1) System __CMP.A2___
2) Recipe __PMD______
3) Step # _3___
4) Time into step __2___
5) Type of wafers that broke _PRODUCT (PMD LOT AT TOUCHUP).
6) Carrier which wafer slid out of _LEFT_
7) Other carriers that were damaged _BOTH___
8) Alarms displayed by polisher NONE-----------------------------------------
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _NO_, sysytems____________
10) # of wafers on pad _322__
11) # of wafers on carrier _193__
12) Was there any vibration prior to the crash __NO__
13) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table __YES____
NEWMAIL
14) Check step height of the carrier from question #6 _ 6.5MILS
15) Please note any other unusual circumstances:
WITNESSED WAFER SLIP OUT FROM LEFT CARRIER AND SLIDE UNDER RIGHT
CARRIER. EMO'D TOOL BEFORE WAFERS BROKE, BUT BOTH WERE SCRATCHED BEYOND
SAVING. REPLACING PAD/CARRIERS.
16) Put this check sheet in CMP note #9 - DONE
CORRECTIVE ACTION: NEW PAD AND CARRIERS.
|
| 62.416 | JL0527 high STdev ILD1 on CMP.B1 | SUBPAC::KULP | | Mon Oct 14 1996 07:45 | 39 |
|
CMP PEX
LOT #: JL0527 PRODUCT..DC1041-001-BA-8P
QUANTITY: 11
OPERATION # 1992 CMP_ILD1
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 10/14/96 00:55:11 B shift
PROBLEM: High STdev = 19.45 UCL = 10
THK_ME_5 WAFER #1 5622.000
WAFER #2 5372.000
WAFER #3 5756.000
WAFER #4 5489.000
WAFER #5 N/A
THK_RG JD0527 3665.000
LOG AN EVENT THK_SD_5 WAFER #1 16.100 10/14/96 00:55:11
WAFER #2 20.200
WAFER #3 17.600
WAFER #4 23.900
WAFER #5 N/A
DISPOSITION: The range was high. This lot was inherited from A shift. Not
sure all that happened with initial polish and touch up. Checked measurements
on the UV1050, all the sites were measured but GOF doesn't get captured for
some reason. I was getting a File error. Could see any thing else why Stdev
was so high.
CORRECTIVE Moved lot on
ACTION:
|
| 62.417 | JD0560 high stdev ILD1 CMP.B3 | SUBPAC::KULP | | Mon Oct 14 1996 07:45 | 32 |
| CMP PEX
LOT #: JD0560 PRODUCT..DC1026-000-EA-8G
QUANTITY: 23
OPERATION # 1981 CMP_ILD1 CMP
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 10/14/96 01:28:07 B shift
PROBLEM: High STdev = 10.62 UCL = 10,
THK_ME_5 WAFER #1 5708.000
WAFER #2 5631.000
LOG AN EVENT WAFER #3 5963.000 10/14/96 01:28:07
WAFER #4 5706.000
WAFER #5 5106.000
THK_RG JD0560 2126.000
THK_SD_5 WAFER #1 10.700
WAFER #2 10.800
WAFER #3 13.400
WAFER #4 9.800
WAFER #5 8.400
DISPOSITION: Again GOF did not record on UV1050.
CORRECTIVE none, moved lot on
ACTION:
|
| 62.418 | CMP PEX, TWO WAFERS BROKE ON XE0541 | SUBPAC::SMARTIN | | Tue Oct 15 1996 18:03 | 26 |
|
LOT: XE0541
MACHINE: CMP.B2
OPER#: 1989
PROCESS LEVEL: ILD3
DATE: 10/15/96
SHIFT: A-SHIFT
QUANTITY: 14 DOWN TO 12
PRODUCT...TM0069-007-BA-8C
PROBLEM: WAFER MAPPER BROKE TWO WAFERS.
DISPOSITION: LOT WILL BE MOVED LESS 2 WAFERS.
CORRECTIVE ACTION: SYSTEM WAS CLEANED AND IS GOOD TO GO!
|
| 62.419 | Pex report for XE0557 | YIELD::SHONG | | Thu Oct 17 1996 07:13 | 24 |
| PE PEX NOTIFICATION
LOT # XE0557
QUANTITY: 18
OPERATION # 1981 CMP_ILD1
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: Thickness.A5
DATE: 10/17/96 D-Shift
PROBLEM: Standard deviation for this lot came out at 13.4%. The UCL for
Standard deviation is 13.0%.
DISPOSITION: I checked remarks on this lot and there has been several splits
done on it.
CORRECTIVE Moved lot on.
ACTION:
|
| 62.420 | Pex for lot XE0557 | YIELD::SHONG | | Thu Oct 17 1996 07:14 | 29 |
| PE PEX NOTIFICATION
LOT # XE0557
QUANTITY: 23
OPERATION # 1981 CMP ILD1
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 10/16/96 D-Shift
PROBLEM: There was a miscommunication between the C-Shift operator and
the D-shift operator. There were 5 wafers sitting on the table
when D-shift came in. The D-shift operator thought the C-shift
operator said they were the 5 center heads and they still needed
to be ran. They were the 5 center heads but they had already
been ran. The D-shift operator ran them again. So they've seen
2 segements of 150 seconds.
DISPOSITION: The thickness was read on all 5 wafers which came out real low.
The thickness ranged from 1800� to 2500�. All 5 wafers were
scrapped.
CORRECTIVE Production supervisor is going to follow up on this.
ACTION:
|
| 62.421 | JD0533 HIGH OUTGOING SD @ILD2 | YIELD::PHESTER | | Fri Oct 18 1996 19:19 | 36 |
|
CMP PEX
LOT # JD0533
QUANTITY: 24
OPERATION # 3054 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 10/3/96 C-Shift
PROBLEM: HIGH OUT GOING SD ILD2 DC1026
LOT OUTGOING STD % = 10%~ UCL IS 10%
*** LOT OUTGOING RANGE WAS W/IN SPEC AT 2658�. ***
- FINAL MEASUREMENTS WERE,
5854 8.54
5184 6.87
5857 10.
5570 11.
4916 13.8
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: NONE. SD WAS JUST AT UCL AND RANGE WAS GOOD
|
| 62.422 | JD0526 HIGH INCOMING STEP @ILD2 | YIELD::PHESTER | | Fri Oct 18 1996 19:23 | 29 |
|
CMP PEX
LOT # JD0526
QUANTITY: 24
OPERATION # 3080 STEP ILD2
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 10/18/96 C-Shift
PROBLEM: HIGH INCOMING STEP HEIGHT...ILD2
HIGH INCOMING STEP AVG = 9669�
UCL IS 9600�
LOT RAN ON CMP.B3
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION LOT POLISHED ACCORDINGLY
|
| 62.423 | XD0513 HIGH OUTGOING SD @ILD3 | YIELD::PHESTER | | Fri Oct 18 1996 19:27 | 31 |
|
CMP PEX
LOT # XD0513
QUANTITY: 24
OPERATION # 3064 THK_CMP 16
/DESCR.
POLISHER: PST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 10/18/96 C-Shift
PROBLEM: LOT HAD HIGH STD% ~16.5% UCL IS 16.0% ILD3
FINAL MEASURMENTS...
9447 18.7
10882 16.6
9717 16.1
9807 13.1
8287 18.1
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: NONE TAKEN. PROBLEM WAS WITHIN WAFER.
|
| 62.424 | XD0441 three wafers scrapped | YIELD::PHESTER | | Fri Oct 18 1996 19:32 | 25 |
|
CMP PEX
LOT # XD0441
QUANTITY: 13/10
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 10/18/96 C-Shift
PROBLEM: 3 WAFERS WERE OVER POLISHED, WRONG RECIPE WAS RUN.
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: THE BALANCE OF THE LOT WILL BE RE-WORKED AT CAP. LOT HAS BEEN
REMARKED AT 2133 DEP_ILD2 3 WITH DETAILS AND INSTRUCTIONS.
|
| 62.425 | CMP PEX, 4 WAFERS OVER POLISHED ON JD0580 "HOT LOT" . | SUBPAC::SMARTIN | | Sun Oct 20 1996 15:49 | 30 |
|
LOT: JD0580
MACHINE: CMP.B3
OPER#: 1980
PROCESS LEVEL: ILD-2
DATE: 10/20/96
SHIFT: B-SHIFT
QUANTITY: 22 DOWN TO 18
PRODUCT...DC1026-000-JA-8G
PROBLEM: 2 WAFERS WERE OVER POLISHED. SAME POLISH TIME WAS USED FOR ALL THE
PREVIOUS WAFERS WITH NO PROBLEM. 4 WAFERS WERE POLISHED WITH
1 DUMMY WAFER AT THE TIME. ??????? NOT SURE IF THE 1 DUMMY WAFER
COULD HAVE BROUGHT THE REMOVAL RATE UP THAT MUCH HIGHER.
DISPOSITION: LOT WILL BE MOVED LESS 4 WAFERS.
CORRECTIVE ACTION: NONE
|
| 62.426 | CMP PEX, 3 WAFERS OVER POLISHED ON JD0548 | SUBPAC::SMARTIN | | Mon Oct 21 1996 17:27 | 32 |
|
LOT: JD0548
MACHINE: CMP.B2
OPER#: 1985
PROCESS LEVEL: ILD-2
DATE: 10/21/96
SHIFT: A-SHIFT
QUANTITY: 20 DOWN TO 17
PRODUCT...DC1026-000-EA-8G
PROBLEM: 3 WAFERS WERE OVER POLISHED. THERE WAS A BUBBLE IN THE SLURRY LINE
AND ASHLAND DECIDED TO CHANGE THE FILTER WHILE THE TOOL WAS POLISHING
PRODUCT. THIS CAUSED THE TOOL TO SHUT DOWN AND WHEN IT CAME BACK UP
IT STARTED TO POLISH THE WAFERS AGAIN FOR THE FULL POLISH TIME.
2 OF THE FIVE WAFERS WERE OK TO REDEP AND THREE WERE TOO THIN.
TO SUM IT UP...... THE WAFERS WENT THROUGH TWO POLISHES
DISPOSITION: LOT WILL BE MOVED LESS 3 WAFERS.
CORRECTIVE ACTION: TOOLS SHOULD BE STOPPED BEFORE CHANGING ANY FILTERS
|
| 62.427 | XD0561 2 WAFERS SCRAPPED DUE TO CRASH. | YIELD::PHESTER | | Fri Oct 25 1996 19:31 | 30 |
|
CMP PEX
LOT # XD0561
QUANTITY: 22
OPERATION # 1985 (CMP_ILD DEP2)
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: 10/24/96 C-Shift
PROBLEM: TWO WAFERS SCRAPPED DUE TO TOOL CRASH
DISPOSITION: LOT MOVED ON
CORRECTIVE
ACTION: CALL RECIEVED FROM ASHLAND CHEMICAL ASKING IF THERE WAS AN
ADEQUATE SUPPLY OF SLURRY IMMEDIATELY AFTER SYSTEM CRASH.
SUSPECT PROBLEM WITH SLURRY DELIVERY.
ONLY 60 WAFERS ON PAD AND 30/30 ON CARRIERS.
EE TOOK TOOL FOR REPAIR.
|
| 62.428 | XD0589 low outgoing thickness @ILD1 | YIELD::PHESTER | | Fri Oct 25 1996 19:37 | 31 |
|
PE PEX NOTIFICATION
LOT # XD0589
QUANTITY: 24
OPERATION # 3054 POST THICKNESS ILD1
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 10/25/96 C-Shift
PROBLEM: POST THICKNESS
LOT POST THICKNESS AVG = 5099�
UCL IS 5200�
LOT WAS POLISHED ON CMP.B3
DISPOSITION: LOT MOVED TO CAP
CORRECTIVE
ACTION LOT WAS REMARKED AT OPERATION 2130 TO DEP
600 EXTRA � ON WAFERS # 05,10,13,14,21,22,23
|
| 62.429 | JD0574 high SD @ILD1 | YIELD::PHESTER | | Sat Oct 26 1996 20:12 | 30 |
|
PE PEX NOTIFICATION
LOT # JD0574
QUANTITY: 24
OPERATION # 3054 POST THICKNESS
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 10/26/96 C Shift
PROBLEM: HIGH SD @ ILD1 DC1026
POST SD AVG = 26.4�
UCL IS 10.0�
LOT RAN ON CMP.B2
DISPOSITION: LOT MOVED ON
CORRECTIVE PROBLEM WAS HIGH SD ON ALL FIVE WAFERS CHECKED WITH WAFER# 1
ACTION: VERY HIGH AR 20%. OTHERWISE AVERAGE THICKNESS LOOKS GOOD.
|
| 62.430 | xd0559 high range and STdev | SUBPAC::KULP | | Sun Oct 27 1996 07:20 | 37 |
| CMP PEX
LOT #: XD0559 PRODUCT..TM0069-032-BA-8C
QUANTITY: 23
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 10/27/96 03:31:38 B shift
PROBLEM: popped chart high range and St.dev all sites measured,
GOF good lot had heavy edge removal.
range= 5684 UCL 4500
STdev= 22 UCL 16
THK_ME_5 WAFER #1 9197.000
WAFER #2 10267.000
LOG AN EVENT WAFER #3 10022.000 10/27/96 03:31:38
WAFER #4 9054.000
WAFER #5 9620.000
THK_RG XD0559 5684.000
THK_SD_5 WAFER #1 28.300
WAFER #2 11.300
WAFER #3 21.200
WAFER #4 26.200
WAFER #5 23.000
DISPOSITION: Means were in spec. lot ran edge heavy, due up for MQC's next
Moved lot on...
CORRECTIVE None
ACTION:
|
| 62.431 | Jd0566 2 broken wfrs cmp.b3 | SUBPAC::KULP | | Sun Oct 27 1996 07:21 | 58 |
| CMP PEX
LOT #: JD0566 PRODUCT..DC1026-000-JA-8G
QUANTITY: 24-2=22
OPERATION # 1985 CMP_ILD2 CMP
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: 10/26/96 B shift
PROBLEM: 2 wafers broke, wfrs slide out carrier 2 into 1.
carrier step height measured high 8.5 - 9.0 mil
DISPOSITION: Complete touch up on another system, moved lot on with 2 less
wafers
CORRECTIVE Change carrier 1, 2 and pad, running MQC's
ACTION:
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _cmp.b3____
2) Recipe _tup_175___
3) Step # __5__
4) Time into step __1__
5) Type of wafers that broke _product_
6) Carrier which wafer slid out of __2___
7) Other carriers that were damaged ___1___
8) Alarms displayed by polisher _Wafer loss alarm on pad______________________
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _No_, sysytems____________
10) Did wafer detect work _Yes__
11) # of wafers on pad _160__
12) # of wafers on carrier _25___
13) Was there any vibration prior to the crash __No__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __Yes___
15) Check step hight of the carrier from question #6 _8.5-9.0_
16) Please note any other unusual circumstances:
Crashed during tup-175. 1 second into segment 5. Wafer came out of 2
and took out 1. Alarm on screen was main vac low. Operator put that the
alarm was wafer loss detect on the crash sheet but thats not the alarm
Roger or I saw. Pad was changed and the two carriers. Checking cup to
carrier alignments now. We are assuming that it was misload at the
carrier due to the same thing occurring during our shift last week. Why
it didn't happen on the other shifts is unknown. On a side note we
observed the scrubber not operating properly. The brushes stopped
prematurely while manually unloading 5 wafers. Motor was checked and
smells like it could be bad. Maxim is down so this might be passed on.
B-shift
|
| 62.434 | JD0550 low pre-thickness mean ILD3 CMP.B3 | SUBPAC::KULP | | Mon Oct 28 1996 07:33 | 25 |
| CMP PEX
LOT #: JD0550 PRODUCT..DC1026-000-EA-8G
QUANTITY: 17
OPERATION # 3058 THK_CMP 16 THK_ILD3_PST 3
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 10/28/96 01:35 B shift
PROBLEM: Popped chart low pre mean all sites measured,
UCL 35000
THK_ME JD0550 34993.000
THK_RG JD0550 1768.000
DISPOSITION: Moved lot on...
CORRECTIVE None
ACTION:
|
| 62.435 | CMP.B2 JD0549 ILD3 high range | SUBPAC::KULP | | Mon Oct 28 1996 07:34 | 36 |
| CMP PEX
LOT #: JD0549 PRODUCT..DC1026-000-EA-8G
QUANTITY: 22
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST 3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 10/28/96 03:16:14 B shift
PROBLEM: Popped chart high range all sites measured,
GOF good, lot had heavy center removal.
range= 5666 UCL 4500
THK_ME_5 WAFER #1 9931.000
WAFER #2 N/A
WAFER #3 10072.000
WAFER #4 8860.000
WAFER #5 9432.000
THK_RG JD0549 5666.000
LOG AN EVENT THK_SD_5 WAFER #1 9.300 10/28/96 03:16:14
WAFER #2 N/A
WAFER #3 10.700
WAFER #4 11.300
WAFER #5 8.970
DISPOSITION: Lot ran center heavy, nothing unusaual mean and sigma within
limits. Moved lot on...
CORRECTIVE None
ACTION:
|
| 62.432 | JD0550 low pre-thickness mean ILD3 CMP.B3 | SUBPAC::KULP | | Mon Oct 28 1996 07:45 | 25 |
| CMP PEX
LOT #: JD0550 PRODUCT..DC1026-000-EA-8G
QUANTITY: 17
OPERATION # 3058 THK_CMP 16 THK_ILD3_PST 3
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 10/28/96 01:35 B shift
PROBLEM: Popped chart low pre mean all sites measured,
UCL 35000
THK_ME JD0550 34993.000
THK_RG JD0550 1768.000
DISPOSITION: Moved lot on...
CORRECTIVE None
ACTION:
|
| 62.433 | CMP.B2 JD0549 ILD3 high range | SUBPAC::KULP | | Mon Oct 28 1996 07:45 | 36 |
| CMP PEX
LOT #: JD0549 PRODUCT..DC1026-000-EA-8G
QUANTITY: 22
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST 3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 10/28/96 03:16:14 B shift
PROBLEM: Popped chart high range all sites measured,
GOF good, lot had heavy center removal.
range= 5666 UCL 4500
THK_ME_5 WAFER #1 9931.000
WAFER #2 N/A
WAFER #3 10072.000
WAFER #4 8860.000
WAFER #5 9432.000
THK_RG JD0549 5666.000
LOG AN EVENT THK_SD_5 WAFER #1 9.300 10/28/96 03:16:14
WAFER #2 N/A
WAFER #3 10.700
WAFER #4 11.300
WAFER #5 8.970
DISPOSITION: Lot ran center heavy, nothing unusaual mean and sigma within
limits. Moved lot on...
CORRECTIVE None
ACTION:
|
| 62.436 | JL0648 low outgoing thickness @ILD1 | YIELD::PHESTER | | Wed Oct 30 1996 19:36 | 40 |
|
CMP PEX
LOT # JL0648
QUANTITY: 5
OPERATION # 3114 THK_CMP
/DESCR.
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A5
DATE: 10/30/96 C-Shift
PROBLEM: LOT WAS OVER POLISHED BY C SHIFT . LOT WAS 100% ON THICKNESS.A5
FINAL READINGS
5111 4.76
4865 5.05
4973 6.37
4939 6.44
4862 6.26 AVG = 4810
RANGE AND SD WERE BOTH GOOD.
THK_RG JL0648 1430.000
THK_SD_5 WAFER #1 4.760
WAFER #2 5.050
WAFER #3 6.370
WAFER #4 6.440
WAFER #5 6.260
CORRECTIVE
ACTION: LOT MOVED ON.
A REMARK HAS BEEN ADDED TO NEXT DEP OPERATION FOR EXTRA 500�
DEP.
|
| 62.437 | XD0590 low outgoing thickness @PMD | YIELD::PHESTER | | Wed Oct 30 1996 19:36 | 41 |
|
CMP PEX
LOT # XD0590
QUANTITY: 24
OPERATION # 2957 THK_CMP
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: THICKNESS.A4
DATE: 10/30/96 C-Shift
PROBLEM: LOT WAS OVER POLISHED BY D SHIFT . LOT WAS 100% ON THICKNESS.A5.
FINAL READINGS
5856 3.4
5664 3.73
5841 2.06
5836 3.03
6114 2.7 AVG = 5862
RANGE WAS GOOD AT 1008.
SD WAS ALSO GOOD.
HK_SD_5 WAFER #1 3.400
WAFER #2 3.730
WAFER #3 2.060
WAFER #4 3.090
WAFER #5 2.700
CORRECTIVE
ACTION: LOT MOVED ON.
A REMARK HAS BEEN ADDED TO NEXT DEP OPERATION FOR EXTRA DEP.
|
| 62.438 | jd0553 broke 2 wfrs cmp.b2 | SUBPAC::KULP | | Sun Nov 03 1996 07:33 | 35 |
| CMP PEX
LOT #: JD0553 PRODUCT..DC1026-000-EA-8G
QUANTITY: 24-2=22
OPERATION # 1989 CMP AFTER ILD3
POLISHER: CMP.B2
EVAL TOOL: n/a
DATE: B shift
PROBLEM: 2 broken wafers
DISPOSITION: Lot needs to finish polish
CORRECTIVE Pad and carrier replaced, running MQC's note 34.16
ACTION:
-< Wafer break (Double Load) >-
B2 was ready to run some send aheads. It ran a set (5)
of dummy wafers first. When unloading the dummies,
carrier 5 did not unload it's wafer. Tool then loaded
the send aheads and tried to polish. AS soon as the
double loaded carrier hit the pad the send ahead came
out, taking out carrier 4 also. Replaced 4 and 5 and
manually loaded and unloaded wafers with new carrier.
No problem found. Also replaced the pad. Conditioned
new pad and returned tool to Operations.
B shift
|
| 62.439 | JD0581 THK_ILD3 - 16 wafers overpolished | STRATA::POZORSKI | | Sun Nov 03 1996 12:19 | 25 |
| CMP PEX
LOT #: JD0581 PRODUCT..DC1026-000-JA-WF
QUANTITY: 23
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST 3
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 11/02/96 08:47:24 (Processed on B shift and A-Shift read
100% on the lot on 11/03)
PROBLEM: The lot was overpolished at CMP_ILD3, there were 14 wafer
that need an extra 1000� dep and 2 other wafer that need
1500� dep.
DISPOSITION: Lot has been remarked at operation #2136 for an extra
deposition.
CORRECTIVE Lot will recieve extra dep at DEP ILD3 operation.
ACTION:
|
| 62.440 | jd0455 i wfr over polish | SUBPAC::KULP | | Mon Nov 04 1996 08:01 | 48 |
| CMP PEX
LOT #: JD0455 PRODUCT..DC1035-000-RA-8T
QUANTITY: 24
OPERATION # 2957 THK_CMP 4 THK_PMD_PST
POLISHER: CMP.A2
EVAL TOOL: THICKNESS.A5
DATE: B shift 11/04/96 05:05
PROBLEM: 1 wafer over polish, popped chart 6163.6 LCL: 6200
THK_ME_5 WAFER #1 5746.000
WAFER #2 6387.000
WAFER #3 6292.000
WAFER #4 6380.000
WAFER #5 6013.000
THK_RG NA 2368.000
LOG AN EVENT THK_SD_5 WAFER #1 9.600 11/04/96 05:05:21
WAFER #2 10.100
WAFER #3 6.800
WAFER #4 10.000
WAFER #5 9.300
DISPOSITION: Remarked lot at next dep. step to add 500 ang.
CORRECTIVE None, moved lot on
ACTION:
-< Wafer break (Double Load) >-
B2 was ready to run some send aheads. It ran a set (5)
of dummy wafers first. When unloading the dummies,
carrier 5 did not unload it's wafer. Tool then loaded
the send aheads and tried to polish. AS soon as the
double loaded carrier hit the pad the send ahead came
out, taking out carrier 4 also. Replaced 4 and 5 and
manually loaded and unloaded wafers with new carrier.
No problem found. Also replaced the pad. Conditioned
new pad and returned tool to Operations.
B shift
|
| 62.441 | CMP PEX, 8 WAFERS OVER POLISHED ON XD0591 | SUBPAC::SMARTIN | | Mon Nov 04 1996 09:49 | 39 |
|
LOT: XD0591
MACHINE: CMP.B1
OPER#: 1981
PROCESS LEVEL: ILD-2
DATE: 11/4/96
SHIFT: B-SHIFT
QUANTITY: 24
PRODUCT...TM0069-032-BA-8C
PROBLEM: 8 WAFERS WERE OVER POLISHED.
5164 A
4926 A LCL=5200
5055 A
5182 A
4968 A
5181 A
4284 A
5087 A
DISPOSITION: THESE 8 WAFERS WERE REMARKED FOR REDEP OF
500A AND THE 4284A WAFER WILL GET A REDEP OF 1000A.
CORRECTIVE ACTION: NONE
|
| 62.442 | JD0562 high pre step ht. ILD3 | SUBPAC::KULP | | Wed Nov 06 1996 03:55 | 22 |
| CMP PEX
LOT #: JD0562 DC1026-000-JA-8G
QUANTITY: 21
OPERATION # 1989 STP_ILD3_PRE
POLISHER: CMP.B3
EVAL TOOL: PROFILER.A2
DATE: B shift 11/05/96 23:13
PROBLEM: Popped chart STP_ILD3_PRE HEIGHT_ME at 20280. Measured 2
other wafers, came in spec. 19383.75
DISPOSITION: Thickness in spec. MQC's performed on Profiler.
CORRECTIVE None, moved on to polish
ACTION:
|
| 62.443 | JD0566 high outgoing range @ILD3 | YIELD::PHESTER | | Thu Nov 07 1996 18:46 | 28 |
|
CMP PEX
LOT #: JD0566 ILD3
QUANTITY: 21
OPERATION # 3064
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 11/7/96
PROBLEM: HIGH OUTGOING RANGE AT 5479�
UCL IS 4500�
DISPOSITION: AVERAGE THICKNESSES WERE GOOD FOR ALL WAFERS CHECKED. ALL
STANDARD DEVIATION CALCULATIONS WERE WELL WITHIN RANGE. PROBLEM
APPEARS TO BE ACROSS THE LOT.
CORRECTIVE
ACTION: NONE
|
| 62.444 | JL0594 high outgoing range & SD @ILD2 | YIELD::PHESTER | | Thu Nov 07 1996 18:46 | 28 |
|
CMP PEX
LOT # JL0594
QUANTITY: 24
OPERATION # 3274 ILD2
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 11/07/96 C-Shift
PROBLEM: HIGH POST RANGE AND DEV %
LOT RANGE WAS 3866� UCL IS 3400�
LOT % DEV WAS 19. UCL IS 16.
DISPOSITION: 4 OUT OF 5 WAFERS HAD OUT OF SPEC SD. PROBLEM WAS WITHIN WAFER
UNIFORMITY.
CORRECTIVE
ACTION: SR. ENGINEERING NOTIFIED.
|
| 62.445 | XD0581 over polished @ILD3 | YIELD::PHESTER | | Thu Nov 07 1996 18:46 | 29 |
|
PE PEX NOTIFICATION
LOT # XD0581
QUANTITY: 23
OPERATION # 3064 POST THICKNESS
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 11/7/96 C-Shift
PROBLEM: LOW POST THICKNESS ILD3
LOT POST THICKNESS AVG=9349� UCL IS 9500�
LOT WAS POLISHED ON CMP.B2
POST RANGE WAS 2569
DISPOSITION: LOT SENT TO CAP.
CORRECTIVE
ACTION LOT HAS BEEN GROUPED INTO 500� BINS AND REMARKED TO EXTRA DEP
WAFERS AT OPERATION 2136.
|
| 62.446 | popped chart CMP.B1 THK_ILD2_PST THK_SD_5 = 16.6 UCL:16 | SUBPAC::KULP | | Sun Nov 10 1996 08:19 | 34 |
| CMP PEX
LOT #: JD0591 DC1026-000-JA-WF
QUANTITY: 24
OPERATION # 3066 THK_CMP 11 THK_ILD2_PST 3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: B shift 11/10/96 03:47
PROBLEM: popped chart CMP.B1 THK_ILD2_PST THK_SD_5 = 16.6 UCL:16
THK_ME_5 WAFER #1 5636.000
WAFER #2 5391.000
WAFER #3 5291.000
WAFER #4 5736.000
WAFER #5 6371.000
THK_RG JD0591 2893.000
THK_SD_5 WAFER #1 16.500
WAFER #2 19.000
WAFER #3 14.300
LOG AN EVENT WAFER #4 19.000 11/10/96 03:47:08
WAFER #5 14.200
DISPOSITION: Moved lot on readings on map were not even, on side larger then
other.
CORRECTIVE Ran MQC's
ACTION:
|
| 62.447 | JD0589 high stdev ILD3 CMP.B3 | SUBPAC::KULP | | Sun Nov 17 1996 08:48 | 34 |
| CMP PEX
LOT #: JD0589
QUANTITY: 24
OPERATION # 3064 THK_ILD3_PST
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: B shift 11/17/96
PROBLEM: Popped Stdev chart, ILD3. This lot was inherited from C shift
with high STd. from 100 % inspect.
THK_ME_5 WAFER #1 10124.000
WAFER #2 9664.000
WAFER #3 10403.000
WAFER #4 9768.000
WAFER #5 9611.000
THK_RG N/A 2589.000
LOG AN EVENT THK_SD_5 WAFER #1 20.800 11/17/96 05:52:35
WAFER #2 12.800
WAFER #3 23.000
WAFER #4 10.000
WAFER #5 16.300
DISPOSITION: Finish touch up moved on
CORRECTIVE None
ACTION:
|
| 62.448 | JD0617 - 2 wfrs scrapped due to crash | STRATA::POZORSKI | | Sun Nov 17 1996 19:09 | 49 |
| CMP PEX
LOT #: JD0617 PRODUCT..DC1026-000-JA-WF
QUANTITY: 24-2=22
OPERATION # 1985 CMP ILD2
POLISHER: CMP.B1
EVAL TOOL: n/a
DATE: A shift
PROBLEM: 2 broken wafers
DISPOSITION: The machine did not alarm, the scrubber did not release wafers
into the unload cassette which caused the wafer breakage.
CORRECTIVE EE is still looking into to this problem.
ACTION:
================================================================================
Note 34.18 CMP.B WAFER CRASH FORM 18 of 18
FABSIX::K_JUBINVILLE 24 lines 17-NOV-1996 17:13
-< CMP.B1 crash >-
--------------------------------------------------------------------------------
crash report for product wafers broken in unload station on cmp.b1.
Lot # JD0617, two broken wafers at operation 1985; 24 wafers down to 22.
1) System CMP.B1 ___________
2) Recipe ild2__________
3) Step # n/a____
4) Time into step n/a_____
5) Type of wafers that broke product__________
6) Carrier which wafer slid out of n/a_____
7) Other carriers that were damaged none________
8) Alarms displayed by polisher wafer loss_did not alarm__________________
9) Did any other polisher error for slurry or crash no____, systems_no_________
10) Did wafer detect work no_____
11) # of wafers on pad n/a_____
12) # of wafers on carrier n/a_____
13) Was there any vibration prior to the crash n/a_____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table n/a________
15) Check step height of the carrier from question #6 n/a______
16) Please note any other unusual circumstances: machine did not alarm.scrubber
did not release wafers into unload cassette causing breakage.
|
| 62.449 | JL0656 Popped Stdev chart, THK_ILD1_PST THK_SD_5 | SUBPAC::KULP | | Tue Nov 19 1996 05:39 | 34 |
| CMP PEX
LOT #: JL0656
QUANTITY: 24
OPERATION # 3114 THK_CMP 8
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: B shift 11/19/96
PROBLEM: Popped Stdev chart, THK_ILD1_PST THK_SD_5, UCL: 13.0,
data pt. 13.48
THK_ME_5 WAFER #1 5920.000
WAFER #2 5706.000
WAFER #3 5775.000
WAFER #4 5556.000
WAFER #5 5712.000
THK_RG JL0656 2683.000
THK_SD_5 WAFER #1 15.400
LOG AN EVENT WAFER #2 13.100 11/19/96 03:09:04
WAFER #3 10.300
WAFER #4 12.100
WAFER #5 16.500
DISPOSITION: moved lot on, range and mean in spec.
CORRECTIVE None
ACTION:
|
| 62.450 | JD0651 Popped Stdev chart, THK_ILD1_PST THK_SD_5 | SUBPAC::KULP | | Tue Nov 19 1996 05:47 | 34 |
| CMP PEX
LOT #: JD0651
QUANTITY: 24
OPERATION # 3054 THK_CMP 8
POLISHER: CMP.A2
EVAL TOOL: THICKNESS.A4
DATE: B shift 11/19/96
PROBLEM: Popped Stdev chart, THK_ILD1_PST THK_SD_5 UCL: 10.0,
data pt. 10.96
THK_ME_5 WAFER #1 5419.000
WAFER #2 5098.000
LOG AN EVENT WAFER #3 5944.000 11/19/96 03:33:20
WAFER #4 5667.000
WAFER #5 5220.000
THK_RG JD0651 2067.000
THK_SD_5 WAFER #1 13.300
WAFER #2 10.800
WAFER #3 9.900
WAFER #4 9.700
WAFER #5 11.100
DISPOSITION: moved lot on, range and mean in spec.
CORRECTIVE None
ACTION:
|
| 62.451 | XD0595 HAD 3 WAFERS OVER POLISHED | STRATA::POZORSKI | | Tue Nov 19 1996 10:59 | 30 |
| PE PEX NOTIFICATION
LOT # XD0595
QUANTITY: 20
OPERATION # 3064 POST THICKNESS
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 11/19/96 A-Shift
PROBLEM: LOW POST THICKNESS ON 3 WAFERS AFTER ILD3.
DISPOSITION: LOT SENT FOR EXTRA DEP.
SUSPECT SOME OF THE WAFERS CAME IN WITH INSUFFICIENT OXIDE,
CAUSING WAFERS TO BE OVER POLISHED. A LOT CAME IN YESTERDAY
WITH ONE WAFER WITH 10K EXTRA, THIS IS WHAT HAS LEAD US TO
BELIEVE THIS IS THE POSSIBLE CAUSE.
CORRECTIVE
ACTION LOT HAS BEEN GROUPED INTO 4000�, 3000�, 1000� BINS AND
A REMARK FOR THE EXTRA DEP HAS BEEN ENTERED AT OPSERATION 2136.
|
| 62.452 | JL0642 HIGH RANGE @ILD1 | YIELD::PHESTER | | Thu Nov 21 1996 11:04 | 31 |
|
CMP PEX
LOT #: JL0642 ILD1
QUANTITY: 24
OPERATION # 3144
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 11/16/96
PROBLEM: RANGE ABOVE UCL @4156�
LOT MEAN THICKNESS LOOKED GOOD. THIS WAS A DUE TO A COUPLE OF
WITHING WAFER POINTS THAT WERE HIGH/LOW.
DISPOSITION: LOT MOVED TO CAP
CORRECTIVE
ACTION: NONE
|
| 62.453 | JD0591 High SD @ILD3 | YIELD::PHESTER | | Fri Nov 22 1996 08:28 | 28 |
|
CMP PEX
LOT #: JD0591 ILD3
QUANTITY: 24
OPERATION # 3064
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 11/21/96
PROBLEM: STD DEV WAS 16.260. UCL IS 16.0.
DISPOSITION: LOT MOVED TO CAP.
CORRECTIVE
ACTION: NONE. MEAN THICKNESSES WERE FAIRLY GOOD HOWEVER 3 OUT OF FIVE
WAFERS HAD HIGH SD. PROBLEM WAS WITHIN WAFER.
|
| 62.454 | JL0671 HIGH INCOMING STEP @PMD | YIELD::PHESTER | | Sat Nov 23 1996 15:02 | 25 |
|
CMP PEX
LOT # JL0671
QUANTITY: 24
OPERATION # 3362STP_L_PMD
/DESCR.
POLISHER: NA
EVAL TOOL: PROFILER.A2
DATE: 11/23/96 C-Shift
PROBLEM: Lot had a high incoming Step Height of an avg of 4309�, UCL at
4200�.
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: Lot polish time was ajusted to compensate for high step
heights.
|
| 62.455 | JL0518 High outgoing range @ILD2 | YIELD::PHESTER | | Sat Nov 23 1996 16:35 | 31 |
|
CMP PEX
LOT #: JL0518 ILD2
QUANTITY: 19
OPERATION # 3274
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 11/23/96
PROBLEM: LOT HAD HIGH OUTGOING RANGE AT 3477�. UCL IS 3400�
DISPOSITION: ALL FIVE WAFERS MEASURED HAD GOOD MEAN THICKNESS. HIGH RANGE WAS
CAUSED BY TWO SEPERATE HIGH/LOW POINTS.
LOT MOVED TO CAP.
CORRECTIVE
ACTION: NONE.
|
| 62.456 | jd0664 slightly low thickness mean ILD1 | SUBPAC::KULP | | Tue Nov 26 1996 07:28 | 35 |
| CMP PEX
LOT #: JD0664
QUANTITY: 24
OPERATION # 3054 THK_CMP 8 THK_ILD1_PST 3
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A4
DATE: B shift 11/26/96
PROBLEM: Slighty low thickness mean reading.
THK_ILD1_PST THK_ME_5 popped chart low. LCL: 5200
Mean: 5153.600 Wafer 3 and 4 measured low.
THK_ME_5 WAFER #1 5234.000
WAFER #2 5349.000
LOG AN EVENT WAFER #3 4926.000 11/26/96 01:49:52
WAFER #4 5043.000
WAFER #5 5216.000
THK_RG JD0664 1036.000
THK_SD_5 WAFER #1 5.050
WAFER #2 4.630
WAFER #3 5.950
WAFER #4 4.340
WAFER #5 4.470
DISPOSITION: Moved lot on.
