| T.R | Title | User | Personal
Name | Date | Lines |
|---|
| 37.1 | Replaced boot | LUDWIG::STANDING | | Thu Aug 29 1996 10:02 | 7 |
| WSTK.1 Replaced the bellows boot over the unload station dump
valve. After assembling the valve with no leaks, the valve did not
cycle back up to fill the tub. Located TR2,3 and relay cr17 inside
the fluids cabinet, under the top lip. Found that TR2 was not
opening due to the time delay resistor not making good contact
inside the spade terminals. Crimped spade connector and connection
was reestablished. Dump valve then started working normally.
|
| 37.2 | gGIGLIST | LUDWIG::WESTPHAL | | Fri Aug 30 1996 21:13 | 22 |
|
CMP.C1 - Engineering made a list they want completed by this coming Tuesday.
1. Load alignments
2. Unload alignments.
3. Chillers filled
4. Check if platens come up to temperature
5. Repair the final wetting ring
6. Do the sweep alignments for both tables
7. Arm alignments
Topped off the chillers but never checked if the platens temperatures.
Tried to transfer wafers but the tool would not even try to pick a
new wafer. Found that the center bolt for the load cup was so tight
that it was binding and not making its sensors. Tried to again "load
a new wafer" But crashed wafers. The jam sensor is obviously not
working. The wafers were not sensing properly in the load cassette.
Adjusted the optical sensors. Final got the a wafer to load but the
arm kept erroring for an arm Lifting error. Adjusted the air flow to
the arm up/down cylinder and rebalanced the arm. Transferred wafers
from load to unload with several different problems and errors.
Tool presently sets powered off.
|
| 37.3 | Hit List | STRATA::WESTPHAL | | Sat Aug 31 1996 20:36 | 19 |
|
CMP.C1's Hit List Update
------------------------
1. Load alignments
ok 2. Unload alignments.
ok 3. Chillers filled
ok 4. Check if platens come up to temperature
needs to be checked 5. Repair the final wetting ring
6. Arm alignments
CMP.C1 - The final platen was not heating. The chiller had a low glycol level
and the indicator lamp was burned out. The bulb was replaced and the
chiller topped off. Platen heated with out a problem. The upgraded
shuttle jam sensor was installed but there was not enough time to
properly adjust it. The water track to cassette alignment was also
completed. Tool sets still needing the load handler and arm
alignments. Mike Standing and Myself will be in on Tuesday to do
them. Tool power and DI is off.
|
| 37.4 | Shuttle Jam not working | STRATA::STANDING | | Tue Sep 03 1996 20:37 | 4 |
| CMP.C1-7 Troubleshooted the new shuttle jam sensor installation.
Found that U4 and the relay KIL were working, but seemed to be sticking
for some unknow reason...Checked stock for new ones had none. Called
WESTECH tech support got none. Will try again in the morning.
|
| 37.5 | WSTK START-UP WORK CONTINUED. | STRATA::WESTPHAL | | Wed Sep 04 1996 21:05 | 9 |
| CMP.C1 - Continued with the install of the shuttle jam sensor. Suspect that
we are missing part of the new shuttle kit. This is being checked on
and the parts will be ordered as needed. Most of the handling
alignments have been completed but a few adjustments are still
necessary. Losing wafers on the primary pad. Carrier film was gouge.
The carrier was rebuilt and reinstalled and with some changes to the
recipe this problem has been corrected. The primary heat exchanger
was leaking. Did not have time to address this issue.
|
| 37.6 | WSTK START-UP WORK CONTINUED. | LUDWIG::WESTPHAL | | Thu Sep 05 1996 21:16 | 4 |
| CMP.C1 - Continued to prepare the WSTK for process engineering. The Alignments
were completed. Tool sets needing the down force calibration and some
minor handling problems worked out. The rest of the install kit for
the shuttle jam sensor has been requested from Westech.
|
| 37.7 | START-UP | STRATA::WESTPHAL | | Fri Sep 06 1996 20:44 | 3 |
| CMP.C1 - Continued with the start up. Shuttle jam sensor is now
operating properly (Thanks to Mike Standing). Alignments and
calibrations are complete.
|
| 37.8 | Ready to run process | LUDWIG::STANDING | | Sat Sep 07 1996 18:24 | 8 |
| CMP.C1-7 Continued with the startup. Finished the shuttle jam
install. Adjusted load elevator home switch, shuttle hard stop, wafer
prespray to 1 sec. Adjusted the unload track water exit and bowl
water. Adjusted the wafer in track sensor gain. Ran 75 wafers with
out any errors before finishing. Tool has been wiped down and is ready
to run process. NOTE! Do not power down tool! The motor for the
primary heat exchanger will not restart! A new motor should be rushed
in, A.S.A.P.
|
| 37.9 | passdown | STRATA::FINN | | Tue Sep 10 1996 20:40 | 10 |
|
Installed slurry filters and new hose for primary and final tables.
Found final slurry not turning on , completed wiring at tb7-25. tested
AOK.
Set up flows for slurry rinse both tables.
Installed regulation for water and n2 to Air brush tube.
Tim/Larry/Brendan
|
| 37.10 | PROJECTS | STRATA::WESTPHAL | | Fri Sep 13 1996 19:52 | 5 |
| CMP.C1 - Continued with the project list. Connected the a piece of hose to the
return for the day tank to avoid splashing. Repaired the polish tub
rinse ring. Installed a new 30" vacuum/pressure 30 psi gauge to the
carrier. shut the DI of to the tool due to the fact the line will be
purged.
|
| 37.11 | projects. | LUDWIG::WESTPHAL | | Wed Sep 18 1996 20:19 | 6 |
| CMP.C1 - The second polish conditioner was slopping around. The bolts
were bottoming out. Cut the bolts and reinstalled with no further
problems. Installed a clip to hold the final rinse ring flat against
the table top. Moved the slurry drum and pump into the room but did
not hook it up.
|
| 37.12 | Day tank / Carrier wetting. | STRATA::WESTPHAL | | Thu Sep 19 1996 20:53 | 3 |
| CMP.C1 - Poly welded a small piece that secures the slurry return to
the day tank. Also having some problems getting the carrier wetting to
work while the tool is idle. No conclusion was reached.
|
| 37.13 | Final table condition arm sweep hooked up | SUBPAC::LANDRY | | Mon Sep 23 1996 18:28 | 10 |
| Today.....
The condition arm for the final table was setup to utilize the
sweep motor. The motor power was re-connected and the "set-screw"
mechanical stop was removed from the motor housing. Also, the small
diamond disk was re-installed to allow proper sweep movement. Upon
checkout, the conditioner would bounce occassionlly. The air input
was reduce to <10 psi to eliminate the problem. All's working fine.
Doc
|
| 37.14 | SHAFT HEIGHT ADJUSTED | STRATA::WESTPHAL | | Sat Sep 28 1996 22:11 | 7 |
|
CMP.C1 - Adjusted the shaft height as requested by engineering. The shaft
height was .740. The new pad height is .022. The shaft height is now
.772 (actual .775). A new button was installed. The tool presently
sets all put back together, out of wet idle because that was how it
was found.
|
| 37.15 | VACUUM PROBLEMS | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:25 | 12 |
|
WESTECH - DROPPING WAFERS OFF THE CARRIER
FOUND WE WERE GETTING ONLY .375 IN OF MERCURY VACUUM TO THE CARRIER.
FOUND NO CLOGS OR VACUUM LEAKS. CHECKED WATER PRESSURE TO THE
TO THE SYSTEM AND NOTICED WE WERE DROPPING 5PSI IN THE FILTER.
REPLACED THE CLOGGED FILTER AND THE VACUUM WENT UP TO .540 IN OF
MERCURY. MANUALLY CYCLED WAFERS THROUGH WITH NO VACUUM ERRORS.
WE WERE NOT ABLE TO AUTOMATICALLY LOAD A WAFER UNTO THE CHUCK.
COULD FIND NO OBVIOUS PROBLEMS. THINK IT MIGHT BE OE ON OUR PART.
SHERMAN WANG WILL NEED TO CHECK OUT SYSTEM COMPLETELY FOR PROPER
OPERATION TOMORROW.
|
| 37.16 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:25 | 14 |
| -< WAFER LIFTER PROBLEMS >-
--------------------------------------------------------------------------------
WESTECH - WAFER LIFT KEEPS ON JAMMING
REMOVED THE WAFER LIFT, DISASSEMBLED AND CLEANED WITH ISO AND DI
WATER. INSTALLED THE WAFER LIFT AND CYCLED ABOUT 4 WAFERS THROUGH
WITH OUT PROBLEMS. IT WAS STARTING ON THE 5TH WAFER AND THE
SYSTEM ALARMED FOR WAFER NOT ON CARRIER. NOTICED THE LIFTER WAS
NOT STAYING UP ALL THE WAY. TOOK THE CUP OFF AND RAN THE LIFTER
UP AND DOWN AND SAW THE THE LIFTER WAS NOT HOLDING PRESSURE IN
ORDER TO STAY UP. THE SEALS WERE LEAKING BY ON THE BOTTOM
PNEUMATIC LIFT. FOUND ONE IN STOCK AND REPLACED. CYCLED WAFERS
THROUGH WITH NO FURTHER PROBLEMS.
|
| 37.17 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:25 | 15 |
| -< Load cup faults >-
--------------------------------------------------------------------------------
WESTECH---> Found out through the grape vine that the Westech was not
loading properly. Found that the load cup was
intermittently not making it to the lift to load position.
Adjusted the solenoid that supplies air to the lift to load
cylinder. Ran 25 wafers in the IDLE 1 program without any
problems. System is UP.
Mark/Brian
|
| 37.18 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:25 | 16 |
| -< Primary conditioning arm >-
--------------------------------------------------------------------------------
WSTK.1---> The primary conditioning arm was
not moving over to the pad to condition. Found
that the arm was bound to the home position. The
spring was not actuating it to the pad. Moved the
arm over while turning the pad conditioner on.
Cycled several times and it tested good
Brian
|
| 37.19 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:26 | 8 |
| -< Was down for "load problem" >-
--------------------------------------------------------------------------------
System was down because the wafers would not load, meaning they would
not transfer from the load cassette to the lift cup. Found spindle
controller breakers tripped. Reset them, system runs fine.
Item of note, the tool box combo has been changed due to "pilferage."
See me for the new combination.
|
| 37.20 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:26 | 6 |
| -< pad conditioner >-
--------------------------------------------------------------------------------
Westech - Primary pad conditioner not returning to its home position
found the spring and the retainer screw off the conditioner arm
and laying in the bottom of the system. Reinstalled the screw and
the spring, cycled the conditioning arm with no further problems.
|
| 37.21 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:26 | 12 |
| -< BAD SHUTTLE LOAD CELL >-
--------------------------------------------------------------------------------
WSTK.1 - SHUTTLE JAMMED
CLEARED THE SHUTTLE AND ATTEMPTED TO CLEAR ALARM. THE ALARM WOULD
NOT CLEAR. REMOVED THE SHUTTLE ARM TO EXPOSE THE LOAD CELL PINS.
TRIED TO CLEAR ALARM WITH THE PINS EXPOSED. THE ALARM WOULD STILL
NOT CLEAR. REMOVE THE FRONT PANEL TO EXPOSE THE WIRING AND
FIND WHICH WIRES WERE GIVING US THE FAULT. FOUND THE TWO WIRES
THAT WERE GIVING US THE CONTINUOUS FAULT AND REMOVE. THE SYSTEM
WILL RUN FINE WITHOUT THE LOAD CELL CONNECTED FOR NOW. TIM IS
IN CONTACT WITH WESTECH TO RUSH A LOAD CELL IN. THE SYSTEM IS
AT A WARNING UNTIL THEN.
|
| 37.22 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:26 | 6 |
| -< LOAD CELL REPLACED >-
--------------------------------------------------------------------------------
WESTECH - THE NEW SHUTTLE LOAD CELL WAS INSTALLED AND TESTED OUT. THE GFI
CIRCUIT HAS BEEN REPAIRED AND IS FUNCTIONAL. SOME MINOR
ADJUSTMENTS WERE MADE TO THE ARM UP AND DOWN PNEUMATICS IN ORDER
TO FIX THE ARM SLAMMING UP AFTER A PROCESS. RETURNED TO ASD
|
| 37.23 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:27 | 6 |
| -< PAD CONDITIONING >-
--------------------------------------------------------------------------------
WESTECH - PRIMARY PAD CONDITIONER NOT WORKING
THE PAD CONDITIONER STARTED WORKING ON ITS OWN. CYCLED WAFERS
THROUGH WITH NO FURTHER PROBLEMS. STRAIGHTENED OUT THE
CONDITIONER SO THE DIAMOND SURFACE WAS FLAT TO THE PAD.
|
| 37.24 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:27 | 20 |
| ASDG::COSTA "Paintball, Paintball, Paintball" 17 lines 16-DEC-1992 23:53
-< system reboot >-
--------------------------------------------------------------------------------
Good afternoon,
WSTK.1 --> The system did not load the first
wafer in the cassette. So we rebooted the system, just in
case it was effected by the power glitch earlier in the
day. No other problems were noted after the reboot. I
assisted Roger Spencer with the rest of the lot.
Brian
|
| 37.25 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:27 | 6 |
| ESKIMO::MAZE 3 lines 29-DEC-1992 22:54
-< UNLOAD WAFERS HANGING UP >-
--------------------------------------------------------------------------------
WESTECH - DOWN FOR UNLOAD WAFERS HANGING UP.
CLEANED THE WATER TRACK AND ADJUSTED PITCH OF EXIT TRACK. RAN
SEVERAL WAFERS THROUGH WITH NO FURTHER PROBLEMS.
|
| 37.26 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:27 | 16 |
| ROULET::SITRIN 13 lines 6-JAN-1993 14:31
-< Lifter sensor problem >-
--------------------------------------------------------------------------------
Wstk.1 The wafer sensor that is mounted in the lifter does not
operate. This sensor is a fiber optic type and thus the reciever
portiion has a break in the fiber optic part of the sensor. We were
unable to splice the fiber optic together therfore odering a new assembly.
Senor due in tomorrow. I will leave the parts there if someone can come
up with a splice kit.
This was not the original problem. The system went down because the
carrier did not sense a wafer when it tried to pick it off the lifter.
We adj the lifter speed to see if this would fix the problem but was
unable to test due to the sensor problem.
|
| 37.27 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:28 | 6 |
| Note 96.16 WESTECH PASSDOWN 16 of 437
ESKIMO::MAZE 2 lines 7-JAN-1993 22:47
-< WAFER SENSOR >-
--------------------------------------------------------------------------------
WSTK.1 - FIBER OPTIC WAFER SENSOR CABLE REPLACED. CYCLED WAFERS THROUGH
WITH NO PROBLEMS. RETURNED TO MFG.
|
| 37.28 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:28 | 9 |
| ROULET::SITRIN 6 lines 5-FEB-1993 12:58
-< Platens off >-
--------------------------------------------------------------------------------
Wstk.1- Is up, when production came in this morning they found the
system down. The platens were off and slurry was all over them.
The CB for the platen drives had to be reset. This condition is
usually caused by the system being EMO'd then powered up too soon.
You know this has happened by going to the 24 volt panel and not seeing
relays 4a and 4b lite behind the CPU card cage.
|
| 37.29 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:28 | 8 |
| -< missing final pad step >-
--------------------------------------------------------------------------------
WSTK.1 - Down for arm not going to final pad.
Ran the CMOS 5 recipe with no problems. The system was also down
for the press not working. Found the shaft height was mis
adjusted. Readjusted the press shaft height and returned to MFG.
JMZ/BF
|
| 37.30 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:28 | 12 |
| ESKIMO::MAZE 9 lines 23-FEB-1993 22:57
-< transfer problems >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer transfer problems.
The wafers were hanging up in the exit water track. Removed the
exit jets and cleaned the track. We put some shims between the
bottom of the track and the jets. The heavy white boats are also
giving us problems. The heavy boats are to muck for the exit
indexer to hold. The wafers tilt forward and slide out of the
boat. This causes the wafers to hang up on the bottom of the
exit track. JMZ/MS
|
| 37.31 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:28 | 9 |
| ROULET::SITRIN 6 lines 5-APR-1993 14:14
-< testing di flush solenoid >-
--------------------------------------------------------------------------------
Wstk.1 - Has low etch rate, Sherman suspected the primary flush
solenoid was leaking by diluting the slurry. We found this not to be
the case, disconnected the flush solenoid electrically (DI rail#2
wire# 152). and there was not di flush which meant the solenoid was
closing. Tim is presently testing the slurry.
|
| 37.32 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:29 | 15 |
| ROULET::SITRIN 12 lines 6-APR-1993 14:10
-< more on low e.r. problem >-
--------------------------------------------------------------------------------
Wstk.1 - Etch rate is still very low. We checked the down force press
and it needed a minor adj. The slurry was tested and it
appears watered down. Presently we are having incoming slurry
from bulk fill tested. The slurry we already had tested came
right from the dispense nozzle on the platen. We also looked
into seeing if the DI water was contaminating the slurry.
Checked where any DI valves come in contact with slurry. There
is one DI line by the tank and it was shut off with no signs of
water seeping by. The valve used for purging out the slurry lines
were disconnected at the output side of solenoid and there was no
DI slipping by there either. The line tying into the new system
is shut off and also appears empty of any liquid.
|
| 37.33 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:29 | 16 |
| ESKIMO::MAZE 13 lines 6-APR-1993 22:41
-< low removal >-
--------------------------------------------------------------------------------
WSTK.1 - down for low polish rate.
Called the lab and found the slurry PH at 9.1 This is a low reading
Dumped the slurry out of the PH tank and refilled with new slurry.
Ran a polish rate test and the removal was around 600. Switched
to pump two and ran the same test and the removal rate was around
900. Saw the hole in the dispense tube for pump one was
partially clogged. Cleaned out the tube and ran another polish
rate test. The rate was still around 600 with pump one. Changed
the pad and ran another removal rate test. It was still low. The
pad conditioner appears to be OK. Suggest a slurry sample be
taken from: Pump 1, pump 2, and the PH tank itself. JMZ/Ceasar
|
| 37.34 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:29 | 7 |
| LUDWIG::POOLE 4 lines 29-APR-1993 06:49
-< ACCESS CODE >-
--------------------------------------------------------------------------------
Access code: When system is powered down push access code,
enter 456 then push enter access code.
Then initialize.
|
| 37.35 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:29 | 13 |
| ROULET::SITRIN 10 lines 29-APR-1993 10:49
-< unif being effect by parallelism of arm >-
--------------------------------------------------------------------------------
Wstk.1 - Was down for uniformity, the polish rate was low in the
middle. We checked the arm sweep and it was off .008". Adjusted
set screws on top bearing for this issue. Next we did carrier sweep
/runout and it was out by .005". Also noted was the carrier height
adj shaft was off and the whole arm was not parallel to the platen
so instead of just adj the gearbox shims we adj the turnbuckle on the
lower elbow link. This brought in the carrier sweep/runout right to
0. A thing to remember is the arm parallel to the platen should be
checked before any sweep leveling is adj.
|
| 37.36 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:29 | 16 |
| ROULET::SITRIN 13 lines 1-MAY-1993 10:45
-< clean station not draining >-
--------------------------------------------------------------------------------
Wstk.1 Clean station not draining fast enough. Put work order in that
we wanted to modify plumbing under clean station so it drained faster
and more completely (Water is draining from cleanstation but some of
the water is being trapped in the plumbing below. Showed Bill Kurz from
facilities what is happening. He had his folks do a quick fix only to
speed the time in which takes to drain the tank. The tygon part of the
drain that was just hanging there is gone. So now it is a straight
shot from the bottom of the clean station to the pvc plumbing. The
clean station now drains faster but this is a simple temporary fix.
The pernament fix is going to take a lot work and designing. The
biggest problems are we have drains going up hill and to small of
piping thus impeding the flow. Next week we will sit down and draw
up a plan that will work.
|
| 37.37 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:30 | 27 |
| ASDG::COSTA "Paintball, Paintball, Paintball" 24 lines 11-MAY-1993 00:22
-< EQUIPMENT Passdown - 11-MAY-1993 >-
--------------------------------------------------------------------------------
Good morning,
WSTK.1 --� The transport arm jammed
into the input cassette while trying to go to "shuttle
to elevator position". While the shuttle was pulling a
wafer out of the cassette it pulled the next wafer
out of the cassette enough so that the through beam sensor
did not see it. Then the transport jammed on the next
wafer. This happened a second time while I was watching it
cycle.
I adjusted the shuttle stop
and limit switch on the load cassette side so that the
shuttle is centered under the wafer. I then cycled 50
wafers and it tested good. The system is UP in RTC.
No other equipment issues...
Mark was out.
Brian
|
| 37.38 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:30 | 15 |
| SCOMAN::TDYER 12 lines 18-MAY-1993 10:37
-< Low center PR/old pad >-
--------------------------------------------------------------------------------
WSTK.1 - Down for low center polish rate. The primary pad was near 3
weeks old, it was replaced. The carrier was replaced with a new 6u convex
curvature carrier. The center PR is now fast, the system was put down
for high uniformity again. This was incorrect, we actually desire a fast
center rate due to the incoming oxide film layer which is center thick.
The conditioner plate was adjusted to control rate drop off from 1st to
last wafer.
Note: When the pad life is near it's end, the center of the wafer is the
first place where the polish rate will drop due to clogged pours. Also,
a new pad must be broken in before running a lot.
|
| 37.39 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:30 | 24 |
| SCOMAN::TDYER 21 lines 28-MAY-1993 15:51
-< high uniformity >-
--------------------------------------------------------------------------------
System down for 30% center fast high uniformity. The system allignment
was checked. The sweep was .015/1000" out. The carrier arm had no up
down play when in the down position. The cam follower was mounted too
close to the carrier arm post, adjusted same. Also adjusted lock over
arm and calibrated down force.
