TOPIC | 62.0 | Process Excursion (PEX) for CMP |
| 62.508 | Sat Jan 25 1997 14:01 | JD0809 low outgoing thickness @ILD2 | 34 lines |
| 62.509 | Sat Jan 25 1997 17:48 | JD0784 HIGH OUTGOING RANGE @ILD3 | 35 lines |
| 62.510 | Sat Jan 25 1997 19:29 | JD0763 high outgoing range @ILD3 | 35 lines |
| 62.525 | Thu Jan 30 1997 17:19 | JL0952 2 wafers scrapped due to crash on .A2 | 32 lines |
| 62.576 | Sat Mar 01 1997 19:37 | JL1042 HIGH SD @ILD1 | 44 lines |
| 62.583 | Thu Mar 06 1997 12:38 | jd1031 one wafer scrapped on scrubber | 28 lines |
| 62.585 | Sat Mar 08 1997 18:09 | JD0959 HIGH OUTGOING SD @ILD3 | 47 lines |