CORRECTIVE None
ACTION:
|
| 62.457 | CMP PEX 3 WAFERS SCRAPPED DUE TO OVER POLISH | SUBPAC::SMARTIN | | Tue Nov 26 1996 11:41 | 30 |
|
LOT: JL0657
MACHINE: CMP.B2
OPER#: 1995
PROCESS LEVEL: ILD-2
DATE: 11/26/96
SHIFT: B-SHIFT
QUANTITY: 23 DOWN TO 20
PRODUCT....DC1044-003-EC-8P
PROBLEM: 5 WAFERS WERE OVER POLISHED. 3 WAFERS OUT OF THE 5 WILL BE SCRAPPED DUE
TO SEVERE OVER POLISH. THE OTHER TWO WILL BE RE-DEPPED.
DISPOSITION: 2 WAFERS WERE REMARKED FOR REDEP.
THE OTHER THREE WILL BE SCRAPPED.
CORRECTIVE ACTION: NONE
|
| 62.458 | CMP PEX, 1 WAFER SCRAPPED DUE TO OVER POLISH | SUBPAC::SMARTIN | | Tue Nov 26 1996 18:38 | 29 |
|
LOT: JD0646
MACHINE: CMP.A1
OPER#: 1981
PROCESS LEVEL: ILD-1
DATE: 11/26/96
SHIFT: A-SHIFT
QUANTITY: 24 DOWN TO 23
PRODUCT....DC1026-900-JA-WF
PROBLEM: 1 WAFER WAS OVER POLISHED. ALL WAFERS WERE POLISHED FOR A TOTAL TIME
OF 8 MIN 13 SEC. 1 WAFER CAME OUT WITH A THICKNESS OF 3000A.
THE REST OF THE LOT WAS FINE. THIS WAS DONE ON THE THIRD PASS FOR THE
LOT. LCL=3400 FOR RE-DEP.
DISPOSITION: 1 WAFER WILL BE SCRAPPED. THE REST OF THE LOT WILL BE MOVED ON LESS
1 WAFER.
CORRECTIVE ACTION: NONE
|
| 62.459 | JD0667 HIGH INCOMING STEP HEIGHT @ILD1 | YIELD::PHESTER | | Sat Nov 30 1996 08:10 | 28 |
|
CMP PEX
LOT # JD0667
QUANTITY: 24
OPERATION # 3079 STEP..ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 11/29/96 C-Shift
PROBLEM: HIGH INCOMING STEP ....ILD1
LOT INCOMING STEP HEIGHT AVG = 9617� UCL IS 9600�
LOT BEING POLISHED ON CMP.B2
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: LOT POLISHED ACCORDINGLY
|
| 62.460 | XE0608 LOW INCOMING STEP HEIGHT @PMD | YIELD::PHESTER | | Sat Nov 30 1996 08:16 | 30 |
|
CMP PEX
LOT #: XE0608 PMD
QUANTITY: 24
OPERATION # 3078
POLISHER: CMP.A1
EVAL TOOL: PROFILER.A2
DATE: 11/29/96
PROBLEM: LOW INCOMING STEP HEIGHT
INCOMING STEP HEIGHT WAS 2955� LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION: NONE
|
| 62.461 | JL0673 overpolished @ILD1 | YIELD::PHESTER | | Sat Nov 30 1996 19:10 | 32 |
|
CMP PEX
LOT # JL0673
QUANTITY: 24
OPERATION # 3114...THICKNESS POST
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 11/30/96 C-Shift
PROBLEM: LOW POST THICKNESS ILD1
LOT POST THICKNES AVG = 4990� UCL IS 5200�
LOT WAS POLISHED ON CMP.B1.
DISPOSITION: LOT WAS POLISHED USING THE REMOVAL RATE FROM A DIFFERENT DEVICE
AT ILD1 THAT WAS POLISHED JUST PRIOR TO THIS LOT. THE REMOVAL
RATE WAS NOT THE SAME AND LOT WAS OVERPOLISHED.
CORRECTIVE
ACTION: REMARK HAS BEEN POSTED AT DEP OPERATION #2166
WITH WAFER #'S TO BE DEPED AN EXTRA 500�.
|
| 62.462 | XD0560 OVERPOLISHED @ILD3 | YIELD::PHESTER | | Sat Nov 30 1996 19:13 | 32 |
|
CMP PEX
LOT # XD0560
QUANTITY: 23
OPERATION # 3064 POST THICKNESS ILD3
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 11/27/96 C-Shift
PROBLEM: LOW POST THICKNESS
LOT POST THICKNESS AVG= 8102� LCL IS 10000� + OR - 500�
LOT WAS POLISHED ON CMP.B2
DISPOSITION: LOT WAS STARTED BY ONE MFG TECH WHO POLISHED IT FOR 400 SEC.
IT WAS THEN FINISHED BY ANOTHER WHO POLISHED IT FOR 350 SEC.
REMOVAL RATE WAS HIGH AND THE LOT SHOULD NOT HAVE BEEN POLISHED
THIS LONG. MIS-COMMUNICATION.
CORRECTIVE
ACTION: LOT HAS BEEN REMARKED AT OPERATION 2136 DEP ILD3
WITH WAFER #'S AND THICKNESS OF EXTRA DEP NEEDED.
|
| 62.463 | CMP PEX, 5 WAFERS SCRAPPED DUE TO TOOL FAILURE. | SUBPAC::SMARTIN | | Mon Dec 02 1996 17:01 | 29 |
|
LOT: XD0605
MACHINE: CMP.B1
OPER#: 1985
PROCESS LEVEL: ILD-2
DATE: 12/2/96
SHIFT: A-SHIFT
QUANTITY: 23 DOWN TO 18
PRODUCT....TM0069-032-BA-8C
PROBLEM: 5 WAFERS WERE SCRAPPED DUE TO TOOL FAILURE. THE CPU LOCKED UP. AS A
RESULT FROM THE LOCK UP THE TOOL KEPT ON POLISHING THE WAFERS. THE
TOOL HAD TO BE REBOOTED. AFTER THE REBOOT, EXERCISE WAFERS WERE RAN
WITH NO PROBLEMS.
DISPOSITION: 5 WAFERS WILL BE SCRAPPED. THE REST OF THE LOT WILL BE MOVED ON
LESS 5 WAFERS.
CORRECTIVE ACTION: TOOL TESTED OK AFTER THE REBOOT.
|
| 62.464 | 2 wafers scrapped (crash) CMP.A2 | SUBPAC::KULP | | Wed Dec 04 1996 07:39 | 49 |
| CMP PEX
LOT #: JL0691
QUANTITY: 23-2=21
OPERATION # 1984 CMP_L_PMD CMP
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: B shift 12/04/96
PROBLEM: 2 wafers crashed
DISPOSITION: Lot is still in the area,
CORRECTIVE EE cleaning system, will need MQC's
ACTION:
CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together)
2 product wafers crashed
pmd recipe
0 seconds in interval #3
1) System _cmp.a2 ___
2) Recipe _ pmd _____
3) Step # _3___
4) Time into step __ 0 ___
5) Type of wafers that broke _product jl0691 (x2)__
6) Carrier which wafer slid out of _ left _
7) Other carriers that were damaged _ both ___
8) Alarms displayed by polisher _ no alarm was sounded _______________________
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _ no _, __________
10) # of wafers on pad _ 112 __
11) # of wafers on carrier _ l-241 r-242 __
12) Was there any vibration prior to the crash _ no ___
13) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table _ yes _____
14) Check step height of the carrier from question #6 _ carrier too trashed __
15) Please note any other unusual circumstances:
16) Put this check sheet in CMP note #9 - done.
|
| 62.465 | 4 wafers over polish, scrapped out < 3400K | SUBPAC::KULP | | Wed Dec 04 1996 07:42 | 68 |
| CMP PEX
LOT #: JL0669
QUANTITY: 22-4=18
OPERATION # 1994 CMP_ILD2 CMP
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: B shift 12/02/96
PROBLEM: 4 wafers overpolished
DISPOSITION: Wafers are still in the area, touch up.
CORRECTIVE Op's tech should not guess at times after machine error.
ACTION: Remove wafers from CMP system for accurate measuremnts.
The wafer id's are as follows:
The four wafers to be scrapped:
wafer #4 with thk of 2132
wafer #12 with thk of 1102
wafer #1 with thk of 1539
wafer #8 with thk of 862
the four for dep
wafer #24 will need .5k (4899)
wafer #20 will need 1k (4564)
wafer #9 will need 1k (4101)
wafer #17 will need 1k (4043)
Just so you know all wafer measurments were checked on both UV1050
tools.
These are the events that happened when five wafers were on CMP.B1,
1. At interval 5 set time 166sec, with 147 sec. left, an alarm sounded.
2. Upon investigation, alarm read "alarm - process doors open"
3. Checked the time, it was stuck at 147, but carriers were still
down on the pad polishing.
4. Went around back to check if process doors had jostled loose
initializing an alarm, none of the doors were open or jostled.
5. Came around to front, pressed start button to get rid alarm, and to
start time, so end segment could be performed.
6. Carriers stopped rotating, carrier not rotating alarms go off.
7. Maint was called @ 1:00 am
8. Upon investigation,it was found that a sensor on one of the process
doors was intermitently giving an open circut causing the alarm.
9. Run was started and touched down again and end segment was ended.
Note 17.476
Alarmed for process door open during process. Operator checked doors
and found them closed and restarted to continue processing. The tool
then alarmed for heads not rotating in segment 5. Thats when we saw the
Bat signal. We checked all the doors and found that the right side
index table process door sensor wasn't seeing the door. Turned out to
be just a loose crimp on one of the pins. Corrected and resumed
polishing with out a hitch.
B-shift
|
| 62.466 | CMP PEX,5 WAFERS OVER POLISHED ON JD0664 | SUBPAC::SMARTIN | | Wed Dec 04 1996 18:40 | 29 |
|
LOT: JD0664
MACHINE: CMP.B1
OPER#: 1980
PROCESS LEVEL: ILD-2
DATE: 12/4/96
SHIFT: B-SHIFT
QUANTITY: 24
PRODUCT...DC1026-900-JA-WF
.
PROBLEM: 5 WAFERS WERE OVER POLISHED ON B SHIFT LAST NIGHT. TIME WAS THOUGHT
TO BE MISCALCULATED ON THE TOUCH UP ACCORDING TO A SHIFT.
DISPOSITION: 5 WAFERS WERE REMARKED FOR REDEP.
CORRECTIVE ACTION: NEED TO TALK TO B SHIFT ON THIS ONE.
|
| 62.467 | CMP PEX,2 WAFERS OVER POLISHED ON XE0553 | SUBPAC::SMARTIN | | Wed Dec 04 1996 18:51 | 30 |
|
LOT: XE0553
MACHINE: CMP.A2
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 12/4/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT...TM0069-907-BA-8C
.
PROBLEM: 2 WAFERS WERE OVER POLISHED.
WFR#1=5824
WFR#2=5574 LCL=6200
DISPOSITION: 2 WAFERS WERE REMARKED FOR REDEP OF 500A
CORRECTIVE ACTION: THIS LOT WAS POLISHED FOR 80 SEC. SPEC SAYS THEY SHOULD
BE POLISHED FOR 100 SEC. IF THE OPERATOR WENT BY SPEC
WE WOULD HAVE HAD A SCRAP PROBLEM.???????????
|
| 62.468 | CMP PEX 3 WAFERS SCRAPPED DUE TO OVER POLISH ON JD0524 | SUBPAC::SMARTIN | | Wed Dec 04 1996 19:23 | 34 |
|
LOT: JD0524
MACHINE: CMP.B2
OPER#: 2001
PROCESS LEVEL: ILD25
DATE: 11/21/96 ?????
SHIFT: C-SHIFT
QUANTITY: 7 WAFERS DOWN TO 4
PRODUCT...DC1026-041-DJ-WF
.
PROBLEM: 3 WAFERS WERE SCRAPPED DUE TO OVER POLISH. I WAS TOLD THIS WAS DONE
TWO WEEKS AGO ON C SHIFT AND THEN THE LOT WAS PUT ON HOLD. THE
THREE WAFERS WERE POLISHED WITH TWO DUMMY WAFERS. THE DUMMY WAFERS HAD
NO OXIDE ON THEM WHICH INCREASED THE REMOVAL RATE ON THE THREE WAFERS.
FYI- THE LOT WAS NEVER PROC'D INTO THE POLISHING STEP WHEN THEY GOT TOASTED
TWO WEEKS AGO.
DISPOSITION: 3 WAFERS WERE SCRAPPED AND THE OTHER 4 WAFERS WERE SENT ON.
1 WAFER OUT OF THE 4 WAS REMARKED FOR REDEP.
CORRECTIVE ACTION: PLEASE MAKE SURE THE THE DUMMIES HAVE ENOUGH OXIDE ON THEM
BEFORE USING THEM
|
| 62.469 | XM0587 low thickness and high range outgoing @ILD2 | YIELD::PHESTER | | Thu Dec 05 1996 16:28 | 49 |
|
CMP PEX
LOT # XM0587
QUANTITY: 22
OPERATION # 3066_THK_CMP ILD2
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 12/5/96 C-Shift
PROBLEM: LOT HAD LOW OUTGOING THICKNESS AND HIGH RANGE. SD WAS JUST
BELOW UCL.
FINAL MEASURMENTS: THICK. UNF.
5252 8.67
5892 13.5
5077 17.1
5355 17.2
4350 23.0
AVG 5185 (LCL 5200)
RANGE 557 (UCL 550)
LAST WAFER HAD A ONE SITE AT 2136�, CAUSING RANGE AND THICKNESS
TO BE OUT OF SPEC.
DISPOSITION: LOT MOVED TO CAP.
CORRECTIVE
ACTION: THE THIN WAFER WAS READ AGAIN ON THICKNESS.A4 AND READ
5741� WITH A SD OF 5.6 AND RANGE OF 880�. (NOTE ABOVE READINGS
TAKEN ON .A5). ALSO LOT WAS GIVEN 100% ON THICKNESS.A4.
IT WAS FOUND THAT THE PATTERN REC. WAS SLIPPING OFF THE DIE ON
TWO EDGE DIE ON THICKNESS.A4. ALSO THICKNESS.A4 WAS READING
THE DIE IN A DIFFERENT LOCATION THAN THICKNESS.A5. THIS HAS
BEEN CORRECTED.
THE LOT WAS READ 100% AGAIN WITH CORRECTED PROGRAM ON
THICKNESS.A5. GOF WAS GOOD ON ALL POINTS. FIVE WAFERS WERE
IDENTIFIED THAT NEEDED AN EXTRA 1000� AT CAP AND LOT WAS
REMARKED. ALSO ONE WAFER NEEDED A SLIGHT TOUCH-UP AND THIS
WAS DONE.
|
| 62.470 | JD0633 SOME WAFERS OVER-POLISHED @ILD3 | YIELD::PHESTER | | Fri Dec 06 1996 10:33 | 48 |
|
CMP PEX
LOT # JD0633
QUANTITY: 20
OPERATION # 3064_THK_CMP ILD3
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 12/6/96 C-Shift
PROBLEM: SOME WAFERS OVER-POLISHED @ILD3
THICKNESS AVG = 8567� LCL IS 9500�
FINAL MEASURMENTS: THICK. UNF.
7480 5.78
9463 6.01
8136 6.00
8391 9.42
9366 2.78
DISPOSITION: LOT MOVED TO DEP_ILD3 3
LOT WAS 100% AND REMARKED FOR EXTRA DEP.
GROUP #1...1000� EXTRA W#...7,21,3,15,18,16,5,2
GROUP #2...2000� EXTRA W#...4,6,19,12,9
CORRECTIVE
ACTION: WAFERS FROM THE LOT WERE READ ON BOTH THICKNESS.A4 AND .A5 TO CHECK
CORRELATION AND IT WAS GOOD. GOODNESS OF FIT WAS ACCEPTABLE TO
EXCELLENT ON ALL POINTS READ.
THIS LOT WAS POLISHED ON THE PREVIOUS SHIFT AND WAS UNDERGOING FINAL
THICKNESS EVALUATION AT SHIFT CHANGE. NO CONCRETE EXPLANATION FOR
OVER-POLISH. SUSPECT SOME MIS-CALCULATIONS ON TOUCH-UP TIMES.
REMOVAL RATE ON TOOL AT TIME OF POLISH WAS EXCEPTIONALLY GOOD AND
WOULD AMPLIFY ANY MIS-CALCULATION.
|
| 62.471 | XD0622 over dep CMP PMD rework | SUBPAC::KULP | | Mon Dec 09 1996 04:53 | 23 |
| CMP PEX
LOT #: XD0622 Hot lot
QUANTITY: 23
OPERATION # 2947 THK_PMD 2
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: B shift 12/09/96
PROBLEM: Over dep. from films, oper. error wrong recipe used.
DISPOSITION: Lot had ~ 16.3K thickness, target 8900.
CORRECTIVE Did 100% on lot, running very conservative. Lot will run
ACTION: over to A shift, I belive it will require FURN before
moving to Photo.
|
| 62.472 | XD0618 - 1981 CMP AFTER ILD1 BROKE 2 WAFERS ON CMP.A2 | SUBPAC::KULP | | Mon Dec 09 1996 06:04 | 52 |
| CMP PEX
LOT #: JL0691
QUANTITY: 24-2=22
OPERATION # 1981 CMP_ILD1
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: B shift 12/09/96
PROBLEM: 2 wafers crashed
DISPOSITION: Lot is still in the area,
CORRECTIVE EE cleaned system, will need MQC's
ACTION:
CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together)
2 product wafers crashed
ild recipe
seconds in interval #
1) System _cmp.a2 ___
2) Recipe _ ild _____
3) Step # _ 2/3 ___
4) Time into step __ ___
5) Type of wafers that broke _product xd0618 ild1 (x2)__
6) Carrier which wafer slid out of _ left _
7) Other carriers that were damaged _ both ___
8) Alarms displayed by polisher _ no alarm was sounded until after crash _____
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _ no _, __________
10) # of wafers on pad _ 54 __
11) # of wafers on carrier _ l-256 r-256 __
12) Was there any vibration prior to the crash _ no ___
13) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table _ yes _____
14) Check step height of the carrier from question #6 _ carrier too trashed __
15) Please note any other unusual circumstances: breakin wafers ran, with no
problem. this was the first 180 sec, and the first two product wafers,
from this lot to touch pad.
16) Put this check sheet in CMP note #9 - done.
|
| 62.473 | XD0625 2 wafers lost on CMP.A1 | SUBPAC::KULP | | Tue Dec 10 1996 07:38 | 84 |
| CMP PEX
LOT #: XD0625
QUANTITY: 24-2=22
OPERATION # 1978 CMP_PMD CMP
POLISHER: CMP.A1
EVAL TOOL: N/A
DATE: B shift 12/10/96
PROBLEM: 1 wafer broke, the other scratched beyond repair
DISPOSITION: Lot is still in the area,
CORRECTIVE EE cleaned system, will need MQC's
ACTION:
REV. 2.0
12/9/97
CMP.A1 & CMP.A2 WAFER BREAKAGE FORM
-----------------------------------
1) System: CMP.A1:__ x ___ CMP.A2:_____
2) Time of incident:___ 4:30 am _ 12/10/96 __________
3) Name of Operations Technician:_ M_Provencher _________
4) Recipe Name:__ pmd _____
5) Recipe Step #:__ 3/4 ____
6) Time into step:___ 0 ____
7) Type of wafers that broke: PRODUCT:_ x ___ MONITOR:_____
8) If Product, give: LOT #:____ xd0625 ____ DEVICE #:__ t-69 ____
9) If Monitors, were they: PAD BREAKIN/EXERCISE:__ n/a __ MQC:__ n/a __
10) Which carrier lost the wafer: RIGHT:_____ LEFT:__ x ___
BOTH:_____ DON'T KNOW:_____
11) Alarms displayed by polisher:_left carrier not arriving up ________________
______________________________________________
12) # of wafers on pad:__ 58 ____
13) # of wafers on carrier:__ l-118/r-206 __
14) If Product, how many wafers in the lot were polished before the crash:_ 24
_
15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__ x __
16) If Monitors, how many monitors were polished before the crash:__ n/a __
17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__ x __
If yes, what were the "ASSISTS" for:_______________________________________
___________________________________________________________________________
18) On previous runs, were the carriers sticking to the pad at the end of
the polish cycle: YES:_____ NO:__ x __
19) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table: YES:__x __ NO:_____
20) Please note any and all other unusual circumstances that were noticed
about the tool at the time of the crash or on any prior runs. No in-
formation is too trivial!! Two screws were missing from the left carrier,
(where wafer slid out). They were found in the carrier clean station. step
height was performed on the left carrier. it measured -.004.
|
| 62.474 | Jd0615 - 2 wafer overpolished 1 wafer scrapped | STRATA::POZORSKI | | Tue Dec 10 1996 17:16 | 21 |
| CMP PEX
LOT #: JD0615
QUANTITY: 24-1=23
OPERATION # 1985 ILD2 CMP
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: B shift 12/10/96
PROBLEM: 2 wafers over polished and the lot was remarked for extra
dep, 1 wafer was scrapped due to extensive over polish.
DISPOSITION: Lot was remarked and moved on.
CORRECTIVE Not sure really what happened it was processed on B-Shift,
ACTION: and A-Shift discovered this.
|
| 62.475 | XD0624 - 4 wafer overpolished | STRATA::POZORSKI | | Tue Dec 10 1996 17:17 | 21 |
| CMP PEX
LOT #: XD0624
QUANTITY: 24
OPERATION # 1985 ILD2 CMP
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: B shift 12/10/96
PROBLEM: 4 wafer were over polished by 2000�.
DISPOSITION: This lot was polished on B-Shift and A-Shift discoved
the 4 wafers by doing 100% Lot was remarked and moved on.
CORRECTIVE The lot was remarked and moved on. Will need to talk to
ACTION: B-Shift to see really what is happening to these.
|
| 62.476 | Pex for lot XD0605 | YIELD::SHONG | | Fri Dec 13 1996 07:34 | 51 |
|
CMP PEX
LOT # XD0605
QUANTITY: 18
OPERATION # 3064_THK_CMP ILD3
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 12/12/96 C-Shift
PROBLEM: OUTGOING THICNESSS AVERAGE WAS LOW, RANGE WAS HIGH.
THICKNES AVG = 9279� LCL IS 9500�
RANGE = 6018� UCL IS 4500�
FINAL MEASSUREMENTS
THK_ME_5 WAFER #1 11438.000
WAFER #2 8094.000
WAFER #3 8177.000
WAFER #4 9407.000
WAFER #5 N/A
THK_RG XD0605 6018.000
LOT WAS PROCESSED ON D-SHIFT.
DISPOSITION: LOT WAS MOVED TO CAP.
CORRECTIVE
ACTION: THIS LOT HAD PROBLEMS WITH METROLOGY EVALUATION ON THICKNESS.A4.
THE LOT WAS READ ON THICKNESS.A5 AND RESULTS WERE BETTER.
THE PROGRAM ON THICKNESS.A4 WAS READING THREE OF THE WRONG DIE.
THIS WAS CORRECTED AND NOW THICKNESS.A4 AND .A5 HAVE IDENTICAL
PROGRAMS. IN ADDITION BOTH PROGRAMS WERE OPTIMIZED. READINGS
ARE WITHIN 10� FROM TOOL TO TOOL.
REASON FOR OVERPOLISH ON SELECTED WAFERS IS NOT CLEAR AS IT WAS
PREVIOUS SHIFT.
LOT WAS 100% ON THICKNESS.A5 & BINNED
ACCORDINGLY AND A REMARK WAS ADDED AT OP#2136 FOR EXTRA DEP.
|
| 62.477 | JL0706 high SD @ILD2 | YIELD::PHESTER | | Sat Dec 14 1996 13:26 | 41 |
|
CMP PEX
LOT #: JL0706 ILD2
QUANTITY: 23
OPERATION # 3274
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 12/13/96
PROBLEM: STD DEV ABOVE UCL.
STD DEV WAS 16.2. UCL IS 16.0
HK_ME_5 WAFER #1 5224.000
WAFER #2 5377.000
WAFER #3 5839.000
WAFER #4 5737.000
WAFER #5 5105.000
THK_RG JL0706 3101.000
THK_SD_5 WAFER #1 12.400
WAFER #2 18.800
WAFER #3 12.600
WAFER #4 15.600 12/13/96 15:44:08
WAFER #5 21.600
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: THICKNESS AND RANGE WERE RIGHT ON TARGET. ALL MEASUREMENT GOFs'
GOOD. INCOMING THICKNESS AND SD LOOKED GOOD AS WELL. LOOKS TO BE
A WITHIN WAFER ISSUE. NO CORRECTIVE ACTION.
|
| 62.478 | xd0759 low incoming step height | SUBPAC::KULP | | Sun Dec 15 1996 07:32 | 93 |
| CMP PEX
LOT #: XD0759
QUANTITY: 23
OPERATION # 3078 STP_PMD_PRE
POLISHER: CMP.A1
EVAL TOOL: N/A
DATE: B shift 12/10/96
PROBLEM: Incoming step height out of spec. low
Incoming step height was 2975� LCL is 3000�
RUN_ID_1 XD0759 23
HEIGHT_ME WAFER #1 CENTER 3040.000
LOG AN EVENT WAFER #1 EDGE 2951.000 12/15/96 03:36:16
WAFER #2 CENTER 2954.000
WAFER #2 EDGE 2955.000
DISPOSITION: Lot moved to polish
CORRECTIVE None
ACTION:
REV. 2.0
12/9/97
CMP.A1 & CMP.A2 WAFER BREAKAGE FORM
-----------------------------------
1) System: CMP.A1:__ x ___ CMP.A2:_____
2) Time of incident:___ 4:30 am _ 12/10/96 __________
3) Name of Operations Technician:_ M_Provencher _________
4) Recipe Name:__ pmd _____
5) Recipe Step #:__ 3/4 ____
6) Time into step:___ 0 ____
7) Type of wafers that broke: PRODUCT:_ x ___ MONITOR:_____
8) If Product, give: LOT #:____ xd0625 ____ DEVICE #:__ t-69 ____
9) If Monitors, were they: PAD BREAKIN/EXERCISE:__ n/a __ MQC:__ n/a __
10) Which carrier lost the wafer: RIGHT:_____ LEFT:__ x ___
BOTH:_____ DON'T KNOW:_____
11) Alarms displayed by polisher:_left carrier not arriving up ________________
______________________________________________
12) # of wafers on pad:__ 58 ____
13) # of wafers on carrier:__ l-118/r-206 __
14) If Product, how many wafers in the lot were polished before the crash:_ 24
_
15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__ x __
16) If Monitors, how many monitors were polished before the crash:__ n/a __
17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__ x __
If yes, what were the "ASSISTS" for:_______________________________________
___________________________________________________________________________
18) On previous runs, were the carriers sticking to the pad at the end of
the polish cycle: YES:_____ NO:__ x __
19) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table: YES:__x __ NO:_____
20) Please note any and all other unusual circumstances that were noticed
about the tool at the time of the crash or on any prior runs. No in-
formation is too trivial!! Two screws were missing from the left carrier,
(where wafer slid out). They were found in the carrier clean station. step
height was performed on the left carrier. it measured -.004.
|
| 62.479 | JD0688 1 wafer scrapped | STRATA::POZORSKI | | Mon Dec 16 1996 11:13 | 25 |
| CMP PEX
LOT #: JD0688
QUANTITY: 24-1 = 23
OPERATION # 1982
POLISHER: N/A
EVAL TOOL: N/A
DATE: 12/15/96
PROBLEM: One wafer was scrapped off of Scrub.A3, the system alarmed while
a wafer was on the Dry Spin Station. EE went in and tried to
recover the wafer but, the system was locked up so they had to
EMO the system which caused the wafer to break. The wafer got
caught on the roller.
DISPOSITION: The wafer was scrapped out and the rest of the lot was moved on.
CORRECTIVE
ACTION: NONE.
|
| 62.480 | JD0708 Had high incoming stp height | STRATA::POZORSKI | | Mon Dec 16 1996 18:42 | 29 |
| CMP PEX
LOT #: JD0708
QUANTITY: 23
OPERATION # 3097 STD_ILD1_PRE HEIGHT_ME
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 12/16/96
PROBLEM: Incoming step height out of spec. High
Incoming step height was 9660� UCL= 9600
RUN_ID_1 NA MA
HEIGHT_ME WAFER #1 CENTER 9619.000
WAFER #1 EDGE 9778.000 12/16/96 15:17:41
WAFER #2 CENTER 9474.000
WAFER #2 EDGE 9770.000
DISPOSITION: Lot moved to polish
CORRECTIVE None
ACTION:
|
| 62.482 | JD0733 2 wafers overpolished | STRATA::POZORSKI | | Tue Dec 17 1996 14:43 | 23 |
| CMP PEX
LOT # JD0733
QUANTITY: 24
OPERATION # 2957 THK_CMP
/DESCR.
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A5
DATE: 12/17/96 A-Shift
PROBLEM: Two wafers were overpolished, the lot was polished correctly and
times were set according to the 2 send ahead wafers. The rest
the lot came out good with the times.
These two wafers will need to get an extra 1500� dep on them.
CORRECTIVE The lot was moved on and a remark was added to get an extra dep
ACTION:
|
| 62.483 | JL0713 ILD1 - Two wafers overpolished | YIELD::MANDREOLI | | Wed Dec 18 1996 05:18 | 30 |
| PE PEX NOTIFICATION
LOT # JL0713 (DC1033)
QUANTITY: 22
OPERATION # 1992 CMP_ILD1
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 12/18/96 B-Shift
PROBLEM: 3 wafers overpolished.
DISPOSITION: REMARK added at Oper 2166 DEP_ILD1 3 for;
Wafers 11, 16 to get extra 1000� Deposition.
Wafer 24 to get extra 500� Dep.
These 3 wafers were polished with dummies, although without a
reduction in time due to having fillers.. This could account
for the accelerated removal rate, or they came into the room
from films with lower tox..? (previous shift)
CORRECTIVE
ACTION: Three wafers REMARKed at Oper# 2166 for extra Dielectric Dep.
|
| 62.484 | JD0687 ILD2 - 5 wafers scrapped for over-polish | YIELD::MANDREOLI | | Wed Dec 18 1996 05:31 | 25 |
| PE PEX NOTIFICATION
LOT # JD0687 (DC1026)
QUANTITY: 24 - 5 = 19
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A5
DATE: 12/18/96 B-Shift
PROBLEM: 5 wafers overpolished. The 5 send ahead wafers for this lot
were accidently polished again with full time, resulting in
severe overpolish with Metal exposure. Wafers are in the CMP
area.
DISPOSITION: Wafers {01, 08, 10, 17, 21} will be scrapped at Oper# 1985.
CORRECTIVE
ACTION: no further action required.
|
| 62.485 | XD0632 2 WAFERS SCRAPPED @PMD DUE TO CRASH | YIELD::PHESTER | | Thu Dec 19 1996 13:35 | 110 |
|
CMP PEX
LOT #: XD0632 PMD
QUANTITY: 22
OPERATION # 1978 CMP_PMD
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: 12/14/96
PROBLEM: TWO WAFERS SCRAPPED AT TOUCH-UP. HIGH AMPERAGE ON TOOL NOTED JUST
BEFORE CRASH. NO TIME TO EMO TOOL BEFORE CRASH. EE SUSPECTED
A BAD PAD. OTHER PROBLEMS HAVE BEEN ENCOUNTERED WITH THIS LOT.
A NEW LOT OF PADS WAS SELECTED AND THE PAD WAS CHANGED OUT.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: CRASH FORM FILLED OUT AND POSTED. FORM ATTATCHED.
REV. 2.0
12/9/97
CMP.A1 & CMP.A2 WAFER BREAKAGE FORM
-----------------------------------
1) System: CMP.A1:_____ CMP.A2:__XXXXX
2) Time of incident:__8:39
3) Name of Operations Technician:_Gwen
4) Recipe Name:__PMD
5) Recipe Step #:___2_
6) Time into step:__4.2 sec
7) Type of wafers that broke: PRODUCT:_X_ MONITOR:_____
8) If Product, give: LOT #:XD0632 DEVICE #:_PMD
9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______
10) Which carrier lost the wafer: RIGHT:_XXXX LEFT:_____
BOTH:_____ DON'T KNOW:_____
11) Alarms displayed by polisher:__NO ALARMS AMPS SPIKED UP TO 35 THRU 48
______________________________________________
______________________________________________
12) # of wafers on pad:_106
13) # of wafers on carrier:__59
14) If Product, how many wafers in the lot were polished before the crash:_24
15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:XXX
16) If Monitors, how many monitors were polished before the crash:______
17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO_XXX
If yes, what were the "ASSISTS" for:_______________________________________
___________________________________________________________________________
18) On previous runs, were the carriers sticking to the pad at the end of
the polish cycle: YES:_____ NO:XXXX
19) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table: YES:_____ NO:_____YOU CAN NOT SEE THE SLURRY FLOW FROM
THE OPERATORS POSITION IN FRONT OF
THE TOOL. VIEW IS BLOCKED BY CARRIERS.
20) Please note any and all other unusual circumstances that were noticed
about the tool at the time of the crash or on any prior runs. No in-
formation is too trivial!!
The amps on the tool have been going very high just before
the table: YES:_____ NO:_____YOU CAN NOT SEE THE SLURRY FLOW FROM
THE OPERATORS POSITION IN FRONT OF
THE TOOL. VIEW IS BLOCKED BY CARRIERS.
20) Please note any and all other unusual circumstances that were noticed
about the tool at the time of the crash or on any prior runs. No in-
formation is too trivial!!
The amps on the tool have been going very high just before
a wafer slides out. I was watching the tool when the wafer
slid out. Brad was with me also watching the tool.
We were looking at the amps just as the wafer slid out
but unable to emo the tool in time to stop the wafer
from crashing into the carrier.
21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
[EOB]
|
| 62.486 | JD0710 2 Wafers scrapped @PMD | YIELD::PHESTER | | Thu Dec 19 1996 13:36 | 92 |
|
CMP PEX
LOT #: JD0710 PMD
QUANTITY: 22
OPERATION # 1978 CMP_PMD
POLISHER: CMP.A1
EVAL TOOL: N/A
DATE: 12/14/96
PROBLEM: TWO WAFERS SCRAPPED AT PMD INITIAL POLISH.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: NO IMMEDIATE CAUSE IDENTIFIED. EE INVESTIGATED AND SUSPECTED
THE PAD WAS BAD. A NEW LOT OF PADS WAS SELECTED AND THE PAD WAS
CHANGED OUT.
CRASH FORM HAS BEEN SUBMITTED AND IS ATTATCHED.
CMP.A1 & CMP.A2 WAFER BREAKAGE FORM
-----------------------------------
1) System: CMP.A1:_X____ CMP.A2:_____
2) Time of incident:__14:30__________
3) Name of Operations Technician:____EARL_______
4) Recipe Name:_____PMD________
5) Recipe Step #:____2_____
6) Time into step:___?______
7) Type of wafers that broke: PRODUCT:__X___ MONITOR:_____
8) If Product, give: LOT #:__JD0710________ DEVICE #:__DC1026__________
9) If Monitors, were they: PAD BREAKIN/EXERCISE:___NA___ MQC:__NA____
10) Which carrier lost the wafer: RIGHT:__?___ LEFT:__X___
WAFERS WERE POLISHING IN SEG#2 WHAEN I NOTICED THE
BREAK'GE.
BOTH:_____ DON'T KNOW:_____
11) Alarms displayed by polisher:___NA.....I'LL ASSUME THERE SHOULD BE_________
______________________________________________
______________________________________________
12) # of wafers on pad:___14____
13) # of wafers on carrier:__183/62____
14) If Product, how many wafers in the lot were polished before the
crash:__6 WITH 4 BREAK'IN PRIOR...THIS LEADS ME TO BE LEAVE THERE WERE
MORE WAFERS ON THIS PAD THAN THE COUNTER SHOWED.___
15) Was the PRODUCT lot receiving: INITIAL POLISH:_XXX____ or TOUCH UP:_____
16) If Monitors, how many monitors were polished before the crash:__NA____
17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__XX___
If yes, what were the "ASSISTS" for:_______________________________________
___________________________________________________________________________
18) On previous runs, were the carriers sticking to the pad at the end of
the polish cycle: YES:_____ NO:__XX___
19) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table: YES:__XX___ NO:_____...?
20) Please note any and all other unusual circumstances that were noticed
about the tool at the time of the crash or on any prior runs. No in-
formation is too trivial!!
21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
|
| 62.487 | jd0652 1 wfr overpolish | SUBPAC::KULP | | Sun Dec 22 1996 08:29 | 85 |
| CMP PEX
LOT #: Jd0652
QUANTITY: 22
OPERATION # 3064 THK_CMP 16
POLISHER: CMP.b1
EVAL TOOL: THICKNESS.A5
DATE: B shift 12/22/96
PROBLEM: 1 wafer over polish, from c shift.
DISPOSITION: Remarked for extra dep. 3000 ang. 2136 DEP_ILD3 3
B shift just scrubbed and measured.