The following alignments/adjustment were made:
Pre Post
Level +/-.350 +/-.003
Sweep +/-.015 +/-.004
Run out +/-.016 +/-.003
Next:
System errored for arm not down, the arm down switch was adjusted.
Uniformity was checked, it came in at 15%. The carrier was changed
and the uniformity came in at 17%. The carrier curvature will be
changed to decrease the center polish rate.
|
| 37.40 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:30 | 12 |
| ESKIMO::POOLE 9 lines 1-JUN-1993 06:37
-< fluid/spindle primary+final backwards??? >-
--------------------------------------------------------------------------------
WSTK.1 - Primary platen fluid was not dispensing. Production was
using the fluid/spindle test screen when trying to flow
slurry. Slurry tank was empty so I filled the tank. Slurry
still would not flow. Noticed final flowed rinse water
when rinse flow was on for the primary. Flowed slurry on
final and the primary started flowing slurry. Ran wafers
thru system on process recipe and it ran without error.
Looks like the software is backwards on the Fluid/Spindle
test page.
|
| 37.41 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:30 | 29 |
| ASDG::COSTA "Paintball, Paintball, Paintball" 26 lines 9-JUN-1993 23:10
-< EQUIPMENT Passdown - 9-JUN-1993 >-
--------------------------------------------------------------------------------
Good morning,
WSTK.1 --� I worked with Bob Francis on a
problem with carrier vacuum. The carrier arm would pick
the wafer up, sense vacuum then loose vacuum. We replaced
the carrier assembly and this fixed the problem. During
troubleshooting, a wafer broke on the final pad. We also
noticed that the system was making noises when the carrier
was on the final platen. There are 4 new final pads that
we got out of the stockroom in the westech room.
Misc --� I placed a call to 4141 because
there is water leaking into APL through the hepa filters,
and near the light fixtures.
Facilities removed the water from
above the filters and wiped down the walls. There is still
some residual water in the hepa filters, but they should
dry out.
No other equipment issues.
Brian
|
| 37.42 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:31 | 14 |
| ASDG::KETRON 35 lines 12-JUN-1993 11:31
-< EQUIPMENT Passdown - 12-JUN-1993 >-
--------------------------------------------------------------------------------
Passdown for Saturday 6/12
Westech Set-up the two terminals for the Westech room.
These terminals are now set up to run dual sessions.
The data drop cable was missing from the outlet in the
service area. I found a extra cable and installed it on
the terminal drop.
|
| 37.43 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:31 | 7 |
| STRATA::MENSAH 4 lines 14-JUN-1993 14:06
-< CONDITIONER ARM PROBLEMS >-
--------------------------------------------------------------------------------
DOWN FOR CONDITIONER ARM PROBLEMS; REMOVED THE COVER FOR THE CONDITIONER
STATION AND FOUND A PLASTIC INSIDE PREVENTING THE CONDITIONER ARM FROM
REACHING ITS HOME SENSOR...REMOVED THE PLASTIC AND CYCLE DUMMIES WITH NO
CONDITIONER ARM PROBLEMS.
|
| 37.44 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:31 | 7 |
| STRATA::CLOUTIER 4 lines 19-JUN-1993 03:18
-< CONDITIONING ARN STUCK AT EDGE OF TT >-
--------------------------------------------------------------------------------
WSTK.1: Down for pad conditioner arm stuck between the edge of the
turntable.---Found the allen screw holding conditioning fitting
to the motor assembly loose. Tightened same and had production run
system for a while to check it out. No further problems.
|
| 37.45 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:31 | 16 |
| SCOMAN::TDYER 13 lines 22-JUN-1993 12:04
-< Conditioner bouncing >-
--------------------------------------------------------------------------------
WSTK.1 - Down for primary condition arm jumping up and down.
Found the Primary condition arm jumping up and down during the
condition cycle. Noticed the motor stopping and the arm lifting
up. If we held the limit switch, it would work correctly.
Adjusted the limit switch and was able to manually run the pad
conditioner. But the conditioner was not working automatically
when cycling wafers. Swapped sol 29 with 40 (primary with final)
Cycled wafers through without further problems. note** We need
to replace the sol for the final conditioner.
JMZ/BF
|
| 37.46 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:31 | 8 |
| LUDWIG::SITRIN 5 lines 24-JUN-1993 12:11
-< conditioner station assembly swap >-
--------------------------------------------------------------------------------
WSTK.1 - We placed the new conditioner assembly that came off the
final side. It worked fine except for a couple of adjustments
to the up/down speed. Presently the old style conditioner
is on the system. The unit pulled off is in the tan cabinet
in the wstk room.
|
| 37.47 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:31 | 9 |
| STRATA::GILMAN 6 lines 24-JUN-1993 12:13
-< Load cycle locked up. >-
--------------------------------------------------------------------------------
Wstk.1- Down for load cycle locked up. I found the shuttle's "lift"
position sensor not being made. This was caused from Slurry getting
on the Guide Rods for the Shuttle. The Slurry made it difficult for
the shuttle to travel smoothly to the lift and it was slamming into
the sensor, which moved it. I cleaned the Guide Rods and adjusted the
position of the sensor.
|
| 37.48 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:32 | 13 |
| <<< SCOMAN::SILVER$:[NOTES$LIBRARY]ETCH.NOTE;4 >>>
-< ETCH >-
================================================================================
Note 96.48 WESTECH PASSDOWN 48 of 437
STRATA::GILMAN 6 lines 24-JUN-1993 12:13
-< Load cycle locked up. >-
--------------------------------------------------------------------------------
Wstk.1- Down for load cycle locked up. I found the shuttle's "lift"
position sensor not being made. This was caused from Slurry getting
on the Guide Rods for the Shuttle. The Slurry made it difficult for
the shuttle to travel smoothly to the lift and it was slamming into
the sensor, which moved it. I cleaned the Guide Rods and adjusted the
position of the sensor.
|
| 37.49 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:32 | 8 |
| LUDWIG::SITRIN 5 lines 24-JUN-1993 14:43
-< arm bouncing\ >-
--------------------------------------------------------------------------------
wstk.1 - The conditioner arm was bouncing, the reason is the it was
applying to much down force. What we did is adj prv12 and
whatch the guage next to it while we were running. Book
says to adj it to 3psi but that is not enough for production
so we raised to 6psi.
|
| 37.50 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:32 | 10 |
| LUDWIG::SITRIN 7 lines 25-JUN-1993 14:32
-< New conditioner and shuttle problem >-
--------------------------------------------------------------------------------
Wstk.1 - We swapped out the old conditioner and placed on the new one.
Production tested it and the new conditioner kept the polish
rate consistent thru the whole lot. Waiting for micro scoring
results next.
Shuttle was slaming very hard into the carrier. Adj the
centering blade and cleaned the guide rod. Tested looks good.
|
| 37.51 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:32 | 15 |
| ESKIMO::MAZE 12 lines 28-JUN-1993 22:44
-< high particles >-
--------------------------------------------------------------------------------
WSTK.1 - VERIFY-high particles
Cleaned the carrier, platens and exit station. Dumped the slurry
from the PH tank and cleaned thoroughly. Hooked up all dead legs
in the slurry system and purged with DI. Refilled the slurry PH
tank and cycled new slurry to tool. Ran a particle check and it
came out to 300+. Was in the process of running another particle
check when the lift to sense failed. Found a bad solenoid for the
pneumatics. (sol8). Removed the solenoid and is in the process of
finding another.
|
| 37.52 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:33 | 20 |
| SCOMAN::TDYER 17 lines 29-JUN-1993 09:07
-< review of high particle prob >-
--------------------------------------------------------------------------------
REVIEW OF THE HIGH PARTICLE PROBLEM. 6/29/93
The system was put down on Sunday start up 6/27 with particle counts
of 3000. On the previous Friday 6/25, the new style end effector was
installed and a monthly pm performed. To go back to square one, the
new end effector was removed, both pads changed load and unload are
cleaned and slurry tank was washed out. Particles came in at 178. We
were looking to achieve <100, this is what was achieved ion the past.
EXCEPT these low readings were on product wafers and read on the 7000.
The monitor wafers are not polished as long and are read on the 6200.
We will continue to monitor monitor particle levels with the upper
control limit set to 500.
Tim
|
| 37.53 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:33 | 6 |
| LUDWIG::SITRIN 3 lines 29-JUN-1993 15:12
-< final slurry pump disconnected for final pad >-
--------------------------------------------------------------------------------
wstk.1 Disconnect wires from tb7 terminal #31 and #25 wires #235 and
#153. They can be connected at any time and go to the slurry
pumps for the final platen.
|
| 37.54 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:33 | 9 |
| LUDWIG::SITRIN 6 lines 30-JUN-1993 13:49
-< adj vac switch replaced valve >-
--------------------------------------------------------------------------------
WSTK.1 went down for two problems, the 1st was the water valve for the
final slurry was leaking across the seat. Replaced with the upgraded
valves. Tested looks good. The other problem was wafer vacuum on the
carrier. Vacuum switch sensitivuty was increased. Tested looks good.
|
| 37.55 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:33 | 11 |
| LUDWIG::SITRIN 8 lines 1-JUL-1993 14:36
-< wafer vacuum >-
--------------------------------------------------------------------------------
Wstk.1-Down for wafer vacuum not being sensed on the carrier.
Production and process engineering have seen the problem many
times today. At first they thought it was the wafers because it
seemed to happened on just WJ wafers. Then we saw it happen once
and what we noticed was the wafer was not sitting in the pocket
of the carrier. Therefore we have been looking at the loading
of the wafer especially coming into the lift. Have been running
many wafer tranfers with no problems seen.
|
| 37.56 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:33 | 15 |
| -< carrier vacuum problems >-
--------------------------------------------------------------------------------
WSTK.1 - down- for Carrier vacuum not achieved.
Changed the carrier and cycled two boats of wafers through without
further problems. On the third boat of wafers we left the system
and came back to a wafer smash on the primary pad. Did not see
why the wafer broke, but there was a wafer in the carrier when we
arrived. The only explanation was there was two wafers stuck
together in the load cassette and the tool loaded both of them
as one. We cleaned up the mess and replaced the carrier and the
primary pad. A vacuum/pressure gauge has been installed on the
tool and a boat of wafers were cycled without problems. Turned
system over to mfg for full mqc's
|
| 37.57 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:33 | 16 |
| ESKIMO::MAZE 13 lines 1-JUL-1993 22:29
-< carrier vacuum >-
--------------------------------------------------------------------------------
WSTK.1- Down for carrier vacuum not achieved
Found the wafer was being placed on the carrier to one side and out
of the pocket. Adjusted the lift over and still had the same
intermittent problem. After several test and alignment tests, It was
concluded the alignment was good and the problem was happening
during the lift to carrier. Turned up the N2 to the system and was
able to increase the secondary reg to 80 lbs. It was originally
sitting on 70 lbs. We also turned down the load spray from 1 sec to
1/2 sec. With those two changes, were were able to cycle 3 boats
of wafers through without further problems. The system was turned
over to MFG and a removal rate was done. The removal rate is still
low at 800. Mfg decided to run with it and ran both lots without
any problems.
|
| 37.58 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:34 | 19 |
| STRATA::POOLE 16 lines 6-JUL-1993 03:41
-< Wafer loading problem >-
--------------------------------------------------------------------------------
WSTK.1 - Passdown stated that wafer lift needed replacement without
any explanation or reason. Checked wafer lift out and only
fault noted was the lift to load vibrated when it retracted.
The lift to load assembly was replaced and the new part had
the same symptoms. The pneumatic switch (SOL9) has a pre-
sicion flow valve (PRV17) on its input. PRV17 was adjusted
and the lift operated smoothly. Tried running wafers and
the carrier did not pick the wafer from the load station.
Noticed the load station move down slightly when the arm
came down to load. Again adjusted PRV17 and the system ran
without error.
The system pressure was adjusted from 70 to 80 psi
last thursday. The PRV17 adjustment is sensitive so this
might have thrown it off.
The primary and final pads were replaced.
|
| 37.59 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:34 | 21 |
| COMAN::TDYER 18 lines 14-JUL-1993 14:19
-< REVIEW OF LOW POLISH RATES >-
--------------------------------------------------------------------------------
WSTK.1 - Low polish rates, <1000a/m since 6/25/93. On 6/30/93 slurry
samples were taken. The tank in the chase was low at 10% solids. The
tank out back was mixed and than sampled, it read 12%. The chase tank
was drained and refilled, polish rates came in spec at 1060a/m on
7/2/93. Again on Thursday 7/8/93 low polish rates were experienced,
@900a/m. Samples taken again showed the chase tank was at 11.5%. Again
the tank was dumped an refilled. Polish rates came in at 1200a/m. This
problem will be eliminated by modifying the bulk system to constant
recirc.
FYI slurry specs
% solids 12%
PH 10
% KOH <1%
% DI 87%
|
| 37.60 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:34 | 23 |
| SCOMAN::TDYER 20 lines 14-JUL-1993 15:30
-< Test data for Low ER >-
--------------------------------------------------------------------------------
WSTK.1- Problem= Low Etch Rate.
Solution= At the request of Tim Dyer the following things had to be
checked out on the Tool: 1)Down Force 2)Platen Rotation 3)Carrier
Rotation 4) Leaks from DI Water Valves into Slurry System.
My findings were as follows:
1) Down Force Reading from screen= 197 lbs
Reading from Meter = 200 lbs
2) Primary Platen Rotation Reading from screen= 20 rpms 65rpms
Reading from Strobe= 20 rpms 66rpms
3) Carrier Rotation Reading from screen= 14 rpms 30 rpms
Reading from Strobe= 14 rpms 30 rpms
4) Found no leaks in the system.
Scott Gilman
|
| 37.61 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:34 | 10 |
| STRATA::FRANCIS 7 lines 15-JUL-1993 21:55
-< WSTK.1 Power down. >-
--------------------------------------------------------------------------------
WSTK.1 - The system powered down by itself. Powered the system back up.
Checked and found no water in the back panel or the Tub exhaust.
Don't know why the system powered down. It was noticed that the
shuttle was bumping into the wafer lift. Tightened up the top
air cylinder of the wafer lift to the bottom one. Also changed
both pads. Ran several wafers with no more problems.
|
| 37.62 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:35 | 11 |
| STRATA::GILMAN 8 lines 30-JUL-1993 18:29
-< No vacuum at Load Cup >-
--------------------------------------------------------------------------------
WSTK.1- It went down for not making vacuum at Load Cup. When I
examined the tool I found it was dropping on the Primary Platen, as
well as not making vacuum at the Load Cup. I adjusted the travel for
the downward motion on the robot arm to make the Carrier and Load
Cup flush to each other. I also had another Carrier rebuilt, then
installed it. A full cassette of wafers was run with no problems.
SDG
|
| 37.63 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:35 | 17 |
| SCOMAN::TDYER 14 lines 2-AUG-1993 19:59
-< No Waf Vac/particles/shuttle >-
--------------------------------------------------------------------------------
NO VACUUM AT LOAD CUP....
NO WAFERS could be picked at the load cup, system did not reach vacuum.
The arm stabilizer DO was on but the stabilizer air cylinder was not
acuated. This was letting the arm go limp in the upward direction,
causing the wafer to not sit firmly in the pocket of the carrier.
The needle valve for the stabilizer cyclinder was adjusted. Next the
system had high particles @1700. The wafer was hitting on the two of
the cup's depressor pins. Both shuttle stops were adjusted; the shuttle
at cassette and the shuttle at load cup. The wafer now drops into the
center of the load cup. Both pads were replaced, they became dry. The
next particle check was in, near the UCL.
TD
|
| 37.64 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:35 | 7 |
| LUDWIG::SITRIN 4 lines 4-AUG-1993 10:43
-< wstk carrier vacuum problems >-
--------------------------------------------------------------------------------
Wstk.1 - Vacuum sense problem was due to button missing from the
carrier. Replaced vacuum switch but they are preset from the
factory for 4". Vacuum should be about 20" and this will
be reflected on the guage.
|
| 37.65 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:37 | 38 |
| SCOMAN::TDYER 35 lines 6-AUG-1993 16:27
-< SYSTEM PROBLEM HINTS>-
--------------------------------------------------------------------------------
The access code is 456. The MFG access code is 222.
For high particle:- Clean the entire tool thoroughly with DI, especially
the load area (all parts). Remove all slurry build up.
- Dump the clean station and refill (DI/DO page 3)
- Dump the exit tank several times.
- Replace both pads (with zero bubbles), rinse both pads
with DI water. Have MFG Run 10 or so oxide monitors wafers
with the "Warmup" recipe.
- Recheck particles.
Low Polish rate: - Replace the Primary pad and conditioner
- Drain the Slurry tank and refill.
- Recheck the rate.
- If bad: verify platen speed and carrier speed.
check down force.
Handler problems: - Check error page for what type of failure.
- check to see that the carrier is sitting in the load
cup properly.
- Check vacuum gauge, should read ~20"
- If low check vacuum line for leaks and check Soft water
filter on the chase wall. If this is clogged there
will not be enough water flow to create a good venturie
vacuum.
- If there is good vacuum and the wafer is not staying
in the pocket, have MFG replace the carrier.
Uniformity high (greater than +15% or less than -5%)
- How old is the carrier?.....have MFG try new carrier.
- Replace primary pad.
- Check again.
- Check alignments (Trained personnel only)
|
| 37.66 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:37 | 5 |
| LUDWIG::SITRIN 2 lines 19-AUG-1993 14:37
-< shuttle problem >-
--------------------------------------------------------------------------------
wstk.1 Shuttle getting hung because the guide bearing fell off.
Reattached guide bearing tested looks good wup.
|
| 37.67 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:37 | 11 |
| STRATA::FRANCIS 8 lines 20-AUG-1993 18:46
-< WSTK.1 Arm up/down problem. >-
--------------------------------------------------------------------------------
WSTK.1 - Went down for a suspected Carrier problem. Carrier looked OK.
The vacuum for the wafer Carrier came on before the arm moved all
the way over to the Primary platen edge after being polished on
every wafer. Adjusted the flow valves for the arm up/down motion
since the arm was moving up slow. This helped out a lot. The Arm
balance, the water track, and the load cassette present switch
were adjusted also. Cycled several wafers through with no more
problems. BF
|
| 37.68 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:37 | 15 |
| STRATA::GILMAN 12 lines 23-AUG-1993 17:29
-< High polish rate in center of wafer >-
--------------------------------------------------------------------------------
WSTK.1 - Down for high Polish Rate in center of wafer. We found
several leveling problems with the Polish Arm. We ended up doing a
complete realignment of the Arm. 1st) Adjusted Locking Mechanism.
2nd) Adjust Arm Level. 3rd) Adjusted Platen Sweep over both Platens.
4th) Performed Carrier Runout. 5th) Adjusted Down Force. We had some
difficulty performing the Carrier Runout, because the 90 Degree Box
does not sit perfectly in the Arm. So we leveled the Arm .007 inch lower in
the front than in the back. This allowed for the Carrier Sweep be
+or- .003 inch, which got it in spec and did not affect the Platen
Sweep.
SDG/TD
|
| 37.69 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:38 | 7 |
| STRATA::FRANCIS 4 lines 14-SEP-1993 21:33
-< WSTK.1 SOLENOID PROBLEM. >-
--------------------------------------------------------------------------------
WSTK.1 - Replaced Solenoid 12 for the wafer vacuum on the Carrier. The
original one was cracked. Tried a number of wafers with no
problems. Gave it back to MFG for MQCs.
|
| 37.70 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:38 | 28 |
| ESKIMO::MAZE 25 lines 16-SEP-1993 14:49
-< shutlle problems late entry >-
--------------------------------------------------------------------------------
WSTK.1 - Down for loss of wafer backside control and shuttle control
When the backside pressure was enabled in the recipe, the system would
do a cpu dump. The system would come up to a DOS prompt. We tried to
run the system with the backside disabled, but we encountered a
shuttle jam. Was not able to clear the shuttle jam on the screen.
Disconnected the load cell leads to the amp board and was still unable
to reset the shuttle. Jumpered the output wires from the amplifier
board, and was able to toggle the shuttle. The screen would toggle
but the shuttle would not move. Disconnected the air lines to the
shuttle from under the load station and toggled the screen. No air
was flowing. We then disconnected the air lines at the solenoid and
there was air. The air was lost between the solenoid and the piston.
Found a separate set of solenoids that were controlled by the shuttle
force load cell PCB. The PCB need the reset signal to open the set
of solenoids before the shuttle piston. Went to the D.O and found the
signal was getting passed. The wire was later found to be a control
line for the new backside pressure mod. Disconnected the wrong wire
and found the correct wire for the shuttle reset signal stuck inside
the wiring harness. Connected the correct wire up but we still could
not reset the shuttle jam. The shuttle jam pcb must be blown from
running the backside signal to it. Had to jumper the entire board
out in order to move the shuttle back and forth. The tool will not
run wafers correctly do to backside signals passing thorough the
Shuttle reset D.O. The software must of been changed by the reps to
do this. Westech has been notified and will be in tomorrow.
|
| 37.71 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:38 | 10 |
| STRATA::MAZE 7 lines 23-SEP-1993 14:49
-< shuttle jam and gimble problems >-
--------------------------------------------------------------------------------
WSTK.1 - down for Shuttle jam.
The shuttle was jammed half way into the lot. Reset the
shuttle and cycled wafers through without further problems.
The slurry was dried on the pad so the pad was changed as
well. Later in the day the system went down for gimble
problems. A new button was drawn from stock and and installed
in the carrier. MFG is runing MQC's at this time.
|
| 37.72 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:38 | 29 |
| SCOMAN::TDYER 26 lines 28-SEP-1993 13:13
-< POLISH FOREVER/ARM #'S >-
--------------------------------------------------------------------------------
WSTK.1 - The system would not stop polishing.
The polish time would go to zero, out the tool would continue
to polish...forever. When the time reached zero, the tool
would back off on polish pressure from 7 psi to 3 psi. It
should go to zero psi, when the polish time is up. The arm
covers were removed for an inspection of the load cell. The
stabilizer alignment spacer was left installed. This spacer
should ONLY be installed dering alignment checks, not durring
polishing. The spacer was removed and system tested. Durring
edge lift the carrier was rubbing against the side of the
table top. All arm calibration positioning constants were
adjusted and saved to config. Cal numbers are listed below.
No further control problems....waiting on polish rate data.
WSTK.1 Arm constants
PC = 24195
PL = 4549
FC = 42243
FL = 3525
UL = 57197
CS = 11091
TIM
|
| 37.73 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:38 | 11 |
| STRATA::FRANCIS 8 lines 30-SEP-1993 18:03
-< WSTK.1 - Multiple problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for the Carrier pads wearing out quickly because of
the high pressure coming out of the spray nozzles of the Clean
station. Installed a manual valve to Sol18 to control the
pressure. Replaced the last stationary nozzle of the Clean
station with a swivel nozzle. Also adjusted the Load elavator
so that the Shuttle would not scrape any wafers as it was going
in and when it was coming out. Gave the system back to MFG.
|
| 37.74 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:38 | 11 |
| STRATA::POOLE 8 lines 7-OCT-1993 07:37
-< transport stopped after final polish >-
--------------------------------------------------------------------------------
WSTK.1 - Transport arm stopped at final platen after final polish.
Found fiber optic cable broken at exit sense. None in stock.
Repaired cable by flairing cable and putting it back in its
holder. Also adjusted the load cassette sense and the shuttle
blade.
|
| 37.75 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:39 | 7 |
| STRATA::FRANCIS 4 lines 12-OCT-1993 22:11
-< WSTK.1 Low polish rates. >-
--------------------------------------------------------------------------------
WSTK.1 - Changed the Centering button, the End efector, and the Primary
pad at different times during the night because of the low polish
rates. The pad was changed about 10:15 PM. MFG will run MQCs.
|
| 37.76 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:39 | 30 |
| STRATA::GILMAN 27 lines 18-OCT-1993 19:06
-< High Center Polish Rate. >-
--------------------------------------------------------------------------------
WSTK.1 Down for High Center Polish Rate. I check everything that could
create the High Center Polish Rate. I found three things to be out of spec.,
#1 the Carrier Shaft Hieght, #2 Found a high spot on Primary Platen, #3 found
"Polish Vacuum" setting to be incorrect. The rest of the checks I did came well
within spec. I have listed below all my finding.
1) Carrier Shaft Hieght Pre. = .810 in. Post = .751 in. I added shims to
correct this.
2) A high Spot on Primary Platen was taken out by losening, then tightening
back down the Platen. It caused the Platen Sweep to be out on one spot
to be +/- .007 in.
3) "Ploish Vaccum" setting was at 2.0, should be 3.5.
4) Platen Sweep in spec. at +/- .002 in.
5) Carrier Sweep in spec. at +/- .002 in.
6) Platen Runnout in spec. at +/- .003 in.
7) Down Force Pre. when asking for 275 lbs.= 274 lbs. ; Post when asking for
275 lbs. = 275 lbs.
Scott G.
|
| 37.77 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:39 | 10 |
| STRATA::FRANCIS 7 lines 22-OCT-1993 01:03
-< WSTK.1 - Broken sensor. >-
--------------------------------------------------------------------------------
WSTK.1 - Was originally down because both pads had to be replaced and
they were changed. Also, one end of the Fiber optic sensor for the
water track was broken off. The Allen screw that held it in place
had come loose causing the sensor to drop in the path of a wafer
as it was going to the unload cassette. The sensor has been replaced.
Cycled 5 wafers through with no more problems.
|
| 37.78 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:39 | 15 |
| ESKIMO::MAZE 12 lines 9-NOV-1993 06:35
-< cycle not ending >-
--------------------------------------------------------------------------------
WSTK.1 - Down for arm not lifting wafer at end of etch
The arm was stuck in the down position and was not going back up
at the completion of the recipe. Calibrated the arm to all points
on the table. After that we found the arm hitting the new edge
rinse ring and not continuing to the edge for the wafer lift. The
new rinse ring has a smaller opening for the carrier than the old
one. Look for scribes near the dispense arm in order to line rinse
ring up properly. We later had problems with the wafer sticking
in the water track. Adjusted the bowl jet, exit jet and the wafer
eject. Cycled numerous wafers through without further problems.
Returned to MFG.
|
| 37.79 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:39 | 13 |
| ESKIMO::DAVIS 10 lines 11-NOV-1993 16:34
-< Backside air upgrade >-
--------------------------------------------------------------------------------
The reps came in today to install an upgrade to the backside air
modification. The location of the backside air AO was changed from
DT 2815 board to the analog rail zero position 10. The EPROMs were
also changed to allow communication to the AO position. PREV1
(Backside air) was calibrated. The .5 micron filter for the backside
air needs to be changed but we have no such filter in the stockroom.
The rep said he would send one to HLO. Due to the amount of time the
system was powered off, the pads dried out and need to be changed.
The system should be ran until the system has been fully tested and
no problems remain.
|
| 37.80 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:39 | 12 |
| JUNCO::FRANCIS 9 lines 11-NOV-1993 18:42
-< WSTK.1 - Wrong Eproms. >-
--------------------------------------------------------------------------------
WSTK.1 - Ran some wafers after the install and ran into a problem. The
conditioner would not activate. It worked fine in manual. The problem
is that the Rep was given the wrong Eproms. The Eproms are the same as
the ones in WSTK.2 which is a different software setup. The Rep put the
originals back in. Ran the conditioner and then some wafers through
with no problems. The alarm DT2815 failure on the Alarm page can be
ignored. The Rep said the correct Eproms may or may not arrive tomor-
row. He said he'll give John Maze a call and let him know. Changed
both pads and gave the system back to MFG.
|
| 37.81 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:40 | 14 |
| ESKIMO::MAZE 11 lines 12-NOV-1993 14:49
-< arm problems and timing problems >-
--------------------------------------------------------------------------------
WSTK.1 _ Down for arm position unknown
Found the arm down sensor no working. Presently isolating the
loss of signal.
-------------------------------------------------------------------------------
HIGHLIGHTS:
WSTK.1 - Down for polish arm crashing into the conditioner arm
Powered system down and back up. Fault did not occur rest of day.
Rep from Westech said the new software for tool will be in
tomorrow. He will be first thing Saturday to install it.
|
| 37.82 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:40 | 8 |
| STRATA::FRANCIS 5 lines 12-NOV-1993 17:48
-< WSTK.1 Limit switch problem. >-
--------------------------------------------------------------------------------
WSTK.1 - Replaced the Arm down limit switch. The wiper was broken and
the old switch was worn out. A wiper didn't come with the new switch.
Put the new one in without one. Just adjusted the switch block and
the switch works OK. Ran a few wafers with no problems. Gave it back
to MFG.
|
| 37.83 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:40 | 9 |
| ESKIMO::FRANCIS 6 lines 16-NOV-1993 22:53
-< WSTK.1 - Sensor problem. >-
--------------------------------------------------------------------------------
WSTK.1 - The water track sensor was sensing a wafer when there wasn't
a wafer. Moved the sensor cable out of the way of the hood and Polish arm.
Noticed that there was a washer missing on one of the bolts holding
the water track in place, and one of the springs at the other end
was missing. Replaced both and readjusted the PSC1 sensor for the
water track. Ran some wafers with no more problems.
|
| 37.84 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:40 | 8 |
| STRATA::FRANCIS 5 lines 18-NOV-1993 00:09
-< WSTK.1 Load sensor problem. >-
--------------------------------------------------------------------------------
WSTK.1 - All the Platen and Carrier alignments and the Carrier shaft height
were done. The shaft height has been adjusted to 0.85 inches. New pads
have been put on. Tried some wafers and the sensor for the Load station
is not seeing some of the wafers. Either the alignment of the Emitter and
Receiver needs adjustment or the amp gain for the sensor needs adjustment.
|
| 37.85 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:40 | 16 |
| SCOMAN::DEJORDY 13 lines 18-NOV-1993 06:28
-< Wafers not loading/shuttel jam error. >-
--------------------------------------------------------------------------------
WSK.1: Load wafers were not being sensed all the time. Adjusted the
thru-beam sensor amp 1 down. Cycled 20 wafers on the dec5cmos
process. Checked out the load opperation in the I/O page and
the wafers are now being sensed.Production is currently doing
removal rate and partical checks now.
|
| 37.86 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:41 | 12 |
| STRATA::FRANCIS 9 lines 18-NOV-1993 22:52
-< WSTK.1 Sensor and C. arm problems. >-
--------------------------------------------------------------------------------
WSTK.1 - The Unload station sensor needed to be adjusted. Some of the
wafers were not being sensed. Turned down the exit bowl jet also.
Another problem was that the Conditioner arm wasn't going to its home
position right away. The arm would raise up stay there for about 4
seconds and then go back down on the pad and go across. It would then
repeat the same thing again before going home. Adjusted FV38 to slow
down the Condition arm which was going up a bit hard and fast. Ran the
Conditioner several times without any problems. WUP.
|
| 37.87 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:41 | 11 |
| STRATA::GILMAN 8 lines 23-NOV-1993 22:48
-< Conditioner Problems >-
--------------------------------------------------------------------------------
WSTk.1 - Down for Primary Pad Conditioner not working properly. The
Conditioner was going back over the Platen when the conditioning Cycle was
finished. It was also bouncing on the Platen during the Conditioning Cycle.
I adjusted FV38 for the problem of the Conditioner not staying at Home at the
end of the Conditioning Cycle. I adjusted FV12 to take care of the bouncing
during the Conditioning Cycle. Tool is back up.
SDG
|
| 37.88 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:41 | 17 |
| STRATA::GILMAN 14 lines 28-NOV-1993 18:50
-< Wafers not being seen in unload station >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not seeing Wafers in Unload Station. I noticed something
very interesting when Wafers were being unloaded. I was watching the
Input/Output Panel on the CRT and the "UNLD WAFER SENSE" was being highlighted
when a Wafer passed through the Light Sensor, but the Polish Arm behaved as if
the Sensor never saw the Wafer. When I moved the Wafer back over the Light
Sensor the Polish Arm would then recognize the Wafer being seen in the Unload
Station. I felt this may be a problem with the 5 V Supply. I monitored the
5 V input to one of the Analog I/O Boards and when the tool was at rest the
input 5 V's was = 5.01v ; when the tool was running it was fluctuating
between 5.01v & 4.98. This is within the Spec., but I adjusted the input 5v
to the Analog I/O Board to 5.1V (the upper limit to the spec.), to be on the
safe side. I also adjusted the Sensor's Gain and the Exit Jet FV 10. I then
ran 75 Wafers over the tool with no problems. The tool is up.
SDG
|
| 37.89 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:41 | 8 |
| STRATA::FRANCIS 5 lines 29-NOV-1993 17:38
-< WSTK.1 - Cond. arm problem. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for the Conditioning arm bumping into the Polish arm.
Adjusted FV30 and FV32 to slow down the arm from going out to the
pad and back to Home. Also made a small adjustment to FV38 and FV39
which is for the up/down motion of the Conditioning arm. Cycled
10 wafers through with no problem. WUP. BF/SG
|
| 37.90 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:41 | 7 |
| STRATA::FRANCIS 4 lines 30-NOV-1993 22:51
-< WSTK.1 - Replaced Cond. assembly. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for the Conditioner arm acting erratic. Replaced the
whole Conditioner arm assembly with a rebuilt one. Execised the
arm for about 20 minutes with no problems. Also, put on a new
End efector. WUP
|
| 37.91 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:41 | 7 |
| ESKIMO::MAZE 4 lines 1-DEC-1993 14:57
-< wafers hanging up in water track >-
--------------------------------------------------------------------------------
WSTK.1- Down for wafers hanging up in the water track.
Found the elevator out of alignment. adjusted elevator height and
side to side. Adjusted home switch and cycled numerous wafers
through without further problems.
|
| 37.92 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:42 | 14 |
| STRATA::MAZE 11 lines 6-DEC-1993 14:22
-< numerous process problems >-
--------------------------------------------------------------------------------
WSTK.1 - Down for loosing its mind again.
The tool was trying to polish a wafer on the final pad, but the
arm was up in the air and not on the pad. The carrier was spinning
and the timer was counting down. Aborted the step and unloaded
the wafer. Started the process over again and this time the tool
stopped while on the primary pad. The carrier was stopped, the
platen was stopped, and the arm remained down. The tool had an
alarm for arm position unknown. Aborted the process and powered
down the tool. After a few minutes the tool was powered back up and
numerous wafers were cycled through without further problems.
|
| 37.93 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:42 | 14 |
| SCOMAN::DEJORDY 11 lines 21-DEC-1993 08:25
-< Shuttle jam and load cup >-
--------------------------------------------------------------------------------
WSTK.1 Machine went down for shuttle jam. Checked out the system and
found the shuttle jamed, reset the shuttle and tryed to run the
system. System still errored, system thought there was not a
wafer present at load cassett, adjusted amp 1 down while in the
I/O page. Load cup was making a crashing sound, found that the
lift to load sensor was being hit when the load cup went down.
Adjusted the sensor and greased the shaft a little. Ran 15
wafers in the deccmos5 process with out any further problems.
|
| 37.94 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:42 | 16 |
| SCOMAN::DEJORDY 13 lines 23-DEC-1993 06:43
-< High particals >-
--------------------------------------------------------------------------------
WSTK.1 Machine was down for high patricles. Production ran a particle
check and it came in high at 210. We ran some warm up wafers
and the particles came in spec, but the uniformity went out of
spec at 15.1%. ran 5 warm up wafers and checked the polish
rate again. Uniformity = 11% edge uniformity = 8.1%
Production informed me that the TF1 measurement machine was
having auto focus problems, so they did all measurements on
the nano.System is up and running.
|
| 37.95 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:42 | 20 |
| SCOMAN::TDYER 17 lines 23-DEC-1993 14:49
-< High Unif, CNTR FAST >-
--------------------------------------------------------------------------------
Passdown from 12/22/93....High uniformity center fast 30%
typical readings = center at 1600a/m edge at 1100a/m
Check complete alignment, carrier run out was out by .019" carrier
sweep waws out by .009".Both of these were alligned to within .002"
Uniformity was still high at ~25%. Because the rate is so fast in the
center we suspected that the carrier curviture was to great. We
suspected the carrier film or curvature as the problem. The carrier
press platen temp was droped by 10 degrees, from 275 to 265. This
produced a 2.5u curve instead of a 4.5u curve. The polish uniformity
came in at 11%.
*NOTE- Normaly when the alignment is out, the edge rate speeds up..FYI
That is why we looked towards the carrier or carrier film.
Tim
|
| 37.96 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:42 | 12 |
| SCOMAN::DEJORDY 9 lines 11-JAN-1994 07:38
-< Wafer unload problems >-
--------------------------------------------------------------------------------
WSTK.1 Machine would not unload wafer. Went into the I/O page
and manually unloaded the wafer. Ran 5 wafers through
the deccmos5 process with no further problems.
|
| 37.97 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:42 | 9 |
| STRATA::MAZE 6 lines 11-JAN-1994 14:13
-< shuttle problems >-
--------------------------------------------------------------------------------
WSTK.1 - Down for smashed wafer in shuttle
Cleaned the broken product wafer and cycled more wafers through
tool. Found the cassette present switch lifting the boat up when
there was only a couple of wafer left. Adjusted the switch height
and cycled several boats of wafers through without further problems.
Laura and Eric are experimenting with heavier boats.
|
| 37.98 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:42 | 8 |
| STRATA::GALAN 5 lines 12-JAN-1994 23:53
-< Broken wafer >-
--------------------------------------------------------------------------------
WSTK.1 - Broken wafer in exit cassette.
Removed exit cassette elevator and bowl. Cleaned up the wafer chips
inside the exit station enclosure. Realigned bowl to arm, and adjusted
bowl height for smooth exit of wafer into cassette. Did not have time
to cycle wafers to check for proper operation, tool is still down.
|
| 37.99 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:43 | 8 |
| ESKIMO::FRANCIS 5 lines 19-JAN-1994 23:00
-< WSTK.1 Strange errors. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for intermittant "Unknown wafer- P arm. Ran a boat of
wafers and the error ocurred three times. Adjusted power supplies
1,2 & 3. All of them were a little low. A boat of wafers will need
to be run to check for errors.
|
| 37.100 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:43 | 10 |
| STRATA::GILMAN 7 lines 24-JAN-1994 18:13
-< Clean Head Cycle not working. >-
--------------------------------------------------------------------------------
WSTK.1 - Operator informed us the Clean Head Cycle was not working again. We
examined the input 5 volts going into the Card Cage and it was 5.28 V. We also
checked the connectors for the +5v,+12v,-12, and Ground on the Mother board in
the Card Cage. No problems were found and no adjustments were made. Powered
the system back up and the Clean Head cycle was working.
SDG/BF
|
| 37.101 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:43 | 14 |
| ESKIMO::FRANCIS 11 lines 27-JAN-1994 20:48
-< WSTK.1 Load cup errors from 1st. >-
--------------------------------------------------------------------------------
WSTK.1 - Problems with the system loading wafers onto the Load cup. Ran
30 wafers with only minor errors on the Wafer water track. Adjusted
the Water track sensor PSC1. Adjusted the Load cup sensor PSC2 to be
a little more sensitive. None of the 30 wafers hung up on the Load
cup. The Shuttle worked fine. There wasn't any vacuum switches for the
Carrier vacuum in Stock. The highest reading that the vacuum gauge
went to was 20 psi. Didn't get any unknown wafer errors. Put the system
back up and then down to PRO for Process engineering. There are some
changes being made to the Process spec.
|
| 37.102 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:43 | 16 |
| SCOMAN::DEJORDY 13 lines 28-JAN-1994 06:39
-< Cascade flow increase. >-
--------------------------------------------------------------------------------
WSTK.1 Machine was down pro-eng. Checked out the exit cassette
cascade flow,found out that hv2 did not controll the flow
for the exit cascade. found that sel 48 is what runs the
exit cascade, we disconnected the solinode and connected
the lines togeather using a 1/2 jayco elbow. the cascade
flow increased. we left it that way for production/eng to
evaluate.
|
| 37.103 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:43 | 28 |
| ESKIMO::FRANCIS 25 lines 29-JAN-1994 00:41
-< WSTK.1 Pad temp too high. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for a high pad temperature. Had to calibrate the Pad
temperature sensor. At ~100 degrees F, it was reading ~134.
Also adjusted the Carrier vacuum switch sensitivity down a
little. Ran about 10 wafers with the DecCmos5 recipe. The
setpoint for the Primary pad temp was 85 degrees, but the
the temp would start at ~68 at the beginning of the polish
cycle and then migrate up to 75 by the end of the cycle. Prior
to running the wafers, we heated up the Primary platen to
100 degrees and then checked the surface with temp meter to
check the difference between the actual platen temp and what
showed on the screen for the pad temp. There was about a 15 to
20 degree difference. To get the desired 85 degrees for the
pad temp on the Primary, maybe the Primary heater will have to
be programmed to go up to a much higher temp instead of the 70
degrees that it usually is set to. Something that needs to be
taken into account is that the platens take a long time to get
up to temp. We didn't time how long, but when we changed the
platen temp to go up 40 more degrees, it took maybe 15 minutes
to get there. Even if the platen works together with the pad
temp sensor, by time the polish cycle finishes, the platen temp
would only heat up a few degrees which would still be lower than
the 85 degrees. The system had a water track error at about 12:30
AM and was fixed. The system is back to MFG.
SP/BF
|
| 37.104 | ELEVATOR ISSUES | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:44 | 14 |
| STRATA::GILMAN 11 lines 29-JAN-1994 18:06
-< PROBLEMS,PROBLEMS,PROBLEMS,PROBLEMS. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for "ARM NOT UP" Error, it occured when the Polish Arm was above
the Primary Platen. When I attempted to run the system, the Load Elevator was
not seeing all the Wafers in the Load Cassette and sometimes the Shuttle was
getting Jammed. I increased the Angle for the Light Barrier Sensor and
decreased the Gain on the Amplifier for this Sensor. The Receive Elevator was
also having problems. I made adjustments to the angle of the Cassette, angle
of the Exit Ramp, increased the N2 for Exit Ramp a little bit and lowered the
hieght of the Home Position Sensor a little. When all of this was complete the
system ran with no problems.
SDG
|
| 37.105 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:44 | 10 |
| STRATA::GILMAN 7 lines 30-JAN-1994 15:00
-< Low Uniformity Problem.\ >-
--------------------------------------------------------------------------------
WSTK.1 - Verify - Down for Low Uniformity. Manufacturing noticed the Primary
Platen Temp. was not in Spec.. I performed the Primary Platen Temp. Cal. during
the Weekly PM. I found the Screen to be reading 10 Degrees below what the
actual reading was on the Temp. Probe. I ran the DEC CMOS-5 Recipe and had no
problems with the system. MQC's need to be checked again by Manufacturing.
SDG
|
| 37.106 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:44 | 6 |
| STRATA::POOLE 3 lines 31-JAN-1994 07:35
-< Unload wafer present >-
--------------------------------------------------------------------------------
WSTK.1 - Down: Unload wafer present error. Adjusted exit track sensor.
It took 5 or 6 turns to get sensor not sense a wafer.
Running warm-ups to verify fix.
|
| 37.107 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:45 | 12 |
| ESKIMO::FRANCIS 9 lines 1-FEB-1994 21:59
-< WSTK.1 High uniformity. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for high uniformity. The Primary platen had to be
leveled. The Polish arm sweep was at 0.02". Adjusted it to .003", the
arm level for the underside was already at .003", and the Carrier
sweep was adjusted to .003". Had to place a couple of shims under the
carrier gear housing. The shaft height was at .852". The height wasn't
changed. The down force was only off by 2 at 50 lbs and 300 lbs. Adjusted
it anyways to the actual on the meter. Replaced both pads and cleaned
the conditioner which was caked up some with slurry. The system is WUP.
|
| 37.108 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:45 | 14 |
| ESKIMO::FRANCIS 11 lines 4-FEB-1994 23:03
-< WSTK.1 Uniformity. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for uniformity problems. We decided to pull the Primary
platen off. Found the small oring worn and replaced it. Used scotch bright
to clean off the edge that sits on the large oring because of some
slurry buildup. Noticed that there is a high spot on the platen which
was brought down to .002". Finished up on the alignments. The Carrier
shaft height is .851". A little later on during the shift, the water
track sensor PSC1 sensitivity was increased. The flow valve, FV14A,
was turned in some because the shuttle was going into the Load cup too
fast. Back to MFG.