CORRECTIVE Have to question c shift when they come back in
ACTION:
REV. 2.0
12/9/97
CMP.A1 & CMP.A2 WAFER BREAKAGE FORM
-----------------------------------
1) System: CMP.A1:__ x ___ CMP.A2:_____
2) Time of incident:___ 4:30 am _ 12/10/96 __________
3) Name of Operations Technician:_ M_Provencher _________
4) Recipe Name:__ pmd _____
5) Recipe Step #:__ 3/4 ____
6) Time into step:___ 0 ____
7) Type of wafers that broke: PRODUCT:_ x ___ MONITOR:_____
8) If Product, give: LOT #:____ xd0625 ____ DEVICE #:__ t-69 ____
9) If Monitors, were they: PAD BREAKIN/EXERCISE:__ n/a __ MQC:__ n/a __
10) Which carrier lost the wafer: RIGHT:_____ LEFT:__ x ___
BOTH:_____ DON'T KNOW:_____
11) Alarms displayed by polisher:_left carrier not arriving up ________________
______________________________________________
12) # of wafers on pad:__ 58 ____
13) # of wafers on carrier:__ l-118/r-206 __
14) If Product, how many wafers in the lot were polished before the crash:_ 24
_
15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__ x __
16) If Monitors, how many monitors were polished before the crash:__ n/a __
17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__ x __
If yes, what were the "ASSISTS" for:_______________________________________
___________________________________________________________________________
18) On previous runs, were the carriers sticking to the pad at the end of
the polish cycle: YES:_____ NO:__ x __
19) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table: YES:__x __ NO:_____
20) Please note any and all other unusual circumstances that were noticed
about the tool at the time of the crash or on any prior runs. No in-
formation is too trivial!! Two screws were missing from the left carrier,
(where wafer slid out). They were found in the carrier clean station. step
height was performed on the left carrier. it measured -.004.
|
| 62.488 | CMP PEX, TWO WAFERS BROKE ON CMP.A1 FOR JD0732 | SUBPAC::SMARTIN | | Sun Dec 22 1996 11:55 | 27 |
|
LOT: JD0732
MACHINE: CMP.A1
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 12/22/96
SHIFT: A-SHIFT
QUANTITY: 23 WAFERS DOWN TO 21
PRODUCT...DC1026
.
PROBLEM:TWO WAFERS SCRAPPED DUE TO CRASH. RIGHT HAND CARRIER LOST WAFER AND
TOOK OUT THE LEFT CARRIER AND WAFER.
DISPOSITION: LOT WILL BE MOVED ON LESS THE TWO WAFERS.
CORRECTIVE ACTION: PAD AND CARRIERS WILL BE CHANGED.
|
| 62.489 | CMP PEX,2 WAFERS OVER POLISHED ON JD0742 | SUBPAC::SMARTIN | | Mon Dec 23 1996 19:12 | 36 |
|
LOT: JD0742
MACHINE: CMP.B3
OPER#: 883
PROCESS LEVEL: ILD1
DATE: 12/23/96
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT...DC1031-903-EA-8P
.
PROBLEM: Two wafers over polished.
2 wafers out of the entire lot came out thin, lot ran based upon send
aheads, which resulted from 5987 to 7342. Its believed at some level
these two wafers were below LCL on thickness. Also noted was that these
2 wafers did not measure on ANY thickness tool, it had to be re taught to
get it to measure the 2 wafers.
DISPOSITION: The two wafers were remarked for extra dep and moved on.
Wafer # Thickness Extra dep.
3 4985 500
6 4758 500
CORRECTIVE ACTION: The two wafers will get redepped for an extra 500A
|
| 62.490 | Pex for ILD1 lots. | YIELD::SHONG | | Fri Dec 27 1996 07:24 | 28 |
| PE PEX NOTIFICATION
LOT # JD0682/JL0747
QUANTITY: 24
OPERATION # 1981 CMP_ILD1
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: Thickness.A4
DATE: 12/27/96 D-Shift
PROBLEM: This lot had high STD.DEV after touchup for ILD1(~18%). Lot
was ran on CMP.A2. I checked the incoming STD.DEV and that was
fine. The 100% done prior to touchup looked good. The average
for the lot was ~6 to 7%. The device type for this lot is
DC1026.
DISPOSITION: I remarked the lot for the high STD.DEV and moved it on. Thick-
ness was still in spec.
CORRECTIVE At this point I think the problem is the tool. I'm having prod-
ACTION: uction run MQC's before they run any more lots. This might be
carried over to the next shift.
|
| 62.491 | jd0688 4 wafers scrapped, CMP.B2 | SUBPAC::KULP | | Tue Dec 31 1996 08:19 | 59 |
| CMP PEX
LOT #: JD0688
QUANTITY: 23-4=19
OPERATION # 1989 CMP_ILD3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: B shift 12/31/96
PROBLEM: 4 wafers were scratched when carrier 5 stuck to pad.
dummy wafer on carrier 5 broke, scratching other wafers.
DISPOSITION: Lot moved on with 4 less wafers.
CORRECTIVE System will require pad change, carrier change and MQC's
ACTION:
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B2
2) Recipe: TUP_D
3) Step #: 4
4) Time into step: ?
5) Type of wafers that broke: 1 dummy 4 product 11,12,17,18
6) Carrier which wafer slid out of: #5
7) Other carriers that were damaged: #yes, all
8) Alarms displayed by polisher: n/a was EMO'd before alarm
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: NO
11) # of wafers on pad: 304
12) # of wafers on carrier: 60
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: no, but plenty of slurry in delivery tube
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances:
System alarmed with no error message displayed on screen. Both Ops
and EE personnel observed carrier 5 stuck to the pad while the others
were up. The table was spinning at the desired speed but the carriers
were not rotating. EE's first thought for an explanation was that
the wafer loss detect board didn't operate properly. This was tested
using the same recipe and 4 dummies (carrier 5 was trashed). While the
carriers were on the pad a wafer was manually placed under the wafer
loss sensor. The wafer loss board led lit up for the sensor being
tripped but the wafer loss detect led didn't light up. The table and
carriers kept spinning and stayed on the table. With this in mind our
next thought was that maybe the wafer came out in step 3 while vacuum
was still on. The alarm could have been main vac low which may cause
the carriers to lift off the pad and possibly stop the slurry pumps.
Which would explain all observations seen. At any rate the wafer loss
board will be replaced and tested for functionality.
B-shift EE.
17) Put this check sheet in CMP note #32: done
|
| 62.492 | CMP PEX.10 WAFERS SCRAPPED DUE TO OVER DEP at 2165 DEP_ILD1 2 | SUBPAC::SMARTIN | | Tue Dec 31 1996 10:55 | 51 |
|
LOT: JL0751
MACHINE: CMP.B1
OPER#: 1993
PROCESS LEVEL: ILD1
DATE: 12/31/96
SHIFT: A-B SHIFT
QUANTITY: 24 DOWN TO 14
PRODUCT...DC1071-900-BA-8
.
PROBLEM: Over dep. at 2165 DEP_ILD1 2, lot was over depped should have been
~18k, the thickness of the lot is ~33k. Lot was polished
longer to get it into spec. Popped chart at pre step height ~ 24.
Most likly because of extra dep and rework at CMP.B3. No annotation
for popped chart. "A" shift did initial rework polish for 400 sec.
from 33K to 16K. 100% performed on lot before polishing to 5500 on
"B" shift. End result was 15 wafers over polished.
10 Wafers will be scrapped and 5 will get extra dep.
DISPOSITION: Wafers #22, 7, 2, 14, 6 were over polished and need an extra
1000 ang of oxide put on them.
Wafers 1,3,5,6,7,10,15,16,17,20 will be scrapped.
WAFER/THK
1=3082* 12=4782 23=4146
2=5228 13=5388 24=5799
3=2669* 14=5726
4=4737 15=3203*
5=2484* 16=3039*
6=2529* 17=2875*
7=2203* 18=5036
8=4030 19=5581
9=4911 20=3322*
10=3153* 21=3433
11=5451 22=4452
* = SCRAP
CORRECTIVE ACTION: Dep lot to spec at 2165 DEP_ILD1 2.
|
| 62.493 | XE0756 LOW INCOMING STEP HEIGHT @PMD | YIELD::PHESTER | | Thu Jan 02 1997 08:43 | 27 |
|
CMP PEX
LOT # XE0756
QUANTITY: 19
OPERATION # 3078 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 12/26/96 C-Shift
PROBLEM: LOW INCOMING STEP ....PMD
LOT INCOMING STEP AVG = 2844�
LCL IS 3000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE
|
| 62.494 | JD0687 HIGH INCOMING STEP @ILD3 | YIELD::PHESTER | | Thu Jan 02 1997 13:23 | 29 |
|
PE PEX NOTIFICATION
LOT # JD0687
QUANTITY: 19
OPERATION # 3081 STEP_ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 12/27/96 C-Shift
PROBLEM: HIGH INCOMING STEP ....ILD3
LOT INCOMING STEP AVG = 20260�
UCL IS 20000�
DISPOSITION: LOT MOVED TO POLISH
CORRECTIVE
ACTION NONE. NO TREND SEEN.
|
| 62.495 | 1 wfr broke CMP.B2 Jd0709 | SUBPAC::KULP | | Mon Jan 06 1997 07:26 | 41 |
| CMP PEX
LOT #: JD0709
QUANTITY: 18-1=17
OPERATION # 1989 CMP_ILD3
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: B shift 01/06/96
PROBLEM: 1 wafer broke while unloading manually when system locked
up.
DISPOSITION: Lot moved on with 1 less wafers.
CORRECTIVE see below
ACTION:
Note 19.291
Operator found tool alarming whilst processing. Observations made were;
MHTA was over the index table, the pad conditioner was over (but not on)
the polish table, the table was rotating, the transfer paddle at track
1, no wafer was blocking the track sensors, the mhta had unloaded and
loaded fine, main vac was good, screen had locked up. All DIN's were
checked and nothing out of the ordinary was found. Those that should be
lit were lit and those that would indicate a problem were not lit.
EMO'd tool to recover since the screen locked up. While unloading the
wafers manually from the index table 1 broke. It broke real easily as
no excessive pressure was used and the fracture was straight across the
wafer starting from the notch. May have been a chip in the edge. PSS
was informed. Since the transfer paddle remained at track 1 while the
mhta unloaded and loaded, 5 wafers were ran with the "NOT_TOUCH" recipe
to insure proper operation of the unload module.
B-shift
|
| 62.496 | JL0837A HIGH INCOMING STEP @PMD | LUDWIG::POZORSKI | | Sun Jan 12 1997 09:57 | 33 |
| CMP PEX
LOT #: JL0837A
QUANTITY: 6
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/12/97
PROBLEM: Incoming step height out of spec. High
Incoming step height was 4534� UCL= 4200
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JL0837A N/A
HEIGHT_ME WAFER #1 CENTER 4669.000
WAFER #1 EDGE 4078.000
WAFER #2 CENTER 4611.000
WAFER #2 EDGE 4779.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lots polish time will be ajusted to compensate for high step
ACTION: heights.
(FYI - THERE WAS A CHART THAT POPPED BUT, NO ANNOTATIONS CAME
UP WHEN IT POPPED THE CHART??????)
|
| 62.497 | JL0841 HIGH INCOMING STEP HEIGHT @PMD | STRATA::POZORSKI | | Sun Jan 12 1997 19:42 | 32 |
| CMP PEX
LOT #: JL0841
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/12/97
PROBLEM: Incoming step height out of spec. High
Incoming step height was 4387� UCL= 4200
RUN_ID_1 JL0841 N/A
HEIGHT_ME WAFER #1 CENTER 4330.000
WAFER #1 EDGE 4313.000
WAFER #2 CENTER 4388.000
WAFER #2 EDGE 4517.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lots polish time will be ajusted to compensate for high step
ACTION: heights.
(FYI - THERE WAS A CHART THAT POPPED BUT, NO ANNOTATIONS CAME
UP WHEN IT POPPED THE CHART??????)
|
| 62.498 | JL0845 2 WAFERS SCRAPPED/2 OVERPOLISHED @PMD | STRATA::POZORSKI | | Mon Jan 13 1997 12:18 | 69 |
| CMP PEX
LOT: JL0845
MACHINE: CMP.A2
OPER#: 1984
PROCESS LEVEL: PMD
DATE: 01/13/97
SHIFT: A-SHIFT (LOT WAS RUN ON B-SHIFT)
QUANTITY: 24 WAFERS DOWN TO 22
PRODUCT...DC1031
PROBLEM: 1) ONE WAFER SCRAPPED DUE TO CRASH. THE WAFER BROKE IN THE LEFT LOAD
CUP IT SNAPPED INTO 3 PIECES. NOT REALLY SURE WHY BUT, THE PAD AND
CARRIERS WERE NOT DAMAGED BY THIS CRASH.
2) ONE WAFER WAS SCRAPPED DUE TO THE FACT IT GOT OVER POLISHED, THEY
THINK WHAT HAPPENED WAS WHEN THE CRASHED HAPPENED THEY TOOK THIS
WAFER AND PUT IT BACK IN TO GET POLISHED NOT REALIZING THAT IT HAD
ALREADY BEEN POLISHED. THE THICKNESS CAME OUT AT 2467�.
3) TWO WAFERS WERE OVER POLISHED, A REMARK WAS ADDED AT OPERATION
2160 TO RECEIVED AN EXTRA 500�.
DISPOSITION: LOT WILL BE MOVED ON WITH TWO LESS WAFER. A CRASH REPORT WAS
WRITTEN. SEE BELOW FOR REPORT.
CORRECTIVE ACTION: CLEANED THE LOAD STATION AND IS BACK TO RUNNING PRODUCT.
********************************************************************************
CRASH REPORT
CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together)
LOT# - JL0845
DEVICE - DC1031
OPER# - 1984 (CMP AFTER PMD DEP1)
WAFERS - 1 WAFER BROKE IN LOAD STATION
1) System __CMP.A2___
2) Recipe __PMD______
3) Step # _NONE___
4) Time into step __??___
5) Type of wafers that broke _PRODUCT (PMD LOT).
6) Carrier which wafer slid out of _BROKE ON LEFT STATION_
7) Other carriers that were damaged _NONE___
8) Alarms displayed by polisher NONE-----------------------------------------
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _NO_, sysytems____________
10) # of wafers on pad _66__
11) # of wafers on carrier _33__
12) Was there any vibration prior to the crash __NO__
13) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table __YES____
14) Check step height of the carrier from question #6 _ N/A
15) Please note any other unusual circumstances:
WAFER BROKE IN THE LEFT LOAD CUP. IT SNAPPED CLEAN INTO 3 PIECES
(DID NOT SHATTER). NOT SURE WHY. PAD AND CARRIERS NOT DAMAGED.
16) Put this check sheet in CMP note #9 - DONE
|
| 62.499 | JL0848 HIGH INCOMMING STEP HEIGHT @PMD | STRATA::POZORSKI | | Tue Jan 14 1997 14:33 | 28 |
| CMP PEX
LOT #: JL0848
QUANTITY: 24
OPERATION # 3362 STP_L_PMDPRE
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/14/97
PROBLEM: Incoming step height out of spec. High
Incoming step height was 4568� UCL= 4200
RUN_ID_1 JL0848 N/A
HEIGHT_ME WAFER #1 CENTER 4671.000
WAFER #1 EDGE 4460.000
WAFER #2 CENTER 4644.000
WAFER #2 EDGE 4495.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lots polish time will be ajusted to compensate for high step
ACTION: heights.
|
| 62.500 | JD0765 3 wafers scrapped (overpolished) | STRATA::POZORSKI | | Tue Jan 14 1997 15:32 | 27 |
| PEX
LOT # JD0765 (DC1026)
QUANTITY: 22 - 3 = 19
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 01/14/97 A-Shift
PROBLEM: 3 wafers overpolished. These wafers were going through
for touch-up and the operator edited the M2 recipe for the
10 sec, which was needed to touch-up these wafers but, instead
of loading the M2 recipe they loaded the M1 recipe which was set
to run for 196 sec. Needless to say the wafers were toasted.
DISPOSITION: Wafers will be scrapped at Oper# 1985.
CORRECTIVE They are going to double check the recipe before hitting START.
ACTION: no further action required.
|
| 62.501 | 2 wafers over polish ILD3, lot# JD0710 | SUBPAC::KULP | | Wed Jan 15 1997 07:22 | 26 |
| CMP PEX
LOT #: JD0710
QUANTITY: 22
OPERATION # 1989 CMP_ILD3 CMP
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: B shift 01/15/96
PROBLEM: 2 wafers overpolish, lot was inherited from A shift,
not sure of cause for overpolish. Found at 100% after touch
up.
DISPOSITION: Lot remarked at oper 2136,
wafer# 5 (slot#24) needs 2000� added
wafer#19 (slot#25) needs 4000� added
CORRECTIVE None.
ACTION:
|
| 62.502 | pex.; | STRATA::TDYER | | Wed Jan 15 1997 08:06 | 2 |
|
test of com file.
|
| 62.503 | JL0820 high incoming step height @PMD | STRATA::POZORSKI | | Wed Jan 15 1997 11:20 | 32 |
| CMP PEX
LOT #: JL0820
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/15/97
PROBLEM: Incoming step height out of spec. High
Incoming step height was 4507� UCL= 4200
RUN_ID_1 JL0820 N/A
HEIGHT_ME WAFER #1 CENTER 4484.000
WAFER #1 EDGE 4485.000
WAFER #2 CENTER 4535.000
WAFER #2 EDGE 4522.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lots polish time will be ajusted to compensate for high step
ACTION: heights.
There was no remarks as to any splits or problem and I talk to
etch to see if there were any problem and no noted.
|
| 62.504 | JL0849 high incoming step height @PMD | STRATA::POZORSKI | | Wed Jan 15 1997 11:39 | 32 |
| CMP PEX
LOT #: JL0849
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/15/97
PROBLEM: Incoming step height out of spec. High
Incoming step height was 4560� UCL= 4200
RUN_ID_1 JL0849 NA
HEIGHT_ME WAFER #1 CENTER 4700.000
WAFER #1 EDGE 4170.000
WAFER #2 CENTER 4719.000
WAFER #2 EDGE 4654.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights.
There was a remark at oper #3363 THK_OXSPCR for high and out of
control thickness and also there was another remark at oper #3260
for high shr rho. Other then that nothing else was found.
|
| 62.505 | Low incoming step height | YIELD::SHONG | | Fri Jan 17 1997 03:00 | 24 |
| PE PEX NOTIFICATION
LOT # XD0633
QUANTITY: 24
OPERATION # 3081 STEP_ILD3
/DESCR.
POLISHER: N/A
EVAL TOOL: Profiler.A2
DATE: 01/17/97 D-Shift
PROBLEM: This lot came into the area with low step height. The LCL for
step height is 17000. The lot came in at 16840.
DISPOSITION: Moved the lot on to polish.
CORRECTIVE None
ACTION:
|
| 62.506 | CMP PEX,SLIGHTLY HIGH POST THK FOR JD0734 | SUBPAC::SMARTIN | | Mon Jan 20 1997 08:50 | 44 |
|
LOT: JD0732
MACHINE: CMP.B2
OPER#: 1986
PROCESS LEVEL: ILD3
DATE: 1/20/97
SHIFT: B- SHIFT
QUANTITY: 21
PRODUCT....DC1026-900-JA-8G
LOT; JD0732
.
PROBLEM: Lots post thickness reading was three angstroms over the upper
control limit. Lot came out with 10,503 the upper control
limit is 10,500. Lot is too close to touch up.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 10442.000
WAFER #2 10421.000
WAFER #3 10323.000
WAFER #4 10827.000
WAFER #5 N/A
THK_RG JD0732 3373.000
THK_SD_5 WAFER #1 13.300
WAFER #2 8.700
WAFER #3 8.800
WAFER #4 13.800
WAFER #5 N/A
DISPOSITION: Lot will be moved on to next operation.
CORRECTIVE ACTION: None required.
|
| 62.507 | JL0884 HIGH INCOMING STEP HEIGHT @PMD | STRATA::POZORSKI | | Tue Jan 21 1997 11:38 | 31 |
| CMP PEX
LOT #: JL0884
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/21/97
PROBLEM: Incoming step height out of spec. High
Incoming step height was 4628� UCL= 4200
RUN_ID_1 JL0884 N/A
HEIGHT_ME WAFER #1 CENTER 4486.000
WAFER #1 EDGE 4645.000
WAFER #2 CENTER 4664.000
WAFER #2 EDGE 4717.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights.
There was no remarks for this lot as to why we had high incoming
step heights.
|
| 62.508 | JD0809 low outgoing thickness @ILD2 | LUDWIG::PHESTER | | Sat Jan 25 1997 14:01 | 34 |
|
PE PEX NOTIFICATION
LOT # JD0809
QUANTITY: 24
OPERATION # 3066 POST THICKNESS
/DESCR.
POLISHER: POST READINGS - CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 01/24/97 C-Shift
PROBLEM: LOW POST MEAN THICKNESS....ILD2
LOT POST THICKNESS AVG = 5175�
LCL IS 5200�
DISPOSITION: LOT MOVED ON.
LOT PROCESSED BY THE BOOK, HOWEVER THE REMOVAL RATE FROM CARRIER
CARRIER WENT BAD DURING PROCESSING OF THIS LOT. AFTER THIS LOT
WAS PROCESSED EE TOOK TOOL FOR A PM AND REPLACED PAD AND
CARRIERS.
CORRECTIVE
ACTION WAFERS NEEDING EXTRA DEP WERE REMARKED AT OPERATION
2133.
|
| 62.509 | JD0784 HIGH OUTGOING RANGE @ILD3 | LUDWIG::PHESTER | | Sat Jan 25 1997 17:48 | 35 |
|
CMP PEX
LOT # JL0784 DC1026
QUANTITY: 24
OPERATION # 3064 THK_ILD3_PST
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 1/25/97 C-Shift
PROBLEM: HIGH OUTGOING RANGE @ILD3
DISPOSITION: LOT MOVE ON.
TOOL IS A BIT MORE EDGE FAST THAN NORMAL ON THIS LOT. NOTHING
UNUSUAL ABOUT THE RUN.
MEAN THICKNESS AND SD ARE GOOD.
CORRECTIVE
ACTION: PAD IS RELATIVELY NEW. OTHER ILD LEVELS POLISHING WELL ON THIS
PAD.
INCOMING THICKNESS, RANGE AND SD WERE VERY GOOD.
METRO TOOLS CHECK OUT AND GOF WAS GOOD.
|
| 62.510 | JD0763 high outgoing range @ILD3 | LUDWIG::PHESTER | | Sat Jan 25 1997 19:29 | 35 |
|
PE PEX NOTIFICATION
LOT # JD0763
QUANTITY: 23
OPERATION # 3064 POST THICKNESS .A5
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A5 ILD3
DATE: 01/25/87 C-Shift
PROBLEM: HIGH POST RANGE ILD3 DC1026
HIGH POST RANGE LOT AVG = 4745�
UCL IS 4500�
DISPOSITION: Lot was polishing on CMP.B3 at the change of shifts.
Lot only had a removal rate on B3 of 900, so lot was
moved over to B1 because tool had new pad. Removal rate
went to 2280�. Lot finished polishing on B1.
Ran a ILD2 lot on B1 right after the ILD3 and the
post range was excellent, 1200.
CORRECTIVE
ACTION NONE.
|
| 62.512 | CMP.B3 broke 1 wafer on wafer track JL0824 | SUBPAC::KULP | | Sun Jan 26 1997 03:52 | 54 |
| CMP PEX
LOT #: JL0824
QUANTITY: 24-1=23
OPERATION # 1994 CMP_ILD2 CMP
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: B shift 01/26/96
PROBLEM: 1 broken wafer. The wafer did not clear the wafer track
before another wafer was brought over to get unloaded
from the paddle.
DISPOSITION: Moved lot on with 1 less wafer
CORRECTIVE EE cleaned wafer track turned back over to ops.
ACTION:
Note 32.26 CMP.B WAFER CRASH FORM 26 of 27
28 lines 25-JAN-1997
-< One more for CMP.B3 >-
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _cmp.b3____
2) Recipe _TUP_A___
3) Step # __?__
4) Time into step __?__
5) Type of wafers that broke _Product_
6) Carrier which wafer slid out of _None___
7) Other carriers that were damaged _None__
8) Alarms displayed by polisher _Scrubber time out. Wafer has not cleared_____
_Wafer track._________________________________
______________________________________________
9) Did any other polisher error for slurry or crash ___, sysytems____________
10) Did wafer detect work _No__
11) # of wafers on pad _580__
12) # of wafers on carrier ___
13) Was there any vibration prior to the crash __No__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __Yes___
15) Check step hight of the carrier from question #6 ___
16) Please note any other unusual circumstances:
The wafer did not clear the wafer track before another wafer was brought
over to get unloaded from the paddle.
|
| 62.513 | CMP.B2 broke 1 wafer on scrubber JD0789 | SUBPAC::KULP | | Sun Jan 26 1997 03:53 | 54 |
| CMP PEX
LOT #: JD0789
QUANTITY: 24-1=23
OPERATION # 1985 CMP_ILD2 CMP
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: B shift 01/26/96
PROBLEM: 1 wafer broke. The wafer broke on the scrubber, it wasn't
seated correctly and got caught on the top scrubbing pad.
DISPOSITION: Moved lot on with 1 less wafer
CORRECTIVE EE cleaned scrubber, turned back over to ops.
ACTION:
Note 32.27 CMP.B WAFER CRASH FORM 27 of 27
33 lines 25-JAN-1997
23:26
-< .b2 break >-
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B2
2) Recipe: TUP_175
3) Step #: n/a
4) Time into step: n/a
5) Type of wafers that broke: 1 product #15
6) Carrier which wafer slid out of: n/a
7) Other carriers that were damaged: n/a
8) Alarms displayed by polisher: scrubber time out
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: n/a
11) # of wafers on pad:1200/1225
12) # of wafers on carrier: 1039
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: n/a
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances:
This wafer broke on the scrubber, it wasn't seated correctly and got
caught on the top scrubbing pad
B-shift EE.
17) Put this check sheet in CMP note #32: done
|
| 62.514 | CMP PEX, HIGH INCOMING STEP HEIGHT FOR JL0880 | SUBPAC::SMARTIN | | Sun Jan 26 1997 18:13 | 31 |
|
LOT #: JL0880
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/26/97
PROBLEM: Incoming step height out of spec. High
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JL0880 N/A
HEIGHT_ME WAFER #1 CENTER 4478.000
WAFER #1 EDGE 4468.000
WAFER #2 CENTER 4417.000
WAFER #2 EDGE 4339.000
ucl=4100.000
DISPOSITION: Lot will be moved on to next operation.
CORRECTIVE ACTION: None required.
|
| 62.515 | xd0585 2 wafer broken cmp.a2 | SUBPAC::KULP | | Mon Jan 27 1997 08:14 | 98 |
| CMP PEX
LOT #: XD0585
QUANTITY: 24-2=22
OPERATION # 1978 CMP_PMD CMP
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: B shift 01/27/96
PROBLEM: 2 wafers broke.
DISPOSITION: Moved lot on with 2 less wafers and finish polish.
CORRECTIVE Cleaned up, change carrier and pad. New MQC's required.
ACTION:
REV. 2.0
12/9/97
CMP.A1 & CMP.A2 WAFER BREAKAGE FORM
-----------------------------------
1) System: CMP.A1:__ ___ CMP.A2:__ x ___
2) Time of incident:___ 4:10 am 01/27/97 __________
3) Name of Operations Technician:_ M_Provencher _________
4) Recipe Name:__ pmd _____
5) Recipe Step #:__ 3/4 ____
6) Time into step:___ 0 ____
7) Type of wafers that broke: PRODUCT:_ x ___ MONITOR:_____
8) If Product, give: LOT #:____ xd0585 ____ DEVICE #:__ t-69 ____
9) If Monitors, were they: PAD BREAKIN/EXERCISE:__ n/a __ MQC:__ n/a __
10) Which carrier lost the wafer: RIGHT:__ x ___ LEFT:__ ___
BOTH:_____ DON'T KNOW:_____
11) Alarms displayed by polisher:_right carrier not arriving up ________________
12) # of wafers on pad:__ 80 ____
13) # of wafers on carrier:__ l-40/r-40 __
14) If Product, how many wafers in the lot were polished before the crash:_ 24_
15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__ x __
16) If Monitors, how many monitors were polished before the crash:__ n/a __
17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__ x __
If yes, what were the "ASSISTS" for:_______________________________________
18) On previous runs, were the carriers sticking to the pad at the end of
the polish cycle: YES:__ x ___ NO:__ __
19) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table: YES:__ x __ NO:_____
20) Please note any and all other unusual circumstances that were noticed
about the tool at the time of the crash or on any prior runs. No in-
formation is too trivial!! right carrier was intermitantly sticking for
no longer than 1 second.
Note 7.309 CMP.A2 EE/PE PASSDOWNS 309 of 309
-< crash >-
Tool crashed with no apparent nor obvious reason. The wafer came out
of the right carrier. Earlier in the evening the right carrier was
sticking to the pad. The black oring and the platen screws were
replaced but the problem persisted. The carriers were swapped which
improved the release but the right still lagged by about a second.
Not sure why the right would be sticking to the pad with a good
carrier. The cal/config numbers were checked and compared to A1 with
nothing out of the ordinary found. To recover from the crash the
carriers were flushed (autocycle, f8, f5) due to the right carrier
sucking up wafer debris. And then the carriers, pad, and diamond disk
were replaced. The disk was just replaced this AM by A-shift and
already had signs of considerable wear (only 80 wafers on pad).
Weekly pm was going to be performed but A-shift beat us to it.
B-shift
|
| 62.516 | XE0902 incoming step height low ILD2 | SUBPAC::KULP | | Mon Jan 27 1997 08:15 | 31 |
| CMP PEX
LOT #: XE0902 TM0060-007-CA-8C Hot lot
QUANTITY: 9
OPERATION # 3080 STEP_CMP 3 STEP_ILD2
POLISHER: CMP.B1
EVAL TOOL: PROFILER.A2
DATE: B shift 01/27/96
PROBLEM: Incoming step height very low. LCL: 7200
LOG AN EVENT EVENT STP_ILD2_PRE FOR ENTITY CMP.B1 1/26/97 23:44:35
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 XE0902 9
HEIGHT_ME WAFER #1 CENTER 1674.000
LOG AN EVENT WAFER #1 EDGE 1893.000 1/26/97 23:44:35
WAFER #2 CENTER 1561.000
WAFER #2 EDGE 1626.000
DISPOSITION: Moved lot on to polish.
CORRECTIVE ACTION: None, 1st time processed through area.
|
| 62.517 | XE0609 - 5 wafers over polished | STRATA::POZORSKI | | Mon Jan 27 1997 15:15 | 28 |
| CMP PEX
LOT #: XE0609
QUANTITY: 22
OPERATION # 1989 CMP_ILD3
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: A shift 01/27/97
PROBLEM: 5 wafers overpolish, lot was inherited from B shift. A-Shift
was told that they were overpolished before they left.
Not really sure what happened with them. Looks like the
polish time was over calculated on these wafers.
DISPOSITION: Lot remarked at oper 2136,
wafer# 11,15 and 20 needs additional 2000� added at dep.
wafer# 12 and 17 needs additional 4000� added at dep.
CORRECTIVE Lot was remarked and moved on.
ACTION:
|
| 62.518 | JD0786 - 5 wafer over polished | LUDWIG::POZORSKI | | Tue Jan 28 1997 14:51 | 31 |
| CMP PEX
LOT #: JD0786
QUANTITY: 24
OPERATION # 1989 CMP_ILD3
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: A shift 01/28/97
PROBLEM: 5 wafers overpolish, these wafers polished faster than the
rest of the lot, for the touch-up time calculated for the
rest of the lot was correct.
DISPOSITION: Lot remarked at oper 2136,
Please add an additional 3,000 angstroms to wafer # 15.
Please add an additional 2,000 angstroms to wafer # 17.
Please add an additional 1,000 angstroms to wafer #'s 11,23
and 24.
CORRECTIVE Lot was remarked and moved on.
ACTION:
|
| 62.519 | JL0884 5 wafer scrapped overpolish | SUBPAC::KULP | | Wed Jan 29 1997 08:29 | 27 |
| CMP PEX
LOT #: JL0884
QUANTITY: 24-5= 19
OPERATION # 1992 CMP_ILD1 CMP
POLISHER: CMP.B3
EVAL TOOL: Thickness.A5
DATE: B shift 01/28/96
PROBLEM: 5 send ahead smoked. 5 scrap.
DISPOSITION: Moved lot on with 5 less wafers, still need touch up.
CORRECTIVE Not sure what exactly happened. Calculations were determined
correct, rest of lot still needs touch up. Op's tech said
1 sec was used for the 5 send aheads. Not sure if the send
aheads saw the calculated 190 sec. time for the rest of lot.
It doesn't appear to be the case, because still a lot of
circuitry left. Or some other time was entered, other then
the 1 sec. for the 5 send aheads. Not able to tell, no run
history on CMP system.
|
| 62.520 | JL0822 1 wafer scrapped overpolish | SUBPAC::KULP | | Wed Jan 29 1997 08:30 | 24 |
| CMP PEX
LOT #: JL0822
QUANTITY: 24-1=23
OPERATION # 1994 CMP_ILD2
POLISHER: CMP.B3
EVAL TOOL: Thickness.A5
DATE: B shift 01/28/96
PROBLEM: 1 wafer scrapped and 2 reworked for over polish.
DISPOSITION: Moved lot on with 1 less wafer. This lot was inherited
from previous shift. This did not occur at touch up.
Finished touch up with out any other problems. No charts
popped or annotations created.
CORRECTIVE Action: Need to talk to A shift for possible answers to what
happened.
|
| 62.521 | CMP PEX,JL0906,HIGH INCOMING STEP HEIGHT. | SUBPAC::SMARTIN | | Wed Jan 29 1997 09:42 | 31 |
|
LOT #: JL0906
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/29/97
PROBLEM: Incoming step height out of spec. High
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JL0906 N/A
HEIGHT_ME WAFER #1 CENTER 4353.000
WAFER #1 EDGE 4224.000 1/29/97 08:57:07
WAFER #2 CENTER 4576.000
WAFER #2 EDGE 4577.000
UCL=4200.000
DISPOSITION: Lot will be moved on to next operation.
CORRECTIVE ACTION: None required.
|
| 62.522 | CMP PEX,1 WAFER OVERPOLISHED ON JL0887 "B" SHIFT | SUBPAC::SMARTIN | | Wed Jan 29 1997 11:36 | 45 |
|
LOT: JD0887
MACHINE: CMP.B2
OPER#: 1992
PROCESS LEVEL: ILD-1
DATE: 1/29/97
SHIFT: B- SHIFT
QUANTITY: 24
PRODUCT.....DC1064-903-BA-8P
LOT; JL0887
.
PROBLEM: 1 Wafer was over polished on the first five send ahead wafers
for this lot.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5284.000
WAFER #2 5275.000
WAFER #3 5723.000
WAFER #4 5631.000
*** OVER POLISHED WAFER WAFER #5 4685.000
THK_RG JL0887 1550.000
THK_SD_5 WAFER #1 4.200
WAFER #2 2.750
WAFER #3 2.560
WAFER #4 5.610
LCL=5200
DISPOSITION: Please add an additional 1,000 angstroms at DEP to wafer #6. |
This wafer was overpolished at CMP. Thank you!!
CORRECTIVE ACTION: Maybe cut back on the send ahead time for the initial
polish.
|
| 62.523 | CMP PEX,JL0941 HIGH INCOMING STEP HEIGHT | SUBPAC::SMARTIN | | Wed Jan 29 1997 15:18 | 31 |
|
LOT #: JL0941
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 01/29/97
PROBLEM: Incoming step height out of spec. High
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JL0941 N/A
HEIGHT_ME WAFER #1 CENTER 4336.000
WAFER #1 EDGE 4244.000
WAFER #2 CENTER 4680.000
WAFER #2 EDGE 4489.000
UCL=4200.000
DISPOSITION: Lot will be moved on to next operation.
CORRECTIVE ACTION: None required.
|
| 62.524 | CMP PEX, 7 WAFERS OVER POLISHED FROM XD0781 | SUBPAC::SMARTIN | | Wed Jan 29 1997 15:35 | 48 |
|
LOT: XD0781
MACHINE: CMP.B3
OPER#: 1989
PROCESS LEVEL: ILD-3
DATE: 1/29/97
SHIFT: A- SHIFT
QUANTITY: 22
PRODUCT.....DC1043-905-AC-8P
LOT; XD0781
.
PROBLEM: Lot passed on from previous shift with only a few wafers requiring a
very light touch up, which they got. Random sorted the lot and
discovered 2 thin wafers. 100% Measured the lot and found 5 additional
wafers that are low and will require extra dep. Also found a recipe
on CMP.B3 ( TUP A ) that was corrupted, recipe was deleted and a new
one was copied from a good recipe. We caught and repaired the recipe
before the light touch up was performed.
DISPOSITION: The lot was remarked for the extra dep required.
Wafer Thickness Extra Dep.
4 5503 4500
23 6484 3500
13 7247 2700
19 7994 2000
20 8329 2000
2 8946 1000
14 9341 500
CORRECTIVE ACTION: Due to the corrupt recipe that was found, please check
recipes before they are run on the tool to make sure
they are correct.
|
| 62.525 | JL0952 2 wafers scrapped due to crash on .A2 | LUDWIG::PHESTER | | Thu Jan 30 1997 17:19 | 32 |
|
CMP PEX
LOT # JL0952 DC1064
QUANTITY: 22
OPERATION # 1984 CMP_L_PMD
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: THICKNESS.A4
DATE: 1/30/97 D-Shift
PROBLEM: TWO WAFERS SCRAPPED DUE TO CRASH
DISPOSITION: LOT MOVE ON.
Due to the end results of the location of the broken
wafer, it looks like that the wafer slid out the left carrier
just prior to the right carrier lifting off.
Upon removal of the pad, several small bubbles were noticed
under the IC1000 pad.