TD/SG/BF
|
| 37.109 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:45 | 14 |
| ESKIMO::FRANCIS 11 lines 10-FEB-1994 17:18
-< WSTK.1 Conditioner bouncing. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for the conditioner making loud noises as it sweeped across
the pad, and it was bouncing up during its sweep. Was told by TD that
one of the switches at the base of the conditioner has to be made the
whole time the conditioner is on or the arm will go up as though it
has finished polishing. That switch is the one closest to the platen.
Loosened the bolts and moved it as close as possible towards the
conditioner motor. Also, bent the conditioner to change the angle to
the pad, and it stopped making the loud noises. Ran the conditioner for
about 10 minutes, and it was OK. WUP.
|
| 37.110 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:45 | 8 |
| ESKIMO::FRANCIS 5 lines 15-FEB-1994 22:07
-< WSTK.1 Conditioner change. >-
--------------------------------------------------------------------------------
WSTK.1 - Down because the conditioner had to be changed. The Process
spec has some new changes to it. Whenever the Primary pad or the
Conditioner or the Carrier reaches 300 counts, that particular
item has to be changed. Put the system back up.
|
| 37.111 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:45 | 15 |
| LUDWIG::FRANCIS 12 lines 25-FEB-1994 18:04
-< WSTK.1 - Unknown error and lock up of process >-
--------------------------------------------------------------------------------
WSTK.1 - Down for intermittant "Unknown wafer- P arm. Ran a boat of
wafers and the error ocurred three times. Adjusted power supplies
1,2 & 3. All of them were a little low. A boat of wafers will need
to be run to check for errors. Readjusted PWS2 to 5.3 volts. Ran a
boat of wafers without any problems. Changed the Conditioner and
gave back to MFG.
Then the tool went down for the arm was not raised up error. The
arm was up but could not get the tool to abort the clean head cycle.
Powered the tool down, and it worked OK afterwards. Ran a couple of
boats of wafers without any problems. Returned the system to MFG.
|
| 37.112 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:45 | 24 |
| STRATA::GILMAN 21 lines 27-FEB-1994 18:39
-< Heat Exchanger problems >-
--------------------------------------------------------------------------------
WSTK.1 -DOWN- While performing Monthly PM two problems occurred. The first was
the Carrier was accidentally dropped and damaged during removal for PM. The
second was discovered when performing Temperature Calibration Checks. We found
The Primary Heat Exchanger was not Turning on when the System sent a DI output
to it. The DI output was making it into the Heat Exchanger, but the heater was
not turning on. The Tank was topped off and the Float Switch was working
correctly. We found the SSR's 3 & 4 were not turning on and allowing the 208V
AC to go to the Heater Core. While trouble shooting we noted the Final Heat
Exchanger in the OFF Mode had 0 V at TB23-7 & TB23-8 to Ground, but when the
Primary was in the OFF Mode we found 24V at TB22-8 (to ground) and 0V at
TB22-7 (to ground). In the CRTL Mode the Final Heat Exchanger had 24 V at
TB23-7 & TB23-8, while the Primary had 24.5V at TB22-7 & 22.7V at TB22-8. This
voltage drop was across CR25. The Voltage reading at TB22-8 goes through CR14
and then makes it to the SSR's. We swapped the Mechanical Relays, but it did
not help us find the problem. We noticed both Heat Exchangers have the same
Functionality , but are wired differently from each other and do not necessarily
correspond with the Prints made available to us.
Please note we used the Engineering Drawing # 372-36267; Heat Exchangers Power
Schematics.
SDG/JB/KF
|
| 37.113 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:46 | 14 |
| JUNCO::FRANCIS 11 lines 28-FEB-1994 22:34
-< WSTK.1 No heat for the PRImary. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for the Primary heater was not coming on. At the start
of 2nd shift, we were able to find the grounding problem for the
Haet exchanger. Found that the wire for pin 1 of PL122 was discon-
nected. Fixed that, but there was still no heat coming on. Checked
everything from the SSRs and back towards the control signals. We
finally found that the pico fuse for the Digital rail #2 output for
the Primary platen temp control was open. Put in another one and
toggled it on and off. Works fine. Checked the temp on the Platen TC
at 75 degrees and it was about 74.6. Put on both pads and gave it back
to MFG.
BF/TM
|
| 37.114 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:46 | 8 |
| STRATA::GILMAN 5 lines 18-MAR-1994 12:20
-< Exit Track problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Wafers not being seen in Exit Track. I found the N2 for the
Exit Jets was too high. The N2 pressure was reduced, and 25 Wafers were run
with no Problems. System is back to Manufacturing.
SDG
|
| 37.115 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:46 | 5 |
| JUNCO::FRANCIS 2 lines 23-MAR-1994 17:15
-< WSTK.1 Faulty Load cup wafer sensor. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for a faulty fiber optic sensor at the Load cup. Replaced
the sensor and ran some wafers through with no more problems.
|
| 37.116 | SHUTTLE AND LOAD CUP ISSUES | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:47 | 13 |
| JUNCO::FRANCIS 10 lines 24-MAR-1994 20:17
-< WSTK.1 Multible problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for numerous problems. Pulled off some of the solenoids
that operate the Shuttle and Load cup and made sure they were clean.
It was suspected that some slurry may have gotten into them and
caused them to stick. Adjusted PSW2 from about 5 volts to 5.3 volts.
There was also a problem with the Carrier wafer vacuum. All of these
problems stopped after the voltage adjustment. The bulk system is now
working. Ran some wafers through and then gave the system back to MFG.
TD/BF/TM
|
| 37.117 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:48 | 9 |
| STRATA::FRANCIS 6 lines 5-APR-1994 20:50
-< WSTK.1 Polish arm lifting too quick. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for the Polish arm lifting too quickly because of the
suction of the liquid on the pad. Adjusted FV1 which is for the
exhaust of the Polish arm piston and increased the piston pressure
with PRV5. Ran several wafers and most of them lifted up OK. There
were a couple of wafers that stuck a little. Back to Mfg.
|
| 37.118 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:48 | 15 |
| STRATA::FRANCIS 12 lines 6-APR-1994 22:47
-< WSTK.1 - Vacuum problem. >-
--------------------------------------------------------------------------------
WSTK.1 - The vacuum was staying on several seconds after the wafers were
being polished. Found Solenoid 12 was sticking open which keeps the
vacuum on. Replaced it and manually operated the solenoid several
times. The solenoid closed quickly each time. Ran some wafers, and the
vacuum would go off according to the vacuum gauge, but the screen
showed a vacuum. Made some adjustments to the pressure switch for the
vacuum. The vacuum went off ok after the adjustments, but the vacuum
dropped off during the clean head part of the cycle which caused a
missing wafer error. Another pressure switch has been ordered from the
Stockroom. Will be replaced on third shift.
|
| 37.119 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:49 | 13 |
| STRATA::GILMAN 10 lines 9-APR-1994 17:30
-< DI Water/Slurry in Exhaust Line >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Water/Slurry coming out of Exhaust Line, which caused an ERT
Call. About 3 Gallons of Water/Slurry was allready on the floor, and when I
pulled the End of the Exhaust Line about 2 more came out. I called Tim Dyer
about the problem and he told me two things: 1) There has been a Hot Line call
made to Facilities to install a drain on the Exhuast Line, which will cure the
problem alltogether. 2) To turn off the DI Water to the Rinse Ring in the
Primary Platen, which will reduse the amount of DI in the Primary Platen Tub.
System is back to Manufacturing.
SDG
|
| 37.120 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:49 | 14 |
| SCOMAN::DEJORDY 11 lines 11-APR-1994 06:17
-< Plattens not rotating and unload elevator >-
--------------------------------------------------------------------------------
WSTK.1 System's plattens would not turn on. Found the breakers
triped. reseated the breakers and turned the plattens on.
Unload elevator not working properly. Adjusted the cassette
pitch cycled warm up wafers through the system without further
errors.
|
| 37.121 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:49 | 12 |
| STRATA::MAZE 9 lines 20-APR-1994 14:30
-< wafer not sensed in carraige ? >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer not sensed on carrier
MFG said the alarm was wafer not sensed in carriage. There is no
carriage on the tool, but checked out the wafer lift and carrier.
Saw the soft water filter was showing a 15 lb loss between input
and output. Replaced the filter with a new one from stock. The old
filter and water sample was taken to Matt Fanara to get analyzed and
see what the contamination is that is clogging our filters so
frequently. 15 wafers were cycled through the tool without any
further problems.
|
| 37.122 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:49 | 6 |
| STRATA::MENSAH 3 lines 21-APR-1994 10:39
-< WILL NOT CLEAN HEAD >-
--------------------------------------------------------------------------------
DOWN FOR WILL NOT CLEAN HEAD; CLEARED WAFER MISSING ALARM AND RESET
CLEAN HEAD CYCLE..CYCLE WAFERS USING CLEAN HEAD IN THE
ROUTINE WITH NO PROBLEMS.
|
| 37.123 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:49 | 13 |
| STRATA::GILMAN 10 lines 21-APR-1994 10:48
-< SHUTTLE NOT AT LIFT ERROR >-
--------------------------------------------------------------------------------
WSTK.1 System errored for not sensing the shuttle at lift. Found
the actuator for the limit switch was broken. Removed and
replaced the actuator. System then errored for lift failure
adjusted the sensor for wafer lift at load. Cycled wafers
through the system doing load and unload only.
RD/SG/JM/RL
|
| 37.124 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:49 | 8 |
| STRATA::MENSAH 5 lines 21-APR-1994 14:17
-< dropping wafers >-
--------------------------------------------------------------------------------
Down for dropping wafers on the primary pad; checked water supply,
the pressure for input and output were the same..next checked
carrier found scratch on the surface..replaced carrier and
cycle wafers with no wafer dropping problems..all mqc's came
in spec.
|
| 37.125 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:50 | 8 |
| STRATA::FRANCIS 5 lines 21-APR-1994 21:29
-< WSTK.1 - Conditioner change. >-
--------------------------------------------------------------------------------
WSTK.1 - Changed the conditioner and adjusted the pressure switch for the
Carrier vacuum. The vacuum would register on the screen after about
20 seconds when a wafer was being loaded. Plus, the wafer wasn't always
being sensed even though there was a wafer on the Carrier.
|
| 37.126 | UNIFORMITY | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:51 | 19 |
| SCOMAN::DEJORDY 16 lines 27-APR-1994 06:40
-< Many many errors >-
--------------------------------------------------------------------------------
WSTK.1 System went down for high uniformity and production tech
claims he saw air bubbles in the slurry. Uniformity was
at 16.1%. Checked the bulk fill system and found no problems
there. Checked the back of system and found two fittings
loose on the return line tightened up same. System then
errored for no wafer present in the carrier, adjusted the
vacuum swtich. System then errored for wafer not seen at
unload cassette,adjusted amp 1. Ran four warm up wafers
with out any problems. System then would not see wafers
at the load elevator. Powered system down and then restarted
system. Tryed to run some wafers after second wafer system
errored for p polish error wafer not in track and no wafer
at load. system is still down
|
| 37.127 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:51 | 11 |
| LUDWIG::MENSAH 8 lines 27-APR-1994 14:43
-< transport problems... >-
--------------------------------------------------------------------------------
WSTK.1 Down for wafer transport problems; adjusted sensetivity for load
indexer sensor, lift wafer sensor and unload indexer sensor..also
reduced the wafer eject water pressure and adjusted wafer track.
cycle 25 wafers with no problems...production did polish rate
and uniformity was high..checked arm leveling, primary platen
run out, and carrier run out they were all with in spec..replaced
carrier button and the carrier...had to adjusted conditioner
pressure to 12.5 PSI...Production to perform full mqc...
|
| 37.128 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:51 | 8 |
| STRATA::FRANCIS 5 lines 27-APR-1994 21:50
-< WSTK.1 - Water track jets were too high. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for the Water track sensor not sensing the wafers. The
wafers were going too fast into the cassette. Slowed down the bowl
and exit water jets quite a bit. Also adjusted the Unload sensor a
little. Now the wafers are going through at a slow pace. Ran 20 wafers
without anymore problems.
|
| 37.129 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:51 | 10 |
| SCOMAN::DEJORDY 7 lines 28-APR-1994 05:15
-< exit track adjustments. >-
--------------------------------------------------------------------------------
WSTK.1 System did not go down in RTC but production called and
they were having a problem with wafers exiting the unload
track. Adjusted the pitch on the exit track,also adjusted
the bowl jet and the exit jet pressure they were set to
low. system ran for 5 hrs and then exit pressure needed
a small adjustment.
|
| 37.130 | NOT UNLOADING WAFERS | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:51 | 11 |
| STRATA::GILMAN 8 lines 30-APR-1994 18:30
-< system was very confused. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not unloading Wafers. The system would finish Polishing on
the Final Platen, lift off the Platen and would not move after this. There
were NO alarms and all the sensors which need to be lit for the Arm to unlaod
the Wafer were there. Could not understand why the system was confused. I
then powered the system down and back up. Once I did this it worked the rest of
the day with no problems.
SDG
|
| 37.131 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:52 | 13 |
| LUDWIG::POOLE 10 lines 4-MAY-1994 08:01
-< DROPPING WAFERS >-
--------------------------------------------------------------------------------
WSTK.1 - System dropped wafers on 2nd. Checked warm-ups and found a
few that were blue indicating no oxide left. Cleared errors
and ran new warm-ups. Ran boat w/o error. System later
errored for no wafer on P-Arm. Operator found wafer slightly
off-center. Carrier shim height was checked and was off by
a few thousandths. Also found two screws missing. Carrier
was corrected and system is running warm-ups.
WSTK.2 - 12 to 5 volt DC to DC converter was installed.
|
| 37.132 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:52 | 12 |
| SCOMAN::DEJORDY 9 lines 9-MAY-1994 06:31
-< would not unload wafers. >-
--------------------------------------------------------------------------------
WSTK.1 System would not unload the wafers.Found the cassette switch
not seated on the cassette. cleared the errors and removed
wafer from the carrier using the I/O page. Restarted the
process and ran 10 wafers with out further errors.
|
| 37.133 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:52 | 9 |
| SCOMAN::DEJORDY 6 lines 12-MAY-1994 07:48
-< Wafer not sensed at load cup >-
--------------------------------------------------------------------------------
WSTK.1 System would not sense wafer in the load cup,Adjusted psc2.
System would not sense wafer at unload cassette,Adjusted psc1
and the pressure for the bowl jets.Cycled 15 wafers with out
further errors.
|
| 37.134 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:52 | 8 |
| SCOMAN::DEJORDY 5 lines 13-MAY-1994 07:35
-< no wafer at load cup. >-
--------------------------------------------------------------------------------
Wstk.1 System did not see wafer at load cup again. Watched the system
load wafers noticed that one wafer was not sitting flat in the
load cup.Started the process again system ran with out error.
|
| 37.135 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:52 | 5 |
| STRATA::MOTT 2 lines 17-MAY-1994 08:09
-< Exit track error >-
--------------------------------------------------------------------------------
WSTK.1-DOWN for wafer not sensed in exit track; Adjusted PSC1
then ran 10 wafers with no further error.
|
| 37.136 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:53 | 11 |
| LUDWIG::GALAN 8 lines 24-MAY-1994 00:04
-< Bad servo-amp control board >-
--------------------------------------------------------------------------------
WSTK.1 - Down for erratic arm movement. Polishing arm loses
track of its position and does not properly disengage from
the primary platen at the end of the polishing cycle.
Found servo-amp control board (mod no 215) to be bad,
presently reconfiguring new board.
EG/TM
|
| 37.137 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:53 | 14 |
| SCOMAN::DEJORDY 11 lines 24-MAY-1994 07:36
-< Polish arm not moving. >-
--------------------------------------------------------------------------------
WSTK.1 Removed and replaced the polish arm servo drive board. Tryed
to set the servo motor current limit adjustments.Turned pot
R-5 fully counterclockwise and adjusted pot R-4 feedback trim
pot until arm motor started to oscillate. Tryed to check the
arm position when it swings out but the system would not
cycle to any of the positions. Tryed to move the systerm
manually but they would not work either. The servo drive
board is mounted to two outher boards inside black case.
suspect that one or both of the outher boards are bad.System
needs further troubleshooting.
|
| 37.138 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:53 | 9 |
| LUDWIG::MULDOON 6 lines 26-MAY-1994 21:52
-< REPLACED SERVO DRIVE ASSEMBLY >-
--------------------------------------------------------------------------------
WSTK.1 -UP- Replaced servo drive assembly. Had to adjust polish arm
current limits using R2 and R3(on servo drive board). Check arm
positioning at all stations, no problems. Ran two full boats to
verify no further problems. Gave to production for MQC's.
TD/JM/SG/BF/TM
|
| 37.139 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:53 | 15 |
| SCOMAN::DEJORDY 12 lines 8-JUN-1994 08:20
-< High edge uniformity and wafers not unloading. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for high uniformaty and would not unload
wafers into the unload cassette. Changed the button after
talking to the production tech. The system would not unload
wafers after being final polished.Found that the edge carrier
lift was off. Turned back on. Production will be doing MQC's
again.First check last night was polish rate 1087 uniformity
4.6% edge 18% and particle check was 0.this was before the
button was replaced. 2nd MQC's were done and the polish rate
was 1235 uniformity -5.3% and edge was 5.8% system is still
down
|
| 37.140 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:53 | 14 |
| SCOMAN::DEJORDY 11 lines 9-JUN-1994 05:50
-< High uniformity >-
--------------------------------------------------------------------------------
WSTK.1 System was down for high uniformity. Started the decision
tree.Production tech measured the carrier and found no
problems with it. Changed the o-ring and button and had
MQC's checked on the system again. O-ring for the button
looked worn. MQC's came in spec polish rate was 1162,
uinformity 4.8 and edge uniformity was 11.3.
|
| 37.141 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:53 | 9 |
| STRATA::GILMAN 6 lines 10-JUN-1994 14:36
-< Arm is laboring >-
--------------------------------------------------------------------------------
WSTK.1 - System went down for " Arm is laboring on edge lift". Found the
Primary Platen Center & Primary Polish Limit were both off. Recalibrated the
positions for the Arm on the Primary Platen. Edge Lift worked smoothly after
the Cal. was done. System is back to Manufacturing.
SDG/RL/Red
|
| 37.142 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:54 | 14 |
| STRATA::GILMAN 11 lines 13-JUN-1994 12:22
-< Arm lifting hard of primary platen >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Polish Arm having a difficult time (crashing) lifting off of
the Primary Platen at the end of processing. The Edge Lift was working
correctly as well as the Flow Valve settings for the Piston which raises and
lowers the Arm. The Polish Arm was only doing this on the Primary Platen.
Found the Arm Stabilizer Piston was not applying enough pressure when it was
activated. Tried adjusting the air flow to the Piston, but it did not work.
Putt some Vacuum Grease inside the Piston to help the Seal inside work better
and this corrected the problem. The Arm is lifting A LOT more smoothly than it
was before. The system is back to Manufacturing.
SDG
|
| 37.143 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:54 | 9 |
| STRATA::GILMAN 6 lines 17-JUN-1994 19:03
-< wrong downforce setting >-
--------------------------------------------------------------------------------
WSTK.1 - Down for a low pressure setting of the Conditioner downforce.
Replaced Diamond Conditioner and Pad, then dialed in the Conditioner downforce
to 11 PSI.
SDG/JB
|
| 37.144 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:54 | 17 |
| STRATA::FRANCIS 14 lines 22-JUN-1994 22:41
-< WSTK.1 Arm up/down cyclinder bad. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for Polish arm jurking up at the end of a Primary polish
cycle. Checked the pneumatic air and it is 95 psi. It should be set
between 90 - 100 psi. Disconnected one of the air lines for the Polish
arm up/down air cylinder and toggled the arm up and down to test Sol 1
which supplies the air. The air came on instantaneously with each try.
Tried different pressure settings with PRV5 and adjusted flow valve
(FV1) with no real significant changes in the up motion of the Polish
arm. Pushed against the arm which is attached to the air cylinder and
then commanded the arm to come up. The air cylinder didn't actuate for
about 6 seconds and then the pressure built up. Tried the same thing on
WSTK.2 and the air cylinder activated within 1 second. The problem may
be the air cylinder itself. Found the Vendor # and gave to TDYER since
there are none in stock.
|
| 37.145 | POLISH ARM JERKING AT END OF CYCLE | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:55 | 13 |
| STRATA::POOLE 10 lines 23-JUN-1994 22:48
-< LATE ENTRY >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Polish arm jerking up at the end of a Primary polish
cycle. Changed primary pad. Adjusted FV1 and FV6 and the jerking
ceased. Put system up and it went back down because the downward
movement would intermittently slam. Continued adjusting FV1 and 5
arm movement is somewhat close now. Need Tim to check it.
Also the lower seal in the polish arm is cracked and rotted.
There is no isloation between the polish arm inards and the pro-
cess area.
|
| 37.146 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:55 | 11 |
| STRATA::FRANCIS 8 lines 23-JUN-1994 23:43
-< WSTK.1 Polish arm coming up hard. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for Polish arm raising up too hard. Adjusted FV1 in to
have the arm come up slow, and then adjusted PRV5 in to reduce the air
volume. Ran 20 wafers with a 30 second polish time, and every 2 to 3
wafers had some trouble coming up but didn't slam up as hard as previous.
Then 10 wafers were run with a 2 minute polish time per wafer, and the
arm came up OK for all of them. The system is running some more wafers.
BF?TM
|
| 37.147 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:55 | 15 |
| STRATA::GILMAN 12 lines 25-JUN-1994 18:32
-< Arm up/down piston replaced >-
--------------------------------------------------------------------------------
WSTK.1 - Down for a Part (Air Piston for Arm Up/Down). Installed the new Piston
and performed the Monthly PM for WW52, because I had to do all of the
Mechanical Alignments anyway after the new Piston was installed. The PM is in
the Incomplete Notes File, because the DI Water Samples & H202 Purge were not
done. Installed new Pads on both Platens to test/adjust the new Piston and ran
50 Wafers using the Patrical Recipe without any problems with the Arm slaming as
it lifted off the Primary Platen. The Partical Recipe was the one which was
giving us the most problems before. The system needs to have the Pads I put on
replaced and Full MQC's need to be done. I cleaned the system when I was
finished, but it should be done again do ensure there are no partical issues.
SDG
|
| 37.148 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:56 | 7 |
| STRATA::FRANCIS 4 lines 7-JUL-1994 17:46
-< WSTK.1 Polsh arm movement problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for the Polish arm not responding to arm movement commands.
Powered the system down. After the system was powered up, the Polish
arm worked fine.
|
| 37.149 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:56 | 15 |
| SCOMAN::DEJORDY 12 lines 14-JUL-1994 06:02
-< Arm problem and loader problem. >-
--------------------------------------------------------------------------------
WSTK.1 System went down arm would not go to the exit station. Did
a calibration recall and tryed to run the system. System
ran the first wafer o-kay but then the send cassette drove
all the way down. found that amp 1 was sensing a wafer all
the time even when a wafer was not present. Adjusted Amp 1
and ran 5 wafers through system without any further errors.
|
| 37.150 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:56 | 7 |
| SCOMAN::DEJORDY 4 lines 25-JUL-1994 06:48
-< Final platen would not turn on. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for final platten would not turn on. Found
the 25 amp breaker was triped. Reset the breaker and rebooted
the system. System ran without failure.
|
| 37.151 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:56 | 12 |
| SCOMAN::DEJORDY 9 lines 29-JUL-1994 06:26
-< polish arm problems. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for polish arm comming up to fast. Ran 5
wafers on the decmos5 recipe and watch the polish arm,
noticed that the carrier was sticking to the primary pad
due to suction. Talked with second shift and they said that
the carrier curverture is only about half of what it's
supposed to be. I told production to change the carrier and
primary pad and to run MQC's. We changed the carrier and the
conditioner,and the primary pad, ran numerous wafers with
no problems with the polish arm........
|
| 37.152 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:57 | 11 |
| STRATA::GILMAN 8 lines 29-JUL-1994 09:26
-< CYCLE NOT ENDING >-
--------------------------------------------------------------------------------
WSTK.1 - Down for system locking up during a cycle. Found the "ARM UP" Switch
was not being made ever time at the end of a cycle. So the system would
show a cycle continually running, because it was waiting for the last sensor it
needed to see, the "ARM UP" Switch to end the cycle. Adjusted the position of
the ARM UP Switch, so it was more sensitive. Ran a Cassette of Wafers with no
problems. The system is back to Manufacturing.
SDG/RL
|
| 37.153 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Tue Oct 15 1996 23:57 | 10 |
| STRATA::GILMAN 7 lines 29-JUL-1994 14:10
-< unload problems >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Wafers not exiting the Unload Station. Adjusted the weights
on the Arm to ensure the Wafers would exit smoothly. Ran a dozen Wafers with
no problems. System is back to Manufacturing.
SDG
|
| 37.154 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:19 | 14 |
| STRATA::FRANCIS 11 lines 4-AUG-1994 18:08
-< WSTK.1 Unload elevator not stepping. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for intermittantly putting two wafers into a slot and
for the Polish arm slamming up. Ran 30 wafers through without either
problem occuring. The Polish arm doesn't come off the pad right away,
but it doesn't come up hard. Did notice that once all the wafers were
finished, the elevator would sometimes hesitate on the way up. Found
that if a wafer was sticking a little bit out from the back of the
cassette, the wafer sensor on the water track picked up on the wafer.
There is no real need to adjust the sensor amp since the amp is very
sensitive to adjustments and no problems will occur from the situation.
BF
|
| 37.155 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:19 | 7 |
| LUDWIG::GILMAN 4 lines 5-AUG-1994 14:26
-< unload problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Wafers not going into Unload Cassette. Adjusted Arm Level &
ran a Cassette of Wafers with no problems.
SDG
|
| 37.156 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:19 | 8 |
| STRATA::FRANCIS 5 lines 8-AUG-1994 22:25
-< WSTK.1 Wafer loading problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for vacuum not being achieved during a wafer load onto
the carrier. Adjusted the position of the load cup, because the
carrier wasn't fitting into the load cup all the way. Cycled some
wafers and they loaded good. WUP.
|
| 37.157 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:19 | 7 |
| STRATA::FRANCIS 4 lines 9-AUG-1994 17:57
-< WSTK.1 - Water slide adjustments. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Endpoint experiments and continued adjustments on the
water slide. The experiments are done for now and finished up on the
wafer slide adjustments. Back to MFG.
|
| 37.158 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:19 | 14 |
| STRATA::POOLE 11 lines 10-AUG-1994 06:56
-< POLISH ARM down switch failure >-
--------------------------------------------------------------------------------
WSTK.1 System errored for Polish arm not down. Arm was in down posi-
tion. Removed cover to check micro-switch position and it was
made. Toggled micro-switch manually while obsering input/output
screen. Arm down would not come on. Checked switch with meter
and initially it wouldn't toggle. Switch started working after
I checked it out. Put system up and it then failed again. This
time the I/O screen showed the polsih arm always down. Checked
stock, no part in stock. Switch has # 91929 on it. Could not
locate part on the Westech parts drawing I had so not sure of
the Westech #.
|
| 37.159 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:20 | 6 |
| STRATA::FRANCIS 3 lines 11-AUG-1994 21:29
-< WSTK.1 - High bacteria count. >-
--------------------------------------------------------------------------------
WSTK.1 - The Final and Unload stations had a high 1st bacteria count.
Flushed out the system with H2O2 using the DI canister in back before
lunch. Took a sample for QA after lunch.
|
| 37.160 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:20 | 19 |
| STRATA::GILMAN 16 lines 14-AUG-1994 16:44
-< PCW Water Leak >-
--------------------------------------------------------------------------------
WSTK.1 & WSTK.2 - The PCW Solenoid Valves in the Heat Exchangers were
vibrating so strongly when activated, a 2 Inch PCW Water Line had been damaged.
Site Services contacted us early in the morning and infomred us of the
situation. They also infomred us the fix is temporary, so any further strong
vibrations in the PCW Line may result in the PCW Tank being emptied into the
Westech Room. A different Solenoid Valve was tried in the Primary Heat
Exchanger in WSTK.1 and it worked ten times smoother than the existing style.
The only problem is there was only one of these 24 VDC Valves which could be
used in the Stock Room. A new Solenoid Valve of the existing style was put
into the Final Heat Exchanger of WSTK.1, but it worked just as poorly as the
one it replaced. The system has the Final Heat Exchanger turned off as well as
the Solenoid itself is disconnected. Tim Dyer was contacted at home and he
will be addressing the issue on Monday morning. WSTK.1 can be run as is, and
this information was relayed to production.
SDG
|
| 37.161 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:20 | 10 |
| STRATA::MAZE 7 lines 16-AUG-1994 14:43
-< chilled water problem >-
--------------------------------------------------------------------------------
STK.1 - Scheduled down
The process chilled water PVC piping being repaired.
A different type of 24 volt solenoid was installed in the heat
exchanger. The return shut off valves are turned in order to
restrict the flow which in turn will reduce the water hammers. If
this works. the valves are to be installed on WSTK.2 **NOTE***
the chilled water will be turned back on at 3:00 pm.
|
| 37.162 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:20 | 8 |
| STRATA::FRANCIS 5 lines 16-AUG-1994 17:26
-< WSTK.1 Water pipes. >-
--------------------------------------------------------------------------------
WSTK.1 - Facilities finished with repairing the PVC piping. Adjusted the
flow of the main cooling water valve from ~90 psi to ~60 psi. Then
toggled each platen cooling valve on and off, and the pipes didn't
hammer. Gave the system back to MFG.
|
| 37.163 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:21 | 11 |
| SCOMAN::DEJORDY 8 lines 25-AUG-1994 07:30
-< Pre-wet problem. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for not pre-wetting. Checked out the system
and found no problem with the pre-wet. Cycled 10 wafers with
no problem on the warmup recipe. Production ran system all
night.
|
| 37.164 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:21 | 9 |
| SCOMAN::MOTT 6 lines 30-AUG-1994 23:33
-< System Lockup >-
--------------------------------------------------------------------------------
WSTK.1 System locked up and would not respond to operator input.
Powered system down and re-booted tool, ran fine there after.
Dejordy
|
| 37.165 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:21 | 18 |
| SCOMAN::DEJORDY 15 lines 31-AUG-1994 06:30
-< Cascade modification on exit track. >-
--------------------------------------------------------------------------------
WSTK.1 System did not go down in RTC but the exit track cascade
modification was completed. Modified the 3/8 supply line
to 1/2 supply. The 1/2 " line used to supply the exit track
is located under the front part of system under the exit
track. Tapped the supply line for the di water vegatable spray
hose and set the cascade flow to original flow. The ball
valve is about half way closed. Could not install the
ball valve where the hand valve was located with out
drilling and tapping the mounting plate. This will have to
be done on a later date.
|
| 37.166 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:21 | 14 |
| <<< SCOMAN::SILVER$:[NOTES$LIBRARY]ETCH.NOTE;4 >>>
-< ETCH >-
================================================================================
Note 96.205 WESTECH PASSDOWN 205 of 437
STRATA::MULDOON 7 lines 31-AUG-1994 18:30
-< excessive exit flows >-
--------------------------------------------------------------------------------
WSTK.1 - The system went down for wafers not being sensed at exit
cassette. Found that the flows for the exit track, wafer
eject, and bowl eject were too high. Adjusted flow valves
9,10,11 (2nd,3rd,and 4th from the left). Returned to
production.
TMM
|
| 37.167 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:22 | 9 |
| SCOMAN::MOTT 6 lines 19-SEP-1994 07:26
-< MDU error code B4 >-
--------------------------------------------------------------------------------
WSTK.1 MDU gave an error code "B4". Chem. mix was not in at the time and
error could not be cleared. "Slurry supply empty" is the probable
cause for the alarm.
BOB/ROB/MOTT
|
| 37.168 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:22 | 6 |
| STRATA::CLOUTIER 3 lines 19-SEP-1994 10:12
-< BULK FILL SENSOR PROBLEM RESOLVED >-
--------------------------------------------------------------------------------
WSTK.1 - Down for bulk fill sensor error #64. Bulk fill reset sensor
and had bulk fill operating right after passdown.
LC
|
| 37.169 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:22 | 8 |
| STRATA::CLOUTIER 5 lines 19-SEP-1994 10:15
-< BROKEN CONDITIONER SCREEN >-
--------------------------------------------------------------------------------
WSTK.1 - Down for broken conditioner screen under the primary platen.
Removed the broken conditioner from under platen and set system
in idle mode with assistance from production tech.
LC
|
| 37.170 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:22 | 9 |
| STRATA::CLOUTIER 6 lines 20-SEP-1994 18:27
-< NEW HARD DRIVE AND WIRING UPGRADE COMPLETED >-
--------------------------------------------------------------------------------
WSTK.2 - Down for new hard drive and controller. Installed new PWS2 and wiring
upgrade for new hard drive. PWS2 is now both 5v and 12v adjustable. Sys-
tem is now a 386 versus a 286. System is ready for running. Needs to be
tested.
MS/LC
|
| 37.171 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:22 | 11 |
| SCOMAN::MOTT 8 lines 28-SEP-1994 07:31
-< DIAMOND GRIT CONDITIONER NOISE >-
--------------------------------------------------------------------------------
WSTK.1 Went DOWN for "Excesive noise durring primary platin conditioning
cycle". First adjusted and excersised the conditioner, this
attempt helped, yet problem reoccured after ~ 20 cycles.
Then replaced the Diamond grit screen conditioner.
Verified fix by performing ~ 10 condition cycles with
no noise present. MM
|
| 37.172 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:23 | 9 |
| SCOMAN::DEJORDY 6 lines 3-OCT-1994 19:22
-< Slurry bulk problems. >-
--------------------------------------------------------------------------------
WSTK.1 System did not go down in RTC but slurry alarm went on and
the MDU also was alarming. After about 3-5 min all alarms
went off and system was operating normally. I think the
barrel switched over.
|
| 37.173 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:23 | 6 |
| STRATA::GILMAN 3 lines 11-OCT-1994 06:54
-< NO PCW >-
--------------------------------------------------------------------------------
WSTK.1 & WSTK.2 - Both down for no PCW. Both systems have the Heat Exchangers
turned off through the PROCESS TEMP/PROCESS VARIABLE page in the
software.
|
| 37.174 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:23 | 8 |
| STRATA::B_RIVERS 5 lines 18-OCT-1994 22:31
-< WSTK.1 DOWN NO SLURRY >-
--------------------------------------------------------------------------------
WSTK.1-DOWN for no slurry in primary ....ran line to sol.22 into bucket
no clog, checked for 24vdc on sol.24 did not have 24vdc. Changed
process to CMOS5 and checked for 24vdc and it was present, activated
sol.22 several times and had no further problems. Turned system
over to production for MQC's.
|
| 37.175 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:23 | 6 |
| STRATA::B_RIVERS 3 lines 21-OCT-1994 06:14
-< WSTK.1 DROPPING WAFERS >-
--------------------------------------------------------------------------------
WSTK.1-Down for dropping wafers and one broken...cleaned broken wafer,
operator was running wafers with no oxide on them. Changed to good
wafers and no further problems.
|
| 37.176 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:23 | 8 |
| SCOMAN::MOTT 5 lines 23-OCT-1994 07:35
-< Bulk fill off line >-
--------------------------------------------------------------------------------
WSTK.1 Slurry bulk fill off line. (Big red lamp to the right of the CRT)
Called Chem Mix/Bulk Fill, and discovered that the slurry drum
was being changed. After change, the lamp went out. System had no
further problems. MM
|
| 37.177 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:23 | 12 |
| STRATA::FRANCIS 9 lines 30-OCT-1994 06:18
-< WSTK.1 - Dropping wafers. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for dropping wafers as the Polish arm was lifting.
Adjusted FV1 to slow down the upward motion of the Polish arm.
A wafer was run, and the problem was still there. The vacuum
was climbing up to about 18 inches of water before lifting up,
and the Polish arm was also going very close to the edge before
lifting. The carrier was taken off and measured. It had almost
no curve on it. Once another carrier was built and put on, 20
wafers were run without any of them dropping off. Gave the system
back to MFG.
|
| 37.178 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:24 | 9 |
| SCOMAN::MOTT 6 lines 1-NOV-1994 08:22
-< Stopped Process >-
--------------------------------------------------------------------------------
WSTK.1 Stopped process after picking wafer from load cup. Found that
the cycle mode select was in the manual mode. Placed in continous
mode then watched 5 wafers run with no problems. Mott
Annual PM completed. BF
|
| 37.179 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:24 | 18 |
| STRATA::MAZE 15 lines 3-NOV-1994 07:12
-< NEGATIVE UNIFORMITY >-
--------------------------------------------------------------------------------
WSTK.1 - Down for negative uniformity and for dropping wafers on primary pad
Found when the stabilizer pin was engaged the arm would jam down
into the exit track. Removed all the pads and checked arm alignments.
Platen run out and sweep were good at .001 and .002. checked the
carrier runout and could not read the indicator due to the
misalignment. Found the arm was at a 1/2 in tilt towards the
carrier. Roughly straightened the arm with the load cell so it
was parallel to the platen. Was able to keep the indicator within
.010. Adjusted the arm some more and was able get a steady .004
deflection. Checked the down force followed by the arm balance.
Put the tool back together and MQC's were ran. Removal rates were
1135, unif=11.7%, edge unif= 2.5 with particles at 30 total.System
placed to WUP.
|
| 37.180 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:24 | 9 |
| SCOMAN::GILMAN 6 lines 7-NOV-1994 07:01
-< bulk fill off line >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Bulk Slurry Off-line. Tried to contact some one on call from
Bulk Fill, but no one answered. Finally this morning we got a hold of some one
to resolve the issue.
RL/SG
|
| 37.181 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:24 | 10 |
| STRATA::CLOUTIER 7 lines 8-NOV-1994 17:00
-< PRIMARY PLATEN TUB CLEANED THOROUGHLY >-
--------------------------------------------------------------------------------
WSTK.1 - Down for particle problem and waiting for new rinse ring.
Matt V. asked for the tub for primary platen be thoroughly
scrubbed to get the machine to possibly run this evening.
Scrubbed the tub and rinsed thoroughly. Laura Prowell
mentioned that system was to stay down until rinse ring is
reinatalled. Down to PART.
LC/KT
|
| 37.182 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:24 | 6 |
| LUDWIG::REDRIVERS 3 lines 10-NOV-1994 07:22
-< WSTK.1 CARRIER VACUUM PROBLEM. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for no vacuum on carrier...replaced wafers with ones
with enough oxide on and vacuum problem solved. Would not load
wafer into load cup. Reset system and everything worked fine.
|
| 37.183 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:24 | 6 |
| STRATA::BOUCHER 3 lines 12-NOV-1994 19:17
-< installed new primary platen rinse ring... >-
--------------------------------------------------------------------------------
WSTK.1 - Completed weekly pm, also installed new primary platen rinse ring
that arrived today. System is currently running fine.
|
| 37.184 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:25 | 7 |
| SCOMAN::GILMAN 4 lines 13-NOV-1994 02:58
-< DROPPING WAFERS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for dropping Wafers on Primary Platen during Edge Lift. Found
the Edge Lift to be off. Re-calibrated the Edge Lift Positions for
both Platens. This did not totally cure the problem. So the Carrier
was replaced and the system ran with no further difficulties.
|
| 37.185 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:25 | 10 |
| STRATA::CLOUTIER 7 lines 14-NOV-1994 18:45
-< SLURRY BUILDUP UNDER THE LIFT CUP >-
--------------------------------------------------------------------------------
WSTK.1 - Down for slurry buildup under lift cup causing erratic shut-
tle movement. Removed the shuttle cup and thoroughly cleaned
under all mechanisms. Rinsed all components down, wiped load
area thoroughly. Ran 7 wafers to insure smooth operation of
shuttle and returned to production.
LC/RD
|
| 37.186 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:25 | 6 |
| STRATA::REDRIVERS 3 lines 17-NOV-1994 07:29
-< WSTK.1 VACUUM ALWAYS ON >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer on carrier error (vacuum always on)...Read vac.
guage and there was no vacuum present checked vacuum switch
and it read on, replaced switch system back to production.
|
| 37.187 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:25 | 11 |
| SCOMAN::GILMAN 8 lines 22-NOV-1994 06:52
-< water leak >-
--------------------------------------------------------------------------------
WSTK.1 - Down for large DI Water leak. Operator noticed leak and shut off DI
Water in back of system. Before I made it to the system an ERT Call
was placed for liquid raining down in DI Waste Treatment. The sorce of
the liquid was from the DI Water Leak on WSTK.1. Found the Tubing for
the Primary Platen Rinse Ring to have split. Replaced the Tubing with
new Teflon tubing. System did not spring another leak afterwards.
|
| 37.188 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:25 | 7 |
| SCOMAN::GILMAN 4 lines 28-NOV-1994 06:58
-< shuttle hitting wafer >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Shuttle hitting into Wafer in Load Cassette. The Send
Elevator did not look like it was in the HOME Position. Homed
the Elevator and cycled Wafers over system without an error.
|
| 37.189 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:26 | 21 |
| STRATA::MAZE 18 lines 1-DEC-1994 19:27
-< low removal rate >-
--------------------------------------------------------------------------------
WSTK.1 - Down for low removal rates
Completed the monthly pm on tool Found a couple things out of
spec. The down force at 200 lbs was 10 lbs low. Calibrated the down
force for proper indications. Found the platen temps were 10 deg
low. The carrier rotation was out of spec as well. Removed the shim
in the gear box and was able to adjust the rotation with the
turnbuckle. There is a few things that still need to be done:
1. The water for the bowl jet is not turning off in the I/O page
2. The wafer eject takes to long to turn off in the I/O page
3. The front cover interlock is not making contact and needs fixed
4. The carrier rotation was showing 10 rpm when calling for 5
5. The platen rotation RPM's needs to be checked
6. The surgical Pump flows need to be confirmed
*note* a slurry sample was taken to the lab for % of solid measurement.**
|
| 37.190 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:26 | 10 |
| STRATA::CLOUTIER 7 lines 3-DEC-1994 06:45
-< uniformity and mqc's in spec >-
--------------------------------------------------------------------------------
WSTK.1 - Down for low uniformity at the edge at end of C shift.