CORRECTIVE
ACTION: CRASH REPORT HAS BEEN WRITTEN AND POSTED.
|
| 62.526 | JL0901 high incoming step @PMD | STRATA::PHESTER | | Fri Jan 31 1997 19:20 | 42 |
|
CMP PEX
LOT #: JL0901 PMD
QUANTITY: 24
OPERATION # 3362
POLISHER: CMP.A1
EVAL TOOL: PROFILER.A2
DATE: 1/31/97
PROBLEM: MEAN WAS 4231.5 UCL IS 4200
DISPOSITION: CHECKED THICKNESS AND SD AT OX DEP AND IT LOOKED PRETTY GOOD.
NO OBVIOUS EXPLANATION. OX DEP DATA BELOW.
THK_ME_5 WAFER #1 11638.000
WAFER #2 11455.000
WAFER #3 11409.000
WAFER #4 11390.000
WAFER #5 11374.000
THK_UN_5 WAFER #1 1.130
WAFER #2 1.270
WAFER #3 1.320
WAFER #4 1.240
WAFER #5 1.290
CORRECTIVE
ACTION: NONE
|
| 62.527 | High Std.Dev | YIELD::SHONG | | Sat Feb 01 1997 07:10 | 28 |
| PE PEX NOTIFICATION
LOT # XE0902
QUANTITY: 09
OPERATION # 1989 CMP_ILD3
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: Profiler.A2
DATE: 02/01/97 D-Shift
PROBLEM: This lot had high Std.Dev at this operation.
DISPOSITION: Checked remarks on this lot. This lot has been through a ton
of splits. Including non-standard thickness prior to coming into
CMP. The UCL for Std.Dev is 16%. The lot had readings of ~16.4%
and 17.0%. The films group has been moving this lot through
using a monitor instead of product due to no program in there
UV1050. The monitor failed but the lot was moved on. Lot was
moved on here as well to Furn.
CORRECTIVE None
ACTION:
|
| 62.528 | JL0829 SLIGHTLY LOW OUTGOING THICKNESS @PMD | STRATA::PHESTER | | Sat Feb 01 1997 13:57 | 27 |
|
CMP PEX
LOT #: JL0829 PMD
QUANTITY: 24
OPERATION # 3106
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A4
DATE: 1/11/97
PROBLEM: MEAN WAS 6172 LCL IS 6200
DISPOSITION: LOTS MOVED ON.
CORRECTIVE
ACTION: LOT LOOKED GOOD COMING IN. UNIFORMITY WAS OK. NOTHING UNUSUAL
ABOUT PROCESS. GOF ON ALL POINTS LOOKED GOOD.
|
| 62.529 | LATE POSTING XD0582 SLIGHTLY HIGH SD @PMD | STRATA::PHESTER | | Sat Feb 01 1997 14:06 | 26 |
|
CMP PEX
LOT #: XD0582 PMD
QUANTITY: 23
OPERATION # 2957
POLISHER: CMP.A2
EVAL TOOL: THICKNESS.A4
DATE: 1/17/97
PROBLEM: SD WAS 9.8 UCL IS 9.0
DISPOSITION: LOT MOVED ON
CORRECTIVE MEAN THICKNESS WAS GOOD. NOTHING UNUSUAL ABOUT LOT INCOMING
ACTION: OR PROCESSING. GOF ON READING GOOD.
|
| 62.530 | JL0938 High incoming step height @pmd | STRATA::POZORSKI | | Mon Feb 03 1997 15:56 | 33 |
| CMP PEX
LOT #: JL0938
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 02/03/97
PROBLEM: Incoming step height out of spec. High
Incoming step height was 4493� UCL= 4200
RUN_ID_1 JL0938 N/A
HEIGHT_ME WAFER #1 CENTER 4531.000
WAFER #1 EDGE 4430.000 2/03/97 15:09:36
WAFER #2 CENTER 4501.000
WAFER #2 EDGE 4511.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights.
There was no remarks for this lot as to why we had high incoming
step heights.
|
| 62.531 | CMP.A2 CRASH @ PMD, XD0947 lost 2 wafers {02, 24} | YIELD::MANDREOLI | | Tue Feb 04 1997 04:09 | 25 |
| PE PEX NOTIFICATION
LOT # XD0947 (TM0069)
QUANTITY: 24 - 2 = 22
OPERATION # 1978 CMP_PMD
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: 02/03/97 23:55:00 B-Shift
PROBLEM: CMP.A2 CRASHED. Right Carrier dropped its wafer in step 3 of the
PMD recipe. One wafer smashed, the other severely scratched. See
CMP Notesfile 9.50 for all crash details.
DISPOSITION: Two wafers {#02 #24} were scrapped from the lot.
CORRECTIVE
ACTION: PAD and CARRIER change completed, system running breakins and
then MQC.
|
| 62.532 | Overpolish on a PMD lot. | YIELD::SHONG | | Wed Feb 05 1997 00:00 | 30 |
| PE PEX NOTIFICATION
LOT # JD0936
QUANTITY: 22
OPERATION # 1978 CMP_PMD
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 02/04/97 D-Shift
PROBLEM: The lot was overpolished by ~3000� at this operation. The UV1050
program was not measuring the correct spot on the wafer. In turn
the readings that were given after the operator polished the lot
were false. The operator thought the lots needed to be polished
some more but they actual were to thin as it was. Eric noticed
the recipe was wrong and adjusted it. The lot was re-measured
and was then noticed.
DISPOSITION: A remark has been added to operation 2127 Dep_PMD to add an
extra 3000�.
CORRECTIVE It might be time to change the password on the UV1050's. It
ACTION: seems everybody has there hands in there and making changes
that are not needed.
|
| 62.533 | Overpolish on a PMD lot. | YIELD::SHONG | | Wed Feb 05 1997 00:01 | 31 |
| PE PEX NOTIFICATION
LOT # JD0928
QUANTITY: 20
OPERATION # 1978 CMP_PMD
/DESCR.
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A4
DATE: 02/04/97 D-Shift
PROBLEM: The lot was overpolished by ~3000� at this operation. The UV1050
program was not measuring the correct spot on the wafer. In turn
the readings that were given after the operator polished the lot
were false. The operator thought the lots needed to be polished
some more but they actual were to thin as it was. Eric noticed
the recipe was wrong and adjusted it. The lot was re-measured
and was then noticed.
DISPOSITION: A remark has been added to operation 2127 Dep_PMD to add an
extra 3000�.
CORRECTIVE It might be time to change the password on the UV1050's. It
ACTION: seems everybody has there hands in there and making changes
that are not needed.
|
| 62.534 | xd0585 5 wafers scrapped @ILD1 | STRATA::PHESTER | | Fri Feb 07 1997 16:07 | 31 |
|
CMP PEX
LOT # XD0585
QUANTITY: 22...17
OPERATION # 1981 CMP AFTER ILD1
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: NA
DATE: 2/7/97 C-Shift
PROBLEM 5 SEND AHEADS RAN AT 200 SEC. WAFERS CAME OFF .B2 RANGING FROM 6090 -
6915. RAN LOT FOR 217 SECONDS. 100% ON THICK.A5, 5 SEVERELY OVER
POLISHED (METAL) AND 14 WERE OVERPOLISHED. THESE 5 THAT WERE SCRAPED
WERE IN THE MIDDLE OF THE RUN. THIS WAS THE 4TH RUN OF THE LOT, 5
(SEND AHEAD TOUCH UP) WAFERS PRIOR WERE FINE, 5 AFTER WERE FINE..??
DISPOSITION: 5 WAFERS SCRAPPED. LOT MOVED ON.
LOT WILL BE BINNED ACCORDING TO THICKNESS AND REMARKED FOR EXTRA
DEP AT NEXT OPERATION.
CORRECTIVE
ACTION: TOOL HAS BEEN CHECKED AND NOTHING OBVIOUS FOUND. MQCs' WILL BE
DONE ON TOOL.
|
| 62.535 | JL0672 1 wafer scrapped overpolished | STRATA::POZORSKI | | Sun Feb 09 1997 12:57 | 25 |
| CMP PEX
LOT #: JL0672
QUANTITY: 24-1=23
OPERATION # 1994 CMP_ILD2
POLISHER: CMP.B1
EVAL TOOL: Thickness.A5
DATE: A shift 02/09/97
PROBLEM: 1 wafer scrapped for being overpolished. The one wafer was
toasted it was run with the rest of the lot at 220 sec it is
the only wafer that came out low it read 990 and he reread it
and it was 1061. The program look good so, it looks like this
wafer may have had a problem when it came into the room.
DISPOSITION: Moved lot on with 1 less wafer.
CORRECTIVE Action: Lot was remarked and moved on, no further action required
at this time.
|
| 62.536 | High SD @PMD - JL09696 | STRATA::POZORSKI | | Sun Feb 09 1997 19:29 | 32 |
| CMP PEX
LOT #: JL0969
QUANTITY: 24
OPERATION # 1984 CMP_L_PMD
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: A shift 02/09/97
PROBLEM: Slightly high SD after lot was polished 12.2 (UCL = 9)
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 6543.000
WAFER #2 6689.000
WAFER #3 6621.000
WAFER #4 6710.000
WAFER #5 6583.000
THK_RG NA N/A 2/09/97 19:19:06
THK_SD_5 WAFER #1 13.100
WAFER #2 12.600
WAFER #3 14.500
WAFER #4 10.600
WAFER #5 10.200
DISPOSITION: Lot moved on.
CORRECTIVE No further action required, lot was moved.
|
| 62.537 | JL0978 High incoming step height @PMD | STRATA::POZORSKI | | Mon Feb 10 1997 15:53 | 33 |
| CMP PEX
LOT #: JL0978
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 02/10/97
PROBLEM: Incoming step height out of spec. High
Incoming step height was 4500� UCL= 4200
RUN_ID_1 NA JL0978
HEIGHT_ME WAFER #1 CENTER 4528.000
WAFER #1 EDGE 4586.000
WAFER #2 CENTER 4318.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights.
There was no remarks for this lot as to why we had high incoming
step heights.
|
| 62.538 | JL0938- 3 wafers overpolished- update from b-shift | STRATA::POZORSKI | | Mon Feb 10 1997 16:43 | 37 |
| PE PEX NOTIFICATION
LOT # JL0938 (DC1031)
QUANTITY: 24
OPERATION # 1992 CMP_ILD1
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 02/10/97 B-Shift
PROBLEM: 3 of the 5 send ahead wafers for this lot were slightly
overpolished, after the initial 170 second time. Thickness
Measurements are:
THICKNESS.A4
Wfr# Tox
13 4995� (LCL = 5200 �)
19 5032�
22 4747�
The other two wafers were within limits at 5483�, and 5282�.
DISPOSITION: Time was adjusted down to 165 and the remainder of the lot was
polished.
CORRECTIVE The 3 above mentioned wafers will require extra dep.
ACTION: Wafers #13 & 19 will need an extra dep of 500�
Wafer #22 will need an extra dep of 1000�. A remark was added
at operation 2166 DEP_ILD1 3.
|
| 62.539 | JL0944 - 5 WAFERS OVERPOLISHED @ILD1 | STRATA::POZORSKI | | Mon Feb 10 1997 17:46 | 36 |
| CMP PEX REPORT
--------------
LOT: JL0944
MACHINE: CMP.B3
OPER#: 1992
PROCESS LEVEL: ILD-1
DATE: 2/10/97
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT..DC1044-903-EC-8P
.
PROBLEM: 5 wafers was over polished on the first five send ahead wafers
for this lot. These were five send aheads that were polished for the
same initial time as five wafers from a previous similar lot. However,
these five wafers came out a little thin.
DISPOSITION: These wafers were remarked at oper #2166 DEP_ILD1 3 to receive
extra dep.
Please add an additional 1,500 angstroms at DEP to wafer #12
Please add an additional 1,000 angstroms at DEP to wafer #10,13,
21 and 22.
CORRECTIVE ACTION: Maybe need to cut back on the send ahead time for the initial
polish or do not go by the previous lot.
|
| 62.540 | JL0907 - All wafers overpolished @ILD2 | STRATA::POZORSKI | | Mon Feb 10 1997 18:19 | 59 |
| CMP PEX REPORT
--------------
LOT: JL0907
MACHINE: CMP.B1
OPER#: 1994
PROCESS LEVEL: CMP_ILD2
DATE: 2/10/97
SHIFT: A-SHIFT
QUANTITY: 24
PRODUCT..DC1044-903-EC-8P
.
PROBLEM: All 24 wafers were overpolished at ILD2. They ran all of the wafers
for 200 secs and these were the readings they got after the 200 sec:
1. 7656 x 8. 6721 a 15. 7004 - 22. 6619 a
2. 7108 - 9. 6886 a 16. 6827 a 23. 6694 a
3. 7741 X 10. 6993 a 17. 6822 a 24. 6325 a
4. 7332 - 11. 6620 a 18. 6873 a
5. 7797 x 12. 6883 a 19. 6770 a
6. 7005 - 13. 6744 a 20. 7188 -
7. 7662 x 14. 6533 a 21. 6833 a
After that they group the wafers and the ones with the (a) next to
them were run for 8 secs.
The ones with the (x) were run for 30 secs.
The ones with the (-) were run for 19 secs.
(NOTE - The removal rate to begin with was 3287)
And after running these wafers they came out as followed:
1. 5265 10. 4833 19. 5038
2. 5538 11. 4740 20. 4853
3. 5191 12. 5003 21. 5374
4. 5253 13. 4804 22. 5045
5. 4736 14. 5084 23. 4853
6. 5085 15. 5051 24. 4561
7. 4704 16. 5011
8. 4763 17. 4584
9. 5271 18. 4669
Eric checked the program on the UV1050 and everything looked good as
far as reading the right sites so, this is one that we are really
not sure what happened.
DISPOSITION: This lot was remarked at oper #2172 DEP_ILD2 3 to receive
500� extra dep on all of the wafers.
CORRECTIVE ACTION: Not really sure what needs to be done due to the fact we
are not sure what happened. The only thing to do would be
to cut back on the touch up times.
|
| 62.541 | JD0960 - 2 wafers scrapped due to crash on A2 | STRATA::POZORSKI | | Mon Feb 10 1997 18:57 | 25 |
| PE PEX NOTIFICATION
LOT # JD0960
QUANTITY: 23 - 2 = 21
OPERATION # 1978 CMP_PMD
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: 02/10/97 A-Shift
PROBLEM: They were running the 2 wafers through the touch-up when
the right carrier decided that it didn't want that wafer so,
it lost the one wafer which causing the other wafer to get
scratched up.
DISPOSITION: Two wafers were scrapped from the lot.
CORRECTIVE PAD and CARRIER change completed, system running breakins and
ACTION then MQC.
|
| 62.542 | JL0979 - High step height at PMD | STRATA::POZORSKI | | Tue Feb 11 1997 12:59 | 33 |
|
CMP PEX
LOT #: JL0979
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 02/11/97
PROBLEM: Incoming step height out of spec. (Slightly High)
Incoming step height was 4217� UCL= 4200
RUN_ID_1 JL0979 N/A
HEIGHT_ME WAFER #1 CENTER 4198.000
WAFER #1 EDGE 4176.000
WAFER #2 CENTER 4229.000
WAFER #2 EDGE 4265.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights.
There was no remarks for this lot as to why we had high incoming
step heights.
|
| 62.543 | XE0597 - 13 wafers overpolished @ILD1 | STRATA::POZORSKI | | Tue Feb 11 1997 14:23 | 69 |
| CMP PEX REPORT
--------------
LOT: XE0597
MACHINE: CMP.B2
OPER#: 1981
PROCESS LEVEL: CMP_ILD1
DATE: 2/11/97
SHIFT: A-SHIFT
QUANTITY: 22
PRODUCT..TM0069-907-BA-8C
PROBLEM: 13 Wafers overpolished...Ran 5 send aheads last night but then did a
pad change. B shift I assume ran 5 more and then the lot. There was
no additional information on what time they ran the rest of the lot
given to us. It was passed down to us that the lot should be close
to being done and needed 100%. They had trouble reading this lot this
morning and called Rich Dumas. He did make adjustments to the program.
Also, Eric made further adjustments. It's very possible that the send
aheads of this lot were not reading accurately.
THK_ME_5 WAFER #1 5728.000
WAFER #2 5735.000
WAFER #3 5029.000
WAFER #4 5115.000
WAFER #5 5408.000
THK_RG XE0597 2212.000
THK_SD_5 WAFER #1 12.300 2/11/97 13:47:59
WAFER #2 14.200
WAFER #3 3.070
WAFER #4 7.140
Below are the thickness results from the 13 wafes after the touch-ups
were done:
Wafer # reading
3 4880
4 4925
5 4807
8 4577
10 5011
11 5138
14 5060
15 4567
17 4751
18 5111
19 4891
20 5016
23 5095
DISPOSITION: These wafers were remarked at oper #2166 DEP_ILD1 3 to receive
extra dep.
Wafer #8 and #15 were remarked for an extra 1000A dep. All
remaining wafers were remarked for an extra 500� dep.
CORRECTIVE: Need better passdown from the other shift so that we know
ACTION what went on that shift. It is very hard to understand what
happened if the information is not passed down. Also we
are not sure what time was used for the touch-up.
|
| 62.544 | JL0972 - Slightly high incoming step height @pmd | STRATA::POZORSKI | | Wed Feb 12 1997 16:14 | 33 |
| CMP PEX
LOT #: JL0972
QUANTITY: 23
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 02/11/97
PROBLEM: Incoming step height out of spec. (Slightly High)
Incoming step height was 4370� UCL= 4200
RUN_ID_1 JL0972 N/A
HEIGHT_ME WAFER #1 CENTER 4401.000
WAFER #1 EDGE 4432.000
WAFER #2 CENTER 4330.000
WAFER #2 EDGE 4318.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights.
This lot did get splits done at 1332 I2_L_N+, 1334 I2_L_MDN D,
1335 I2_L_MDN S, 1326 I2_L_WELL, 1327 I2_L_VTP other then that no
other splits were done.
|
| 62.545 | Overpolioshed wafers | YIELD::SHONG | | Wed Feb 12 1997 23:36 | 33 |
| PE PEX NOTIFICATION
LOT # JD0959
QUANTITY: 24
OPERATION # 1978 CMP_PMD
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 02/12/97 D-Shift
PROBLEM: Five wafers from this lot were overpolished at this operation.
I checked the history in the UV1050 and everything looked OK.
Thickness dropped to ~5000� for five wafers after the first
pass. There's a remark at this operation about pattern Recog-
nition issues for some of the wafers. Apparently the lot was
split in photo using different reticles and that was going to
through off the pattern set up for several wafers. Out of the
five wafers overpolished two of them were from the split.
A special recipe was set up in the UV1050 for these wafers.
I think the 5 wafers could have received an extra polish some
how but I'm not sure.
DISPOSITION: I added a remark at operation 2127 DEP_PMD 2 for an extra
1500� on wafers 1,3,8,12 and 23.
CORRECTIVE None.
ACTION:
|
| 62.546 | JL0901 HIGH INCOMING STEP @PMD | STRATA::PHESTER | | Thu Feb 13 1997 15:38 | 29 |
|
CMP PEX
LOT #: JL0901 PMD
QUANTITY: 24
OPERATION # 3362
POLISHER: cmp.a1
EVAL TOOL: profiler.a2
DATE: 1/31/97
PROBLEM: INCOMING STEP HEIGHT SLIGHTLY ABOVE UCL.
DISPOSITION: LOT MOVED TO POLISH
SD FROM DEP LOOKED PRETTY GOOD.
CORRECTIVE
ACTION: NONE. LOT WILL BE POLISHED ACCORDINGLY.
|
| 62.547 | JD0933 high SD @ILD1 | STRATA::PHESTER | | Thu Feb 13 1997 19:03 | 45 |
|
CMP PEX
LOT #: JD0933
QUANTITY: 24
OPERATION # 3054 THK_ILD1_PST
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 2/13/97
PROBLEM: HIGH OUTGOING STANDARD DEVIATION AVERAGE AT 17.8. UCL IS 15.0
THK_ME_5 WAFER #1 N/A
WAFER #2 5504.000
WAFER #3 5523.000
WAFER #4 5418.000
WAFER #5 5112.000
THK_RG JD0933 3263.000
THK_SD_5 WAFER #1 N/A
WAFER #2 13.000
WAFER #3 17.500
WAFER #4 22.000 2/13/97 10:54:26
WAFER #5 18.800
DISPOSITION: LOT MOVED ON
MEAN THICKNESS LOOKED GOOD. INCOMING SD WAS VERY GOOD. NO SPLITS
THAT WOULD CONTRIBUTE TO THE PROBLEM. UV1050 PROGRAMS AND
READINGS VERIFIED AS GOOD.
CORRECTIVE
ACTION: LOT WAS POLISHED ACROSS SHIFTS. SPC CHART SHOWS SD TRENDING UP
THE LAST THREE RUNS. SYSTEM WAS POLISHING EDGE FAST. ID/OD
WAS ADJUSTED AND THE NEXT LOT THAT WAS RUN HAD SD OF 12.3.
|
| 62.548 | YE0218 high outgoing range @ILD3 | STRATA::PHESTER | | Fri Feb 14 1997 19:14 | 44 |
|
CMP PEX
LOT #: YE0218
QUANTITY: 23
OPERATION # 3064 THK_CMP 16 THK_ILD3_PST
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 2/14/97
PROBLEM: RANGE SLIGHTLY ABOVE UCL @ 4644�. UCL IS 4500�
THK_ME_5 WAFER #1 10168.000
WAFER #2 9821.000
WAFER #3 9567.000
WAFER #4 10230.000
WAFER #5 10576.000
THK_RG YE0218 4644.000
THK_SD_5 WAFER #1 14.600
WAFER #2 10.700
WAFER #3 7.600
WAFER #4 8.400 2/14/97 12:48:11
WAFER #5 10.400
DISPOSITION: LOT MOVED ON
MEAN THICKNESS LOOKED GOOD. INCOMING SD WAS VERY GOOD. NO SPLITS
THAT WOULD CONTRIBUTE TO THE PROBLEM. UV1050 PROGRAMS AND
READINGS VERIFIED AS GOOD. RANGE EXCURSION IS ACROSS LOT. NO
OVERPOLISHING SEEN ON WAFERS.
CORRECTIVE
ACTION: SUBSEQUENT LOT POLISHED ON TOOL HAD MUCH LOWER RANGE. LOOKS LIKE
AN ANOMALY.
|
| 62.549 | JL0901 15 wafers overpolish | SUBPAC::KULP | | Sun Feb 16 1997 05:59 | 124 |
| CMP PEX
LOT #: JL0901 PRODUCT...DC1040-901-DB-8P
QUANTITY: 24
OPERATION # 1994 CMP_ILD2
POLISHER: CMP.B2
EVAL TOOL: Thickness.A4
DATE: B shift 02/15/96
PROBLEM: 15 wafers were over polished from previous shift C.
popped chart CMP_B2, THK_ILD2_PST THK_ME_5
DISPOSITION: Send aheads used 5, removal rate was 4155 from previous shift
and a time of 180sec. Going through some calculations this is
what I came up with. Lots were remarked extra dep. at capping
dep. and moved on.
THK_ME_5 WAFER #1 4456.000 LCL:5200
WAFER #2 4245.000 mean = 4992.80
LOG AN EVENT WAFER #3 5255.000
WAFER #4 5641.000
WAFER #5 5367.000
THK_RG JL0901 1921.000 2/16/97 00:11:06
THK_SD_5 WAFER #1 10.100
WAFER #2 13.100
WAFER #3 8.500
WAFER #4 9.600
WAFER #5 8.300
Wafers from films:
K_ME_5 WAFER #1 18083.000
WAFER #2 18259.000
WAFER #3 18228.000
WAFER #4 18390.000
WAFER #5 18273.000
avg 18246. target 18000
18246-5500 = 12746�/180sec = 70.81 * 60 = 4247.6.4�/min calc'ed
removal rate. Initial run is spec'ed at 150 sec for ILD2.
Thick.A2 1. Take five pre readings mean: 18246�
2. Pre - target = delta: 18246� - 5500� = 12746�
3. run for 150 sec.s ??? not sure no history on speedfams!!
Thick.A4 4. Meas. the five send aheads from UV1050 = 4349.26�
5. If given a removal rate from previous shift of 4155, then
a guess at the time could be done. (4155�/min)/60 sec =
69.25�/sec. 18246� - 4349� (5 send aheads) = 13897� removed.
13897�/(69.25�/sec) = 200.7 sec.
CORRECTIVE Action: Speedfams need data capture. Better communication between
shifts. There was a pad change just before this lot was run
not sure of the reason, nothing in notes or passdown.
If my calculations are correct, then a guess at the
initial run time was about 200 sec, which is to long.
Some how we need to capture the data for removal rate and
run time for each run of a lot. There isn't a way to calc.
predicted removal vs. actual removal. Until then, I don't
think we will know if it's the CMP tool or measurement
techniques.
Ken, Keith, and Mark,
good evening, passed down, from c-shift, was lot jl0901 ild2 1040 at
CMP.b2.it was measuring 100% on thickness.a4.
After 100% the lot, here are the results:
wafer slot wafer # thickness deviation g.o.f.
1 08 4456* 20.0 good
2 18 4008- 25.1 " "
3 02 4007- 9.8 " "
4 10 4627* 14.9 " "
5 06 4245* 13.1 " "
6 --
7 11 4783# 20.0 " "
8 03 5090# 7.5 " "
9 14 5094# 8.9 " "
10 22 5204 13.4 " "
11 21 5587 9.8 " "
12 07 4749# 8.0 " "
13 13 5255 8.5 " "
14 09 5114# 7.8 " "
15 24 5385 9.2 " "
16 15 5304 16.4 " "
17 19 4725# 16.1 " "
18 04 5241 8.2 " "
19 16 5459 7.7 " "
20 01 5641 9.6 " "
21 05 5391 11.4 " "
22 17 4932# 13.5 " "
23 23 5367 8.3 " "
24 12 5528 6.2 " "
25 20 5467 10.2 " "
(#) - wafers will need 500 � extra depped
(*) - wafers will need 1000 � extra depped
(-) - wafers will need 1500 � extra depped
wafers #'s 3,7,9,11,14,17,19 will need 500 � extra depped
wafers #'s 6,8,10 will need 1k� extra depped
wafers #'s 2,18 will need 1.5k� extra depped
To verify my readings, I checked the goodness of fit, the measurement
sites, and watched the measurements physically, all was acceptable. This is
going to pop the charts, and annotations will be addressed. Also, the lot
will have to be remarked.
Please, if any questions, or if there is anything further to be
addressed, please let me know.
thanks
Scot
|
| 62.550 | JL1002 high stdev PMD, CMP.B1 | SUBPAC::KULP | | Sun Feb 16 1997 06:47 | 38 |
| CMP PEX
LOT #: JL1002 DC1064-003-BA-8P
QUANTITY: 24
OPERATION # 1984 CMP_L_PMD
POLISHER: CMP.B1
EVAL TOOL: Thickness.A5
DATE: B shift 02/16/96
PROBLEM: Popped chart CMP_B1, THK_PMD_PST THK_SD_5
THK_ME_5 WAFER #1 6225.000
WAFER #2 6294.000
WAFER #3 6203.000
WAFER #4 7026.000
WAFER #5 6761.000
LOG AN EVENT THK_RG JL1002 2327.000 2/16/97 06:04:28
THK_SD_5 WAFER #1 10.400
WAFER #2 6.010
WAFER #3 5.720
WAFER #4 5.850
WAFER #5 4.240
DISPOSITION: Moved lot on, wafer # 1 had 1 site measure at 5000�.
This brought mean down and Stdev. up. Measured on Thickness.a4
measured the same way, edge die was reading low, re-measured
again, moved measurement in 1 die from bad site, Stdev.
Wafer #1 mean 6328.8, stdev 6.79 in spec.
CORRECTIVE Action: None required at this time.
|
| 62.551 | JL0976, 20 wafers over polish ILD1, CMP.B1 | SUBPAC::KULP | | Sun Feb 16 1997 06:48 | 124 |
| CMP PEX
LOT #: JL0976 PRODUCT...DC1064-003-BA-8P
QUANTITY: 24
OPERATION # 1992 CMP_ILD1
POLISHER: CMP.B1
EVAL TOOL: Thickness.A5
DATE: B shift 02/15/96
PROBLEM: 20 wafers were over polished from previous shift C.
DISPOSITION: Send aheads used 5, removal rate was ???? and time ????
popped chart THK_ILD1_PST THK_ME_5, THK_ILD1_PST THK_RG
and THK_ILD1_PST THK_SD_5 for CMP.B1
THK_ME_5 WAFER #1 4290.000 LCL: 5200
WAFER #2 5130.000 mean = 4492.4
WAFER #3 4395.000
WAFER #4 4441.000
WAFER #5 4206.000
THK_RG JL0976 3834.000 UCL: 3400
THK_SD_5 WAFER #1 14.500 UCL: 15
WAFER #2 16.400 mean = 15.6
WAFER #3 15.000
WAFER #4 14.400
LOG AN EVENT WAFER #5 17.700 2/16/97 00:09:56
Films thickness:
THK_ME_5 WAFER #1 17881.000
WAFER #2 18090.000
WAFER #3 18183.000
WAFER #4 18208.000
WAFER #5 18260.000
avg. 18124.4
18124-5500 = 12624/150sec = 84.16�/sec * 60sec/min = 5049.6�/min
removal rate by spec. Initial run is 150 sec for ILD1.
Thick.A2 1. Take five pre readings: 18124�
2. pre - target = delta : 18246� - 5500� = 12746�
3. run for 150 sec.s ??? not sure no history on speedfams!!
Thick.A4 4. meas. the five send aheads. = 5406.84�
5. no removal rate or time given from previous shift.
It seems like the send aheads were polished correct from the
UV1050 data, at what polish time, not sure. The 100% was
performed on B shift, 5 wafers close to the LCL were probably
the send aheads. 100% was on Thick.A5 the rest of the lot needs
extra dep. not sure what happened. Lots were remarked.
CORRECTIVE Action: Speedfams need data capture. Better communication between
shifts. Not sure what run times were used and calc'ed
for removal rates.
Ken, Keith, and Mark,
good evening, passed down, from c-shift, was lot JL0976 ILD1 1064 at
cmp.b1.it was measuring on thickness.a5. I had to 100%, due to low reading on
final 5 wafers measured. here are the results:
wafer slot wafer # thickness deviation g.o.f.
1 20 4290 14.5 pass
6 13 5129 16.3 pass
13 23 4394 15.0 pass
20 6 4440 14.5 pass
23 1 4206 17.7 pass
--------------------------------------------------
mean 4490 15.6 all sites good
After 100% the lot, here are the results:
wafer slot wafer # thickness deviation g.o.f.
1 20 4290* 14.5 good
2 12 4442* 15.1 " "
3 7 4353* 12.9 " "
4 4 5182 11.5 " "
5 24 4868# 12.8 " "
6 13 5129 16.3 " "
7 19 4950# 11.4 " "
8 18 4649* 10.2 " "
9 2 4438* 16.6 " "
10 5 4819# 15.1 " "
11 16 5190 7.46 " "
12 14 5373 12.8 " "
13 23 4394* 15.0 " "
14 21 4264* 18.1 " "
15 8 4786* 9.04 " "
16 11 4573* 11.7 " "
17 22 4194* 13.8 " "
18 9 4991# 8.56 " "
19 15 4910# 9.62 " "
20 6 4440* 14.5 " "
21 17 4218* 16.1 " "
22 3 4653* 18.2 " "
23 1 4206* 17.7 " "
24 10 4821# 12.7 " "
(#) - wafers will need 500 � extra depped
(*) - wafers will need 1000 � extra depped
wafers #5,7,10,18,19,24 will need 500 � extra depped
wafers #1,2,3,8,9,13,14,15,16,17,20,21,22,23 will need 1k� extra depped
To verify my readings, I checked the goodness of fit, the measurment
sites, and watched the measuments physically, all was within parameters. This
is going to pop the charts, and anotations will be addressed. Also, the lot
will have to be remarked.
Please, if any questions, or if there is anything further to be
addressed, please let me know.
I thank you in advance
Mark R. Provencher b-shift cmp
|
| 62.552 | CMP PEX FOR LOW INCOMING STEP HEIGHT FOR XE0903 | SUBPAC::SMARTIN | | Sun Feb 16 1997 09:38 | 33 |
|
LOT #: XE0903
QUANTITY: 24
OPERATION # 3086 STP_PMD_PRE
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 02/16/97
PROBLEM: Incoming step height out of spec. LOW
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 XE0903 N/A
HEIGHT_ME WAFER #1 CENTER 2822.000
WAFER #1 EDGE 2687.000
WAFER #2 CENTER 2802.000
WAFER #2 EDGE 2758.000
LCL=3000.000
DISPOSITION: Polish times will be adjusted accordingly. Lot will be moved
on to next operation.
CORRECTIVE ACTION: None required.
|
| 62.553 | JD0897 1 scrap wafer over polish CMP.B3,ILD2 | SUBPAC::KULP | | Mon Feb 17 1997 05:31 | 43 |
| CMP PEX
LOT #: JD0897 PRODUCT..DC1035-000-SC-8T
QUANTITY: 24
OPERATION # 1985 CMP_ILD2
POLISHER: CMP.B3
EVAL TOOL: Thickness.A5
DATE: B shift 02/17/96
PROBLEM: 1 wafer over polish to 3343�, Thick.A5 scrapped < 3400.
3126�, Thick.A4
DISPOSITION: Checked measurements on both thickness tools. GOF and
thickness were above target for rest of lot. Low reading
found at 100% after initial run. Checked charts and remarks
at dep. no indication of unusual processing at dep.
No alarms on system.
Films thickness THK_ME_5 WAFER #1 18282.000
WAFER #2 17722.000
WAFER #3 17765.000
WAFER #4 17658.000
WAFER #5 17723.000
avg 17830
5 send aheads results low 6918.2 high 7848.5
175sec rr 3522 from A shift
1-4 +1sp: 170 sec
6-10 : 1 sec original send aheads
11-15 : 190 sec
16-20 : 190 sec wfr 16 which was low reading was in this run.
21-25 : 190 sec
CORRECTIVE Action: Continued touch up on lot. Lot will be moved on with 1 less
wafer. Possible low incoming thickness.
|
| 62.554 | Cmp pex for high incoming step height for JL1004 | SUBPAC::SMARTIN | | Mon Feb 17 1997 11:22 | 32 |
|
LOT #: JLI004
QUANTITY: 24
OPERATION # 3362 STP_L_PMDPRE
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 02/17/97
PROBLEM: Incoming step height out of spec. HIGH
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 NA N/A
HEIGHT_ME WAFER #1 CENTER 4511.000
WAFER #1 EDGE 4645.000 2/17/97 10:51:08
WAFER #2 CENTER 4615.000
WAFER #2 EDGE 4550.000
UCL=4200.000
DISPOSITION: Polish times will be adjusted accordingly. Lot will be moved
on to next operation. No remarks were found from dep.
CORRECTIVE ACTION: None required.
|
| 62.555 | CMP PEX FOR HIGH STDEV ON JL0997 | SUBPAC::SMARTIN | | Mon Feb 17 1997 17:40 | 48 |
|
LOT #: JL0997
QUANTITY: 24
OPERATION # 1991
POLISHER: CMP.A2
EVAL TOOL: Thickness.A4
DATE: A shift 02/17/97
PROBLEM: Wafer #23 was doubled dep'd for what ever reason. There were no
remarks stating what happened in films. Since the wafer was
double dep'd and the wafer had to be polished for so long that
the uniformity went high for that wafer only.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 6539.000
WAFER #2 6571.000
WAFER #3 6528.000 2/17/97 14:24:51
WAFER #4 6536.000
WAFER #5 6439.000
THK_RG JL0997 1580.000
THK_SD_5 WAFER #1 3.460
WAFER #2 10.100
WAFER #3 3.700
WAFER #4 4.110
WAFER #5 4.070
UCL=9.0
DISPOSITION:
After the lot was polished the first passs all wafers were in spec and
on target except 1. None of the wafers except this one needed to be
touched up. The remaining oxide on wafer #23 was 12118 after ~115 second
polish. The wafer was polished for an additional 150 seconds to bring it
to target. PE was informed before wafer was repolished. Wafer #23 after
polish had a mean of 6552 and a range 1582. No explanantion in previous
remarks as to why this wafer was ~double the thickness of all other
wafers in lot. The lot was remarked as to what wafer was high and the lot
was moved on.
CORRECTIVE ACTION: None required.
|
| 62.556 | CMP PEX, 2 WAFERS OVERPOLISHED ON JL0943 | SUBPAC::SMARTIN | | Mon Feb 17 1997 18:41 | 46 |
|
LOT: JL0943
MACHINE: CMP.B3
OPER#: 1994
PROCESS LEVEL: ILD-2
DATE: 2/17/97
SHIFT: A- SHIFT
QUANTITY: 24
PRODUCT......DC1044-903-EC-8P
LOT; JL0943
.
PROBLEM: POLISHED LOT ACCORDING TO SEND AHEADS DATA. 2 WAFERS CAME OUT TOO
THIN AND THE REST OF THE LOT NEEDED A TOUCH UP.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5387.000
WAFER #2 5427.000
WAFER #3 5141.000
WAFER #4 5806.000
WAFER #5 5340.000
THK_RG NA 2001.000
LCL=5200
DISPOSITION: A REMARK WAS ADDED FOR EXTRA DEP TO THESE 2 WAFERS.
WAFER THICKNESS EXTRA DEP.
4 4898 500
8 4977 500
CORRECTIVE ACTION: Maybe cut back on the send ahead time for the initial
polish.
|
| 62.557 | CMP PEX FROM YESTERDAY FOR HIGH STDEV FOR JD0935 | SUBPAC::SMARTIN | | Tue Feb 18 1997 09:17 | 47 |
|
LOT: JD0935
MACHINE: CMP.B1
OPER#: 1981
PROCESS LEVEL: ILD-1
DATE: 2/17/97
SHIFT: A- SHIFT
QUANTITY: 24
PRODUCT......DC1073-900-BA-8G
LOT; JD0935
.