After repairs were completed and a set screw was replaced
for carrier the uniformity was still low. It was decided
to rebuild a carrier with a 20 micron instead of a 30 micron
carrier. We were told that MQC's just came in spec. Back
to production.
|
| 37.191 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:26 | 6 |
| STRATA::FRANCIS 3 lines 4-DEC-1994 01:43
-< WSTK.1 Shuttle jam. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for a shuttle jam. The shuttle was a little cock-eyed.
adjusted it and ran 10 wafers without any problems. Gave the
system back to MFG.
|
| 37.192 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:26 | 15 |
| SCOMAN::MOTT 12 lines 13-DEC-1994 07:32
-< Process stoped at load station >-
--------------------------------------------------------------------------------
WSTK.1 Went DOWN for, "Process stopped at load point". (Polish arm
would lower to pick up wafer, yet would not rise after vacuum
was achieved). Re-started process while monitoring wafer status
screen and found that "Wafer present at carrier" input
never toggled. (Gauge was at 20" of mercury). Removed
polish arm cover and checked continunity at the vacuum
switch. Vacuum switch checked out fine. Reset tool with
same systems. Tracked wires back to the terminal block,
and found a loose wire. Re-connected and verified fin by running
25 wafers.
|
| 37.193 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:26 | 5 |
| STRATA::REDRIVERS 2 lines 13-DEC-1994 21:35
-< wstk.1 down for shuttle >-
--------------------------------------------------------------------------------
WSTK.1 Down for shuttle movement was sticky...Cleaned the guide rods of
slurry and lubricated with krytox,no further problems.
|
| 37.194 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:26 | 5 |
| YIELD::PROWELL 2 lines 19-DEC-1994 14:40
-< bulk fill >-
--------------------------------------------------------------------------------
Bulkfill went down for 1/2 hour this morning while liquid level sensor was
calibrated. First lot after that was b50526.
|
| 37.195 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:27 | 9 |
| SCOMAN::GILMAN 6 lines 19-DEC-1994 23:06
-< black powder found?! >-
--------------------------------------------------------------------------------
WSTK.1 - Down for leaving a lot black powder on Final Platen. When I had
arrived to the system the operator had cleaned up the mess. He
informed me the Final Platen & Final Basin was covered withg a black
powder. We believe it was coming from the Carrier, because it looked
to be worn down. The operator replaced the Carrier. Gave system
back to MFG.
|
| 37.196 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:27 | 12 |
| STRATA::DEJORDY 9 lines 20-DEC-1994 19:00
-< Shuttle blade problem. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for shuttle blade end came off. Removed the
shuttle blade and re-epoxyed the end on the blade. Checked
out load sequence and made adjustment to the load blade for
centering. Made slight adjustment to the wafer sensor bracket.
Adjusted amp 1 and cycled 25 wafers through system. System
went down again for not picking first wafer. Adjusted AMP 1
to be more sensitive. Cycled 33 wafers with out further problems.
|
| 37.197 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:27 | 17 |
| STRATA::DEJORDY 14 lines 21-DEC-1994 18:30
-< Loader problems. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for shuttle blade was hitting wafer in slot
1. Adjusted the limit switch for the home position on load
indexer.Found wafer was not centered in the load cup. Ad-
justed the shuttle blade and replaced both screws for load
blade. Noticed that the wafer lift assembly was wobbling when
wafer was being picked from shuttle blade. Found Both cylinders
had loose brass top plates. Tightened plates and wobble was
eliminated. System alarmed for load cup not in position.Adjust-
ed the load cup position sensor till it was activated on the
I/O page. Adjusted the wafer centering for the shuttle blade
by adjusting the shuttle blade hard stop. Cycled 25 wafers
without further errors. Ran 3 wafers at positions 1,15,25
to check out if AMP 1 was working correctly,system had no errors
gave machine back to production.
|
| 37.198 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:27 | 10 |
| STRATA::FRANCIS 7 lines 1-JAN-1995 23:33
-< WSTK.1 Wafers not being seen at the Load station. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafers not being seen at the Load station. Made
adjustments to the Lift cup, the Shuttle, the amp for the
through beam sensor for the Load station, and the position
of the sensor itself. Ran several boats of wafers with random
slots open. No more problems occurred. WUP
BF/MT
|
| 37.199 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:27 | 18 |
| LUDWIG::MAZE 15 lines 4-JAN-1995 12:27
-< water leak and bad vacuum switch >-
--------------------------------------------------------------------------------
WSTK.1 - Down for rusty solution on top of the carrier
Found the water seal between the union and the carrier shaft leaking
water. Did not have another seal in stock so i took a sand stone and
removed the gouges and indentations. Assembled the union back to
the carrier shaft and was able to draw 25 inches of vacuum with wafer
and wafer eject did not leak into the arm. Started to run a wafer
through the system and got an alarm for no vacuum on the carrier.
The gauge was showing 25 inches but the display was at zero. Tried
to adjust the gauge for proper indication,, but was unable to.
Removed the gauge and tried an adjustable atmosphere switch for the
8300's, but it did not work as well. I could get it to toggle both
open and closed but each time I could only do it while turning the
thumbwheel on the switch. The switch is to sensitive for this
application. There is no 10"HG switch in stock. The Westech part
number is HT170030.
|
| 37.200 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 16 1996 00:27 | 5 |
| LUDWIG::REDRIVERS 2 lines 4-JAN-1995 23:08
-< WSTK.1 VAC. PROBLEM >-
--------------------------------------------------------------------------------
WSTK.1 Down for vac switch replacement....replaced vac switch syatem
turned over to production for MQC.
|
| 37.201 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:54 | 5 |
| STRATA::REDRIVERS 2 lines 5-JAN-1995 22:21
-< WSTK.1 SHUTTLE DROPPING WAFERS >-
--------------------------------------------------------------------------------
WSTK.1 Down for shuttle dropping wafers...adj. wafer sensor and shuttle
yaw.
|
| 37.202 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:54 | 18 |
| STRATA::MAZE 15 lines 6-JAN-1995 19:23
-< droping wafer in loader >-
--------------------------------------------------------------------------------
WSTK.1 - Down wafers falling off shuttle blade
Found the shuttle blade was jamming the wafer into the back of the
load cassette. Tried to make adjustments and found the jam sensor
set screws were tightened to their stops. Lostened the set screws and
was able to get the shuttle to indicate a jammed condition. Adjusted
the shuttle stops for proper shuttle placement. Removed the lift cup
and disassembled due to slurry build up. Cleaned the lift cup parts
and load station with ISO. Reassembled the cup and made minor
adjustments to the lift sensors and the exit jets. Later the tool went
down for rust dripping down on the carrier. Removed the carrier and
the two seals above it. Found residual water and rust from water leak
previously in the week. Clean up the parts and reassembled the
carrier.
jmz/mt
|
| 37.203 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:54 | 8 |
| STRATA::DEJORDY 5 lines 8-JAN-1995 18:37
-< Particle problem and Scratches on wafer. >-
--------------------------------------------------------------------------------
WSTK.1 System was having particle problem and scratches were seen
on wafers.System was cleaned by production and a new carrier
was installed. MQC's were run and the system passed all
checks. Produtcion ran without further problems.
|
| 37.204 | SYSTEM NOT LOADING WAFERS, PARTICLES | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:55 | 33 |
| STRATA::DEJORDY 30 lines 9-JAN-1995 19:30
-< Many errors. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for unload cassette not loading wafers
properly. Found that the teflon exit track was not pitched
properly. Adjusted the pitch of the track and checked it
with the alignment tool, cycled 20 wafers doing just the
load / unload. Found the D 40 film was causing a particle
problem. The center of the 40 film was worn cause is unknown.
Checked the press temperature,press temp was in spec. Re-
moved the carrier and checked the down force pressure.
Found the down force was off by 10 pounds. Re calibrated
the down force. Removed and replaced the teflon button,
primary,final pads and the conditioner. Gave system back to
production to do MQC's and the polish rate and uniformity
were way out of spec. Found that the safty cam was not
adjusted properly. Adjusted the cam and gave system back to
production to check polish rates again.
|
| 37.205 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:55 | 8 |
| STRATA::REDRIVERS 5 lines 11-JAN-1995 21:38
-< WSTK.1 DOWN FOR DROPPING WAFERS >-
--------------------------------------------------------------------------------
WSTK.1 System down for dropping wafers at load cassette...cassette was
not indexing enough to lift wafer off of the slot in the cassette,
causing it to drag and drop off of the shuttle blade. Adjusted the
wafer detect sensor bar down so that the wafer is being lifted into
the "V" area of the cassette so that there is no drag at all.
|
| 37.206 | DROPPING WAFERS AND NOT PICKING THEM UP | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:56 | 15 |
| SCOMAN::GILMAN 12 lines 22-JAN-1995 04:09
-< multi problems >-
--------------------------------------------------------------------------------
WSTK.1 - Down for dropping Wafers off Shuttle. Found both the Load Indexer
Home Switch & Shuttle Hard Stop too be lose. System was also not
picking Wafers from the Load Cup, when they made it there. Verified the
DI input pressure of 35 PSI. The Vacuum Gauge read 25 Inches of
Mercury, but the Vacuum Switch was not being made. Found the Vacuum
Switch to be leaking air around the Telfon Tape. Tightened the Sensor
with one full turn. Opened up FV13 a little to help with the dispense
of DI Water when the Pre-Wet is activated. Tighten both the Load
Indexer Home Switch and Shuttle Hard Stop then verified operation of
Shuttle and Load Indexer. The PM is in the Incomplete Notes File, it
only needs DI Water Samples done. The H202 Purge was already
completed.
|
| 37.207 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:56 | 10 |
| SCOMAN::GILMAN 7 lines 22-JAN-1995 23:31
-< not picking wafers >-
--------------------------------------------------------------------------------
WSTK.1 - Continued from A Shift with the Carrier not Picking Wafers from the
Load Cup. Installed a new Carrier Vacuum Switch. The new one switches
states at 4 Inches of Hg and the old one switched states at 15 Inches
of Hg. Also adjusted the Shuttle Hard Stop & Shuttle at Indexer
Switch, because the Shuttle was not loading Wafers in the Load Cup
properly. Cycled two full Cassettes of Wafers over system without
error. Gave back to MFG.
|
| 37.208 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:56 | 14 |
| STRATA::POOLE 11 lines 25-JAN-1995 07:20
-< POWERED off/ Conditioner / fumble >-
--------------------------------------------------------------------------------
WSTK.1 System was powered off by operator opening the rear panel.
The conditioner was bouncing around and he wanted to check
the pressure setting and opened the wrong panel. Powered
system back on and checked out the conditioner. The cond-
itioner had just been installed and was not parallel to the
pad. The front edge of the conditioner was catching on the
pad causing the erratic movement. Bent conditioner so it
was parallel. Checked pad and it looked ok. Conditioner
worked fine after adjustment. System later dropped a wafer
on the primary pad. Cleared wafer and it ran the rest of
the night w/o error.
|
| 37.209 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:56 | 5 |
| STRATA::REDRIVERS 2 lines 26-JAN-1995 03:57
-< WSTK.1 NO CARRIER RINSE >-
--------------------------------------------------------------------------------
WSTK.1 Down for carrier not rinsing...Set up Idle Recipe according to
spec. system ran normally.
|
| 37.210 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:57 | 7 |
| STRATA::REDRIVERS 4 lines 26-JAN-1995 07:31
-< WSTK.1 LOUD SQUEEL >-
--------------------------------------------------------------------------------
WSTK.1 Down for polish arm squeeling and loosing wafer on final pad...
removed carrier and shaft cleaned shaft with scotchbrite and
cleaned shaft bushing and all associated parts from rust and
areas where it looked like it was binding up.
|
| 37.211 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:57 | 35 |
| STRATA::MAZE 32 lines 27-JAN-1995 19:40
-< carrier film problems >-
--------------------------------------------------------------------------------
The following is an action list for the Westech carrier problems we have been
having. The carrier film is degregating after only 25 wafers. The carrier
film appears to have circular pieces of film dug out or missing around the
center of the carrier.
1. Check All alignments (DONE)
all alignments are well within spec
2. Check temp and pressure of platen press (DONE)
temp was 277 with set point of 275 and down force was 191 at 30 PSI
3. Call Westech (DONE)
Talked to Tim ST Marie in Phoenix and he has never heard of this kind
of problem before. There should be no way for slurry or contaminants to get
between the wafer and the carrier. He said the 40 film is the only thing
that could cause this problem. He said the film is very temperature
sensitive and if it ever got frozen during shipment that it would no longer
be usable.
4. Order new film from Rodel (DONE)
New film is being rushed in for tomorrow via overnight delivery.
Talked to Kathy at Rodel and she told me they are having trouble with the
adhesive on the 40 film. The lots we have in the stock room is some that has
the old adhesive on it. They are rushing in some 454 grade film for us to
use. This film is similar to the 593 grade film, but has the new adhesive
that was found to be faulty.
5. Try a carrier on WSTK.2 and see if the problem will occur on a different
tool as well. ( IN PROGRESS)
|
| 37.212 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:57 | 11 |
| STRATA::MAZE 8 lines 27-JAN-1995 19:41
-< carrier film problems >-
--------------------------------------------------------------------------------
WSTK.1 - down for carrier film degregation
Rodel has halted production of there 40 film due to adhesive problems.
Westech was called and they said it was the 40 film that was causing
our problems.. There is a new batch with the new glue being rushed
in for tomorrow. Production will be running the tool while checking
the carriers between runs.
|
| 37.213 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:57 | 9 |
| STRATA::DEJORDY 6 lines 30-JAN-1995 19:35
-< Not picking wafers at load cup cycle to long. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for not picking up wafer at the load cup. Found
that the arm speed was to slow. Adjusted the needle valves for
the up and down speed. Cycled 15 wafres through the system and
gave system back to production.
|
| 37.214 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:57 | 10 |
| STRATA::DEJORDY 7 lines 31-JAN-1995 19:06
-< Arm movement and Shuttle movement problems. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for wafer not on polish arm. Found that the
arm down speed was very slow. Adjusted the speed for the up
and down. Found that the shuttle was moving erraticly, cleaned
the guide rods and the bimba piston. Greased the guide rods and
piston rod and cycled the shuttle back and forth. Cycled 20
wafers through the load unload cycle without further problems.
|
| 37.215 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:57 | 8 |
| STRATA::DEJORDY 5 lines 1-FEB-1995 18:29
-< Arm not going down in the clean station. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for arm not drooping down into the clean
station. Found the the vacuum switch for the carrier was
loose. System was reciving the wrong signals. Adjusted the
vacuum switch and cycled 30 wafers throught the system.
system ran without errors for the rest of the day.
|
| 37.216 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:58 | 8 |
| LUDWIG::POOLE 5 lines 8-FEB-1995 07:29
-< dropping particle monitors on primary >-
--------------------------------------------------------------------------------
WSTK.1 System is dropping 3500 micron particle monitors on the
primary when lifting polish arm. Vacuum is good at -20.
Dummy oxides run fine. Having production replace carrier
and primary pad, then run full boat of dummies on particle
recipe.
|
| 37.217 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:58 | 16 |
| SCOMAN::TDYER 13 lines 11-FEB-1995 10:17
-< OCP RESET PROCD. >-
--------------------------------------------------------------------------------
********************************************************************************
procedure for resetting the ocp controler in the westech chase if the
unit does not come back on line after a transfer.
1) press station reset
2) press yes
3) press button #2 (labeled "1")
4) press yes
5) slurry spike now intiated. After 15 minutes go to step 6
6) press button #4 (labeled "2").
7) press yes
8) infinite dispense now initiated
|
| 37.218 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:58 | 7 |
| STRATA::POOLE 4 lines 17-FEB-1995 07:13
-< rattling inpolish arm >-
--------------------------------------------------------------------------------
WSTK.1 Rattling in arm with carrier rotating. Found sensor in arm
out of its bracket. Bracket is stretched and will not support
sensor. Tie wrapped sensor to bracket. Also tie wrapped the
vacuum line so it wasn't touching carrier drive.
|
| 37.219 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:58 | 8 |
| STRATA::DEJORDY 5 lines 20-FEB-1995 19:31
-< Wafer unloading problems. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for wafer unload problems. Adjusted the wafer track
exit jets and adjusted the bowl jets down. Problem was that the wafers
were exiting to fast and not being sensed.
|
| 37.220 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:58 | 10 |
| STRATA::FRANCIS 7 lines 1-MAR-1995 07:25
-< WSTK.1 Vacuum problem >-
--------------------------------------------------------------------------------
WSTK.1 - System went down for not piking up some of the wafers and some of
the wafers were not going into the exit cassette. Made an adjust-
ment to the water track pitch. Ran a casstte of wafers without any
problems. The backs of the product wafers were dull. The Carrier
had no problem achieving vacuum on all of the monitors. Returned
the system back to MFG.
|
| 37.221 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:59 | 6 |
| STRATA::REDRIVERS 3 lines 12-MAR-1995 11:50
-< WSTK.1 TRANSPORT JAM >-
--------------------------------------------------------------------------------
WSTK.1-Down for wafer transport failure...cleared transport-jam,reset
transport and had to reset system. Ran wafers and gave system back
to production.
|
| 37.222 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:59 | 7 |
| SCOMAN::GILMAN 4 lines 14-MAR-1995 05:18
-< no carrier vacuum >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not achieving Carrier Vacuum. Unloaded the Wafer in question
and noticed it was not sitting inside the Carrier perfectly. Ran two
Cassettes of Warm up Wafers without a problem. Gave back to
Production.
|
| 37.223 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:59 | 8 |
| STRATA::DEJORDY 5 lines 14-MAR-1995 19:22
-< Jerky shuttle movement. >-
--------------------------------------------------------------------------------
WSTK.1 System needed to be checked out for jerky shuttle movement.
Found that the guide rods were covered with slurry. Cleaned
and greased the giude rods,ran the shuttle to the elevator and
lifter cup 5 times without further problems.
|
| 37.224 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:59 | 11 |
| LUDWIG::DEJORDY 8 lines 15-MAR-1995 19:34
-< Vacuum and placement problems. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for not picking wafer at load cup.Found that
the shuttle was extending to far into the lifter cup. Adjusted
the hard stop till wafer was centered. System also would not
per wet for vacuum. Removed the flow block and solinoid cleaned
both and reinstalled. Cycled 10 wafers through system without
further problems.
|
| 37.225 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:59 | 8 |
| SCOMAN::GILMAN 5 lines 20-MAR-1995 07:14
-< no carrier vacuum >-
--------------------------------------------------------------------------------
WSTK.1 - Down for no Carrier Vacuum. Pushed up against Wafer and the Carrier
acheived 22 "Hg. After the Wafer was unloaded, it was noticed the
Carrier 40-Film was hanging off the Carrier. It must not have been
cured properly on the PRESS. Operator installed a new Carrier. Gave
back to Production.
|
| 37.226 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 05:59 | 8 |
| STRATA::POOLE 5 lines 22-MAR-1995 07:19
-< system locked up >-
--------------------------------------------------------------------------------
WSTK.1 System was locked up with the polish arm in the clean station.
Arm would not move out of station and no alarms were indicated.
Moved the arm using the cal page. Pressed run and it started
working again.
|
| 37.227 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:00 | 9 |
| STRATA::WESTPHAL 6 lines 25-MAR-1995 17:04
-< SHUTTLE JAM ERROR >-
--------------------------------------------------------------------------------
WSTK.1 - Down for shuttle jam error. Went to I/O page reset the
shuttle and manually moved the shuttle to lift position.
Tried to restart process but received a "wafer not sensed at
lift". Using the I/O page I placed another wafer at the lift
station and restarted with no further problems.
|
| 37.228 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:00 | 26 |
| STRATA::POOLE 23 lines 29-MAR-1995 07:26
-< Pad conditioner repaired >-
--------------------------------------------------------------------------------
WSTK.1 Conditioning arm would not oscillate. Removed pad conditioner
assembly. Cleaned up some of the slurry and verified all prox-
imity switches worked. Reinstalled assembly back into system.
When the conditioner was turned on it would only lift then extend
(rotate) over the pad. It should normally then lower then start
oscillating. Found and repaired broken wire on TB29 7 in the
conditioner assembly (the conditioner terminal bd.s have Final
conditioner terminal bd designations). Arm would then lower and
still not oscillate. Found bad CB6 1 amp breaker which was in
line with the oscillation motor. Replaced CB6 with breaker taken
from WSTK.2 . Pad conditioner ran normally. We had the assembly
connected but not fully installed. When put back to normal the
arm lifted when oscillating. The mounting holes for the assembly
were causing the problem. One of the two holes is stripped, the
other is partially stripped and the only threads that grab are the
last 3 or 4. The screws are to long and bottom out leaving the
assembly slightly loose. The cam hits the top of the screw when
rotating causing the motor to shift of the extend sense switch
which then causes the arm to lift. Installed lock washer beneath
the assembly so it would snug up and fit tightly. System has been
reassmbled and the pads have been removed. Back to production
for full mqc's.
|
| 37.229 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:00 | 6 |
| LUDWIG::POOLE 3 lines 30-MAR-1995 07:27
-< Adjusted the indexer home and thru beam sense >-
--------------------------------------------------------------------------------
WSTK.1 Adjusted the indexer height/home. Adjusted the thru-beam
sensor for wafer sense in each slot using black poly boats.
Ran boat loading and unloading without error.
|
| 37.230 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:00 | 6 |
| STRATA::POOLE 3 lines 31-MAR-1995 07:43
-< TAPPED CONDITIONER MOUNTS >-
--------------------------------------------------------------------------------
WSTK.1 Removed the arm conditioner assembly. Tapped out the mounting
screw holes. Replaced conditioner, tested and put system back
up.
|
| 37.231 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:00 | 23 |
| STRATA::POOLE 20 lines 1-APR-1995 07:21
-< THRU BEAM ADJUSTED AND CHECKED OUT >-
--------------------------------------------------------------------------------
WSTK.2 Started off by adjusting the shuttle stop. Removed the load
station and cleaned up the load/shuttle/indexer area. Ran
dummys and wafers weren't being sensed in the lower middle
of the cassette. The cassette sense switch broke so I replaced
it with a new one of the same type. Noticed the shuttle tray
was cracked and coming apart where it was glued together so
that was replaced also. Tried aligning and always had one or
two slots that it wouldn't see a wafer. Rechecked home and
adjusted it slightly. Still had trouble with thru-beam.
Noticed cassette post that was moved was slightly in line with
the thru-beam sense. Moved the inner sensor to the outmost
mounting holes on the support bracket. Adjusted thru-beam
and it worked for the entire cassette. The mounting bracket is
warped so when it was tightened it went out of adjustment again
Re-aligned and it checked out good. The shuttle was bumping
the thru-beam sensor when it cycled. Cut a slot in the tray
so that it doesn't hit the sensor. WSTK.1 has a similar slot
in the tray. Started marathon run to verify transfer. Ran
2 boats so far using load/unload in manual mode.
|
| 37.232 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:00 | 8 |
| SCOMAN::GILMAN 5 lines 2-APR-1995 04:47
-< no vacuum >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not sensing Carrier Vacuum. Found the Carrier Vacuum Switch
to be defective. It was repalced. Also had problems picking Wafers
from the Top of the Send Cassette. The Through Beam Sensor was
adjusted and 2 Cassettes were run over the system. Gave back to
Production.
|
| 37.233 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:01 | 6 |
| STRATA::FRANCIS 3 lines 3-APR-1995 04:15
-< WSTK.1 Load sensor problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Some of the wafers were not being seen in the load cassette.
Adjusted the through beam sensors and tried wafers in random
locations. They were good. Gave the system back to MFG.
|
| 37.234 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:01 | 11 |
| SCOMAN::GILMAN 8 lines 3-APR-1995 06:21
-< did not pick wafer >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not picking Wafer from Load Station. The Operator had pushed
LOAD NEW WAFER then the Shuttle went into the Cassette, but it did not
pick the Wafer. The system did not have an alarm and the LIFT TO SENSE,
CASSETTE PRESENT & SHUTTLE AT LOAD Sensors were all made. Aborted the
cycle and attempted to use the INPUT/OUTPUT Screen to move the Shuttle,
but it would not respond. The Shuttle would not move even when the
LOAD SERVICE SWITCH was used. EMO'ed the system and it worked fine
after power up. Gave back to Production.
|
| 37.235 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:01 | 7 |
| SCOMAN::GILMAN 4 lines 4-APR-1995 05:45
-< it's working! Isn't that amazing? >-
--------------------------------------------------------------------------------
WSTK.1 - Continued from A-Shift, which started the Monthly PM. Did not do the
Platen Temp. Calibration. Put the system back together and gave back to
Production to have full MQC's done. It survived MQC's. Uniformity
came in around 13 & the Polish Rate was around 1250.
|
| 37.236 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:01 | 5 |
| STRATA::REDRIVERS 2 lines 4-APR-1995 19:04
-< WSTK.1 SHUTTLE >-
--------------------------------------------------------------------------------
WSTK.1-Down for shuttle sticking...cleaned and lubricated guide rods.
Cycled wafers with no problems.
|
| 37.237 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:01 | 10 |
| STRATA::GALAN 7 lines 5-APR-1995 07:18
-< Bad OCP line >-
--------------------------------------------------------------------------------
WSTK.1 - System was down for bulk fill problems. Bulk chemical found
a loose air line in the OCP. Both WSTK.1 and .2 went down
for the same problem later in the shift. Found the same air
line in the OCP blown off of one of it's fittings. Did not
have proper replacement line, cut off expanded piece of
line, re-attached and ty-wraped. No further problems.
|
| 37.238 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:01 | 8 |
| STRATA::REDRIVERS 5 lines 5-APR-1995 18:55
-< WSTK.1 SLURRY SYSTEM >-
--------------------------------------------------------------------------------
WSTK.1 - down for no slurry return to bulk fill...cleaned clogged
valve in recirculation loop on the wall,then had to reset O.C.P.
unit and had to manually open and close return valve in the floor
by removing and replacing the air line several times,reset the
O.P.C. again and let the slurry circulate for one hour.
|
| 37.239 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:01 | 19 |
| STRATA::MAZE 16 lines 8-APR-1995 19:21
-< slurry and polish rate problems >-
--------------------------------------------------------------------------------
WSTK.1 & .2 - Down for slurry problems.
Found the return pressure gauges were as low as 0 psi. Bill Waxman
said the return to the drum was just trickling. Bypassed the filter
and Bill turned up the pump pressure to ~70 psi. Continued the slurry
purge for 3 hours. removed the filter and found it completely solid with
dry slurry. Replaced the filter with a 1 micron filter. The slurry
drum was replaced with a new one, and the new slurry was cycled through
the tool. The pressure gauge is now reading 10 psi on the return.
Tool was turned over to MFG for MQC's.
WSTK.1 - Down for low polish rates.
The 1 micron filter is bypassed and polish rates were ran to see if
the filter is causing the problem.
|
| 37.240 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:01 | 6 |
| STRATA::MAZE 3 lines 8-APR-1995 19:23
-< conditioner down force >-
--------------------------------------------------------------------------------
WSTK.1 conditioner down force= @15 psi = 7 lbs of down force on load
cell.
|
| 37.241 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:02 | 27 |
| SCOMAN::GILMAN 24 lines 9-APR-1995 07:05
-< low polish rates >-
--------------------------------------------------------------------------------
WSTK.1 - Continued from C-Shift, with very low Polish Rates (900). Rechecked
all the Alignments on the Monthly PM. I only made two changes and
they were getting the Gear Box Runout down to .002" & Calibrating the
Arm Down Force. The results are shown below:
PLATEN RUNOUT PLATEN SWEEP GEAR BOX RUNOUT
============= ============== ===============
Primary = +/-.002" Primary = +/-.003" Pre = +/-.005"
Final = +/-.002" Final = +/-.005" Post = +/-.002"
CARRIER SHAFT HIEGHT = .846"
ARM DOWN FORCE
===============
Pre: Display = 184 lbs.
Meter = 200 lbs.
Post: Display = 199 lbs.
Meter = 200 lbs.
The Pads & Conditioner Diamond Plate were replaced then another Polish
Rate was attempted. It was still low, around 900. Put the system to
PRO_ENG.
|
| 37.242 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:02 | 16 |
| SCOMAN::GILMAN 13 lines 10-APR-1995 06:15
-< low uniformity >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Low Uniformity. Found PRV#12 & PL#12,(which are used to
deliver/monitor the Conditioner Down Force), to have loose/leaking
fittings on them. Tightened the fittings in question. The Process
Eng. (Matt V.), questioned whether the Carrier still had Vacuum on the
Wafer while Processing on Primary Platen. Ran the system and did not
see any problem. The Vacuum Gauge stayed right on Zero. Matt V. also
noticed the Slurry Pressure was drifting from 8 psi to 18 psi inside
the Westech. I found the same thing in WSTK.2. While looking for the
source of the problem, the Bulk Slurry went off-line. When it came
back on the Slurry Pressure was steady at 12 psi. Asked operator
to do MQC's on both Westech's. WSTK.1 still had low Uniformity.
The results are shown below: Polish Rate = 1027, Unif. = -12.36 %,
Edge Unif. = 9.65.
|
| 37.243 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:02 | 10 |
| STRATA::REDRIVERS 7 lines 10-APR-1995 18:32
-< WSTK.1 SLURRY POLISH RATE >-
--------------------------------------------------------------------------------
WSTK.1 DOWN for polish rate and uniformity...swapped from bulk slurry
to a barrel behind the tool. Polish rate came up but uniformity
was still out.Measured the curvature and it was 2.7 so had pro-
duction change carrier from a 20 micron to a 30 micron at 245 and
30. Uniformity came in at -3 and 9.6.
Problem with the slurry was that there was water getting into it at
the bulk fill end.
|
| 37.244 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:02 | 19 |
| SCOMAN::GILMAN 16 lines 12-APR-1995 07:38
-< low polish rate >-
--------------------------------------------------------------------------------
WSTK.1 - Continued form A-shift. Red R. rebuilt the Carrier Gear Box &
installed. B-shift filled the Gear Box with oil and adjusted all
affected alignments. Needed to install a .004" shim for the Gear Box
to get the Left-Right in spec. The results are shown below:
CARRIER SHAFT HEIGHT = .853" (no shims required)
GEAR BOX RUNOUT = +/-.002" (.004" shim required)
PLATEN SWEEPS
=============
Primary = +/-.002"
Final = +/-.004"
Polish Rate is still Low at (717), with a 20 Micron Carrier.
|
| 37.245 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:02 | 7 |
| STRATA::REDRIVERS 4 lines 12-APR-1995 16:22
-< WSTK.1 POLISH RATE >-
--------------------------------------------------------------------------------
WSTK.1 Down for low polish rate ....checked down force and it was OK
noticed that the cam follower block was too close to the center
shaft, adjusted the same and the polish rates and uniformity rates
came in at 1209 and 5.5%.
|
| 37.246 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:02 | 135 |
| STRATA::FRANCIS 132 lines 14-APR-1995 05:52
-< Game plan >-
--------------------------------------------------------------------------------
================================================================================
SUBJECT: WSTK.1 +.2 ACTION PLAN for 4/14/95
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
PLEASE FOLLOW THE ACTION PLAN, WE NEED TO STAY ON TRACK IF WE ARE TO
BE SUCCESSFUL IN IDENTIFYING ALL OUR PROBLEM AREAS. THE TOOLS (WSTK.1,
WSTK.2) NEED TO BE SEPARATED FROM THE CONSUMABLES (40FILM, PADS AND
CONDITIONER). IF YOU NEED TO VARY FROM THE PLAN PLEASE CALL ME AT
HOME, 699-4905.
WSTK.1 - After running lot B50977-39 the ending polish rate (unif)
a standard polish rate and the pilot for the NEXT LOT was
INSPEC , however the uniformity is drifting towards center
slow. Other than specific hardware issues, this has been our
primary problem for the last several weeks. THIS IS THE ONE
WE NEED TO FOCUS ON.
WSTK.2 - After shuttle replacement this tool still indicated a gimbling
problem (2 sets of apposing low/high polish rates). The tool
alignment was check ad the following adjustments were made:
pre post
Crr RU +.013 +.003"
Plt Swp +.008 +.003"
balance front neutral
WSTK.2 - After alignment the following test were conducted to isolate the
WSTK, 40 film or PAD.
2 PR with carrier 881 (40 film) 940 -10%, 5%, (gimbling)
1 PR with BE carrier (DF-200film) 920 0%, 4.5% (no gimbling)
2 PR with carrier 881 (40 film) 940 -10%, 5%, (gimbling)
1 PR with carrier 389 (40 film, 30u) 570 -8%, 13%,
* The gimbling is not due to an equipment issue all hardware has been
checked and re-checked . The gimbling effect is most likely
a false problem. The 40film could ether be swelling or collapsing
on opposing sides of the wafer.
* Nothing but the CARRIERS (carrier film type) were changed in between
these test!
STATEMENT: This last test with WSTK.2 and the fact that WSTK.1's and WSTK.2's
uniformity changes drastically with carrier changes ONLY, and the
DF200 test results point to the 40 FILM. On the last PR for WSTK.2
the rate dropped almost in half, see the WSTK.2 action plan.
The last test to be run on WSTK.2 will test the IC1000 pads for
the uniformity problem. After completion of these test we should
know PAD or carrier film.
Plan: WSTK.1:
1) Run lots, do standard post polish rate checks, if uniformity
drifts negative again please do the following:
2) Continue to build carrier with 40film lot 6y07517 on the 20u
press at 245.
3) Although it seems like we have been doing this over and over, please
replace the carrier when the uniformity goes out of spec. We are
We will work this film issue aggressively. For now, we have to use
the 40film and multiple carriers.
WSTK.2:
Done 1) Check RPC conditioner for proper operation (due to the rate drop).
Picked up a new conditioner disk for RPC2 which is in the clear
cabinet. The one on there now looked good.
Done 2) Reinstall 389, check PR.
Done 3) Install the "glue on top" pad. This is from an old IC lot which
we had good results with. Clean the bad with a nylon brush and
run several extra condition cycles.
- Check PR, if good, run 3 dummies, PR, 3 dummies PR.
If good run lots and Engineering will acquire a new batch of
IC pads.
***If the "old" pad proves to be successful on WSTK.2, go to the SR
and pull IC1000 from a lot other than DB5-xxx and install it on
WSTK.1.
========
WSTK.1 summary of uniformity drifting:
Carrier PR unif edge lot
434 1240 9 6 ct5-la1
ran ONE lot
434 1095 -5 8 ct5-la1
change carrier
868 1116 -7 8 ct5-la1
change PRIMARY pad
868 1270 1.6 8 ct5-la1 SLOW edge spot
change carrier
389 890 25 11 ct5-la1
change carrier
409 1070 8 9 ct5-la1
ran one LOT
409 947 -1 10 ct5-la1
========
WSTK.2 summary
Carrier PR unif edge lot
881 940 -10 5 ct5-la1 gimbling symptom
BE 930 0 4.5 df200 +warmups looked OK
881 940 -11 5 ct5-la1 gimbling symptom
389 975 -9 13 6y07517 (30u)
|
| 37.247 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:02 | 6 |
| SCOMAN::GILMAN 3 lines 17-APR-1995 07:14
-< high particles >-
--------------------------------------------------------------------------------
WSTK.1 - Down for high Particles. Purged the DI Water Supply with H202 &
changed both Pads. Particles came in spec.. Gave back to Production.
|
| 37.248 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:03 | 7 |
| STRATA::POOLE 4 lines 19-APR-1995 07:21
-< wafers stuck at exit track >-
--------------------------------------------------------------------------------
WSTK.1 Wafers were getting stuck under the carrier at the water trap.
Adjusted polish arm balance and the exit track height. Ran
warm-ups without error.
|
| 37.249 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:03 | 9 |
| STRATA::POOLE 6 lines 22-APR-1995 07:24
-< thru-beam adjusted bulk problems >-
--------------------------------------------------------------------------------
WSTK.1 Slurry light came on at 5:20 AM. Had security call Bulk Fill
contact.
WSTK.1 Load index was skipping the 3rd wafer. The thru-beam sensor assembly
was loose and must of gotten bumped. Adjusted thru-beam and checked
all slots.
|
| 37.250 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:03 | 8 |
| SCOMAN::GILMAN 5 lines 24-APR-1995 06:21
-< not picking wafers >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not picking wafers from the top of a Cassette from the Load
Station. Needed to adjusted the HOME & THROUGH BEAM Sensors to have
Wafers picked from every Slot. Randomly placed Wafers in Load Cassette
and it ran without a problem. A Total of 40 Wafers were run. Gave
back to Production.
|
| 37.251 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:03 | 6 |
| SCOMAN::GILMAN 3 lines 26-APR-1995 00:01
-< dead switch >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not picking a Wafer from the Load Cup. Found the SHUTTLE TO
LIFT Switch to be defective. It was replaced and the system was put
back into production.
|
| 37.252 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:04 | 6 |
| STRATA::POOLE 3 lines 27-APR-1995 07:26
-< Thru-beam sensor adjusted >-
--------------------------------------------------------------------------------
WSTK.1 Loader wasn't seeing the 3rd wafer in the cassette. Adjusted the
Thru-beam sensor. Checked wafer sense on each slot.
|
| 37.253 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:04 | 6 |
| STRATA::POOLE 3 lines 29-APR-1995 07:27
-< system powered off >-
--------------------------------------------------------------------------------
WSTK.1 System powered off. Powered back up with no problems. Platen
breaker was tripped when powered back on. Reset breaker.
|
| 37.254 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:04 | 29 |
| STRATA::WESTPHAL 26 lines 29-APR-1995 17:00
-< REP.'S VISIT >-
--------------------------------------------------------------------------------
WSTK - Rep. was in today as planned but did not do anything with the software
on either tool because he had some problems with his software kit.
Ran a boat of wafers on both tools to observe how they were operating.
Every thing looked good except the shuttle on WSTK.1 was skipping
a little so he adjusted the flows to the shuttle. The rep. said that
he would get in touch with Tim Dyer as to when he would be back to
upgrade the software.
|
| 37.255 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:05 | 5 |
| STRATA::POOLE 2 lines 3-MAY-1995 07:32
-< water samples taken >-
--------------------------------------------------------------------------------
WSTK.1 Water samples taken. Semi-annual incomplete in 17.295
|
| 37.256 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:05 | 13 |
| STRATA::POOLE 10 lines 4-MAY-1995 07:38
-< Thru-beam mis-aligned again >-
--------------------------------------------------------------------------------
WSTK.1 Shuttle jam error. Thru-beam sense missed a wafer and caused the
jam. Removed the thru-beam assembly and tightened all screws.
System kept on missing wafers or seeing ghost wafers in various
slots. Tightened all screws on the loader assembly. Adjusted
thru-beam and ran thru all slots with no errors. Verified align-
ment and gave back to production. System errored again for
shuttle jam. Shuttle hit a wafer in the 10th slot.
|
| 37.257 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:05 | 17 |
| STRATA::WESTPHAL 14 lines 4-MAY-1995 19:42
-< PEAK BOAT UPGRADE >-
--------------------------------------------------------------------------------
WSTK.1 - Thru-beam was not sensing wafers correctly. It was decided that while
the tool was down that the peak boat modifications should be done.
That was completed and a new cassette sense micro-switch was also
installed. While trying to adjust the sensor it was discovered that
one of the screw holes were stripped out so the same was retapped for
a bigger screw. The thru-beam was then adjusted so all wafers were
being sensed. Ran a lot of wafers but kept receiving errors for a
wafer not being sensed on the carrier. Checked the vacuum switch and
inspected load cup but didn't see any thing wrong. This could have
been due me not operating the tool software properly. With some
assistance from an operator a lot was run with out any problems and
the tool was put up.
|
| 37.258 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:05 | 9 |
| STRATA::POOLE 6 lines 5-MAY-1995 07:07
-< vacuum error >-
--------------------------------------------------------------------------------
WSTK.1 No wafer in carrier error. Vacuum gauge showed -20mm Hg. while
screen displayed vacuum was not achieved.
Adjusted the vacuum switch. Ran warm-ups w/o error.
|
| 37.259 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:06 | 15 |
| STRATA::WESTPHAL 12 lines 5-MAY-1995 19:21
-< VACUUM PROBLEM >-
--------------------------------------------------------------------------------
WSTK.1 - Down for system not sensing wafers on the carrier. Changed out the
vacuum switch and adjusted it to sense properly. The arm
will move to pick a wafer and then hesitate about 25 sec before
registering vacuum or alarming for no wafer in the carrier. Pulled
and cleaned the load cup and reinstalled it but still had the same
problem. Tried adjusting the position of the LC with the play in the
center bolt. Suspected that the shim height on the carrier might be
to high or the carrier might some how be the problem but this didn't
make any difference either.
Ran out of time to go any further.
|
| 37.260 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:06 | 12 |
| STRATA::POOLE 9 lines 6-MAY-1995 07:20
-< VAC SWITCH ADJUSTED/ NEW GAUGE ADDED >-
--------------------------------------------------------------------------------
WSTK.1 Checked out the vacuum problem. Gauge showed -23 mm Hg and the
screen indicated no vacuum. Adjusted the vacuum switch and trans-
ferred wafers with no errors. Installed another vacuum gauge on
the system so a gauge can be seen from the front at all times.
Vacuum is adjusted so it is being sensed at -12 mm HG.
Completed some of the Semi-annual checks.
incomplete 17.299
|
| 37.261 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:06 | 6 |
| SCOMAN::GILMAN 3 lines 7-MAY-1995 07:08
-< SHUTTLE NOT WORKING >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not Shuttle not working. Found the SHUTTLE TO EVEVATOR &
Load Elevator CASSETTE PRESENT Switches to be in need of adjusted.
Ran a full Cassette of Wafers over the system without problem.
|
| 37.262 | WAFERS NOT ENTERING UNLOAD CASSETTE | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:06 | 5 |
| SCOMAN::GILMAN 2 lines 8-MAY-1995 23:13
-< i >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Wafers not entering into the Unload Cassette. Adjusted the
Exit Slide & cycled a Cassette of Wafers without a problem.
|
| 37.263 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:07 | 11 |
| LUDWIG::POOLE 8 lines 11-MAY-1995 07:40
-< shuttle jam caused by peak /thru-beam >-
--------------------------------------------------------------------------------
WSTK.1 Shuttle jammed caused by thru-beam not sensing the third wafer
in cassette. Checked alignment with warm-ups and it looked good.
Checked alignment with the product and it missed the third wafer
again. Noticed the cassette with the product was new. Placed
a small wrench on cassette inner bottom surface and the thru-beam
sensed the wafer. The reflection is causing the fault. The
cassette with the warm-ups looked old ( less shiny ). Swapped
boats and the product was sensed in the third slot.
|
| 37.264 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:07 | 9 |
| STRATA::DAVIS 6 lines 31-MAY-1995 17:48
-< Slurry filter changed >-
--------------------------------------------------------------------------------
WSTK.1 and WSTK.2 -
A new slurry filter was installed, the filter housing was
filled with slurry and the slurry supply line was reconnected.
The slurry filter bypass valve was closed and the isolation
valves for the filter were opened.
|
| 37.265 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:07 | 9 |
| LUDWIG::DEJORDY 6 lines 5-JUN-1995 08:12
-< Polish arm problem. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for polish arm would pick up wafer at load cup.
found that the polish arm was not centered over the load cup.
aborted the process moved the polish arm. Restatred the process
and system ran without further problems.
|
| 37.266 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:07 | 9 |
| STRATA::REDRIVERS 6 lines 8-JUN-1995 22:11
-< WSTK.1 SHUTTLE JAM 3RD WAFER >-
--------------------------------------------------------------------------------
WSTK.1-Down for shuttle jam on third wafer...replaced cassette and
still had the same problem, ran dummy wafers and still had the
problem,noticed that the cassette was indexing too far. So I
adjusted the cassette home switch to give the shuttle enough
clearance from the next wafer and aslo had to adjust the thru
beam sensor.Back to production.
|
| 37.267 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:07 | 7 |
| STRATA::POOLE 4 lines 10-JUN-1995 07:24
-< slurry barrel on 1 >-
--------------------------------------------------------------------------------
WSTK.1 Installed slurry barrel to rear plumbing.
WSTK.2 DOWN: polish arm won't lift. Installed barrel. Later the
polish arm lift stopped working. Found sol 1 bad.
|
| 37.268 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:08 | 5 |
| STRATA::REDRIVERS 2 lines 15-JUN-1995 05:02
-< WSTK.1 PLATNE TEMPS >-
--------------------------------------------------------------------------------
WSTK.1-Recalibrated the platen temps because they system was erroring
for platen temp.
|
| 37.269 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:08 | 14 |
| STRATA::DSMITH 11 lines 19-JUN-1995 19:16
-< vacuum problems>-
--------------------------------------------------------------------------------
WSTK.1 System down for loosing vacuum.