PROBLEM: HIGH STD DEV ON OUT GOING READING.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5747.000
WAFER #2 5758.000
WAFER #3 N/A
WAFER #4 N/A
WAFER #5 N/A
THK_RG JD0935 2750.000
THK_SD_5 WAFER #1 15.500 2/17/97 19:03:11
WAFER #2 17.100
WAFER #3 N/A
WAFER #4 N/A
WAFER #5 N/A
UCL=15.0
DISPOSITION: LOT WAS REMARKED AND MOVED ON.
CORRECTIVE ACTION:THIS WAS THE THIRD LOT IN A ROW THAT HAD HIGH STDE
V FOR THIS TOOL. PAD AND CARRIERS WILL BE CHANGED
AND THE STDEV SHOULD COME BACK IN.
|
| 62.558 | CMP PEX,11 WAFERS OVER POLISHED ON JL0972 | SUBPAC::SMARTIN | | Tue Feb 18 1997 13:04 | 59 |
|
LOT: JL0972
MACHINE: CMP.B3
OPER#: 1992
PROCESS LEVEL: ILD-1
DATE: 1/18/97
SHIFT: B- SHIFT
QUANTITY: 24
PRODUCT.....DC1040-001-DB-8P
LOT; JL0972
.
PROBLEM: Lot passed on from previous shift, with a final 5 then ship the lot.
We found some thin wafers during the final 5 which resulted in going
to 100%.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5205.000
WAFER #2 5680.000
WAFER #3 5310.000
WAFER #4 5743.000
WAFER #5 5500.000 2/18/97 10:52:36
THK_RG NA 1692.000
THK_SD_5 WAFER #1 7.600
WAFER #2 26.100
WAFER #3 8.000
WAFER #4 8.300
WAFER #5 5.800
LCL=5200
DISPOSITION: The following wafers were remarked for extra dep.
Wafer Thickness Extra Dep.
6 5165 500
2 4929 500
23 4979 500
9 5028 500
21 4881 500
13 4714 500
24 4807 500
11 4992 500
14 4884 500
16 4645 1000
22 4529 1000
CORRECTIVE ACTION: The 11 wafers will get redep'd
|
| 62.559 | Revised pex for cmp on JL0972 over polish | SUBPAC::SMARTIN | | Tue Feb 18 1997 13:45 | 78 |
|
LOT: JL0972
MACHINE: CMP.B3
OPER#: 1992
PROCESS LEVEL: ILD-1
DATE: 1/18/97
SHIFT: B- SHIFT
QUANTITY: 24
PRODUCT.....DC1040-001-DB-8P
LOT; JL0972
.
PROBLEM: Lot passed on from previous shift, with a final 5 then ship the lot.
We found some thin wafers during the final 5 which resulted in going
to 100%.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5205.000
WAFER #2 5680.000
WAFER #3 5310.000
WAFER #4 5743.000
WAFER #5 5500.000 2/18/97 10:52:36
THK_RG NA 1692.000
THK_SD_5 WAFER #1 7.600
WAFER #2 26.100
WAFER #3 8.000
WAFER #4 8.300
WAFER #5 5.800
LCL=5200
DISPOSITION: The following wafers were remarked for extra dep.
Wafer Thickness Extra Dep.
6 5165 500
2 4929 500
23 4979 500
9 5028 500
21 4881 500
13 4714 500
24 4807 500
11 4992 500
14 4884 500
16 4645 1000
22 4529 1000
CORRECTIVE ACTION: This lot was also remarked that it recieved an over etch per
remarks. All wafer that were over etched also came out thin after
the polish.
Current Remark : Lot = JD0928 Rte = N/A Oper = 1424 |
| User = R_MANGIAFICO Pro = DC1035-000-SC-8T Op Des = ET_M1 |
| Start Date/Time = 11-FEB-1997 02:51 End Date/Time = ....perpetual.... |
| |
| THIS LOT WAS SPLIT ON METALETCH.A1 AS REMARKED TO DO. |
| |
| WAFERS 1,4,7,10,13,16,19,22 GOT THE STANDARD 83 SEC OVERETCH TIME. |
| |
| WAFERS 2,5,8,11,14,17,20,23,3,6,9,12,15,18,21,24 RECIEVED 50 SEC |
| OVERETCH TIME AS REMARKED TO DO |
| |
| ENDPOINT TIMES FOR BOTH SETS OF PILOTS WERE 46
| |
| LOT WAS RANDOM SORTED AND MOVED ON
|
| 62.560 | CMP PEX,HIGH STDEV FOR JL0972 | SUBPAC::SMARTIN | | Tue Feb 18 1997 13:47 | 77 |
|
LOT: JL0972
MACHINE: CMP.B3
OPER#: 1992
PROCESS LEVEL: ILD-1
DATE: 1/18/97
SHIFT: B- SHIFT
QUANTITY: 24
PRODUCT.....DC1040-001-DB-8P
LOT; JL0972
.
PROBLEM: High STD DEV for the lot. The lot came from films with the following
remark.
Current Remark : Lot = JD0928 Rte = N/A Oper = 1981 |
| User = R_LAAKKO Pro = DC1035-000-SC-8T Op Des = CMP_ILD1 |
| Start Date/Time = 12-FEB-1997 12:18 End Date/Time = ....perpetual.... |
| |
| This lot popped a chart at Op 3014 Thk_ILD1 2 for high thk range. |
| Five sample wafers measured from 16157 to 17793A for a range of |
| 1636A versus a spec maximum of 800A. |
| |
| Lot has been re-ordered by slot# but Prometrix UV 1050s in Films are not |
| available for 100% lot thk measurement. |
| |
| Please do 100% thk measurement and adjust polish conditions accordingly.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5205.000
WAFER #2 5680.000
WAFER #3 5310.000
WAFER #4 5743.000
WAFER #5 5500.000 2/18/97 10:52:36
THK_RG NA 1692.000
THK_SD_5 WAFER #1 7.600
WAFER #2 26.100
WAFER #3 8.000
WAFER #4 8.300
WAFER #5 5.800
LCL=15.0
DISPOSITION: This lot was also remarked that it recieved an over etch per
remarks. All wafer that were over etched also came out thin after
the polish.
Current Remark : Lot = JD0928 Rte = N/A Oper = 1424 |
| User = R_MANGIAFICO Pro = DC1035-000-SC-8T Op Des = ET_M1 |
| Start Date/Time = 11-FEB-1997 02:51 End Date/Time = ....perpetual.... |
| |
| THIS LOT WAS SPLIT ON METALETCH.A1 AS REMARKED TO DO. |
| |
| WAFERS 1,4,7,10,13,16,19,22 GOT THE STANDARD 83 SEC OVERETCH TIME. |
| |
| WAFERS 2,5,8,11,14,17,20,23,3,6,9,12,15,18,21,24 RECIEVED 50 SEC |
| OVERETCH TIME AS REMARKED TO DO |
| |
| ENDPOINT TIMES FOR BOTH SETS OF PILOTS WERE 46
| |
| LOT WAS RANDOM SORTED AND MOVED ON
CORRECTIVE ACTION: Garbage in garbage out syndrome
|
| 62.561 | CMP PEX FOR OVER POLISH ON XD0864 | SUBPAC::SMARTIN | | Tue Feb 18 1997 16:33 | 60 |
|
LOT: XD0864
MACHINE: CMP.B2
OPER#: 1986
PROCESS LEVEL: ILD-3
DATE: 1/18/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT.....TM0069-932-BA-8C
LOT; XD0864
.
PROBLEM: Over polished wafers.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 9925.000
WAFER #2 10418.000
WAFER #3 10213.000
WAFER #4 10412.000
WAFER #5 9909.000
THK_RG NA 4193.000
THK_SD_5 WAFER #1 15.200 2/18/97 15:48:06
WAFER #2 13.600
WAFER #3 15.900
WAFER #4 11.000
WAFER #5 10.900
PARAMETER UNIT ID/PROMPT VALUE FG LT
RATE_TM69 3543.000
TIME_TM69 150.000
DISPOSITION: Lot was remarked for extra dep.
Add 1000A extra dep to #2, 5, 8, 9, 10, 11, 12, 16, 19, 21, 23, 24
Add 2000A extra dep to #17, 20 and 7
From the best that we can tell, it looks like the polish rate increased.
The lot ranged from 12000-15200 and I grouped the lot and ran them
conservitively. Kyle is aware of the situation and looked at the data.
CORRECTIVE ACTION: Kevin Jubinville had mentioned earlier this week that
TM60's tend to have an increase in polish rate after you
hit a certain point in polishing. Maybe this is the
case w/ TM69's also...can't explain it...
|
| 62.562 | CMP PEX,1 WAFER SCRAPPED AND 6 OVER POLISHED ON JD0870 | SUBPAC::SMARTIN | | Tue Feb 18 1997 19:32 | 72 |
|
LOT: JD0870
MACHINE: CMP.B1
OPER#: 1985
PROCESS LEVEL: ILD-2
DATE: 1/18/97
SHIFT: A - SHIFT
QUANTITY: 22 DOWN TO 21
PRODUCT.....DC1073-900-BA-8G
LOT; JD0870
.
PROBLEM: 1 wafer scrapped and 6 over polished wafers. Lot JD1032 was ran at
the same time as JD0870 and that lot came out fine. It doesn't make
any sense that two lots with the same device and incoming thk was
just about the same and they were both polished together on the same
tool. Why is the end result so different?
The send aheads were ran for 160 sec and the polish was ran for
180 sec for both lots.
I did find out that lot JD1032 had to be reworked. Not sure if
this could be the reason why.
This Lot had to be reworked in OX-DEP.E3 due to the Dep
Rate problem that occurred in OX-DEP.E1. Here are the
Recipes, Slot #'s and the corresponding Wafer #'s of the
portion of the Lot that was reworked.
Wfr.# Slot# Thickness: Std: Spec = 1700 - 1900
14 2 17738 1.09
3 4 17217 .883
13 6 17903 .759
11 8 18103 .617
4 10 18153 .595
22 12 18235 .591
12 14 18350 .631
19 16 18258 .770
18 18 18998 .747
23 20 18179 .635
7 22 18181 .663
24 24 18165 .635
DISPOSITION:Results were, Lot Jd0870 thickness was from 3000 to 7135
results were, Lot jd1032 thickness was from 5763 to 7428 No over
polish's
Please add extra Dep to these wafers:
Wafer Thickness Extra Dep.
14 3421 2000
13 3800 1500
15 4094 1500
18 4288 1500
8 4438 1000
24 4820 500
CORRECTIVE ACTION: Lot was remarked for extra dep
|
| 62.563 | JL0968 HIGH INCOMING STEP @ILD1 | STRATA::PHESTER | | Wed Feb 19 1997 11:19 | 32 |
|
PE PEX NOTIFICATION
LOT # JL0968
QUANTITY: 23
OPERATION # 3198 STEP_ILD1
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 02/19/97 C-Shift
PROBLEM: HIGH INCOMING STEP ....ILD1
LOT INCOMING STEP AVG = 9638� UCL IS 9600�
Lot will be processed on CMP.B2
Annotation #4996 was opened and then closed.
DISPOSITION: LOT MOVED TO POLISH
THE ONLY POSSIBILE CAUSE FOUND FOR THIS IS THAT SOME WAFERS
WERE OVER-POLISHED AT PMD.
CORRECTIVE
ACTION NONE. EXCURSION WARRANTS NO FURTHER ACTION.
|
| 62.564 | XE0949 - 2 wafers scrapped due to chips | STRATA::POZORSKI | | Sun Feb 23 1997 17:20 | 23 |
| CMP PEX NOTIFICATION
LOT # XE0949
QUANTITY: 23 - 2 = 21
OPERATION # 1998 CMP_SCRUB1
/DESCR.
POLISHER: NA
TOOL: CMP-SCRUB.A2
DATE: 02/23/97 A-Shift
PROBLEM: 2 wafers were found chipped after handler mis-handled wafers in
cmp-scrub.a2. Wafer #'s 23 and 24 were scrapped.
DISPOSITION: Two wafers were scrapped from the lot.
CORRECTIVE EE found the cassette to have a broken location tab so, they
ACTION threw out the bad cassette and replaced it with a good one.
|
| 62.565 | JD0935 - 1 wafer over polished @ILD2 | STRATA::POZORSKI | | Sun Feb 23 1997 17:35 | 39 |
| CMP PEX
LOT: JD0935
MACHINE: CMP.B2
OPER#: 1985
PROCESS LEVEL: CMP_ILD2
DATE: 2/23/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT....DC1073-900-BA-8G
LOT: JD0935
.
PROBLEM: One wafer was over polished at ILD2, the proper touchup times were used
for this lot. For some particular reason this wafer just seem to
polish a little quicker then the rest of the lot. No real reason as
to why this 1 wafer got over polished......
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5504.000
WAFER #2 5033.000 (#1 low)
WAFER #3 5759.000
WAFER #4 5202.000
WAFER #5 5715.000
THK_RG JD0935 1922.000
DISPOSITION: Lot was remarked at 2133 DEP_ILD2 3 for an additional 500� to
wafer #1 of this lot.
CORRECTIVE ACTION: Lot was remarked for extra dep and was moved on.
|
| 62.566 | XE0614 - 4 wafers over polished | STRATA::POZORSKI | | Sun Feb 23 1997 18:05 | 36 |
| CMP PEX
LOT: XE0614
MACHINE: CMP.B2
OPER#: 1989
PROCESS LEVEL: CMP_ILD3
DATE: 2/23/97
SHIFT: A - SHIFT
QUANTITY: 20
PRODUCT....TM0069-907-BA-8C
LOT: XE0614
.
PROBLEM: Four wafers were over polished at ILD3, B-Shift polished these wafers
and A-Shift read them on the UV-1050. B-Shift used a removal rate of
3,600� per minute and polished it for the calculated time.
However, being this lot is a TM69 IDL3 they have noticed recently that
the removal rate for this device seems to accelerate when the lot is
close to completion.
DISPOSITION: Lot was remarked at 2136 DEP_ILD3 3 for an additional dep on these
wafers below:
Wafer #5 will require and additional 2,000� at dep.
Wafers #3,8,12 will require an additional 1,000� dep.
CORRECTIVE ACTION: Lot was remarked for extra dep and was moved on.
|
| 62.567 | JL1001 - 2 wafers overpolished @ILD1 | STRATA::POZORSKI | | Sun Feb 23 1997 18:19 | 36 |
| CMP PEX
LOT: JL1001
MACHINE: CMP.B1
OPER#: 1992
PROCESS LEVEL: CMP_ILD1
DATE: 2/23/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT....DC1064-003-BA-8P
LOT: JL1001
PROBLEM: Two wafers was over polished at ILD1, the proper touchup times were
used for this lot. For some unknown reason this wafer just seem to
polish a little quicker then the rest of the lot. No real reason as
to why these 2 wafer got over polished......
Wafer #2 came out at 4439
Wafer #10 came out at 4550
(LCL = 5200�)
DISPOSITION: Lot was remarked at 2166 DEP_ILD1 3 for an additional dep on these
wafers. Both wafers will get an additional dep of 1000�.
CORRECTIVE Lot was remarked for extra dep on the 2 wafers and moved on.
ACTION: NOTE - The rest of the lot came out good.
|
| 62.568 | JL1003 - 1 wafer with high sd | STRATA::POZORSKI | | Sun Feb 23 1997 19:34 | 36 |
| CMP PEX
LOT #: JL1003
QUANTITY: 24
OPERATION # 1992 CMP_ILD1
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: A shift 02/23/97
PROBLEM: Slightly high range on the THK_SD_5 due to 1 wafer being
high for SD after it was polished. Range came in at 13.210
(UCL = 13)
THK_ME_5 WAFER #1 5380.000
WAFER #2 5462.000
WAFER #3 5394.000
WAFER #4 5637.000
WAFER #5 5575.000
THK_RG JL1003 2747.000
THK_SD_5 WAFER #1 5.930
WAFER #2 4.890
WAFER #3 6.800
WAFER #4 18.100 (Kind of High)
WAFER #5 5.690
DISPOSITION: Lot was remarked and moved on, there were no splits done on this
lot but, there was a remark at operation 1992 CMP_ILD1 saying that
this lot 6 wafers above the UCL of 19000�. Other then that nothing
else was noted.
CORRECTIVE No further action required, lot was moved.
|
| 62.569 | CMP PEX, 8 WAFERS FOR EXTRA DEP FOR YD0238 | SUBPAC::SMARTIN | | Mon Feb 24 1997 18:24 | 44 |
|
LOT: YD0238
MACHINE: CMP.B2
OPER#: 1982
PROCESS LEVEL: ILD-1
DATE: 2/24/97
SHIFT: A - SHIFT
QUANTITY: 12
PRODUCT.....DC1018-010-AB-0D
LOT; YD0238
.
PROBLEM: 8 Wafers over polished
DISPOSITION: Polished SA's @ 140 sec. Calculated removal rate @3424.
Touched-up SA's @50 secs. and ran lot @209 secs. thickness ranged from
6190-7200. Grouped wafers and ran @ following times:
6200-6335 TUP 300
6490-6675 2 secs.
7030-7200 14 secs.
After touch-up wafers ranged from 4901-5349. Wafers 1,2,5,6,7,8,10,12
need 500A added at DEP. Wafers were remarked accordingly.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5084.000
WAFER #2 N/A
WAFER #3 5252.000
WAFER #4 N/A
WAFER #5 5349.000
THK_RG NA 1786.000
CORRECTIVE ACTION: Lot was remarked for extra dep
|
| 62.570 | JD0992 - 3 wafers with high stddev | STRATA::POZORSKI | | Tue Feb 25 1997 12:35 | 35 |
| CMP PEX
LOT #: JD0992
QUANTITY: 24
OPERATION # 1981 CMP_ILD1
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: A shift 02/25/97
PROBLEM: Slightly high range on the THK_SD_5 due to 3 wafers being
high for SD after it was polished. Mean Range came in at
15.7 (UCL = 15)
THK_IDL1_PST THK_ME_5 WAFER #1 5782.000
WAFER #2 5556.000
WAFER #3 5661.000
WAFER #4 5258.000
WAFER #5 5482.000
THK_RG NA 2964.000
THK_SD_5 WAFER #1 18.100 *
WAFER #2 18.400 *
WAFER #3 15.600 *
WAFER #4 13.400
WAFER #5 13.200
DISPOSITION: Lot was remarked and moved on, there was only 1 split done on this
lot and it was at I2_VTN S, other then that nothing else was noted.
CORRECTIVE No further action required, lot was moved.
|
| 62.571 | CMP PEX, JD1017 5 WAFERS REMARKED FOR EXTRA DEP. | SUBPAC::SMARTIN | | Tue Feb 25 1997 19:20 | 1 |
|
|
| 62.572 | CMP PEX,XM0948 3 WAFERS REMARKED FOR EXTRA DEP. | SUBPAC::SMARTIN | | Tue Feb 25 1997 19:31 | 49 |
|
LOT: XM0948
MACHINE: CMP.B1
OPER#: 1982
PROCESS LEVEL: ILD1
DATE: 2/25/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. TM0069-925-CA-8C
LOT; XM0948
.
PROBLEM: 3 Wafers over polished
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 4760.000
WAFER #2 5638.000
WAFER #3 5653.000
WAFER #4 5411.000
WAFER #5 5276.000
THK_RG XM0948 2339.000
DISPOSITION: Wafers 10, 13, & 16 need an additional 1000 angstrom oxide dep.
SA's ran @ 150. SA's thickness ranged from 6481-6947. SA's were touched
up at TUP375 and lot was run @166 secs. At 100% measure, 15 were in spec,
6 wafers needed slight touchup (ranged from 5813-6978) and 3 wafers
were overpolished @4146, 4752, and 4661 (Wafer #'s 10, 13, and 16)
As a further note, these were the last three wafers in the cassette when
they came into CMP. Most likely, incoming thickness was low.
Lot was remarked at DEP.
CORRECTIVE ACTION: Lot was remarked for extra dep
|
| 62.573 | CMP PEX ,JD1017 5 WAFERS REMARKED FOR EXTRA DEP | SUBPAC::SMARTIN | | Tue Feb 25 1997 19:37 | 42 |
|
LOT: JD1017
MACHINE: CMP.B1
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 2/25/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT......DC1035-000-SC-8T
LOT; JD1017
.
PROBLEM: 5 Wafers over polished
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 6640.000
WAFER #2 5740.000
WAFER #3 6717.000
WAFER #4 6519.000
WAFER #5 5624.000
THK_RG JD1017 1192.000
DISPOSITION: Please add an EXTRA 1000A oxide to wafer #14,15,20,21 and 23.
The original SA's were run for 15 secs. and ranged from 7526-7855.
These wafers were touched up @ 1 sec. Wafers ranged from 5520-5850.
CORRECTIVE ACTION: Lot was remarked for extra dep
|
| 62.574 | XD0914 HIGH INCOMING STEP @ILD2 | STRATA::PHESTER | | Thu Feb 27 1997 18:43 | 33 |
|
PE PEX NOTIFICATION
LOT # XD0914
QUANTITY: 22
OPERATION # 3080 STEP_ILD2
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 02/27/97 C-Shift
PROBLEM: LOW INCOMING STEP ...ILD-2
LOT INCOMING STEP AVG = 9742�
UCL IS 9600�
ANNOTATION # 5753
HAS BEEN CLOSED
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION NONE. THIS LOT HAS RECIEVED MULTIPLE SPLITS AT ILD DEP
OPERATIONS. THIS COULD BE THE REASON.
|
| 62.575 | JL1014 over polished @ILD2 | STRATA::PHESTER | | Fri Feb 28 1997 19:36 | 33 |
|
PROCESS EXCURSION REPORT FOR IMPLANT
______________________________________
PROCESS: 1308 MDDP
PROCESS DATE: 2/28/97 C SHIFT
IMPLANTER: MED-I.A2
T-WAVE: N/A LOT WAS AN ENGINEERING SPLIT LOT.
RECIPE: N/A
ENERGY: N/A
CURRENT: N/A
QUANTITY: 23
LOT(S): XD1020
PROBLEM: WAFER # 16 SCRAPPED. HANDLER HAD A WAFER NOT FOUND ERROR.
EE ADVISED PROBABLY CAUSED BY AN ARC. WAFER WAS BROKEN IN
CHAMBER WHILE TRANSPORTING.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: TOOL HAS BEEN CLEANED. MAID SERVICE, DUMMY IMPLANTS AND MQC
ARE BEING PERFORMED.
|
| 62.575 | JL1014 OVER POLISHED @ILD2 | STRATA::PHESTER | | Sat Mar 01 1997 18:13 | 33 |
|
PE PEX NOTIFICATION
LOT # JL1014
QUANTITY: 24
OPERATION # 1994 CMP_ILD2
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 02/28/97 C-Shift
PROBLEM: LOT OVERPOLISHED AT THIS OPERATION.
DISPOSITION: LOT MOVED ON.
MFG TECH POLISHED SEND AHEADS AND THEY CAME OUT GOOD AT 6 - 7K.
THE BALANCE OF THE LOT WAS THEN POLISHED. THE POLISH TIME USED
WAS SOMEWHAT LOWER THAN THE SEND AHEADS WOULD INDICATE.
INCOMING THINCKNESSES WERE GOOD AS WELL AS UNIFORM.
CORRECTIVE
ACTION LOT WAS BINNED ACCORDING TO THICKNESS AND REMARKED AT CAP FOR
EXTRA DEP. HANDED OVER TO NEXT SHIFT FOR TOOL DISPOSITION.
MQCs MAY BE PERFORMED.
|
| 62.576 | JL1042 HIGH SD @ILD1 | LUDWIG::PHESTER | | Sat Mar 01 1997 19:37 | 44 |
|
PE PEX NOTIFICATION
LOT # JL1042
QUANTITY: 24
OPERATION # 1992 CMP_ILD1
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 03/01/97 C-Shift
PROBLEM: SLIGHTLY OUT OF SPEC SD AT THIS OPERATION.
SD WAS 15.25 UCL IS 15.0
THK_ME_5 WAFER #1 N/A
WAFER #2 5701.000
WAFER #3 5745.000
WAFER #4 4832.000
WAFER #5 5861.000
THK_RG JL1042 3313.000
THK_SD_5 WAFER #1 N/A 3/01/97 17:23:56
WAFER #2 19.700
WAFER #3 9.100
WAFER #4 20.500
WAFER #5 11.700
DISPOSITION: LOT MOVED ON.
INCOMING THINCKNESSES WERE GOOD AS WELL AS SD. LOT DID
HOWEVER HAVE HIGH SD AT DEP ILD1. PSS MADE SOME ADJUSTMENTS
TO TiN SUBSTRATE THICKNESS IN UV150 RECIPE AND THE UNIFORMITY
CAME RIGHT IN. SUSPECT CHANGE IN TIN THICKNESS. NO TIME TO
MAKE ADJUSTMENTS THIS SHIFT. ONCOMING PSS NOTIFIED OF PROBLEM.
CORRECTIVE
ACTION ADJUSTMENTS MAY BE NEEDED IN UV1050 TIN SUBSTRATE THICKNESS.
|
| 62.577 | XD0915 ILD3 3 wafers broken while mapping input cassette | YIELD::MANDREOLI | | Sun Mar 02 1997 06:55 | 25 |
| PE PEX NOTIFICATION
LOT # XD0915 (TM0069)
QUANTITY: 23 - 3 = 20
OPERATION # 1989 CMP AFTER ILD3
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: NA
DATE: 03/02/97 B-Shift
PROBLEM: Three wafers {04,09,20} were broken while mapping the input
cassette. It appears that the cassette wasn't sitting correctly
in the input station, although the sensor was made, and the
mapping sequence broke the bottom three wafers in the cassette
DISPOSITION: Lot moved on with count minus 3.
CORRECTIVE Cleaned up broken wafer pieces, the other wafers from this lot
ACTION: were not damaged.
|
| 62.578 | JL1090 - Slightly high incoming step heights @PMD | STRATA::POZORSKI | | Sun Mar 02 1997 09:05 | 29 |
| CMP PEX
LOT #: JL1090
QUANTITY: 24
OPERATION # 3362 STP_L_PMDPRE
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/02/97
PROBLEM: Incoming step height out of spec. (Slightly High)
Incoming step height was 4339� UCL= 4200
RUN_ID_1 JL1090 N/A
HEIGHT_ME WAFER #1 CENTER 4246.000
WAFER #1 EDGE 4059.000
WAFER #2 CENTER 4562.000
WAFER #2 EDGE 4488.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits noted on this lot.
|
| 62.579 | JL1062 - High incoming Step height @PMD | STRATA::POZORSKI | | Sun Mar 02 1997 11:16 | 29 |
| CMP PEX
LOT #: JL1062
QUANTITY: 24
OPERATION # 3362 STP_L_PMDPRE
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/02/97
PROBLEM: Incoming step height out of spec.
Incoming step height was 4523� UCL= 4200
RUN_ID_1 JL1062 N/A
HEIGHT_ME WAFER #1 CENTER 4620.000
WAFER #1 EDGE 4481.000
WAFER #2 CENTER 4500.000
WAFER #2 EDGE 4492.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits noted on this lot.
|
| 62.580 | JD1118 - HAD HIGH OUTGOING RANGE @ILD3 | STRATA::POZORSKI | | Sun Mar 02 1997 15:26 | 40 |
| CMP PEX
LOT #: JD1118
QUANTITY: 16
OPERATION # 3064 THK_ILD3_PST
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 03/02/96
PROBLEM: LOT HAD HIGH OUTGOING RANGE ON ONE OF THE OUTGOING WAFERS ON THE
FINAL MASUREMENT.
THK_ME_5 WAFER #1 10166.000
WAFER #2 10490.000
WAFER #3 10098.000
WAFER #4 9814.000
WAFER #5 N/A
THK_RG JD1118 5817.000
THK_SD_5 WAFER #1 10.200 3/02/97 14:24:10
WAFER #2 13.900
WAFER #3 15.300
WAFER #4 19.700
WAFER #5 N/A
DISPOSITION: ALL FIVE WAFERS MEASURED HAD GOOD MEAN THICKNESS. HIGH RANGE WAS
CAUSED BY ONE OUTGOING WAFER OF A RANGE OF ~5800�. (UCL = 4500�)
LOT MOVED ON AND A REMARK WAS ADDED AT OPERATION #2136 FOR THE
RANGE.
CORRECTIVE NONE....THEY ARE GOING TO MONITOR THIS TOOL FOR POSSIBLE PROBLEMS
ACTION: ON THE OTHER LOTS.
|
| 62.581 | JD0930 - 2 wafers overpolished @ILD2 | STRATA::POZORSKI | | Sun Mar 02 1997 18:58 | 32 |
| CMP PEX
LOT: JD0930
MACHINE: CMP.B2
OPER#: 1985
PROCESS LEVEL: CMP_ILD2
DATE: 03/02/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT....DC1026-000-JA-8G
LOT: JD0930
PROBLEM: Two wafers were over polished at ILD2 (Wafer #21 & 24), this is a lot
that was being run for Eric. These 2 wafers had low incoming
thickness per a remark at operation #3080. When they went to run the
lot, slot #25 had a dummy wafer in it and they did not reduce the run
time sufficiently to compensate for the dummy wafer in this slot
causing the wafer #21 and 24 to be overpolished.
DISPOSITION: Lot was remarked at 2133 DEP_ILD2 3 for an additional 500� to
wafer #21 & 24 of this lot.
CORRECTIVE ACTION: Lot was remarked for extra dep and was moved on.
|
| 62.582 | JL1081 - High Step Heights @PMD | STRATA::POZORSKI | | Mon Mar 03 1997 13:55 | 29 |
| CMP PEX
LOT #: JL1081
QUANTITY: 24
OPERATION # 3362 STP_L_PMDPRE
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/03/97
PROBLEM: Incoming step height out of spec.
Incoming step height was 4372� UCL= 4200
RUN_ID_1 JL1081 N/A
HEIGHT_ME WAFER #1 CENTER 4408.000
WAFER #1 EDGE 4315.000
WAFER #2 CENTER 4456.000
WAFER #2 EDGE 4310.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits noted on this lot.
|
| 62.583 | jd1031 one wafer scrapped on scrubber | LUDWIG::PHESTER | | Thu Mar 06 1997 12:38 | 28 |
|
PE PEX NOTIFICATION
LOT # JD1031
QUANTITY: 23
OPERATION # 1980 CMP_SCRUB3
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: 03/06/97 C-Shift
PROBLEM: ONE WAFER SCRAPPED AT THE SCRUB OPERATION.
DUE TO A LIFTER ERROR ONE WAFER WAS BROKEN WHILE BEING
TRANSPORTED IN THE SCRUBBER TOOL.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION EQUIPMENT ENGINEERING IS WORKING ON A REPAIR.
|
| 62.584 | XE0903 high outgoing range @ILD3 | STRATA::PHESTER | | Fri Mar 07 1997 15:37 | 45 |
|
PE PEX NOTIFICATION
LOT # XE0903
QUANTITY: 23
OPERATION # 3120 THK_ILD3_PST
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 03/07/97 C-Shift
PROBLEM: HIGH RANGE AT THIS OPERATION.
THK_ME_5 WAFER #1 9975.000
WAFER #2 10099.000
WAFER #3 9980.000
WAFER #4 10185.000
WAFER #5 10085.000
THK_RG XE0903 6638.000
LOG AN EVENT THK_SD_5 WAFER #1 17.500 3/07/97 14:08:24
WAFER #2 17.400
WAFER #3 20.900
WAFER #4 18.600
WAFER #5 15.000
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION LOT REMARKED AT 2291 DEP_ILD3 TO NOTIFY FILMS.
ALL METRO TOOL READING VERIFIED AS GOOD.
PROBLEM IS WITHIN WAFER AS TOOL IS POLISHING EDGE HEAVEY AT THIS
OPERATION. AVERAGE THICKNESS GOOD.
ID/OD ON TOOL IS SET AT THE MAXIMUM. ANOTHER LOT THAT POLISHED
AT THTE SAME TIME WAS FINE. PAD IS OK.
|
| 62.585 | JD0959 HIGH OUTGOING SD @ILD3 | LUDWIG::PHESTER | | Sat Mar 08 1997 18:09 | 47 |
|
CMP PEX
LOT # JD0959
QUANTITY: 22
OPERATION # 3064 POST THICKNESS.A4 ILD3
/DESCR.
POLISHER: POST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 03/08/96 C-Shift
PROBLEM: HIGH THICKNESS & RANGE
POST THICKNESS AVG = 10572�
UCL IS 10500�
DISPOSITION: Lot ran on D-shift on CMP.B3
Wafer # mean thickness % Dev
1 11141 12.1
2 10636 12.2
3 10992 22.2
4 9844 25.1
5 10248 12.3
mean 10572
Open anno #6569
IT WAS DECIDED TO TOUCH UP THIS LOT. PROD. SUPER MOVED THE LOT
BACK AND THE TOUCH UP WAS DONE. MEAN THICKNESS CAME IN BUT SD
WAS STILL HIGH. THIS PROBLEM IS ATTRIBUTED TO THE PAD LOSING
REMOVAL RATE DURING POLISHING.
CORRECTIVE
ACTION ORIGINAL ANNOTATION WAS CLOSED AS WELL AS NEW ANNOTATION WHEN
LOT WAS PROC'D THROUGH THE SECOND TIME. PE WILL DELETE THE 1ST
POINT.
|
| 62.586 | XM0948 CMP_ILD2 4 wafers scrapped for overpolish | YIELD::MANDREOLI | | Sun Mar 09 1997 03:59 | 33 |
| PE PEX NOTIFICATION
LOT # XM0948 (TM0069)
QUANTITY: 24 - 4 = 20
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B2 ?
EVAL TOOL: THICKNESS.A5
DATE: 03/08/97 C-Shift
PROBLEM: Four wafers {4, 9, 10, 23} were severely overpolished with
exposed Metal. This happened at the end of the previous shift
and the lot was being measured 100% on this shift. All the other
wafers were right on for target thickness, and there is no
explanation for these overpolished ones. My guess is that they
were polished twice, that's only an assumption... Or perhaps
they were not dep'd at ILD2...? You make the call. Without the
Speedfam polish info (it's not saved) there is no verification.
REMARKs show nothing out of the ordinary. There were 3 wafers
overpolished at ILD1 and remarked for extra dep, although only
one of them is common to these, wafer #10.
DISPOSITION: Lot moved on with count minus 4.
CORRECTIVE Getting the Speedfams to store processing info would help...
ACTION: I think there are folks working on that.
|
| 62.587 | JL1088 - 8 wafers overpolished @PMD | STRATA::POZORSKI | | Sun Mar 09 1997 14:52 | 51 |
| CMP PEX
LOT: JL1088
MACHINE: CMP.A2
OPER#: 1984
PROCESS LEVEL: CMP_L_PMD
DATE: 03/09/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT....DC1043-005-AC-8P
LOT: JL1088
PROBLEM: Eight wafers were over polished at CMP_L_PMD (Wafer #1,2,5,6,10,18,20,
24), the lot was run on .A2 but, being the tool failed its mqc's they
decided to run the touch up wafers on .A1. It was noted after the lot
had completed the touch-ups that the left carrier seem to have had some
problems, it would stay down longer then it was suppose to and all of
these overpolished wafers came off the left carrier.
DISPOSITION: Lot was remarked at 2160 DEP_PMD for an additional Dep to
wafers #1,2,5,6,10,18,20,24 of this lot. Below are the final
thickness results:
Wafer # THK Additional Oxide needed at Oper 2160
(LCL = 6200�)
6 6132 500
10 6044 500
2 6176 500
24 6070 500
18 6028 500
5 6033 500
1 6060 500
20 6071 500
CORRECTIVE ACTION: Lot was remarked for extra dep and was moved on.
|
| 62.588 | JL1087 - 9 wafers overpolished @PMD | STRATA::POZORSKI | | Sun Mar 09 1997 15:05 | 56 |
| CMP PEX
LOT: JL1087
MACHINE: CMP.A1 & .A2(touchups)
OPER#: 1984
PROCESS LEVEL: CMP_L_PMD
DATE: 03/09/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT....DC1043-005-AC-8P
LOT: JL1087
PROBLEM: Nine wafers were over polished at CMP_L_PMD (Wafer #1,2,6,9,13,15,17,
19,23), the lot was run on .A2 but, being the tool failed its mqc's
they decided to run the touch up wafers on .A1. It was noted after
the lot had completed the touch-ups that the left carrier seem to have
had some problems, the left carrier would stay down longer then it was
suppose to and all of these overpolished wafers came off the left
carrier. In fact the tool ended up crashing (w/dummy wafer) due to the
left carrier sticking.
DISPOSITION: Lot was remarked at 2160 DEP_PMD for an additional Dep to
wafers #1,2,6,9,13,15,17,19,23 of this lot. Below are the final
thickness results:
Wafer # THK Additional Oxide needed at Oper 2160
(LCL = 6200�)
6 6194 500
13 6184 500
23 6021 500
9 6148 500
1 6120 500
15 6081 500
19 6055 500
17 6035 500
2 6192 500
CORRECTIVE ACTION: Lot was remarked for extra dep and was moved on, the tool
went down to have the pad & carrier change done due to the crash.
|
| 62.589 | JL1089 - High incoming step heights @PMD | STRATA::POZORSKI | | Sun Mar 09 1997 15:20 | 28 |
| CMP PEX
LOT #: JL1089
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/09/97
PROBLEM: Incoming step height out of spec.
Incoming step height was 4492.5� UCL= 4200
RUN_ID_1 JL1089 N/A
HEIGHT_ME WAFER #1 CENTER 4545.000
WAFER #1 EDGE 4254.000
WAFER #2 CENTER 4589.000
WAFER #2 EDGE 4582.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits or problems noted for this lot.
|
| 62.590 | XD0805 - LOW INCOMING STEP HEIGHTS @ILD3 | STRATA::POZORSKI | | Sun Mar 09 1997 16:39 | 28 |
| PE PEX NOTIFICATION
LOT # XD0805
QUANTITY: 22
OPERATION # 3081 STEP_ILD3
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 03/09/97 A-Shift
PROBLEM: LOW INCOMING STEP ...ILD3
LOT INCOMING STEP AVG = 16885�
LCL = 17000
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION NONE. THIS LOT HAS RECIEVED SPLITS AT ILD DEP OPERATIONS.
THIS COULD BE PART OF THE REASON, PLUS THERE WERE OTHER SPLITS
DONE ON THIS LOT.
|
| 62.591 | JL1123 - High incoming step heights @PMD | STRATA::POZORSKI | | Sun Mar 09 1997 18:59 | 28 |
| CMP PEX
LOT #: JL1123
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/09/97
PROBLEM: Incoming step height out of spec.
Incoming step height was 4449.75� UCL= 4200
RUN_ID_1 NA MNA
HEIGHT_ME WAFER #1 CENTER 4316.000
WAFER #1 EDGE 4502.000 3/09/97 17:15:50
WAFER #2 CENTER 4460.000
WAFER #2 EDGE 4521.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits or problems noted for this lot.
|
| 62.592 | JD0985 ILD3 4 wafers overpolished | YIELD::MANDREOLI | | Mon Mar 10 1997 05:24 | 50 |
| PE PEX NOTIFICATION
LOT # JD0985 (DC1073)
QUANTITY: 24
OPERATION # 1989 CMP_ILD3
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 03/09/97 A-Shift/B-shift
PROBLEM: Four wafers overpolished and will require extra dep at Oper 2136
DEP_ILD3.
* Incoming Tox ~34800 �
* Lot initally polished for 300 seconds.
* Mean of 22k� Oxide remaining, Removal Rate 2405�/min used.
* Polished lot for additional 297 seconds.
* 100% measure before touch up. Target = 10000 � 500
Tox results were:
Batch 1) 14466 12955 13670 14816 14407
Batch 2) 12301 11969 11792 12088 10904
Batch 3) 12541 11689 12371 12900 11906
Batch 4) 12666 10592 11208 12857 11591
Batch 5) 7177 6189 6073 5449 BLANK * require extra dep
Batch 5 ran with same time as other batches, the Time for this
batch should have been reduced ~20%. This could be why these
wafers were overpolished.
DISPOSITION: Lot has been REMARKED accordingly
These FOUR wafers require additional OXIDE DEPOSITION at this
Operation; they were overpolsihed at CMP_ILD3.
WAFER# SLOT# ADD
-------------------------
15 22 3000�
8 23 3000�
23 24 3000�
14 25 4000�
CORRECTIVE Lot remarked for extra capping dep.
ACTION:
|
| 62.593 | JL1095 - Slightly high incoming step heights @PMD | STRATA::POZORSKI | | Mon Mar 10 1997 11:21 | 29 |
| CMP PEX
LOT #: JL1095
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/10/97
PROBLEM: Incoming step height out of spec.
Incoming step height was 4384.5� UCL= 4200
RUN_ID_1 JL1095 N/A
HEIGHT_ME WAFER #1 CENTER 4234.000
WAFER #1 EDGE 4518.000 3/10/97 10:50:52
WAFER #2 CENTER 4504.000
WAFER #2 EDGE 4282.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits or problems noted for this lot.
|
| 62.594 | JL1099 - Slightly high incoming step heights @PMD | STRATA::POZORSKI | | Mon Mar 10 1997 11:34 | 29 |
| CMP PEX
LOT #: JL1099
QUANTITY: 24
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/10/97
PROBLEM: Incoming step height out of spec.
Incoming step height was 4327� UCL= 4200
RUN_ID_1 JL1099 N/A
HEIGHT_ME WAFER #1 CENTER 4417.000
WAFER #1 EDGE 4313.000
WAFER #2 CENTER 4169.000
WAFER #2 EDGE 4409.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits or problems noted for this lot.
|
| 62.595 | JL1100 had high incoming step heights @PMD | STRATA::POZORSKI | | Mon Mar 10 1997 18:32 | 28 |
| CMP PEX
LOT #: JL1100
QUANTITY: 22
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/10/97
PROBLEM: Incoming step height out of spec.
Incoming step height was 4497� UCL= 4200
RUN_ID_1 JL1100 N/A
HEIGHT_ME WAFER #1 CENTER 4084.000
WAFER #1 EDGE 4443.000 3/10/97 16:04:28
WAFER #2 CENTER 4649.000
WAFER #2 EDGE 4812.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits or problems noted for this lot.
|
| 62.596 | JD0932 - 3 wafers with high std @ILD2 | LUDWIG::POZORSKI | | Tue Mar 11 1997 18:52 | 34 |
| CMP PEX
LOT #: JD0932
QUANTITY: 23
OPERATION # 1985 CMP_ILD2
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: A shift 03/11/97
PROBLEM: Slightly high range on the THK_SD_5 due to 3 wafers being
high for SD after it was polished. Mean Range came in at
15.1 (UCL = 14)
THK_ME_5 WAFER #1 5896.000
WAFER #2 5871.000
WAFER #3 5531.000
WAFER #4 5313.000
WAFER #5 5528.000
THK_RG NA 1728.000
THK_SD_5 WAFER #1 18.400 *
WAFER #2 7.300
WAFER #3 9.480
WAFER #4 19.000 *
WAFER #5 22.400 *
DISPOSITION: Lot was remarked and moved on, there was a split done on this
lot at DEP_PMD 1, other then that nothing else was noted.
CORRECTIVE No further action required, lot was moved.
|
| 62.597 | JL1122 - Slightly high incoming step heights @PMD | LUDWIG::POZORSKI | | Tue Mar 11 1997 19:03 | 28 |
| CMP PEX
LOT #: JL1122
QUANTITY: 22
OPERATION # 3362 STP_L_CMP1
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/11/97
PROBLEM: Incoming step height out of spec.
Incoming step height was 4315.5� UCL= 4200
RUN_ID_1 JL1122 N/A
HEIGHT_ME WAFER #1 CENTER 4330.000
WAFER #1 EDGE 4544.000
WAFER #2 CENTER 4037.000
WAFER #2 EDGE 4351.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits or problems noted for this lot.
|
| 62.598 | JL1122 - 2 wafers had high SD after PMD | STRATA::POZORSKI | | Wed Mar 12 1997 09:34 | 33 |
| CMP PEX
LOT #: JL1122
QUANTITY: 24
OPERATION # 1984 CMP_L_PMD
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A5
DATE: A shift 02/12/97
PROBLEM: Slightly high SD on 2 wafers after lot was polished 9.02
(UCL = 9)
THK_ME_5 WAFER #1 6462.000
WAFER #2 6516.000
WAFER #3 6849.000
WAFER #4 6545.000
WAFER #5 6283.000
THK_RG JL1122 2342.000
THK_SD_5 WAFER #1 9.940 *
WAFER #2 8.130 3/12/97 09:16:24
WAFER #3 7.730
WAFER #4 8.210
WAFER #5 11.100 *
DISPOSITION: Lot was put on hold because Bryan wants to do some extra
thickness measuremts on this lot and then it will be moved on.
CORRECTIVE No further action required.
|
| 62.599 | XD1024 - 5 wafers scrapped @ILD1 | STRATA::POZORSKI | | Wed Mar 12 1997 17:13 | 35 |
| PE PEX NOTIFICATION
LOT # XD1024 (TM0069)
QUANTITY: 23 - 5 = 18
OPERATION # 1981 CMP_ILD1
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A5
DATE: 03/12/97 A-Shift
PROBLEM: Five wafers {1,2,5,6,9} were severely overpolished with
exposed Metal. These 5 wafers were there send ahead's and they
were run for 150 sec and the readings were 8108, 7555, 8020,
7829, 7337 for a total of 7700. They took the removal rate of
4249 and then they took the send ahead's avg 7500-5500 =
and then they divided it by 4249 x 60 = 28.2 sec but, they ended
up cutting it down to 18 sec and then re-ran the 5 wafers and
for some unknown reason they came out overpolished at 1326, 959,
1102, 1010, 1063. Eric was in there at the time and I talked to
him and he said that everything that the tech did was right and
he could not see why this happen becasue, all of the other wafers
were right on for target thickness. So, there is no real
explanation for why these wafers were overpolished. Without the
Speedfam polish info (it's not saved) there is no verification.
DISPOSITION: Lot moved on with count minus 5.
CORRECTIVE Getting the Speedfams to store processing info would help...
ACTION: I think there are folks working on that.
|
| 62.600 | XM1027 - SLIGHTLY LOW INCOMING STEP HEIGHTS @PMD | STRATA::POZORSKI | | Wed Mar 12 1997 17:25 | 28 |
| CMP PEX
LOT #: XM1027
QUANTITY: 24
OPERATION # 3078 STEP_CMP 1 (STEP_PMD)
POLISHER: N/A
EVAL TOOL: PROFILER.A2
DATE: A shift 03/12/97
PROBLEM: Incoming step height slightly low.
Incoming step height was 2994.25� LCL= 3000
RUN_ID_1 NA XM1027
HEIGHT_ME WAFER #1 CENTER 3036.000
WAFER #1 EDGE 2942.000 3/12/97 16:52:09
WAFER #2 CENTER 3081.000
WAFER #2 EDGE 2918.000
DISPOSITION: Lot moved to polish
CORRECTIVE Lot polish time will be ajusted to compensate for high step
ACTION: heights. There were no splits or problems noted for this lot.
|
| 62.601 | JL1159 high incoming step @PMD | STRATA::PHESTER | | Thu Mar 13 1997 10:59 | 31 |
|
CMP PEX
LOT # JL1159
QUANTITY: 24
OPERATION # 3362 STEP_PMD
/DESCR.
POLISHER: PRE READINGS
EVAL TOOL: PROFILER.A2
DATE: 03/13/96 C-Shift
PROBLEM: HIGH INCOMING STEP ....PMD
HIGH INCOMING STEP AVG = 4424�
LCL IS 4200�
DISPOSITION: CLOSED ANNOTATION # 7031. LOT MOVED TO POLISH.
CORRECTIVE
ACTION NOTHING UNUSUAL IN LOT HISTORY TO EXPLAIN THIS. LOT LOOKED
VERY GOOD AT PMD DEP. GOOD UNIFORMITY AND THICKNESS WAS RIGHT
ON TARGET. NO FURTHER ACTION.
|
| 62.602 | JD1052 4 WAFERS SCRAPPED @ILD2 - CRASH ON .B3 | STRATA::PHESTER | | Fri Mar 14 1997 09:44 | 25 |
|
CMP PEX
LOT # JD1052
QUANTITY: 20
OPERATION #
/DESCR. 1985 CMP_ILD2
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: 03/13/96 C-Shift
PROBLEM: FOUR WAFERS SCRAPPED DUE TO TOOL CRASH.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION EE CHECKED ALL VARIABLES AND MADE SOME ADJUSTMENTS BUT NO
ROOT CAUSE FOUND.
|
| 62.603 | JL1144 some wafers overpolished @pmd | STRATA::PHESTER | | Sat Mar 15 1997 18:17 | 32 |
|
CMP PEX
LOT # JL1144
QUANTITY: 20
OPERATION #
/DESCR. 1985 CMP_ILD2
POLISHER: CMP_B1
EVAL TOOL: THICKNESS.A5
DATE: 03/15/96 C-Shift
PROBLEM: SOME WAFERS OVERPOLISHED.
THIS LOT WAS POLISHED ON THE PREVIOUS SHIFT. LOT WAS GIVEN
100% EVAL AND SOME WAFERS FOUND TO BE OVERPOLISHED. ALL
METROLOGY MEASUREMENTS VERIFIED AS GOOD. NO CAUSE FOUND.
THIS LOT WAS A PMD LOT WHICH IS USUALLY POLISHED ON THE A TOOLS.
IT MAY BE THAT THE REMOVAL RATE WAS MISCALCULATED. NO WAY TO
BE SURE. THIS TOOL PERFORMED WELL AFTER THIS LOT WAS POLISHED
AND THE PAD HAD AROUND 400 WAFERS ON IT.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION LOT BINNED AND REMARKED AT CAP FOR EXTRA DEP.
|
| 62.604 | CMP PEX FOR 1 BROKEN WAFER IN LOT JD1108 | SUBPAC::SMARTIN | | Sun Mar 16 1997 18:54 | 35 |
|
LOT: JD1108
MACHINE: CMP.B2
OPER#: 1978
PROCESS LEVEL: PMD
DATE: 3/16/97
SHIFT: A - SHIFT
QUANTITY: 24 DOWN TO 23
PRODUCT. DC1026-003-JB-8G
LOT; JD1108
.
PROBLEM: 1 PRODUCT WAFER BROKE.
SYSTEM CRASHED. 8 SECONDS INTO SEGMENT 5.
CARRIERS NOT ROTATING ALARM. CARRIER 5 DOWN
ON PAD. OTHER CARRIERS UP.
DISPOSITION: LOT WILL BE SENT ON LESS 1 WAFER.
CORRECTIVE ACTION: TOOL IS BEING LOOKED AT NOW BY EE.
|
| 62.605 | CMP PEX FOR HIGH INCOMING STEP HEIGHT FOR JL1158 | SUBPAC::SMARTIN | | Mon Mar 17 1997 09:07 | 41 |
|
LOT: JL1158
MACHINE: CMP.A1
OPER#: 1984
PROCESS LEVEL: PMD
DATE: 3/17/97
SHIFT: A - SHIFT
EVAL TOOL: PROFILER.A2
QUANTITY: 24
PRODUCT. DC1031-003-EA-8P
LOT; JD1108
.
PROBLEM: HIGH INCOMING STEP HEIGHT.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JL1158 N/A
HEIGHT_ME WAFER #1 CENTER 4654.000
WAFER #1 EDGE 4605.000 3/17/97 08:23:16
WAFER #2 CENTER 4521.000
WAFER #2 EDGE 4590.000
UCL=4200
DISPOSITION: LOT WILL BE POLISHED ACCORDINGLY DUE TO THE HIGH INCOMING
STEP HEIGHTS.
CORRECTIVE ACTION: NONE REQUIRED.
|
| 62.606 | CMP PEX FOR HIGH INCOMING STEP HEIGHT FOR JL1162 | SUBPAC::SMARTIN | | Mon Mar 17 1997 11:16 | 41 |
|
LOT: JL1162
MACHINE: CMP.A2
OPER#: 1984
PROCESS LEVEL: PMD
DATE: 3/17/97
SHIFT: A - SHIFT
EVAL TOOL: PROFILER.A2
QUANTITY: 24
PRODUCT. .DC1071-000-BA-8
LOT; JL1162
.
PROBLEM: HIGH INCOMING STEP HEIGHT.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 JL1162 N/A
HEIGHT_ME WAFER #1 CENTER 4460.000
WAFER #1 EDGE 4070.000
WAFER #2 CENTER 4373.000
WAFER #2 EDGE 4270.000
UCL=4200
DISPOSITION: LOT WILL BE POLISHED ACCORDINGLY DUE TO THE HIGH INCOMING
STEP HEIGHTS.
CORRECTIVE ACTION: NONE REQUIRED.
|
| 62.607 | CMP PEX,JL1129 REMARKED FOR EXTRA DEP. | SUBPAC::SMARTIN | | Mon Mar 17 1997 13:31 | 48 |
|
LOT: JL1129
MACHINE: CMP.B2
OPER#: 1992
PROCESS LEVEL: ILD1
DATE: 3/17/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT..DC1040-001-FA-8P
LOT; JL1129
.
PROBLEM: 8 wafers were over polished. Lot was turned over from B shift
for a Final 5. 2 out of 5 readings were below spec.
Measured lot 100%.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5633.000
WAFER #6 5685.000
WAFER #13 5379.000
WAFER #20 5175.000
WAFER #23 5085.000
THK_RG NA 1191.000
DISPOSITION: #1,9,10,18,22,23 were remarked for an extra 500A dep
#5 and #11 were remarked for an extra 1000A dep.
CORRECTIVE ACTION: #1,9,10,18,22,23 were remarked for an extra 500A dep
#5 and #11 were remarked for an extra 1000A
.
|
| 62.608 | CMP PEX,LOT JD1133 4 WAFERS REMARKED FOR EXTRA DEP | SUBPAC::SMARTIN | | Mon Mar 17 1997 15:03 | 57 |
|
LOT: JD1133
MACHINE: CMP.B2
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 3/17/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT..DC1073-000-BA-8G
LOT; JD1133
.
PROBLEM: 4 wafers were over polished.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5282.000
WAFER #6 5847.000 3/17/97 14:45:12
WAFER #13 5423.000
WAFER #20 5581.000
WAFER #23 4849.000
THK_RG JD1133 948.000
THK_SD_5 WAFER #1 3.920
WAFER #6 4.070
WAFER #13 5.290
WAFER #20 6.420
WAFER #23 5.000
CL=5200-5800
DISPOSITION: Wafer numbers 2,13,14 and 15 were remarked at operation 2130
for an additional 500 angstroms of dep.
CORRECTIVE ACTION: Five send ahead wafers were run for 160 seconds, and a
removal rate of 3766 angstroms/per minute was calculated.
Based on this removal rate, the entire lot was run for
186 seconds and read on the UV-1050, resulting in one
wafer recording 4800 angstroms and three wafers recording
5000 angstroms. I suspect that these four wafers had
low incoming thickness.
.
|
| 62.609 | CMP PEX,1 WAFER REMARKED FOR EXTRA DEP FOR JD1106 | SUBPAC::SMARTIN | | Tue Mar 18 1997 11:14 | 47 |
|
LOT: JD1133
MACHINE: CMP.A1
OPER#: 1979
PROCESS LEVEL: PMD
DATE: 3/18/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT..DC1026-003-JB-8G
LOT; JD1106
.
PROBLEM: 1 wafer was over polished at PMD from last night.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 6553.000
WAFER #2 6747.000
WAFER #3 6687.000
WAFER #4 6592.000
WAFER #5 6296.000
THK_RG JD1106 764.000
THK_SD_5 WAFER #1 2.620
WAFER #2 2.630
WAFER #3 3.130 3/18/97 10:42:45
WAFER #4 2.020
WAFER #5 2.480
control limits= 6200-6800
DISPOSITION: Wafer number 3, was remarked for an additional 500 angstroms of
dep which came out with 6077A
CORRECTIVE ACTION:. This was carried over from last night. Lot was being
100% this morning and it was found to have 1 wafer over
polished.
|
| 62.610 | CMP PEX, 8 WAFERS REMARKED FOR EXTRA DEP ON XM1027 | SUBPAC::SMARTIN | | Tue Mar 18 1997 17:36 | 62 |
|
LOT: XM1027
MACHINE: CMP.B2
OPER#: 1979
PROCESS LEVEL: ILD1
DATE: 3/18/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT.TM0069-025-CA-8C
LOT; XM1027
.
PROBLEM: 8 wafer was over polished at ILD1. 8 wafers were below spec on
initial run. ?????????.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 4873.000
WAFER #2 5443.000
WAFER #3 5792.000
WAFER #4 4680.000
WAFER #5 5767.000
THK_RG NA 1644.000
THK_SD_5 WAFER #1 11.200
WAFER #2 11.100 3/18/97 16:42:57
WAFER #3 7.310
WAFER #4 12.900
WAFER #5 11.000
CL = 5200-5800A
PARAMETER UNIT ID/PROMPT VALUE FG LT
RATE_TM69 4102.000
TIME_TM69 160.000
DISPOSITION: SA's were polished for 160 secs. and ranged from 7505-8684.
Calculated removel rate = 4102 based on the lowest wafer.
TUP'd 5 SA's @12 secs. and lot @189 secs. After polish, SA's
ranged from 5571-7502 and lot ranged from 4680-7285.
8 wafers were below spec on initial run, 8 wafers in spec,
and 8 wafers needed touch up.
CORRECTIVE ACTION: Remarked wafer #'s 9,11,13,14,15
, 20,21, and 24 for an extra 500A dep at operation 2130.
Pad was changed after this run.
|
| 62.611 | JL1160 overpolish | SUBPAC::KULP | | Sun Mar 23 1997 04:58 | 39 |
| CMP PEX
LOT #: JL1160 PRODUCT...DC1040-001-FA-8P
QUANTITY: 24-1 = 23
OPERATION # 1992 CMP_ILD1
POLISHER: CMP.B1
EVAL TOOL: Thickness.A4
DATE: B shift 03/22/97
PROBLEM: Several wafers over polish, 1 wafer scrap.
Left over from C shift, 100 % on B shift.
DISPOSITION: 1 wafer scraped, below 3400�, remark low wafers for extra
dep.
LOG AN EVENT EVENT THK_ILD1_PST FOR ENTITY CMP.B1
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5690.000
LOG AN EVENT WAFER #2 5122.000 3/22/97 23:36:15
WAFER #3 5926.000
WAFER #4 5051.000
WAFER #5 5836.000
THK_RG JL1160 1343.000
THK_SD_5 WAFER #1 8.800
WAFER #2 9.600
WAFER #3 4.400
WAFER #4 5.800
WAFER #5 3.600
CORRECTIVE ACTION: Wafer#'s 01,02,13,14,24 need 500�, and wafer#15 needs 1000�.
It seems from the passdown that the lot was processed at 160
sec. instead of 150 sec. which is spec'ed. Op's tech should
follow spec. for initial run times.
|
| 62.612 | jl1128 overpolish | SUBPAC::KULP | | Sun Mar 23 1997 04:58 | 37 |
| CMP PEX
LOT #: JL1128 PRODUCT...DC1040-001-FA-8P
QUANTITY: 24
OPERATION # 1994 CMP_ILD2
POLISHER: CMP.B2
EVAL TOOL: Thickness.A4
DATE: B shift 03/22/97
PROBLEM: Several wafers over polish,
Left over from C shift, 100 % on B shift.
DISPOSITION: Remark low wafers for extra dep.
THK_ME_5 WAFER #1 5296.000
WAFER #2 5840.000
LOG AN EVENT WAFER #3 5291.000 3/22/97 23:39:58
WAFER #4 5624.000
WAFER #5 5729.000
THK_RG JL1128 1294.000
THK_SD_5 WAFER #1 10.100
WAFER #2 6.100
WAFER #3 7.900
WAFER #4 8.800
WAFER #5 8.100
CORRECTIVE ACTION: Add 500� to wafer#'s 3,5,7,10,11,12,16,20,22,23,24 at
operation # 2172. It seems from the passdown that the lot
was processed at 190 sec. instead of 150 sec. which is
spec'ed. Op's tech should follow spec. for initial run
times.
|
| 62.613 | CMP PEX,SLIGHTLY LOW THICKNESS FOR JD1105 @ILD1 | SUBPAC::SMARTIN | | Mon Mar 24 1997 13:29 | 47 |
|
LOT: JD1105
MACHINE: CMP.B2
OPER#: 1982
PROCESS LEVEL: ILD1
DATE: 3/24/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. DC1026-003-JB-8G
LOT; JD1105
.
PROBLEM: Lot had slightly low thickness after polish. Lot came in at
5196A and the LCL=5200
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5161.000
WAFER #2 5434.000
WAFER #3 5121.000
WAFER #4 5137.000 3/24/97 12:00:39
WAFER #5 5127.000
THK_RG NA N/A
THK_SD_5 WAFER #1 3.400
WAFER #2 5.500
WAFER #3 6.300
WAFER #4 5.400
WAFER #5 5.500
LCL=5200
DISPOSITION: Lot was remarked and moved on. Lot is too close to the lower
control limit to do a redep of 500A, this would bring it too
close to the upper control limit.
CORRECTIVE ACTION: Lot was polished to spec. no further action required.
|
| 62.614 | CMP PEX,LOW INCOMING STEP HEIGHT FOR JL1210 | SUBPAC::SMARTIN | | Mon Mar 24 1997 13:44 | 42 |
|
LOT: JL1210
MACHINE: CMP.B1
OPER#: 1984
PROCESS LEVEL: PMD
DATE: 3/24/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. .DC1040-001-FA-8P
LOT; JL1210
.
PROBLEM: Lot had LOW incoming step height.
PARAMETER UNIT ID/PROMPT VALUE FG LT
RUN_ID_1 NA JL1210
HEIGHT_ME WAFER #1 CENTER 2987.000
WAFER #1 EDGE 2845.000 3/24/97 10:12:15
WAFER #2 CENTER 2955.000
WAFER #2 EDGE 3034.000
LCL=3000
DISPOSITION: Lot polish time will be adjusted accordingly for the LOW
incoming step height.
CORRECTIVE ACTION: Lot polish time will be adjusted accordingly for the LOW
incoming step height.
|
| 62.615 | CMP PEX, 10 WAFERS SCRAPPED DUE TO OVER POLISH ON JD1108 | SUBPAC::SMARTIN | | Mon Mar 24 1997 16:48 | 157 |
|
LOT: JD1108
MACHINE: CMP.B3
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 3/24/97
SHIFT: A - SHIFT
QUANTITY: 23 DOWN TO 13
PRODUCT. DC1026-003-JB-8G
LOT; JD1108
.
PROBLEM: 10 Wafers were scrapped due to over polish. 2 wafers remarked
for extra dep
This lot was started on a shift 3/23/97
Ran Send aheads for 160 sec, resulted: 6884 t0 8337 or a avg removal of
4105/min. Ran rest of lot for 176 sec and touched up send aheads at 2 sec.
we then 100% measured the lot and passed that info to the on coming shift:
Time: Send ahead tup: 2 sec, rest of lot: 176 sec with reduced time in last
run for the spacer wafer. time based upon send ahead data above.
1-5118 send ahead tup
2-6188 send ahead tup
3-5948 send ahead tup
4-6492 send ahead tup
5-6113 send ahead tup
6-7213 initial polish
7-6832 initial polish
8-7235 initial polish
9-6779 initial polish
10-7481 initial polish
11-6364 initial polish
12-7019 initial polish
13-6257 initial polish
14-7174 initial polish
15-6646 initial polish
16-7623 initial polish
17-7715 initial polish
18-7424 initial polish
19-7081 initial polish
20-7283 initial polish
21-6890 initial polish
22-6919 initial polish
23-6952 initial polish
This is how we left the lot after 100% thickness measurment on thick.a5
the order of the wafers were untouched. Again we passed this info onto
the next shift and from what I was told this is what they did:
1-5118 not touched.
2-6188 group A
3-5948 group A
4-6492 group B Where,
5-6113 group A group a= TUP 200
6-7213 group C group b= 1 Sec TUP
7-6832 group B group c= 1 Sec TUP
8-7235 group C group d= 2 Sec TUP
9-6779 group B group e= 1 Sec TUP?? according to there data I cannot
10-7481 group D find if it was ever used and what
11-6364 group A for.
12-7019 group C
13-6257 group A This is the data they sent via. Zaurus to Zaurus xfer.
14-7174 group D
15-6646 group B
16-7623 group D
17-7715 group D
18-7424 group D
19-7081 group D
20-7283 group D
21-6890 group B
22-6919 group B
23-6952 group C
Resulted:
according to there data, From what they said the lot was Final sorted so slot
# matches wafer # and this is there after TUP data:
1-5712
2-6269
3-3383
4-3150
5-2841
6-6068
7-5055
8-5700
9-6282
10-3012
11-5977
12-2813
13-5396
14-2997
15-5451
16-5996
17-3656
18-3029
19- na
20-3140
21-3921
22-2516
23-5693
24-2884
Anything below 3400 gets scrapped out according to spec.
I guess from there they put the lot aside for us to do.
Sooooo...
1. We Reread a sample wafer (wafer 3) 3 times using 2 different thickness tools
to confirm the over polished wafers.
2.We then continued to touch up the wafers 9,2 used tup 325,
6,16 and 11 used a tup 225.
3. results were:
9-5686,2-5719
6-5781,16-5841,11-5745
4. remarked the 2 wafers that will need extra dep.
5. final 100% data now will look like this:
1-5712
2-5719
6-5781
7-5055
8-5700
9-5686
11-5745
13-5396
15-5451
16-5841
17-3656
21-3921
23-5693
DISPOSITION: Lot was remarked for extra dep on 2 wafers and 10 wafers were
scrapped out.
CORRECTIVE ACTION: No data capture to actually tell what times were used for
the touch up.
|
| 62.616 | CMP PEX,JD1136 Leftover lot from B-shift 3 wafers overpolished. | SUBPAC::SMARTIN | | Mon Mar 24 1997 17:00 | 51 |
|
LOT: JD1136
MACHINE: CMP.B2
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 3/24/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. DC1035-000-SC-8T
LOT; JD1136
.
PROBLEM: Leftover lot from B-shift 3 wafers overpolished.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5281.000
WAFER #2 5824.000
WAFER #3 5466.000
WAFER #4 5757.000
WAFER #5 5857.000
THK_RG JD1136 2755.000
THK_SD_5 WAFER #1 11.800 3/24/97 16:14:56
WAFER #2 10.300
WAFER #3 14.400
WAFER #4 18.300
WAFER #5 12.000
CL = 5200-5800A
DISPOSITION: 3 wafers #10,12,4 need an additional 500 angstroms @ OPER 2130.
I remarked the polish and Dep operation and the lot was moved on.
CORRECTIVE ACTION: 3 wafers #10,12,4 need an additional 500 angstroms
|
| 62.617 | JD1181 HIGH SD OUTGOING @PMD | YIELD::PHESTER | | Fri Mar 28 1997 11:16 | 41 |
|
CMP PEX
LOT # JD1181
QUANTITY: 24
OPERATION # 1978 CMP_PMD
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 03/28/96 C-Shift
PROBLEM: HIGH OUTGOING SD @PMD
LOG AN EVENT THK_SD_5 WAFER #1 4.200 3/28/97 09:39:22
WAFER #2 4.900
WAFER #3 9.900
WAFER #4 4.800
WAFER #5 3.100
THK_ME_5 WAFER #1 6567.000
WAFER #2 6542.000
WAFER #3 6001.000
WAFER #4 6297.000
WAFER #5 6784.000
THK_RG JD1181 2017.000
DISPOSITION: CLOSED ANNOTATION # 8173. LOT MOVED TO CAP.
CORRECTIVE
ACTION CHECKED POINTS AND READINGS ALL HAD ACCEPTABLE GOF. ONE SITE
(THE THINNEST) WAS SLIGHTLY HIGHER. RE-READ THIS WAFER AND
CHECKED THREE ADDITIONAL SITES AROUND THE ONE ORIGINALLY READ AND
IT APPEARS THAT THIS PARTICULAR WAFER (SLOT 13) WAS POLISHED A
A BIT EDGE HEAVY. THE PAD IS OK AND MQCS WERE DONE ON THE TOOL
AFTER THIS LOT AND WERE GOOD.
|
| 62.618 | JL1221 - 2 wafers slightly overpolished @ILD1 | STRATA::POZORSKI | | Sun Mar 30 1997 16:01 | 45 |
| CMP PEX
LOT: JL1221
MACHINE: CMP.B3
OPER#: 1992
PROCESS LEVEL: CMP_ILD1
DATE: 3/30/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT....DC1040-001-FA-8P
LOT: JL1221
PROBLEM: Two wafers was over polished at ILD1, the lot was polished on B-Shift
and we had to finish up reading the final 5 and that is when it was
discovered that there were 2 wafers slightly overpolished.
No reason as to why these 2 wafer got over polished will have to talk
to B-Shift.
Wafer #6 came out at 4918
Wafer #15 came out at 5142
(LCL = 5200�)
THK_ME_5 WAFER #1 5779.000
WAFER #2 5743.000
WAFER #3 5580.000
WAFER #4 4918.000 (#6)*
WAFER #5 5695.000
THK_RG JL1221 3046.000
DISPOSITION: Lot was remarked at 2166 DEP_ILD1 3 for an additional dep on these
2 wafers. Both wafers will get an additional dep of 500�.
CORRECTIVE Lot was remarked for extra dep on the 2 wafers and moved on.
ACTION: NOTE - The rest of the lot came out good.
|
| 62.619 | CMP.B3 CRASH ON YD0241, 1 PRODUCT WAFER IS HISTORY. | SUBPAC::SMARTIN | | Tue Apr 01 1997 19:59 | 54 |
|
LOT: YD0241
MACHINE: CMP.B3
OPER#: 1989
PROCESS LEVEL: ILD3
DATE: 4/1/97
SHIFT: A - SHIFT
QUANTITY: 12 DOWN TO 11
PRODUCT. DC1018-010-AB-0D
LOT; YD0241
.
PROBLEM: CMP.B3 CRASHED TAKING OUT 1 DUMMY WAFER AND 1 PRODUCT WAFER.
1) System _cmp.b3__________
2) Recipe _tup b_____
3) Step # _5___
4) Time into step __1___
5) Type of wafers that broke _1 dummy that took out 1 product total of 2.
6) Carrier which wafer slid out of __3___
7) Other carriers that were damaged __2_____
8) Alarms displayed by polisher ____wafer loss detected sending carriers up.__
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash no__, systems____________
10) Did wafer detect work _yes__
11) # of wafers on pad _900__
12) # of wafers on carrier 178___
13) Was there any vibration prior to the crash _yes__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ___yes___
15) Check step hight of the carrier from question #6 _carrier toated
16) Please note any other unusual circumstances: none
DISPOSITION: LOT WILL BE MOVED ON LESS 1 WAFER.
CORRECTIVE ACTION: EE WILL BE DOING AN ALIGNMENT AND THEN THE PAD WILL BE
CHANGED AND THE TWO CARRIERS THAT WERE AFFECTED BY THE
CRASH will be changed also.
|
| 62.620 | JD1176 TWO WAFERS SCRAPPED DUE TO CRASH ON .B1 | YIELD::PHESTER | | Thu Apr 03 1997 14:40 | 26 |
|
CMP PEX
LOT # JD1176
QUANTITY: 21
OPERATION #
/DESCR. 1981 CMP_ILD1
POLISHER: CMP.B1
EVAL TOOL: N/A
DATE: 04/03/96 C-SHIFT
PROBLEM: TWO WAFERS SCRAPPED DUE TO CRASH ON TOOL.
DISPOSITION: CRASH OCCURRED DURING TOUCH-UP. LOT FINISHED AND CRASH REPORT
WRITTEN AND POSTED IN CMP NOTE #34.
CORRECTIVE
ACTION EE CHECKED TOOL AND FOUND NO OBVIOUS CAUSE. PROBLEM WAS A
SLIDE-OUT ON CARRIER 4. RECIPE CHECKED AND WAS OK. NO LOADING
PROBLEMS. TOOL CLEANED AND GIVEN BACK TO PRODUCTION.
|
| 62.621 | Y | FABSIX::B_NEWELL | | Sat Apr 05 1997 12:28 | 29 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System __CMP.B1____
2) Recipe __BREAK INS
3) Step # __3___
4) Time into step __3 OUT OF 13 SECONDS____
5) Type of wafers that broke __1 BREAK IN DUMMY
6) Carrier which wafer slid out of __3
7) Other carriers that were damaged __3 & 2
8) Alarms displayed by polisher ___ALL CARRIERS NOT ROTATING
FOLLOWED BY NO VACUUM
9) Did any other polisher error for slurry or crash _NO__, sysytems____________
10) Did wafer detect work _YES_
11) # of wafers on pad _NA
12) # of wafers on carrier 81
13) Was there any vibration prior to the crash __NO____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ____YES_____
15) Check step height of the carrier from question #6 __
16) Please note any other unusual circumstances:
17) Put this check sheet in CMP note #34
|
| 62.622 | JD1311 one wafer broken on CMP-SCRUB.A1 | YIELD::MANDREOLI | | Sun Apr 06 1997 07:24 | 23 |
| PE PEX NOTIFICATION
LOT # JD1311 (DC1073) HOT LOT
QUANTITY: 24 - 1 = 23
OPERATION # 1978 CMP AFTER PMD DEP1 (ACTUALLY 1979 CMP_SCRUB)
/DESCR.
POLISHER: N/A
EVAL TOOL: N/A
DATE: 04/06/97 B-shift
PROBLEM: One wafer (#01) was broken when it fell off of the Spin dry
station on CMP-SCRUB.A1.
DISPOSITION: Wafer# 01 is scrapped due to breakage.
CORRECTIVE
ACTION: none.
|
| 62.623 | CMP.B2 - Scrapped 2 wafers due to a crash | STRATA::POZORSKI | | Sun Apr 06 1997 12:36 | 63 |
| CMP PEX NOTIFICATION
LOT # JL1153
DEVICE DC1064-004-CA-8P
QUANTITY: 19 - 2 = 17
OPERATION # 1994 CMP_ILD2 CMP
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: 04/06/97 A-shift
PROBLEM: Two wafers (#3 & #11) scrapped due to the crash on CMP.B2.
DISPOSITION: The tool was 4 seconds into step #3 when the tool had an alarm
for carrier #3 not rotating. The product wafer from carrier #3
slid out and ended up crashing into carrier #2 which also had a
product wafer in it. Both of these carrier ring were severely
damaged due to this crash.
CORRECTIVE EE went in and found carrier #3 to have 4 screws missing from
ACTION: the extension ring. The tool went down for a pad & carrier
change. The lot will be moved on with 2 less wafers in it and
a crash report has been written and it was posted in the CMP
NOTE #34.
================================================================================
Note 32.35 CMP.B WAFER CRASH FORM 35 of 35
SUBPAC::LANDRY 26 lines 6-APR-1997 09:41
-< CMP.B1 Crash >-
--------------------------------------------------------------------------------
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B1
2) Recipe: ILD2
3) Step #: 3
4) Time into step: 4 seconds
5) Type of wafers that broke: Product
6) Carrier which wafer slid out of: #3
7) Other carriers that were damaged: #2
8) Alarms displayed by polisher: "carrier #3 not rotating"
9) Did any other polisher error for slurry or crash: NO systems: N/A
10) Did wafer detect work: YES
11) # of wafers on pad: 210
12) # of wafers on carrier: 42
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: YES
15) Check step height of the carrier from question #6: carrier ring too
severely damaged
16) Please note any other unusual circumstances: Found carrier #3 to have
four screws missing from the
extension ring.
17) Put this check sheet in CMP note: Done
|
| 62.624 | JD1178 - 3 wafers overpolished | STRATA::POZORSKI | | Mon Apr 07 1997 15:56 | 25 |
| CMP PEX
LOT #: JD1178
QUANTITY: 24
OPERATION # 1985 CMP_ILD2 CMP
POLISHER: CMP.B1
EVAL TOOL: N/A
DATE: B shift/A-Shift 04/07/97
PROBLEM: 3 wafer were over polished by 500�.
Wafer #4 = 5061
Wafer #7 = 4983 (LCL = 5200�)
Wafer #21 = 5062
DISPOSITION: This lot was polished on B-Shift and A-Shift discoved
the 3 wafers by doing 100% Lot was remarked and moved on.
CORRECTIVE The lot was remarked for extra dep and moved on.
ACTION:
|
| 62.625 | CMP.A2 - 3 wafers scrapped due to crash. | STRATA::POZORSKI | | Mon Apr 07 1997 18:13 | 26 |
| CMP PEX
LOT # JL1269
QUANTITY: 24 - 3 = 21
OPERATION # 1984 CMP_L_PMD CMP
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: 04/07/96 A-SHIFT
PROBLEM: THREE WAFERS SCRAPPED DUE TO CRASH ON TOOL.
DISPOSITION: CRASH OCCURRED WHEN THE WAFERS WERE BEING UNLOADED INTO THE
CASSETTE.
CORRECTIVE EE LOOKED AT THE AND FOUND THE STEP HEIGHT FOR THE ELEVATOR
ACTION TO THE ROBOT WAS OFF SO, THEY WENT IN AND ADJUSTED THE LEFT
ELEVATOR. THE LOT WAS MOVED ON WITH 3 LESS WAFERS IN IT AND
A CRASH REPORT WAS WRITTEN AND FILED IN THE CMP NOTESFILE.
|
| 62.626 | JD1237 - 5 wafers overpolished @ILD1 | STRATA::POZORSKI | | Mon Apr 07 1997 18:22 | 29 |
| CMP PEX
LOT #: JD1237
QUANTITY: 24
OPERATION # 1981 CMP_ILD1 CMP
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: B shift/A-Shift 04/07/97
PROBLEM: 5 wafer were over polished on .B3.
DISPOSITION: These wafers were the last two touch-up runs from B-shift.
A-Shift discoved these wafers by doing 100%. The lot was
remarked and moved on.
THK Additional oxide needed
# 23 5033 500 Angstroms
# 22 4930 500 "
# 9 4831 500 "
# 15 4837 500 "
# 24 4754 1000 "
CORRECTIVE The lot was remarked for extra dep and moved on.
ACTION:
|
| 62.627 | XD1109 - 3 wafers Broken on CMP.B3 | STRATA::POZORSKI | | Tue Apr 08 1997 20:33 | 25 |
| CMP PEX NOTIFICATION
LOT # XD1109
QUANTITY: 23 - 3 = 20
OPERATION # 1989 CMP AFTER ILD3
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: NA
DATE: 04/08/97 A-Shift
PROBLEM: Three wafers were broken while mapping the input cassette.
EE went in and homed the tool and after that it seems to be
working good now. Maybe it just lost its mind or it was just
tired from working so hard.
DISPOSITION: Lot moved on with count minus 3.
CORRECTIVE Cleaned up broken wafer pieces, the other wafers from this lot
ACTION: were not damaged so, the lot was moved on.
|
| 62.628 | JD1108 - High STD & Range | STRATA::POZORSKI | | Wed Apr 09 1997 20:15 | 34 |
| CMP PEX
LOT #: JD1108
QUANTITY: 23
OPERATION # 1985 CMP_ILD3
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: A shift 04/09/97
PROBLEM: Slightly high range on the THK_SD_5 was high at 17.3 (UCL=16)
and also the THK_RG was high at 5625 (UCL = 4500)
THK_ILD3_PST PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 10358.000
WAFER #2 10345.000
WAFER #3 10137.000
WAFER #4 N/A
WAFER #5 N/A
THK_RG JD1108 5625.000
THK_SD_5 WAFER #1 19.700
WAFER #2 14.600
WAFER #3 17.800
WAFER #4 N/A
WAFER #5 N/A
DISPOSITION: Lot was remarked and moved on, there was no prior splits done to
this lot.
CORRECTIVE The tool wen down for a pad change and the lot was moved.
|
| 62.629 | 4 wafers overpolished | YIELD::SHONG | | Fri Apr 11 1997 05:02 | 43 |
| PE PEX NOTIFICATION
LOT # JD1175
QUANTITY: 24
OPERATION # 1985 CMP AFTER ILD2
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 04/11/97 D-Shift
PROBLEM: Four wafers from this lot were scrapped at this operation. The
lot was ran with lot JL1229. They were both at the same oper-
ation. The last 4 wafers in each lot were overpolished. The
remaining thickness average for the four wafers was ~1700�.
Metal was exposed on the edges and in the center.
Both sets of wafers were ran with a monitor. The operator
calculated the removal rate to be 250 seconds. The rest of the
lot was fine ~6000�. These eight wafers were grossly over-
polished.
I checked the thickness machine for this lot in films. The
incoming thickness was fine for the wafer that was in slot
23(wafer #15). Slot # 23 is a standard slot checked for
thickness. The wafers hadn't been moved in CMP so they should
have correlated.
DISPOSITION: I had the operator do MQC's on the tool. Removal rate and Std.
Dev were fine. Nothing to explain this problem. I question the
operator in regards to the possibility of the wafers being his
send aheads. But if that was the case there would be a 5th
wafer.
CORRECTIVE I told the operator on the next run to reduce the polish time
ACTION: on the four wafers that are being ran with the monitor. I want
to monitor the removal rate for the four wafers with the oxide
monitor.
|
| 62.630 | 4 wafers overpolished. | YIELD::SHONG | | Fri Apr 11 1997 05:02 | 37 |
| PE PEX NOTIFICATION
LOT # JL1229
QUANTITY: 24
OPERATION # 1994 CMP AFTER ILD2
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 04/11/97 D-Shift
PROBLEM: Four wafers from this lot were scrapped at this operation. The
lot was ran with lot JD1175. They were both at the same level
(ILD2). The last 4 wafers in each lot were overpolished. The
remaining thickness average for the four wafers was ~1700� to
1800�. Metal was exposed on the edges and in the center.
Both sets of wafers were ran with a monitor. The operator
calculated the removal rate to be 250 seconds. The rest of the
lot was fine ~6000�. These eight wafers were grossly over-
polished.
DISPOSITION: I had the operator do MQC's on the tool. Removal rate and Std.
Dev were fine. Nothing to explain this problem. I question the
operator in regards to the possibility of the wafers being his
send aheads. But if that was the case there would be a 5th
wafer.
CORRECTIVE I told the operator on the next run to reduce the polish time
ACTION: on the four wafers that are being ran with the monitor. I want
to monitor the removal rate for the four wafers with the oxide
monitor.
|
| 62.631 | 1 wafer overpolished. | YIELD::SHONG | | Fri Apr 11 1997 05:12 | 27 |
| PE PEX NOTIFICATION
LOT # JL1347
QUANTITY: 24
OPERATION # 1984 CMP AFTER PMD DEP1 - LIGHT
/DESCR.
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A4
DATE: 04/11/97 D-Shift
PROBLEM: Wafer # 2 was overpolished at this operation. Thickness reading
was real low <1000�. The oxide on the edge of the wafers was
polished down to the sic. The wafer was processed in the center
of the lot. The remaining 23 wafers were fine. The entire lot
was ran for 120 seconds.
DISPOSITION: I believe the wafer came into the area with a problem. It will
be scrapped out when the lot moves on.
CORRECTIVE None.
ACTION:
|
| 62.632 | XB0782 2 wafers broken in automobile crash | YIELD::MANDREOLI | | Sun Apr 13 1997 07:14 | 25 |
| PE PEX NOTIFICATION
LOT # XB0782 (TM0069)
QUANTITY: 24 - 2 = 22
OPERATION # 1989 CMP AFTER ILD3
/DESCR.
POLISHER: CMP.B4
EVAL TOOL: N/A
DATE: 04/12/97 C-SHIFT
PROBLEM: Crash, product wafer slipped out of Carrier #4 and resulted in
the product wafer on Carrier #3 breaking. Two wafers scrapped.
DISPOSITION: This crash occurred at the shift change. EE changed all the
carriers and the Pad was also changed of course.
CORRECTIVE
ACTION: Lot has been moved over to CMP.B2, running more send aheads and
the remainder of the lot will be polished there.
|
| 62.633 | JL1270 - HIGH RANGE FOR THE STD DEV @ILD1 | STRATA::POZORSKI | | Sun Apr 13 1997 12:56 | 38 |
| CMP PEX NOTIFICATION
LOT # JL1270
QUANTITY: 24
OPERATION # 1992 MSP_ILD1 CMP_MSP
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A4
DATE: 04/13/97 B-Shift
PROBLEM: OUT OF SPEC FOR THE RANGE ON THE STD DEV AT THIS OPERATION.
RANGE WAS 16.8 UCL FOR RANGE IS 13
THK_ILD1_PST PARM SET ID.....THICK13 VERSION....2 4/13/97 01:49:56
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5543.000
WAFER #2 5790.000
WAFER #3 5913.000
WAFER #4 5611.000
WAFER #5 5531.000
THK_RG JL1270 2812.000
THK_SD_5 WAFER #1 8.500
WAFER #2 20.600
WAFER #3 3.800
WAFER #4 10.200 4/13/97 01:49:56
WAFER #5 17.500
DISPOSITION: LOT MOVED ON.
CORRECTIVE THE TOOL WENT DOWN FOR MQC, AND THE LOT WAS MOVED ON.
ACTION
|
| 62.634 | JD1230 12 wafers overpolished after ILD2 | YIELD::MANDREOLI | | Mon Apr 14 1997 08:33 | 34 |
| PE PEX NOTIFICATION
LOT # JD1230 (DC1026)
QUANTITY: 24
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B1
EVAL TOOL: THICKNESS.A4
DATE: 04/13/97 B-SHIFT
PROBLEM: 12 wafers are overpolished, they were all part of a split at
this operation, (2xHDP). The Polish time was mis-calculated.
Here are the wafer#s and their final thickness results;
1-5755 2-5690 3-4090 4-4638 5-5513 6-5508 7-4058 8-4473 9-5667 10-5667
11-4136 12-4342 13-5143 14-5567 15-4755 16-4883 17-5635 18-5398 19-4256
20-4103 21-5716 22-6323 23-4039 24-4738
DISPOSITION: The lot is on HOLD for Eric B at Oper# 3066 per REMARK. Needs to
have extensive measurements taken after the polish.
CORRECTIVE
ACTION: HOLDing for Engineering. We have not REMARKed the lot to get extra
dep at the cap step 2133 yet.
|
| 62.635 | NIT.A2 PEX REPORT FOR HIGH/TOTAL PARTICLES CENTER | FABSIX::S_AGUILA | | Tue Apr 15 1997 07:41 | 28 |
|
NITRIDE PEX
RECIPE: SPACER
FURNACE: NIT-TUBE.A2
PROCESS DATE: 04/15/97 B SHIFT
LOT_POSITION TOP JD1460
T CENTER N/A
B CENTER N/A
BOTTOM N/A
PROBLEM: HIGH LARGE AND TOTAL PARTICLES ON THE CENTER
UPP_LG_TCB TOP 21.000
CENTER 105.000 HS
BOTTOM 41.000
UPP_TO_TCB TOP 72.000
CENTER 739.000 HS
BOTTOM 245.000
CORRECTIVE
ACTION: DECTREE WAS RUN. REMARKED THE LOT AT OPERATION 2767. ONE MORE LOT
IS BEING RUN ON THE TOP ZONE XB1503. AFTER THIS RUN IS OVER THE
SYSTEM IS DUE FOR DUMMY CHANGE
|
| 62.636 | CMP PEX, 2 WAFERS REMARKED FOR EXTRA DEP ON XD1168. | SUBPAC::SMARTIN | | Tue Apr 15 1997 14:33 | 39 |
|
LOT: XD1168
MACHINE: CMP.B2
OPER#: 1989
PROCESS LEVEL: ILD3
DATE: 4/15/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. TM0069-932-BA-8C
LOT; XD1168
.
PROBLEM: Two wafers were overpolished on lot #XD1168.
DISPOSITION: These wafers were polished on CMP.B2. Wafer #'s 3 and 17 were
remarked at operation 2136 for an additional 1,000 angstroms
of dep. Wafer #3 came in at 8490 and wafer #17 came in at 9155.
These wafers were run on a touchup recipe at the end of the run
and the rest of the wafers in that group came out fine.
I suspect these wafers were mavericks that ran away from the
group.
CORRECTIVE ACTION: Wafer #'s 3 and 17 were remarked at operation 2136 for
an additional 1,000 angstroms of dep.
|
| 62.637 | CMP PEX FOR HIGH S/D AND HIGH RANGE FOR JD1233 | SUBPAC::SMARTIN | | Tue Apr 15 1997 17:20 | 38 |
| CMP PEX
LOT #: JD1233
QUANTITY: 24
OPERATION # 1985 CMP_ILD2
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: A shift 04/15/97
PROBLEM: Slightly high range on the THK_SD_5 was high at 18.2 (UCL=18)
and also the THK_RG was high at 4051 (UCL = 3400)
THK_ILD2_PST PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5235.000
WAFER #2 5241.000
WAFER #3 5680.000
WAFER #4 5623.000
WAFER #5 5563.000
THK_RG JD1233 4051.000
THK_SD_5 WAFER #1 28.900 4/15/97 15:33:45
WAFER #2 25.400
WAFER #3 12.400
WAFER #4 8.820
WAFER #5 15.700
DISPOSITION: Lot was remarked and moved on, there was no prior splits done to
this lot.
CORRECTIVE The tool went down for a pad change after this lot was ran.
|
| 62.638 | CMP PEX, 1 WAFER BROKE DURING LIFT OFF ON JL1271 | SUBPAC::SMARTIN | | Tue Apr 15 1997 20:04 | 33 |
|
LOT: JL1271
MACHINE: CMP.B2
OPER#: 1994
PROCESS LEVEL: ILD2
DATE: 4/15/97
SHIFT: A - SHIFT
QUANTITY: 24 DOWN TO 23
PRODUCT. .DC1031-003-EA-8P
LOT; JL1271
.
PROBLEM: CMP.B2 CRASHED ON LIFTOFF. TAKING OUT 1 PRODUCT WAFER.
THE WAFER BROKE IN THE TUB.
DISPOSITION: LOT WILL BE MOVED ON LESS 1 WAFER.
CORRECTIVE ACTION: EE CHECKED THE ALIGNMENT AND THE PAD AND ALSO CHECKED
THEW CARRIERS AND FOUND NOTHING WRONG WITH THE SYSTEM.
SYSTEM IS BACK OVER TO PRODUCTION SHORTLY. EE IS NOT
QUITE SURE WHY IT DROPPED A WAFER.
|
| 62.639 | CMP PEX, 1 WAFER OVER POLISHED ON JL1163 | SUBPAC::SMARTIN | | Tue Apr 15 1997 20:42 | 37 |
|
LOT: JL1163
MACHINE: CMP.B1
OPER#: 1994
PROCESS LEVEL: ILD2
DATE: 4/15/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. DC1071-000-CA-8
LOT; JL1163
.
PROBLEM: One wafer was overpolished on lot #XD1168.
DISPOSITION: This wafer was overpolished on the initial run. The next lowest
wafer measured 5563. Looking @ remarks, the lot was remarked at
ILD1 3 to add 1000A oxide at this operaion. No other explanation
except it missed extra dep at the ILD1 level.
CORRECTIVE ACTION: Wafer #19 remarked for 500A extra oxide.
Wafer measured 4973.
|
| 62.640 | XD1104 4 WAFERS SCRAPPED DUE TO OVER-POLISH | FABSIX::P_HESTER | | Thu Apr 17 1997 12:18 | 58 |
|
CMP PEX
LOT: XD1104
MACHINE: CMP.B1
OPER#: 1985 CMP_ILD2
PROCESS ILD2
DATE: 4/16/97
SHIFT: C-D - SHIFT
QUANTITY: 20
PRODUCT: TM0079-001-AA-8T
LOT: XD1104
PROBLEM: FOUR WAFERS SCRAPPED DUE TO OVER POLISH.
INCOMING THICKNESS FROM FILMS WAS NOT BAD:
THK_ME_5 WAFER #1 17970.000
WAFER #2 17792.000
WAFER #3 18112.000
WAFER #4 17448.000
WAFER #5 17848.000
THK_SD_5 WAFER #1 1.100
WAFER #2 0.600
WAFER #3 0.700 4/15/97 15:23:38
WAFER #4 0.600
WAFER #5 0.500
SEND-AHEAD WAFERS WERE POLISHED PER SPEC AND R/R CALCULATED
AT 3364. REMAINDER OF LOT WAS PROCESSED ACCORDINGLY.
SEND AHEAD WAFERS WERE READ ON UV-1050 USING THE ILD1 RECIPE.
BEFORE FINAL POLISH, METROLOGY COPIED AND OPTIMIZED THE RECIPE
FOR ILD2. THEY THEN CONFIRMED THAT THE READINGS TAKEN WITH THE
ILD1 RECIPE WERE CORRECT. READINGS WERE ALSO TAKEN ON ALTERNATE
UV-1050 AND CORRESPONDED.
AFTER SECOND POLISH IT WAS DISCOVERED THAT 4 WAFERS WERE OVER-
POLISHED AND HAD EXPOSED METAL.
DISPOSITION: BALANCE OF LOT MOVED ON.
CORRECTIVE ACTION: NONE. THIS WAS NOT A METROLOGY PROBLEM. THIS COULD BE
RELATED TO THE DEVICE. THIS LOT HAS 57 REMARKS SO FAR AND
HAS HAD MULTIPLE SPLITS, INCLUDING SPLITS AT POLY REOX AND
SPACER OPERATIONS. ALSO DIFFERENT CD SPLITS WERE DONE.
THIS MAY HAVE AFFECTED REMOVAL RATES AND BEEN A FACTOR IN
THIS INCIDENT.
|
| 62.641 | JD1460 2 wafers scrapped @PMD - crash. | FABSIX::P_HESTER | | Thu Apr 17 1997 17:14 | 27 |
|
CMP PEX
LOT: JD1460
MACHINE: CMP.A1
OPER#: 1978 CMP_PMD
PROCESS PMD
DATE: 4/16/97
SHIFT: C - SHIFT
QUANTITY: 15
PRODUCT: DC1039-000-BA-8G
PROBLEM: TWO WAFERS SCRAPPED DUE TO CRASH.
DISPOSITION: BALANCE OF LOT MOVED ON.
CORRECTIVE ACTION: NO ALARMS ON THIS ONE. NO OBVIOUS CAUSE. CRASH REPORT
FILLED OUT AND POSTED.
|
| 62.642 | XD1205 HIGH OUTGOING SD @ILD1 | FABSIX::P_HESTER | | Thu Apr 17 1997 22:15 | 50 |
|
PE PEX NOTIFICATION
LOT # XD1205
DEVICE: TM0079-001-AA-8T
QUANTITY: 23
OPERATION # 3054 SD-POST
/DESCR.
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 04/17/97 C-Shift
PROBLEM: HIGH SD OUTGOING
THK_ME_5 WAFER #1 5473.000
WAFER #2 5722.000
WAFER #3 5719.000
WAFER #4 5699.000 4/17/97 16:50:51
WAFER #5 4637.000
THK_RG XD1205 3188.000
THK_SD_5 WAFER #1 16.200
WAFER #2 16.400
WAFER #3 18.700
WAFER #4 20.300
WAFER #5 16.500
DISPOSITION: PROBLEM WAS WORST IN WAFER # 4. POSSIBLY HEAD IS GOING BAD BUT
ANOTHER ILD2 LOT WAS POLISHED AT THE SAME TIME WITH RANGE IN THE
4.0 - 9.0 RANGE. ALL 5 WAFERS SAMPLED HAD HIGH SD AND WERE
CONFIRMED ON AN ALTERNATE METROLOGY TOOL.
THIS LOT ALSO RECIEVED MULTIPLE SPLITS AMONG THEM AT FURN_REOX,
SPACER_ETCH, THK_REOX, POLY CD. THIS MAY AFFECT HOW THE LOT
POLISHED.
ALL METROLOGY READINGS WERE VERIFIED AS GOOD WITH GOOD GOF.
LOT MOVED ON.
CORRECTIVE
ACTION: TOOL IS GOING DOWN FOR MONTHLY PM.
|
| 62.643 | CMP.B2 CRASHED 1 WAFER SCRAPPED | FABSIX::S_AGUILA | | Sun Apr 20 1997 06:49 | 23 |
| CMP PEX
LOT # JL1312 (HOT LOT)
QUANTITY: 24 - 1 = 23
OPERATION #
/DESCR. 1989 CMP_ILD3
POLISHER: CMP.B2
EVAL TOOL: N/A
DATE: 04/20/96 B-SHIFT
PROBLEM: CMP.B2 CRASHED, ONE WAFERS SCRAPPED. WAFER SLID OUT OF CARRIER
2 OR 3.
DISPOSITION: LOT STILL POLISHING
CORRECTIVE
ACTION CARRIERS AND PAD WERE CHANGED. SEE CRASH REPORT
|
| 62.644 | CMP PEX, 4 WAFERS REMARKED FOR EXTRA DEP FOR JD1307 | SUBPAC::SMARTIN | | Sun Apr 20 1997 17:52 | 40 |
|
LOT: JD1307
MACHINE: CMP.B2
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 4/20/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. DC1026-000-JB-8G
LOT; JD1307
.
PROBLEM: 4 wafers (#1,10,19, and 22) were overpolished on initial run.
SA's were run for 160 secs.
results of SA's: 6995, 6842, 6814, 6533, and 6065
Lot was run for 177 secs.
DISPOSITION: Some splits were previously done to this lot but wafer numbers
do not correlate to any particular split. Wafers were remarked
for an extra 500A dep. (Measured 4981, 4899, 4771, 4749)
CORRECTIVE ACTION: Wafer #1,10,19,and 22 were remarked for 500A extra oxide.
|
| 62.645 | CMP PEX, 3 WAFERS REMARKED FOR EXTRA DEP FOR JD1312 | SUBPAC::SMARTIN | | Sun Apr 20 1997 18:00 | 38 |
|
LOT: JD1312
MACHINE: CMP.B2
OPER#: 1989
PROCESS LEVEL: ILD3
DATE: 4/20/97
SHIFT: A - SHIFT
QUANTITY: 23
PRODUCT. DC1071
LOT; JD1307
.
PROBLEM: 3 Wafers were over polished.
DISPOSITION: Wafer #14 and #19 were overpolished @ initial polish?
Info that was passed down looks that way.
These wafers measured 7762 and 8624 respectively.
Wafer #13 was in a group ranging from 12K - 12.9K. The group was run
for 60secs. Wafer measured below spec 8987.
CORRECTIVE ACTION: Wafer #14 was remarked for 2000 extra dep.
Wafer #19 and #13 were remarked for 1000 extra dep.
|
| 62.646 | CMP PEX,1 WAFER SCRAPPED FROM LOT JL1008 | SUBPAC::SMARTIN | | Sun Apr 20 1997 20:09 | 33 |
|
LOT: JL1008
MACHINE: CMP.B3
OPER#: 1994
PROCESS LEVEL: ILD2
DATE: 4/20/97
SHIFT: A - SHIFT
QUANTITY: 18 DOWN TO 17
PRODUCT. .DC1064-003-BA-8P
LOT; JL1008
.
PROBLEM: 1 Wafer was scrapped due to over polish.
DISPOSITION:Wafer #24 reads 2626 after 1st pass polish. Lot polished for
246 seconds with all other wafers reading between 5700-6500.
Spec states wafer must be scrapped if <3400.
CORRECTIVE ACTION: Lot will be sent on less 1 wafer.
|
| 62.647 | CMP.B3 TWO WAFERS BROKEN | FABSIX::S_AGUILA | | Mon Apr 21 1997 06:06 | 26 |
| CMP PEX
LOT # JD1296
QUANTITY: 24 - 2 = 22
OPERATION #
/DESCR. 1985 CMP_ILD2
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: 04/21/96 B-SHIFT
PROBLEM: TWO WAFERS WERE FOUND BROKEN AT THE RECOVERY CASSETTE. ON A
LATER RUN (AFTER IT HAD FINISHED) IT WAS DISCOVERED THAT WAFERS
ON SLOT #7 AND #8 ON THE RECEIVE CASSETTE HAD CROSS SLOTTED.
THIS APPEARS TO BE THE CAUSE OF WHAT HAPPENED EARLIER
DISPOSITION: LOT WAS SEND TO THE SCRUBER.
CORRECTIVE
ACTION DRG RECOMMENDED TO PLACE A REMARK FOR A 100 % PARTICLE
MEASUREMENT AT THE NEXT UPP PARTICLE INSPECTION (OPER. 2624).
|
| 62.648 | CMP PEX, 2 WAFERS REMARKED FOR EXTRA DEP ON JD1249. | SUBPAC::SMARTIN | | Wed Apr 23 1997 16:15 | 39 |
|
LOT: JD1249
MACHINE: CMP.B3
OPER#: 1985
PROCESS LEVEL: ILD2
DATE: 4/23/97
SHIFT: TOUCHED UP ON B - SHIFT
QUANTITY: 24
PRODUCT. .DC1073-000-BA-8G
LOT; JD1249
.
PROBLEM: 2 WAFERS OVER POLISHED AND WILL NEED EXTRA DEP.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 4786.000
WAFER #2 5577.000
WAFER #3 5755.000
WAFER #4 5740.000
WAFER #5 5784.000
THK_RG JD1249 1981.000
DISPOSITION: THE TWO WAFERS # 18 WAS 5177A AND WAFER #23 WAS 4786. BOTH THESE
WERE REMARKED FOR EXTRA 500A OF DEP @ OP# 2133.
CORRECTIVE ACTION: NONE REQUIRED.
|
| 62.649 | JD1298 slight over polish @ILD2 | YIELD::PHESTER | | Fri Apr 25 1997 09:30 | 43 |
|
PE PEX NOTIFICATION
LOT # JD1298
QUANTITY: 24
OPERATION # 3066 POST THICKNESS ILD2
/DESCR.
POLISHER: POST READING
EVAL TOOL: THICKNESS.A5
DATE: 04/24/97 C-Shift
PROBLEM: LOW POST THICKNESS
LOT POST THICKNESS AVG = 4598�
LCL IS 5200�
THK_ME_5 WAFER #1 5348.000
WAFER #2 4120.000
WAFER #3 4844.000
WAFER #4 N/A
WAFER #5 4081.000
DISPOSITION:
LOT HAD POLISHED ON .B3. TOOL WENT DOWN AND MOVED THE LOT TO
.B4 FOR TOUCH-UP. WAFERS RAN FOR 1 SEC TOUCH-UP.
TOOL HAS HIGH REMOVAL RATE 3600� ON MQC.
WAFERS THAT WERE LOW HAVE BEEN REMARKED FOR EXTRA DEP
AND THE LOT HAS BEEN MOVED ON.
ALL MEASUREMENTS CHECKED AND VERIFIED AS GOOD.
CORRECTIVE
ACTION: SHOULD PROBABLY RECONSIDER DOING 1 SEC TOUCH-UPS ON CMP.B4
AS REMOVAL RATE IS SO HIGH.
|
| 62.650 | JD1326 high range/SD @ILD1 | YIELD::PHESTER | | Fri Apr 25 1997 10:31 | 46 |
|
PE PEX NOTIFICATION
LOT # JD1326
QUANTITY: 24
OPERATION #
/DESCR. 3054 THK_ILD1_PST
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A5
DATE: 04/24/97 C-Shift
PROBLEM: HIGH RANGE/SD @ILD2
RANGE WAS 4547 SD WAS 21.3
UCL IS 3400 UCL IS 15.0
LOG AN EVENT THK_ME_5 WAFER #1 5913.000 4/24/97 16:23:11
WAFER #2 5461.000
WAFER #3 5205.000
WAFER #4 5878.000
WAFER #5 5493.000
THK_RG JD1326 4547.000
THK_SD_5 WAFER #1 22.700
WAFER #2 18.800
WAFER #3 23.300
WAFER #4 18.300
WAFER #5 23.400
DISPOSITION: LOT MOVED TO CAP. ALL METROLOGY READINGS VERIFIED AS GOOD.
LOT WAS POLISHED ON STRASBAUGH TOOL. ILD1 CAN BE DONE ON THIS
TOOL BUT ARE NORMALLY NOT BECAUSE OF LOW REMOVAL RATE. LOW
REMOVAL CAUSES EXTENDED POLISH TIMES WHICH USUALLY RESULTS IN
EDGE FAST POLISHING. THIS WAS THE CASE WITH ALL FIVE WAFERS
IN THIS SAMPLE.
CORRECTIVE
ACTION: NONE
|
| 62.651 | JD1460B high range/SD @ILD3 | FABSIX::P_HESTER | | Fri Apr 25 1997 17:23 | 59 |
|
CMP PEX
LOT # JD1460B
DEVICE: DC1039-000-BA-8G
QUANTITY: 6
OPERATION # 3064 POST THICKNESS ILD3
/DESCR.
POLISHER: CMP.B4
EVAL TOOL: THICKNESS.A4
DATE: 04/25/97 D-C SHIFT
PROBLEM: HIGH RANGE/SD OUTGOING
RANGE WAS 7054.0 UCL IS 4500
AVG SD WAS 21.08 UCL IS 16.00
THK_ME_5 WAFER #1 10381.000
WAFER #2 10430.000
WAFER #3 9942.000
WAFER #4 9943.000
WAFER #5 10177.000
THK_RG JD1460B 7054.000
THK_SD_5 WAFER #1 21.900
WAFER #2 23.300
WAFER #3 20.000
WAFER #4 20.000
WAFER #5 20.200
LOT WAS IN PROCESS WHEN THE SLURRY BARREL WENT DRY. THIS IS
THE PROBABLE CAUSE OF THE HIGH RANGE/SD. POLISHING WAS CENTER
FAST WHICH IS UNUSUAL. THE FIRST MQC ON THIS PAD HAD A
UNIFORMITY OF ~9%. THE 2ND MQC, DONE AFTER THIS LOT WAS
POLISHED WAS UP TO ~13%. NORMALLY THE UNIFORMITY WILL IMPROVE
AFTER THE 1ST MQC. POSSIBLY SOME CONCENTRATED SLURRY FROM THE
BOTTOM OF THE BARREL AFFECTED THE PERFORMANCE OF THE PAD. ALSO
SLURRY PROBABLY NOT FLOWING CONSISTENTLY AT THE BOTTOM OF THE
BARREL.
ANOTHER POSSIBLE CAUSE WAS THAT THE CONDITIONING RING WAS JUST
CHANGED RECENTLY. IF NOT CENTERED PROPERLY THIS COULD BE CAUSING
HIGH SD.
ALL METROLOGY MEASUREMENTS VERIFIED AS GOOD.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: CONDITIONING RING WILL BE CHECKED. RECOMMEND CHECKING SLURRY
LEVEL BEFORE POLISHING A LOT.
|
| 62.652 | XD1292 TWO WAFERS SCRAPPED @PMD | FABSIX::P_HESTER | | Sat Apr 26 1997 17:57 | 30 |
|
CMP PEX
LOT # XD1292
DEVICE: TM0069-084-BA-8C
QUANTITY: 22
OPERATION # 978 CMP_PMD
/DESCR.
POLISHER: CMP.A2
EVAL TOOL: N/A
DATE: 04/25/97 C SHIFT
PROBLEM: TWO WAFERS SCRAPPED
WAFERS WERE BROKEN WHEN UNLOAD ROBOT CRASHED INTO THE RIGHT
SEND CASSETTE.
DISPOSITION: LOT MOVED ON.
CORRECTIVE
ACTION: EE ADDRESSED AND CORRECTED CONDITION.
|
| 62.653 | JD1399 slight overpolish @ILD2 | YIELD::PHESTER | | Sat May 03 1997 19:39 | 37 |
|
CMP PEX
LOT # JD1399
QUANTITY: 24
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B2 & B4
EVAL TOOL THICKNESS.A5
DATE: 05/03/97 C-Shift
PROBLEM: LOW POST THICKNESS MEAN
POST MEAN AVG = 4939�
LCL IS 5200�
DISPOSITION: LOT WAS SPLIT BETWEEN .B4 AND .B2 TO TEST 18%
SLURRY.
WAFERS THAT NEEDED EXTRA DEP HAVE BEEN REMARKED
AT OPERATION # 2133.
ANNOTATION # 10779 HAS BEEN CLOSED.
ALL OVERPOLISHED WAFERS WERE RUN ON CMP.B4 WHICH HAD THE 18%
SLURRY. THIS SLURRY HAS A VERY HIGH REMOVAL RATE AND WE ARE
LEARNING HOW TO CONTROL POLISHING WITH IT.
CORRECTIVE
ACTION NONE
|
| 62.654 | CMP PEX, 12 WAFERS REMARKED FOR EXTRA DEP FROM JD1469 | SUBPAC::SMARTIN | | Sun May 04 1997 18:08 | 81 |
|
LOT: JD1469
MACHINE: CMP.B3
OPER#: 1985
PROCESS LEVEL: ILD3
DATE: 5/4/97
SHIFT: A - SHIFT
QUANTITY: 23
PRODUCT. .DC1073
LOT; JD1469
.
PROBLEM: 12 WAFERS OVER POLISHED AND WILL NEED EXTRA DEP.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5380.000
WAFER #2 5790.000
WAFER #3 5751.000
WAFER #4 5680.000
WAFER #5 5540.000
THK_SD_5 WAFER #1 7.600 5/04/97 16:29:10
WAFER #2 8.300
WAFER #3 11.200
WAFER #4 9.700
WAFER #5 8.600
DISPOSITION: The following wafers will require extra dep :
Wafer Thickness Extra Dep.
7 3574 2000
21 3669 2000
12 3884 1500
14 4182 1500
5 4527 1000
19 4534 1000
1 4790 500
2 4877 500
10 4890 500
16 5105 500
18 5187 500
Lot History below:
This lot was passed onto the next shift, Overpolished wafers were found
during 100% measurement. Its believed that this is a lot problem and NOT
a Tool or operator error problem, proof: these wafers needed touching up
they were grouped together tightly as follows,
Thickness group TUP recipe Resulted Thickness
6474 A TUP 350 5380
6353 A TUP 350 4790*
6172 B TUP 200 5790
6119 B TUP 200 5395
6083 B TUP 200 5380
5984 c TUP 100 5187*
5982 C TUP 100 4890*
5913 C TUP 100 5231
These 3 groups were polished on A Shift, as you can see this lot did not
polish well, 3 more wafers overpolished. Other lots polished on this tool
ran just fine.
CORRECTIVE ACTION: Wafers were remarked for extra dep.
|
| 62.655 | 2 WAFERS OVERPOLISHED ON CMP.B2, XE1112 | FABSIX::S_AGUILA | | Mon May 05 1997 08:18 | 33 |
|
-< CMP PEX, >-
--------------------------------------------------------------------------------
LOT: XE1112
MACHINE: CMP.b2
OPER#: 2009
PROCESS LEVEL: CMP_ILD3
DATE: 5/5/97
SHIFT: B-SHIFT (THIS PROBLEM HAPPENED AT SHIFT CHANGE)
QUANTITY: 21
PROBLEM: 2 WAFERS OVER POLISHED, WAFERS #6 AND #7 WILL NEED TO BE EXTRA DEP.
WITH ~1K A
DISPOSITION: The following wafers will require extra dep :
Wafer Thickness Extra Dep. CL
#6 9201 ~1000 LCL = 9500
#7 8864 ~1000 UCL = 10500
CORRECTIVE ACTION: Wafers were remarked for extra dep.
|
| 62.656 | JD1384 - 9 WAFERS OVERPOLISHED & HIGH THK_SD_5 | STRATA::POZORSKI | | Mon May 05 1997 14:04 | 57 |
| CMP PEX
----------
LOT: JD1384
MACHINE: CMP.B3
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 5/5/97
SHIFT: Leftover from B SHIFT
QUANTITY: 24
PRODUCT. DC1035-000-SC-8T
LOT: JD1384
.
PROBLEM: 9 WAFERS OVER POLISHED AND WILL NEED EXTRA DEP and IT ALSO HAD HIGH
THK_SD_5 FOR THE RANGE ON ONE OF THE 5 OUT GOING WAFERS.
THK_ME_5 WAFER #1 5085.000
WAFER #2 5645.000
WAFER #3 5587.000
WAFER #4 5109.000
WAFER #5 5098.000
THK_RG JD1384 2964.000
THK_SD_5 WAFER #1 20.000 (UCL = 13
WAFER #2 7.340
WAFER #3 7.800
WAFER #4 4.000
WAFER #5 6.620
DISPOSITION: Jd1384 ILD1 Dc1035. (this was leftover from B-shift)
9 wafers Overpolished @CMP ILD1. These wafers will
need an additional oxide dep at OPER 2130.
Wafer Actual THK Additional ox needed at
Number @CMP ILD1 OPER 2130
3 4101 1500
9 4362 1000
22 4658 1000
4 4956 500
23 4734 500
2 4804 500
20 5024 500
13 5009 500
11 4863 500
CORRECTIVE LOT WAS REMARED AND MOVED ON, NO FURTHER ACTION REQUIRED.
ACTION:
|
| 62.657 | JD1307 - 2 wafers scrapped due to breakage | LUDWIG::POZORSKI | | Mon May 05 1997 17:52 | 29 |
| CMP PEX
----------
LOT: JD1307
MACHINE: SCRUB.A3
OPER#: 1986
PROCESS LEVEL: CMP_SCRUB4
DATE: 5/5/97
SHIFT: S SHIFT
QUANTITY: 24 - 2 = 22
PRODUCT. DC1026-000-JB-8G
LOT: JD1307
.
PROBLEM: Two wafers scrapped (11 & 12) due to the fact they broke in the
unload station.
DISPOSITION: Two wafers scrapped after they broke in the unload station due
to a cassette being dropped through the top of the machine.
CORRECTIVE EE came in cleaned up the wafers and the tool was give to
ACTION: production. The rest of the lot was moved on with 2 less wafers.
|
| 62.658 | XD1116 - 6 wafers scrapped due to overpolish | STRATA::POZORSKI | | Tue May 06 1997 18:33 | 32 |
| CMP PEX
----------
LOT: XD1116
MACHINE: CMP.B3
OPER#: 1981
PROCESS LEVEL: CMP_ILD1
DATE: 5/6/97
SHIFT: A SHIFT
QUANTITY: 20 - 6 = 14
PRODUCT. TM0069-084-BA-8C
LOT: XD1116
PROBLEM: 6 wafers scrapped due to being overpolished.
DISPOSITION: 5 wafers run as send aheads were polished just through the TiN
in 100 sec. Eric's note that the lots will polish faster gave
no impression that they should be polished for under 30 seconds
when the standard potion took over 180 seconds. So the first 5
wafers from this split are scrap material as well as one wafer
that came into the area with 1/2 the oxide it should.
CORRECTIVE Lot will have 6 less wafers when it is moved out of this area.
ACTION:
|
| 62.659 | CMP PEX FOR XD1241 1 scrap-10 overpolished left over from b shift. | SUBPAC::SMARTIN | | Wed May 07 1997 20:15 | 53 |
|
LOT: XD1241
MACHINE: CMP.B2
OPER#: 1986
PROCESS LEVEL: ILD3
DATE: 5/7/97
SHIFT: B - SHIFT
QUANTITY: 24 DOWN TO 23
PRODUCT. .TM0069-084-BA-8C
LOT; XD1241
.
PROBLEM: 1 scrap-10 overpolished left over from b shift.
These are the overpolished wafers left over from "B" shift. The
lot is remarked for extra Dep and Matt just finished up all the
measurements needed as per remark. The lot was run for 400s. A
sample was taken and they were around 15000. The lot was then run
for an additional 100s.
Just as an FYI...This is a W CMP/WEB split. All of these wafers are
from the W CMP split
DISPOSITION: The following wafers will require extra dep :
# Mean Std. Extra DEP
25 8202 4.49 1500A
2 7729 13.5 2000A
9 8683 6.83 1500A
10 9391 5.61 500A
11 8411 9.24 1500A
12 6620 15.4 3500A
17 2705 47.7 SCRAP***************
18 7770 9.81 2000A
19 8503 9.5 1500A
20 5542 8.38 4500A
21 9449 6.57 500A
CORRECTIVE ACTION: Wafers were remarked for extra dep.
|
| 62.660 | Pex for overpolished lots. | YIELD::SHONG | | Sat May 10 1997 08:23 | 29 |
| PE PEX NOTIFICATION
LOT # JD1457
QUANTITY: 24
OPERATION # 1978 CMP AFTER PMD DEP1
/DESCR.
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A1
DATE: 05/10/97 D-Shift
PROBLEM: Two wafers from this lot were overpolished at operation 1978
CMP_PMD. The operator ran his send aheads and recalculated
the time for the rest of the lot. While polishing the rest of
the lot he accidentally put the send aheads back through.
Wafer #'s being scrapped are 1 and 2.
DISPOSITION: Wafers were scrapped for low thickness ~2500 to 3000�. This
lot is a split lot for 18% slurry. The wafers that were scrap-
ped were from the POR portion.
CORRECTIVE Talked to the operator and discussed the importance of not
ACTION: sending the send aheads through twice. He assured me it wouldn't
happen again.
|
| 62.661 | XD1482 - 2 wafers overpolished @PMD | STRATA::POZORSKI | | Sun May 11 1997 13:49 | 24 |
| CMP PEX
LOT #: XD1482
QUANTITY: 24
OPERATION # 1978 CMP_PMD CMP
POLISHER: CMP.A1
EVAL TOOL: N/A
DATE: B shift/A-Shift 05/11/97
PROBLEM: 2 wafers (#1 & 5) were overpolished.
DISPOSITION: This lot was polished on B-Shift and A-Shift discoved
the 2 wafers when the lot was measured on the UV-1050. Lot
was remarked at operation 2127 DEP_PMD 2 for an extra 1000�
on these 2 wafers and the lot was moved on. The cause of
these 2 overpolished wafers is unknown.
CORRECTIVE The lot was remarked for extra dep and moved on.
ACTION:
|
| 62.662 | CMP.B3 - 3 WAFERS SCRAPPED DUE TO A CRASH | STRATA::POZORSKI | | Sun May 11 1997 17:51 | 63 |
| CMP PEX
LOT # JL1486
QUANTITY: 24 - 3 = 21
OPERATION #
/DESCR. 1992 MSP_ILD1
POLISHER: CMP.B3
EVAL TOOL: N/A
DATE: 05/11/96 B-SHIFT/A-SHIFT
PROBLEM: 3 WAFERS SCRAPPED ON CMP.B3 DUE TO THE FACT IT CRASHED ON THE
TOUCH-UP-C RECIPE IN STEP #3 WITH 1 SEC INTO THIS STEP, THE
WAFER SLID OUT OF CARRIER 5. THE TOOL WAS HAVING SOME MAJOR
VIBRATIONS BEFORE IT CRASHED.
DISPOSITION: A-SHIFT FINISH POLISHING THE LOT AFTER THE MQC'S WERE PERFORMED
AFTER THE PAD & CARRIER CHANGE. THE LOT WAS MOVED IT ON WITH 3
LESS WAFERS.
(SEE CRASH REPORT BELOW)
CORRECTIVE EE WENT IN AND REPLACED BOTH PAD AND CARRIERS, THEY CHECKED HEAD
ACTION TO CUP ALIGNMENT AND HEIGHT, AS WELL AS VACUUM LEVEL AND RECIPES
AND ALL APPEARED TO BE OKAY EXCEPT FOR A TIME DIFFERENCE IN STEP
ONE OF THE TUP-C (IT WAS SET UP FOR 2 SECS INSTEAD OF 25 SECS)
THIS WAS CHANGED BACK TO THE 25 SECS AND WAS TURNED BACK OVER
TO PRODUCTION TO RUN MQC'S AND THEN THE LOT WAS COMPLETED AND
MOVED ON.
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B3
2) Recipe: touch-up-c
3) Step #: 3
4) Time into step: 1sec
5) Type of wafers that broke: 3 product
6) Carrier which wafer slid out of: 5
7) Other carriers that were damaged:all
8) Alarms displayed by polisher: none
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: yes
11) # of wafers on pad: this tool crashed earlier tonight, it had a fresh
12) # of wafers on carrier: pad and all new carriers
13) Was there any vibration prior to the crash: yes
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: yes
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances: tool had MAJOR vibrations
before it crashed. Due to the time of the crash i could not get the broken
wafer #'s
B-shift EE.
17) Put this check sheet in CMP note #32: done
|
| 62.663 | CMP_PEX Lot XE1025 Slightly over-polished..... | YIELD::VANHANEHEM | | Mon May 12 1997 13:55 | 38 |
| CMP PEX
LOT # XE1025
QUANTITY: 24
OPERATION #
/DESCR. 3054 - THK_ILD1_PST
POLISHER: CMP.B3
EVAL TOOL: THICKNESS.A4
DATE: 05/09/96 C-Shift
PROBLEM: Lot failed for low Mean @5186 (LCL=5200). Only three standard
wafers were entered into workstream according to the following
remark:
------------------------------------------------------------------------
DATE LOGGED : 19-FEB-1997 15:50:59.97
OPERATION : 1999 - CMP_ILD1
OPERATOR : K_WOOLDRIDGE
------------------------------------------------------------------------
Wooldridge @ PAGER #957 if you have questions.
Please also note that this lot was split at PMD and some wafers have a
300A SiN layer under PMD. Please use wafers #1-6,13-18 for measurements
(wafers without SiN). Doubtful you will be able to measure the others.
------------------------------------------------------------------------
DISPOSITION: Lot was sent on as is.
CORRECTIVE
ACTION: None needed. Lots before and after this were good and it
was a nonstandard lot with measurement capabilities on only a
few wafers.
|
| 62.664 | JD1459 ILD1 - 4 scrap, 8 overpolished @ ILD1 HDP | YIELD::MANDREOLI | | Tue May 13 1997 07:56 | 74 |
| PEX NOTIFICATION
LOT # JD1459 (DC1035)
QUANTITY: 24 - 4 = 20
OPERATION # 1981 CMP_ILD1
/DESCR.
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A5
DATE: 05/12/97 B-SHIFT
PROBLEM: Lot has 4 wafers scrapped and 8 requiring extra capping dep.
All wafers from the 2xHDP Split had extremely high removal rate,
compared to the POR portion.
REMARK INFO:
This lot needs to be split at this operation. The final thickness should
be the same for both halves of the split but they need to be run seperately
as they will polish at different rates. Please sort the lot into two
cassettes and process as two seperate lots (DO NOT use one set of send
aheads for both splits). The splits are below:
POR 2xHDP
--------------- -----------------
wafers: 1,2,5,6,9,10,13, 3,4,7,8,11,12,15,
14,17,18,21,22 16,19,20,23,24
ILD1 splits:
------------
ILD1_1 thickness: 3.5kA 7.0kA
ILD1_2 thickness: 16.2kA 9.5kA
CMP to: 5.5kA 5.5kA
ILD1_3 thickness: 3.5kA 3.5kA
-------- --------
Final Tox: 9.0kA 9.0kA
Started with the 2xHDP portion; measured 4 wafers to get Mean thickness,
which was 15425�. The standard for ILD1 initial polish is 160 seconds, these
four send aheads were run for 140 seconds and were all overpolished to the
extent of being scrap. Wafers {03,04,07,08} ranged from 2869� to 3058�, with
the LCL for scrap being <3400�. So these 4 wafers are scrapped.
From the above 4 wafers, the Removal Rate was calculated at 5345�/min, and
this was used to adjust Time to 111 seconds for the remaining 8 wafers in
this Split. These 8 wafers were overpolished, and will need extra capping
Dep at Oper# 2130 DEP_ILD1 3. These wafers are REMARKed for the extra dep,
Their thickness measurements are;
Wafer# Tox LCL is 5200 �
_____________ Target is 5500 �
11 4088
12 4144 add 1500� to each wafer
15 4121
16 4185
19 4077
20 4247
23 4136
24 4091
DISPOSITION: 4 wafers scrapped, 8 wafers REMARKed to get extra capping Dep.
CORRECTIVE These HDP lots are polishing with very fast removal rates. We need
ACTION: to get a reference TIME for these portions in order to minimize
overpolishing. "Polish and Learn..."
The POR wafers (12) are finishing up now.
|
| 62.665 | CMP PEX,JD1459 4 WAFERS REMARKED FOR EXTRA DEP. | SUBPAC::SMARTIN | | Tue May 13 1997 14:15 | 48 |
|
LOT: JD1459
MACHINE: CMP.B2
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 5/13/97
SHIFT: A - SHIFT
QUANTITY: 20
PRODUCT. .DC1035-000-SC-8T
LOT; JD1459
.
PROBLEM: 4 more wafers were overpolished from the standard portion of this lot.
Wafer #1 (4841), #2(5044), #6(4706) and #9(4908). Lot was turned over
from previous shift, I do not know TUP times. An additional remark
was added at oper.2130 to add an extra 500A DEP to these wafers.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 4841.000
WAFER #2 5634.000
WAFER #3 4706.000
WAFER #4 4247.000
WAFER #5 4136.000
THK_RG NA N/A
WAFER #1 10.800 5/13/97 12:28:28
WAFER #2 8.670
WAFER #3 11.200
WAFER #4 4.880
WAFER #5 12.400
DISPOSITION: Popped chart due to overpolished wafers.
Chart popped for THK_ME_5. (4/5 wafers overpolished on final 5). Added
remark to annotation that wafers were remarked for the extra dep.
CORRECTIVE ACTION: Wafers were remarked for extra 500A DEP to these wafers.
annotation#11495 was remarked and closed.
|
| 62.666 | CMP PEX,JD1401 5 WAFERS REMARKED FOR EXTRA DEP | SUBPAC::SMARTIN | | Tue May 13 1997 17:30 | 61 |
|
LOT: JD1401
MACHINE: CMP.B3
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 5/13/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. .DC1026-000-JB-8G
LOT; JD1401
.
PROBLEM: Found these on a B-shift 100% measure lot.
5 wafers overpolished on 1st pass polish. The initial send ahead time
was done for 210 secs and some wafers were in spec and some were
a little high. It is somewhat unclear why the polish time was
set for 230 secs when 210 would have been ok according to the
send ahead wafers. The head to head variation was somewhat high as
well for this lot.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5749.000
WAFER #2 5399.000
WAFER #3 5707.000
WAFER #4 5251.000
WAFER #5 5777.000
THK_RG JD1401 1753.000
THK_SD_5 WAFER #1 10.500 5/13/97 13:50:44
WAFER #2 4.770
WAFER #3 8.240
WAFER #4 11.500
WAFER #5 9.450
DISPOSITION: All 5 will need an additional 500 Angstrom Oxide dep at
OPER 2130.
Wafer Actual CMP
Number ILD1 THK
19 4723
15 5144
22 4988
10 5040
17 5178
CORRECTIVE ACTION: Wafers were remarked for extra 500A DEP to these wafers.
|
| 62.667 | Overpolished wafers | YIELD::SHONG | | Fri May 16 1997 08:11 | 25 |
| PE PEX NOTIFICATION
LOT # JD1403
QUANTITY: 24
OPERATION # 1985 CMP_ILD2
/DESCR.
POLISHER: CMP.B4
EVAL TOOL: THICKNESS.A4
DATE: 05/15/97 D-Shift
PROBLEM: This lot was slightly overpolished at operation 1985 CMP_ILD2.
While polishing the operator recieved alarms for slurry flow.
I believe this playe a part in the overpolished wafers.
Thickness ranged from ~4K to 5K angstroms.
DISPOSITION: Lot has been remarked to recieve extra dep.
CORRECTIVE Slurry came back at ~3:00am. Tool was MQC'ed and is in spec.
ACTION:
|
| 62.668 | JL1528 4 WAFERS SCRAPPED DUE TO OVER-POLISH | YIELD::PHESTER | | Sat May 17 1997 20:02 | 27 |
|
CMP PEX
LOT # JL1528 DC1044 ILD1
QUANTITY: 23
OPERATION # 1992 CMP ILD1
/DESCR.
POLISHER: CMP.B4
EVAL TOOL: THICKNESS.A4
DATE: 05/17/97 C-Shift
PROBLEM: 4 WAFERS WERE SCRAPPED DUE TO SEVERE OVER-POLISH
OPERATOR REVERSED TOUCH-UP TIME FOR SEND AHEADS WITH POLISH
TIME FOR THE BALANCE OF THE LOT. SO SEND-AHEADS GOT BURNED.
BALANCE OF THE LOT IS OK.
DISPOSITION: SCRAP 4 WAFERS. LOT MOVED ON.
CORRECTIVE
ACTION NONE
|
| 62.669 | CMP PEX JL1547, 1 WAFER BROKE ON CMP.A1. | SUBPAC::SMARTIN | | Sun May 18 1997 17:15 | 62 |
|
LOT: JL1547
MACHINE: CMP.A1
OPER#: 1984
PROCESS LEVEL: PMD
DATE: 5/18/97
SHIFT: A - SHIFT
QUANTITY: 24 DOWN TO 23
PRODUCT. ..DC1064-004-CA-8P
LOT; JL1547
.
PROBLEM: Lot # jl1547, one product wafer broken at operation 1984.
IT APPEARS THAT RIGHT CARRIER DROPPED WAFER ON LIFTOFF AND
WAFER MAY HAVE BEEN BROKEN BY CONDITIONER.
DISPOSITION: LOT WILL BE SENT ON LESS 1 WAFER.
CORRECTIVE ACTION: PAD AND CARRIERS WILL BE CHANGED AND THE SYSTEM WILL
RERUN MQC'S.
From: FABSIX::FABSIX::K_JUBINVILLE "CMP .... Whatever it takes 18-May-1997 15
29 -0400"
To: @CMP.DIS;1
CC:
Subj: wafer crash on CMP.A1
crash report for product wafer broken on polish table on CMP.A1.
Lot # jl1547, one product wafer broken at operation 1984, 24 wafers down to 23.
1) System : CMP.A1
2) Recipe: PMD
3) Step # : N/A
4) Time into step: COMPLETED
5) Type of wafers that broke: PRODUCT
6) Carrier which wafer slid out of: RIGHT
7) Other carriers that were damaged: NONE
8) Alarms displayed by polisher: WAFER NOT SITTING AT RIGHT LOAD.
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash: NO systems: NO
10) Did wafer detect work no_____
11) # of wafers on pad : 194
12) # of wafers on carrier: 16
13) Was there any vibration prior to the crash: N/A
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table n/a________
15) Check step hight of the carrier from question #6: 70 MILS
16) Please note any other unusual circumstances: IT APPEARS THAT RIGHT CARRIER
DROPPED WAFER ON LIFTOFF AND WAFER MAY HAVE BEEN BROKEN BY CONDITIONER.
|
| 62.670 | CMP PEX, JL1461-13 WAFERS OVER POLISHED. | SUBPAC::SMARTIN | | Sun May 18 1997 18:09 | 74 |
|
LOT: JD1461
MACHINE: CMP.B4
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 5/18/97
SHIFT: A - SHIFT
QUANTITY: 24
PRODUCT. .DC1035-000-SC-8T
LOT; JD1461
.
PROBLEM: Jd1461 has 13 overpolished wafers.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 5430.000
WAFER #2 4788.000
WAFER #3 4496.000
WAFER #4 4865.000
WAFER #5 5386.000
THK_RG JD1461 1958.000
THK_SD_5 WAFER #1 11.900 5/18/97 16:37:49
WAFER #2 8.160
WAFER #3 12.400
WAFER #4 17.000
WAFER #5 6.770
CL=5200-5800
DISPOSITION:There are 13 overpolished wafers @CMP ILD1. For JD1461
Wafer Act CMP ILD1 Additional oxide
Number Thickness Needed @ OPER 2130
19 4689 1000 Angstroms
1 4788 500
18 4976 500
14 5103 500
21 4855 500
16 4769 500
23 4496 1000
17 5034 500
24 5177 500
4 4701 500
13 4865 500
12 4884 500
2 4794 500
This lot required 4 Groups (20 wafers) of Touch ups. The following were the
pre touch-up thickness ranges and the times the wafers were polished for.
1st Group 2nd Group 3rd Group 4th Group
6815-7041 6662-6794 6571-6639 6333-6476
3 seconds 2 seconds 1 second TUP 375
Time Time
Polished Polished
6815-7041 3 seconds 6662-6794 2 seconds
CORRECTIVE ACTION: LOT WAS REMARKED FOR EXTRA DEP.
|
| 62.671 | CMP PEX,JD1455 had 4 wafers scrapped and the rest redep | SUBPAC::SMARTIN | | Mon May 19 1997 14:20 | 57 |
|
LOT: JD1455
MACHINE: Started on CMP.B3 and finished on CMP.B2 due to tool failure.
OPER#: 1985
PROCESS LEVEL: ILD2
DATE: 5/19/97
SHIFT: A - SHIFT
QUANTITY: 24 DOWN TO 20
PRODUCT. . DC1035-000-SC-8T
LOT; JD1455
.
PROBLEM: This lot has four wafers that are scrap and the rest of the lot
was remarked for extra dep. The wrong recipe was used by mistake.
A metal-3 recipe was used to polish the lot. Metal-2 recipe
should have been used.
What happened was the lot was running on cmp.b3 and that went down for
water leak. So I ran the lot on cmp.b2 but used the removal rate
from my machine which I was running a metal-3 and the lot that came
over was a metal-2 I had a removal rate of 2426 and cmp.b2 was
running a removal rate of some where around 4000.
4 scrapped wafers were # 13, 03, 02, 09
#13=3022A
#03=3043A lcl=3200 for scraps
#02=3052A
#09=2892A
DISPOSITION: The rest of this lot was remarked for an extra 2000A of redep.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 4065.000
WAFER #2 4234.000
WAFER #3 3978.000 5/19/97 12:31:09
WAFER #4 4098.000
WAFER #5 4365.000
THK_RG NA N/A
THK_SD_5 WAFER #1 5.800
WAFER #2 7.700
WAFER #3 6.600
WAFER #4 5.400
WAFER #5 7.800
cl=5200-5800
CORRECTIVE ACTION: LOT WAS REMARKED FOR EXTRA DEP.
|
| 62.672 | CMP PEX 5 WAFERS SCRAPPED FROM OUR BONUS ON LOTJD1554 | SUBPAC::SMARTIN | | Mon May 19 1997 20:02 | 41 |
|
LOT: JD1554
MACHINE: Started on CMP.B3 and finished on CMP.B2 due to tool failure.
OPER#: 1981
PROCESS LEVEL: ILD1
DATE: 5/19/97
SHIFT: A - SHIFT
QUANTITY: 24 DOWN TO 19
PRODUCT. . DC1073
LOT; JD1554
.
PROBLEM:5 wafers scrapped #2,6,14,16 and 21
Lot was started on .B3 by B shift. Tool went down during lot run and
remainder of wafers were run on CMP.B2. I loaded the remainder of the
lot for 180secs. for 1st pass polish on CMP .B2. When we (A shift) run
Touch ups on our send aheads, they run PRIOR to the lot. The SA's that needed
the TUP's on this lot were loaded AFTER the lot. Bottom line...the wafers
that I thought were 1st pass polish (last run of the lot) were actually
the send aheads that needed touch ups.
DISPOSITION: The lot will be sent on less 5 wafers.
CORRECTIVE ACTION: Maybe we should have a standard that all send a head wafers
should be separated from the lot once they have been ran and
or make all send a heads the first 5 wafers in the lot.
The send a heads were wafers 19-24 on this lot and they were
put back in the same cassette. Could be a communication
problem as well.
|
| 62.673 | CMP PEX,JD1540 4 WAFERS SCRAPPED FOR SCRATCHES. | SUBPAC::SMARTIN | | Tue May 20 1997 17:19 | 37 |
|
LOT: JD1540
MACHINE: CMP.B4
OPER#: 1989
PROCESS LEVEL: ILD3
DATE: 5/20/97
SHIFT: A - SHIFT
QUANTITY: 24 DOWN TO 20
PRODUCT. . DC1073
LOT; JD1540
.
PROBLEM: 4 wafers scrapped #3,5,10,AND 13
The send ahead wafers got severly scratched by the tool. We are not
sure what pad the scratches came from. EE partitioned the two pads
for scratches and both showed no signs of scratches. The rest of the
lot that was not polished yet had no scratches. The lot that was
ran prior to this lot was good also. I looked at the carriers and they
seem to have alot of dried slurry on them. Maybe a piece of dried
slurry fell off the carriers while the lot was polishing.
DISPOSITION: The lot will be sent on less wafers.
CORRECTIVE ACTION: EE took the tool and gave it a good cleaning. mqc's were
ran and they passed with no problems. There has been a
few wafers ran on the tool since and I was told the tool
looks good.
|
| 62.674 | XE1025 slightly low outgoing thickness @ILD2 | YIELD::PHESTER | | Sat May 24 1997 09:58 | 36 |
|
CMP PEX
LOT # XE1025
QUANTITY: 24
OPERATION # 2006 CMP POLISH ILD2
/DESCR.
POLISHER: CMP.B4 POST READINGS
EVAL TOOL: THICKNESS.A4
DATE: 5/24/97 C-Shift
PROBLEM: LOW POST THICKNESS ILD2
LOT POST THICKNESS MEAS AVG = 4751�
LCL IS 5200�
DISPOSITION: Lot was polished on D shift on .B4.
Tech had a problem with tool in that the removal
rate increased the closer it got to target. Normal
removal rates decrease the closer to target.
Also this tool was running on a slurry barrel and the level was
low. It is possible that the slurry could have had a higher
solid content causing the higher removal rate. The barrel was
changed out after this lot was polished.
CORRECTIVE
ACTION Lot has been remarked for extra dep at operation # 2284.
|
| 62.675 | XD1383 low outgoing thickness @ ILD3 | YIELD::PHESTER | | Sat May 24 1997 20:27 | 41 |
|
CMP PEX
LOT # XD1383
QUANTITY: 24
OPERATION # 1989 CMP_ILD3
/DESCR.
POLISHER: CMP.B4 POST READINGS
EVAL TOOL: THICKNESS.A5
DATE: 5/24/97 C-Shift
PROBLEM: LOW POST THICKNESS ILD3
LOT POST THICKNESS MEAS AVG = 9456�
LCL IS 9500�
THK_ME_5 WAFER #1 9308.000
WAFER #2 9150.000
WAFER #3 9467.000
WAFER #4 9931.000
WAFER #5 9425.000
THK_RG XD1383 3617.000
THK_SD_5 WAFER #1 12.100 5/24/97 17:03:35
WAFER #2 11.100
WAFER #3 10.400
WAFER #4 9.100
WAFER #5 5.100
DISPOSITION: REMOVAL RATE IS INCREASING AFTER INITIAL POLISH. THIS IS
HIGHLY UNUSUAL. EE AND PE ARE INVESTIGATING.
CORRECTIVE
ACTION LOT REMARKED FOR EXTRA DEP @ 2136 DEP_ILD3 3.
|
| 62.676 | XD1483 five wafers over-polished @ILD2 | FABSIX::P_HESTER | | Wed May 28 1997 20:11 | 36 |
|
CMP PEX
LOT #: XD1483
QUANTITY: 24
OPERATION # 1985 CMP_ILD2 CMP
POLISHER: CMP.B4/CMP.A1
EVAL TOOL: N/A
DATE: D-SHIFT 05/28/97
PROBLEM: 5 WAFERS WERE OVER-POLISHED BY 1500�.
Wafer #1 = 4308
Wafer #2 = 4333 (LCL = 5200�)
Wafer #3 = 4528
wafer #4 = 4679
wafer #5 = 3613
DISPOSITION: LOT WAS POLISHED ON PREVIOUS SHIFT. FROM INFORMATION
GATHERED THE LOT WAS STARTED ON CMP.B4 (SPEEDFAM) AND DUE
TO A TOOL PROBLEM WAS MOVED TO FINISH ON CMP.A1 (STRASBAUGH).
APPARENTLY THE ENTIRE LOT INCLUDING THE SEND AHEADS WAS THEN
POLISHED FOR 180 SEC ON CMP.A1. AS A RESULT THE SEND-AHEADS
WERE OVERPOLISHED. DUE TO LOWER REMOVAL RATE ON THE .A TOOLS
THE WAFERS WERE NOT SEVERELY OVER-POLISHED.
CORRECTIVE
ACTION: THE LOT WAS REMARKED ACCORDINGLY FOR EXTRA DEP AND MOVED ON.
|
| 62.677 | jd1561 7 overpolish 1 scrap | SUBPAC::KULP | | Thu May 29 1997 09:12 | 22 |
| CMP PEX
LOT #: JD1561
QUANTITY: 24-1=23
OPERATION # 3054 THICK CMP @ ILD1 ON PROMETRIX
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A1
DATE: D shift 05/29/97
PROBLEM: 7 wafer over polish, 1 scrap ( wafer# 20)
DISPOSITION: Lot moved on with 1 less wafers.
CORRECTIVE ACTION: Run time was 230 sec. 3150 RR all other wafers were good
with 7 touch ups. No alarms, remarked 6 wafers for extra
dep.
|
| 62.678 | JD1561 revised PEX - 7 wafers overpolish @ILD1 | YIELD::PHESTER | | Thu May 29 1997 17:40 | 31 |
|
CMP PEX
LOT #: JD1561
QUANTITY: 24-1=23
OPERATION # 3054 THICK CMP @ ILD1 ON PROMETRIX
POLISHER: CMP.B2
EVAL TOOL: THICKNESS.A1
DATE: D shift 05/29/97
PROBLEM: 7 wafer over polish, 1 scrap ( wafer# 20)
DISPOSITION: Lot moved on with 1 less wafers.
CORRECTIVE ACTION: Run time was 230 sec. 3150 RR all other wafers were good
with 7 touch ups. No alarms, remarked 6 wafers for extra
dep.
Investigation showed this lot had the lowest mean thickness
of the last 20 or so lots leaving dielectrics (17502).
Also the mean thickness of lots leaving dielectrics at this
level have been averaging below the target thickness for a
week or so. This is not necessarily the sole cause of this
incident, but could have contributed.
|
| 62.679 | JD1401 several wafers over polish. ILD3 | SUBPAC::KULP | | Fri May 30 1997 08:23 | 41 |
| CMP PEX
LOT #: JD1401 DC1026-000-JB-8G
QUANTITY: 23
OPERATION # 1989 CMP_ILD3
POLISHER: CMP.B4
EVAL TOOL: THICKNESS.A1
DATE: D shift 05/29/97
PROBLEM: 7 wafers overpolished from C shift.
Incoming data:
MACH..OX-DEP.E1 32K - 36K mean 32281.199 range 802.000
PARAMETER UNIT ID/PROMPT VALUE FG LT
COL ENG DATA THK_ME_5 WAFER #1 32073.000 5/28/97 06:38:18
WAFER #2 32391.000
WAFER #3 31975.000
WAFER #4 32190.000
WAFER #5 32777.000
THK_SD_5 WAFER #1 1.000
WAFER #2 0.570
WAFER #3 1.200
WAFER #4 0.860
WAFER #5 0.780
DISPOSITION: additional dep. required a capping dep. remarks entered.
1@ 1000, 3@ 2000, 1@ 2500, 1@ 4000 1@ 4500
CORRECTIVE ACTION: This lot was started on C shift with real high removal
rates. Initial polish of 400 sec, some wafers went down
to 5000 to 12000 � range. It was getting near the end of
the barrel, .75 gone, requested to change. When is the
barrel going away???
|
| 62.680 | xb1342 all wafers overpolish PMD | SUBPAC::KULP | | Fri May 30 1997 08:24 | 40 |
| CMP PEX
LOT #: XB1342 TM0069-085-FA-8C
QUANTITY: 22
OPERATION # 1978 CMP_PMD
POLISHER: CMP.A1
EVAL TOOL: THICKNESS.A1
DATE: C shift 05/29/97
PROBLEM: All wafers overpolished
XB1342 Just notified at 7:20 that this lot (TM69 @PMD) was thin. OPS said
there were no remarks or anything unusual. Did send aheads, calc'd
RR at 2900 (fast) and did lot for 103 sec. Lot came out at between
5700 and 5900. OPS will bin and remark for extra dep. Will PEX in
AM if necessary.
Incoming data: MACH..OX-DEP.B3C 12.1K to 10.9K target 11.5K
THK_ME_5 WAFER #1 11513.000
WAFER #2 11528.000
WAFER #3 11520.000
WAFER #4 11497.000
WAFER #5 N/A
THK_UN_5 WAFER #1 1.060
WAFER #2 1.070
WAFER #3 1.030
WAFER #4 1.020
WAFER #5 N/A
DISPOSITION: moved lot on...
CORRECTIVE ACTION: Add 500� on all wafers .
|
| 62.681 | pex report for JL1585, 1 wafer scrapped due to overpolish | FABSIX::S_AGUILA | | Tue Jun 03 1997 07:49 | 30 |
|
-< CMP PEX, >-
--------------------------------------------------------------------------------
LOT: JL1585
MACHINE: CMP.B2
OPER#: 1992
PROCESS LEVEL: MSP_ILD1
DATE: 6/3/97
SHIFT: B-SHIFT
QUANTITY: 22-1 = 21
PROBLEM: 1 WAFER SCRAPPED DUE TO OVER POLISHING (WAFER #11)
DISPOSITION: The lot is on hold for day shift engineering for "review", wafer
#24 on slot 24 had problems with pattern rec. The rest of the
wafers polished to spec.
CORRECTIVE ACTION: Lot will have 1 less wafer when it is moved out of this
area
|
| 62.682 | Updated cmp pex,1 more scrap due to wafer missing pattern | SUBPAC::SMARTIN | | Tue Jun 03 1997 14:27 | 36 |
|
-< CMP PEX, >-
--------------------------------------------------------------------------------
LOT: JL1585
MACHINE: CMP.B2
OPER#: 1992
PROCESS LEVEL: MSP_ILD1
DATE: 6/3/97
SHIFT: B-SHIFT
QUANTITY: 22-2=20
PROBLEM: 1 WAFER SCRAPPED DUE TO OVER POLISHING (WAFER #11) AND WAFER #24
scrapped out for m1 layer never being patterned (per Roger Laakko)
DISPOSITION: When I inspected wafer #24 it was obvious that there was something
wrong with this wafer. The pattern was very different from the
rest of the wafers. The lot was then turn back over to films to
fined out what the deal is. After films took a look at this
wafer it was discovered it never recieved m1 layer pattern.
CORRECTIVE ACTION: Lot will have 2 less wafer when it is moved out of this
area. No further action required.
|
| 62.683 | CMP PEX, 15 WAFERS REMARKED FOR EXTRA DEP ON XB1369 | SUBPAC::SMARTIN | | Tue Jun 03 1997 16:02 | 55 |
|
LOT: XB1369
MACHINE: CMP.A2
OPER#: 1979
PROCESS LEVEL: PMD
DATE: 6/3/97
SHIFT: 100%ed on A - SHIFT but polished on "b" shift
QUANTITY: 23
PRODUCT. . TM0069-085-FA-8C
LOT; XB1369
.
PROBLEM: 15 Wafers remarked for extra dep.
PARAMETER UNIT ID/PROMPT VALUE FG LT
THK_ME_5 WAFER #1 6283.000
WAFER #2 6023.000
WAFER #3 6313.000
WAFER #4 6070.000
WAFER #5 6069.000
THK_RG NA 343.000
lcl=6200
DISPOSITION: The following wafers will need extra dep, they are on the thin
side lot polished from previous shift and passed on to the next.
Wafer Thickness extra Dep.
21 5817 500
4 6185 500 cl=6200-6800
11 5922 500
24 6023 500
5 6062 500
18 6038 500
8 6152 500
9 6133 500
1 6132 500
2 6009 500
17 6070 500
16 6190 500
23 5889 500
7 6069 500
20 5985 500
CORRECTIVE ACTION: The polish times that were used to polish this lot was
definitly a little too aggressive.
|
| 62.684 | JD1474, 3 WAFERS REMARKED FOR EXTRA DEP | FABSIX::S_AGUILA | | Wed Jun 04 1997 04:37 | 43 |
|
CMP PEX REPORT
--------------------------------------------------------------------------------
LOT: JD1474
MACHINE: CMP.B2
OPER#: 1989
PROCESS LEVEL: CMP_ILD3
DATE: 6/4/97
SHIFT: B shift
QUANTITY: 24
PRODUCT: DC1073-000-DA-8G
PROBLEM: 3 Wafers overpolished, wafers remarked for extra dep.
Incoming Thickness
THK_ME_5 WAFER #1 32401.000 6/01/97 06:14:16
WAFER #2 32490.000
WAFER #3 N/A
WAFER #4 31882.000
WAFER #5 32573.000
DISPOSITION: The following wafers will need extra dep
Wafer# Thickness extra Dep.
2 9000 ~1000A
6 8350 ~1500A cl=10,000A +/-500A
17 8723 ~1500A
CORRECTIVE ACTION: The lot was remarked @ Oper #2136 DEP_ILD3 for extra dep.
Lot was moved on. Also this lot flagged for thickness
range, wafer #6 thickness was too low = 8350A
|
| 62.685 | XE1199, 5 WAFERS REMARKED FOR EXTRA DEP | FABSIX::S_AGUILA | | Wed Jun 04 1997 05:04 | 44 |
|
CMP PEX REPORT
--------------------------------------------------------------------------------
LOT: XE1199
MACHINE: CMP.B2
OPER#: 1989
PROCESS LEVEL: CMP_ILD3
DATE: 6/4/97
SHIFT: This lot started being process on A shift, finished on B shift
QUANTITY: 19
PRODUCT: TM0060-000-HA-8C
PROBLEM: 5 Wafers overpolished, wafers remarked for extra dep.
Incoming Thickness
THK_ME_5 WAFER #1 33732.000
WAFER #2 33734.000
WAFER #3 33646.000
WAFER #4 N/A
WAFER #5 33728.000
DISPOSITION: The following wafers will need extra dep
Wafer# Thickness extra Dep.
3 9100 ~1000
9 7686 ~2500
16 7364 ~2500 cl=10,000A +/-500A
18 8341 ~1500
24 8539 ~1500
CORRECTIVE ACTION: The lot was remarked @ Oper #2291 DEP_ILD3 for extra dep.
Lot was moved on.
|