The problem is hard to trace since it happens
6 out off 25 wafers. Tightened all the fitting for
the vacuum lines. Turned on wafer eject flow, all the
holes on the carrier are o.k. Tried running 2 more
warm up through and the vacuum was lost during transfer
from primary to clean station. Ran out of time to investigate
further. The carrier was changed on Saturday from a 20 mic.
to 30 mic. Problem has been re-occuring since Sunday.
|
| 37.270 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:08 | 15 |
| STRATA::FRANCIS 12 lines 20-JUN-1995 05:56
-< WSTK.1 Bad carrier. >-
--------------------------------------------------------------------------------
WSTK.1 - Down from the previous shift for loosing wafers at the Primary
pad. Placed a wafer on the carrier and enabled the vacuum. The
vacuum was achieved when pressing against the wafer and down on
the top of the carrier at the same time. Tried this with a few
wafers with the same result. Found a few spots of slurry build
up on the film. The operator replaced the carrier and a boat of
wafers were run on the DEC-CMOS5 recipe. The vacuum went up 20
Hg of water on all the wafers. None of the wafers fell off. The
arm was coming up a little jerk. There seemed to be a bit of a
suction on the wafer. The polish arm is going over the edge of
the platen. Adjusted the arm-up speed slower. Ran the rest of
the wafers without a problem. Gave the system back to MFG.
|
| 37.271 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:08 | 6 |
| STRATA::DSMITH 3 lines 20-JUN-1995 18:57
-< transport jammed >-
--------------------------------------------------------------------------------
WSTK.1 Down for "Transport Jammed"
Removed wafers from the load station and reset shuttle.
Cycled warm ups thru with no problems. Gave back to production.
|
| 37.272 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:09 | 8 |
| LUDWIG::WESTPHAL 5 lines 21-JUN-1995 18:18
-< SHUTTLE JAM AND LOST WAFER >-
--------------------------------------------------------------------------------
WSTK.1 - Down for a shuttle jam error. Reset the shuttle and while running
the machine to check it out it lost vacuum and thought it lost a
wafer. Cleared the error and rinsed the carrier w/ DI water.
Tool ran with no further errors.
|
| 37.273 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:09 | 12 |
| STRATA::DSMITH 9 lines 27-JUN-1995 19:19
-< LOOSING VACUUM >-
--------------------------------------------------------------------------------
WSTK.1 System down for loosing vacuum.
The fittings to the vacuum lines are all tight. Place
a wafer up against the carrier with the vacuum on and
the gauge read over 20hg. The wafer was only lost after
polishing so, the shims on the carrier were remeasured.
The operator found it to be a little off so they put
new shims on and retried the polish. No wafers have come
off after running 25 wafers. System is back to PRO_ENG.
|
| 37.274 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:09 | 5 |
| STRATA::REDRIVERS 2 lines 30-JUN-1995 22:23
-< WSTK.1 CONDITIONER INOP >-
--------------------------------------------------------------------------------
WSTK.1- Down for conditioner would not sweep...found a broken wire on
TB29, repaired the same and problem solved.
|
| 37.275 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:09 | 12 |
| <<< SCOMAN::SILVER$:[NOTES$LIBRARY]ETCH.NOTE;4 >>>
-< ETCH >-
================================================================================
Note 96.316 WESTECH PASSDOWN 316 of 437
STRATA::WESTPHAL 5 lines 5-JUL-1995 18:29
-< NOT PICKING WAFERS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for polish arm not picking wafers. System seemed to be locked
up. Powered the tool down and powered it back up. Noticed the vacuum
switch was always sensing on so adjusted same. Cycled 3 wafers w/ no
further problems gave tool back to production.
|
| 37.276 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:09 | 12 |
| STRATA::REDRIVERS 9 lines 7-JUL-1995 07:15
-< WSTK.1 PM >-
--------------------------------------------------------------------------------
WSTK.1-Continued from C shift on monthly pm...platen run outs were good
and leveled carrier arm to 04.050in at the back and the front is at
04.052in. Tried to do sweeps and they went from left 5 to center 0
and the right went to 5 again on the primary platen. On the final
platen the deviation was even greater. Checked the carrier run out
and the it was out 0.015in tried to shim the gear box and it made
it worse so removed the shim and tried to shim the other side and
the same thing happened so I took the shim out. Check it out on
the final platen and it seemed worse than the primary platen.
|
| 37.277 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:09 | 7 |
| SCOMAN::GILMAN 4 lines 9-JUL-1995 06:12
-< finshed monthly pm >-
--------------------------------------------------------------------------------
WSTK.1 - Continued from previous shift with the Monthly PM in Progress.
Got all the Mechanical Alignments after a lot of persuasion. The PM
is in the incomplete Notes File, because the DI Water Sample was
not taken.
|
| 37.278 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:10 | 7 |
| STRATA::STANDING 4 lines 14-JUL-1995 17:13
-< Power Up Problem. >-
--------------------------------------------------------------------------------
WSTK.1 Down for not powering up. Checked all of the cabinet
interlocks found Primary heat exchanger not making contact with door.
Powered up machine and returned to production.
|
| 37.279 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:10 | 6 |
| STRATA::POOLE 3 lines 15-JUL-1995 07:28
-< VAC sense error/ adj switch >-
--------------------------------------------------------------------------------
WSTK.1 Vacuum switch not sensing vac at -24 mm Hg. Adjusted switch
and cycled boat thru w/o error.
|
| 37.280 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:10 | 7 |
| STRATA::STANDING 4 lines 15-JUL-1995 11:03
-< Wafer not released when arm is down on pad. >-
--------------------------------------------------------------------------------
WSTK.1 Down for vacuum not releasing wafer when arm is down and
over polish pad. Checked down force, It was not being sensed. Loaded
Cal data, down force was then sensed and wafer was released. Ran three
more wafers with no errors, returned to production.
|
| 37.281 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:10 | 10 |
| STRATA::DSMITH 7 lines 25-JUL-1995 10:28
-< low polish rate and water samples taken >-
--------------------------------------------------------------------------------
WSTK.1 - The system is down for LOW POLISH RATE
Checked the down force and it was out by only 8.
Calibrated the down force and put a new primary
pad on. The system is being evaluated and is still
at PRO_ENG.
WSTK.1 and 2 - WATER SAMPLES TAKEN
|
| 37.282 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:10 | 6 |
| STRATA::DSMITH 3 lines 25-JUL-1995 14:56
-< loose wire in conditioner arm >-
--------------------------------------------------------------------------------
WSTK.1 - System down for conditioner arm not oscillating
Found loose wire on TB 29. Crimped wire on and
it ran fine. System is back to production.
|
| 37.283 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:10 | 7 |
| STRATA::REDRIVERS 4 lines 26-JUL-1995 07:23
-< WSTK.1 HIGH UNIFORMITY >-
--------------------------------------------------------------------------------
WSTK.1-Down for high uniformity 24%...checked out system and could not
find anything wrong, ran a half of a cassette of warm up wafers and
the uniformity dropped to 12%. So had production run another full
cassette of warm ups.
|
| 37.284 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:10 | 9 |
| STRATA::WESTPHAL 6 lines 28-JUL-1995 17:16
-< VACUUM PROBLEMS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not sensing wafer on the carrier properly. Loosened the set
nut on the vacuum switch to adjust it and some water dripped out. So
the same was swapped out and adjusted. The operator complained about
the load cup squeaking so adjusted it with the center bolt. Ran a
boat of wafers w/o a problem so the tool was returned to
production.
|
| 37.285 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:10 | 7 |
| STRATA::POOLE 4 lines 29-JUL-1995 07:09
-< load cassette sense adjusted >-
--------------------------------------------------------------------------------
WSTK.1 Load cassette present sensor was not sensing cassette. Adjusted
sensor tab.
|
| 37.286 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:11 | 12 |
| SCOMAN::JONES 9 lines 1-AUG-1995 07:40
-< LOAD CASSETTE SWITCH AGAIN >-
--------------------------------------------------------------------------------
WSTK.1 - Down for load cassette not being sensed, adjusted the load cassette
limit switch about 20 degrees to give the rocker arm more throw, also
when running test wafers the wafer handler was not holding the wafers
level, adjusted handler, then observed polishing arm was not lowering
smoothly when unloading, adjusted the rotational bumper, then wafers
were not sliding well on the slide so increased the water pressure and
corrected the problem, returned to production.
|
| 37.287 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:11 | 9 |
| STRATA::FRANCIS 6 lines 1-AUG-1995 23:43
-< WSTK.1 Wafer missing - P arm. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer missing on the Polish arm. The Shuttle was going
into the Lift chuck too far and a little too fast. Adjusted the
hard stop and the position switch for the Shuttle at the lift.
Also adjusted FV14A and B to slow down the Shuttle to the Lift
and the Load indexer. The Lift chuck was centered, too. Ran a
boat of wafers without any errors.
|
| 37.288 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:11 | 6 |
| STRATA::REDRIVERS 3 lines 3-AUG-1995 03:31
-< WSTK.1 VACUUM PROBLEM >-
--------------------------------------------------------------------------------
WSTK.1-Down for vacuum being sensed when the guage read "0"...adjusted
the wafer vacuum switch so that it trips at 10hg and ran wafers
without any further problems.
|
| 37.289 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:11 | 9 |
| STRATA::WESTPHAL 6 lines 4-AUG-1995 19:27
-< GRINDING NOISE WHILE POLISHING >-
--------------------------------------------------------------------------------
WSTK.1 - Never went down in the system but was making a load grinding noise
polishing. Found that a military connector in the polish arm had
fallen out of its bracket and was rubbing against the carrier drive
shaft. Tie wrapped the connector into its bracket tool ran w/ no
further problems.
|
| 37.290 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:11 | 8 |
| STRATA::POOLE 5 lines 10-AUG-1995 21:59
-< SHUTTLE SHAFT CLEANED >-
--------------------------------------------------------------------------------
WSTK.1 - Shuttle was not moving into the load point smoothly causing
wafer to intermittently load misaligned. Cleaned the shuttle
guide shafts.
|
| 37.291 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:11 | 8 |
| SCOMAN::JONES 5 lines 14-AUG-1995 07:35
-< UNKNOWN WAFER AT POLISHING ARM >-
--------------------------------------------------------------------------------
WSTK.1 - Down for unknown wafer on polishing arm, the wafer did not seat
properly when loaded to the load cup, tried to repeat the problem but
was unable to. Returned to production.
|
| 37.292 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:11 | 5 |
| STRATA::WESTPHAL 2 lines 18-AUG-1995 19:38
-< UNLOAD NEEDS TO BE UPGRADED >-
--------------------------------------------------------------------------------
WSTK.1 - Tim would like the unload station converted to handle the teflon boats
tonight if possible.
|
| 37.293 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:12 | 10 |
| STRATA::DSMITH 7 lines 22-AUG-1995 14:11
-< teflon boats >-
--------------------------------------------------------------------------------
WSTK.1 and 2 - Modification on unload station for teflon boat.
Adjustments were made to the unload elevator home sensor.
Completed the modifications ran 3 boats of wafers.
Found the shuttle blade on wstk.2 was not placing the wafer
in the load cup properly. Found screws loose on the shuttle.
Tightened the screws and wafer is now centered in the cup.
Both Systems are back to production.
|
| 37.294 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:12 | 7 |
| STRATA::STANDING 4 lines 23-AUG-1995 11:20
-< Boats hanging up. >-
--------------------------------------------------------------------------------
WSTK.1 Down for wafers hanging up in the unload station. Shaved boat guide
posts so that white boats fit more easier. Adjusted home sensor,
two boats no problem. Returned to production.
|
| 37.295 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:12 | 5 |
| STRATA::STANDING 2 lines 23-AUG-1995 19:15
-< Double slotting a wafer in unload. >-
--------------------------------------------------------------------------------
WSTK.1 Down for double slotting a wafer into slot 3. Not enough time to
adjust unloading station tilt.
|
| 37.296 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:12 | 10 |
| Note 96.337 WESTECH PASSDOWN 337 of 437
STRATA::REDRIVERS 6 lines 24-AUG-1995 02:19
-< WSTK.1 UNLOAD STATION >-
--------------------------------------------------------------------------------
WSTK.1 Down for double slotting wafers in the unload station...found
the cassette leveling plate was installed backwards, fixed it
and had to adjust the home switch and turned down the water jets
in the exit tray to slow the wafer down so that the sensor could
see it to index the cassette down.
|
| 37.297 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:12 | 12 |
| STRATA::STANDING 9 lines 25-AUG-1995 18:59
-< Polish rate fell off. >-
--------------------------------------------------------------------------------
WSTK.1 Down because polish rates fell off. Had production change carrier,
no change. Checked air to conditioner arm, OK. Removed final pad
to check polish arm down force. Noticed that down force was not
acting properly. Removed covers on arm and was able to tell right
away that the arm was not coming down fully. Found the swing
interlock pushed to far forward, set it in the correct position.
Recalibrated down force. Returned to production for polish rate
checks. System was put to verify.
|
| 37.298 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:12 | 11 |
| STRATA::STANDING 8 lines 26-AUG-1995 18:01
-< Unload station having problems >-
--------------------------------------------------------------------------------
WSTK.1 Put down because of wafer getting hung up in the unload station.
Found the water was not cascading over the sides of the unload
station. Found the two gaskets that stop the water from cascading
over the entrance lip missing. Replaced gaskets and readjusted
unload station for a smooth transfer.
|
| 37.299 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:12 | 11 |
| STRATA::DSMITH 8 lines 5-SEP-1995 17:29
-< load station >-
--------------------------------------------------------------------------------
WSTK.1 - Load Elev. wouldn't pick-up 25th wafer
The wafer detec. sensor was showing it did find a
wafer but when the shuttle entered the cassette the
elevator wouldn't step down to allow the wafer to seat
in the shuttle. Adjusted the elevator home switch up and then the
first wafer wasn't being seen. continued to adjust the
home switch until both 1st and 25th wafer was acknowledged.
Ran 2 boats with no problems. System is back to production.
|
| 37.300 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:13 | 7 |
| STRATA::STANDING 4 lines 6-SEP-1995 19:20
-< Load Station Loading problems >-
--------------------------------------------------------------------------------
WSTK.1 Down for shuttle hitting the wafers in the load elevator.
Adjusted the home sensor and error went away. Ran 5 boats with no
errors. Returned to production.
|
| 37.301 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:13 | 14 |
| STRATA::WESTPHAL 11 lines 8-SEP-1995 19:32
-< WAFER HANDLING PROBLEMS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for shuttle hitting wafers in the load elevator. Opti's were
adjusted because slot 3 and 16 were not being sensed properly. The
plunger screws for the shuttle jam load cell was completly tight on
one side and was not operating correctly. The same was adjusted.
The shuttle blade was twisted to one side so that wafers were being
placed in the cup unevenly. Straightened the blade out. The unload
elevator was floating the wafers out when it was stepped down. This
could not be adjusted out w/ the set screws so the shoe had to be
shimmed and the station realigned.
|
| 37.302 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:13 | 5 |
| STRATA::REDRIVERS 2 lines 9-SEP-1995 07:44
-< wstk.1 beam director >-
--------------------------------------------------------------------------------
WSTK.1 - Manufactured and installed beam director on sender cassette still
has to be aligned.
|
| 37.303 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:13 | 10 |
| STRATA::WESTPHAL 7 lines 9-SEP-1995 19:22
-< HANDLING PROBLEMS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for the wafers not being sensed properly. Last shift installed
a new part to help focus the beam of the opti-sensor. Realigned
sensors. The sensors seem em to be sensing properly and the problem
of the shuttle hitting the wafers seems to be gone. Now wafers
are sometimes being missed giving a "no wafer at load" error.
|
| 37.304 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:13 | 15 |
| STRATA::FRANCIS 12 lines 10-SEP-1995 07:30
-< WSTK.1 Wafer sensing problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Still down for some of the wafers not being seen. Tried to load a
wafer that was sensed and the shuttle went to the elevator but just
sat there. The system then errored for taking too long and trans-
port fail. Increased the pressure for the shuttle to lift and open-
ed FV14A a little. The shuttle had no more problems. Tried a number
of adjustments to the thru beam sensor and to Amp1. Most of the
wafers were seen but not all. Tried to tightened the screw, closest
to the lift, of the mount for the thru beam sensor and the hole
stripped before the screw could be tightened all the way. Tapped
the hole out and drilled the mounting holes for both screws. The
screw for the other hole is not a perfect fit to begin with. The
mount will be brought to the passdown.
|
| 37.305 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:13 | 12 |
| STRATA::DSMITH 9 lines 10-SEP-1995 18:07
-< shuttle errors >-
--------------------------------------------------------------------------------
WSTK.1 - Down from previous shift for Load station problems.
The wafer sensor bracket was remounted and adjusted.
After half of the 2nd boat of wafers were run the system
failed for shuttle errors. The shuttle wouldn't return
to the Load Cup. Cleaned the shuttle rails and added
Krytox grease to them. System stilled failed to return
shuttle to Load Cup. Adjusted the PRV 6 and 9 and the
Flow valves 14 A and B. Ran 2 boats of warm-up wafers
with no problem. System is back to production.
|
| 37.306 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:13 | 7 |
| SCOMAN::GILMAN 4 lines 12-SEP-1995 07:11
-< high particles. >-
--------------------------------------------------------------------------------
WSTK.1 - Down from previous shift for high particles. Cleaned the Exit Track
and rinsed both Pads with DI. Had production perform a particle check
and it came in spec..
|
| 37.307 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:13 | 7 |
| STRATA::REDRIVERS 4 lines 15-SEP-1995 06:25
-< WSTK.1 >-
--------------------------------------------------------------------------------
WSTK.1 - Wafers not going into the exit cassette at the top...adjusted the
cassette mount so that the cassette plate would not drag on the
back of the teflon cup and change the position of level as in got
closer to the bottom of its travel or the top of the cassette.
|
| 37.308 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:14 | 5 |
| SCOMAN::GILMAN 2 lines 24-SEP-1995 06:55
-< conditioner not aligned >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not Conditioning properly. Found the Conditioner Arm to not
be aligned correctly. Aligned same and tested.
|
| 37.309 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:14 | 13 |
| STRATA::DEJORDY 10 lines 27-SEP-1995 08:13
-< Configuration changes. >-
--------------------------------------------------------------------------------
WSTK.2 System was not put down but the configuration was changed with
the help from Mark Stevens of IPC westech. He was not sure that
this change would help our on going problem with the RPC2.
Confiuration changes made were.
Previous Now
Disket 1 was 1.4 Disket 1 is none
Bioshadowing was enabled Bioshadowing is not shadowing bias
Keyboard/disk errors was hault Keyboard/disk errors is no hault
8 bit wait state was 1 8 bit wait state is 4
|
| 37.310 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:14 | 9 |
| STRATA::WESTPHAL 6 lines 5-OCT-1995 19:34
-< ARM UPGRADE >-
--------------------------------------------------------------------------------
WSTK.1 - Down for arm run away / software upgrade. The arm upgrade was
completed but there was a problem new software that was installed
yesterday. The old software was reloaded and the tool is up for
production. WESTECH is going to attempt to correct the problems with
the new software.
|
| 37.311 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:14 | 11 |
| STRATA::WESTPHAL 8 lines 6-OCT-1995 19:21
-< Arm wont move CCW >-
--------------------------------------------------------------------------------
WSTK.1 - Problems with the arm not moving CCW. Never put down in the system
but engineering requested that a special pad ( triple stacked ) change
be done and .050 be subtracted from the shaft height. While doing this
the polish arm quit rotating CCW. A wire was found off LS13 ( CCW
over travel ) the same was resoldered. The primary & final polish
limits were also adjusted. The tool was returned to production for
testing on the new pad.
|
| 37.312 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:14 | 14 |
| STRATA::REDRIVERS 11 lines 7-OCT-1995 05:06
-< WSTK.1 EXIT CASSETTE >-
--------------------------------------------------------------------------------
WSTK.1 - Down for unload cassette will not recieve wafers...Wafers were
getting stuck at the entrance of the cassette because the
cassette was not square and not level to the exit tray. Had to
level the cassette using the two leveling set screws through
the back plate, then had to loosen the cassette assy mounting
bolts underneath the cassette area and turn the whole assy
clockwise to make it square to the exit tray. The exit tray
was too high blocking the exit jets not allowing the water
to pass by the carrier to guide the wafer into the cassette,
so that was adjusted as well.
|
| 37.313 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:14 | 9 |
| STRATA::POOLE 6 lines 12-OCT-1995 07:19
-< uniformity >-
--------------------------------------------------------------------------------
WSTK.1 Uniformity out of spec (-8.5%). System has new pads, monthly
was just completed this week, two different carriers were tried
still uniformity issue. Replaced pad conditioner (371 wafers).
System at verify.
|
| 37.314 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:14 | 8 |
| STRATA::WESTPHAL 5 lines 20-OCT-1995 18:42
-< HANDLING PROBLEM >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer handling problems. The shuttle drove backwards into
the wafers but no wafers were broke. Found that the torsion spring
that causes the shuttle to make its turn was sheared. Pulled all
necessary parts to replace the spring and cleaned/lubed the rails
and parts. Returned the tool to production.
|
| 37.315 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:14 | 10 |
| STRATA::DEJORDY 7 lines 24-OCT-1995 18:53
-< Polish wafer not being sensed. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for p/wafer not sensed. Found that the vacuum was
low at 10. Removed both selenoids and the flow block. Blew n2 through
the selenoids and the flow block,reinstalled back into the system and
cycled wafers through system without further problems. Vacuum is still
only at 14 in. The valves might need to be replaced soon. Gave system
back to production to finish there lot.
|
| 37.316 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 11 |
| STRATA::WESTPHAL 8 lines 26-OCT-1995 20:08
-< Vacuum problem >-
--------------------------------------------------------------------------------
WSTK.1 - Down for alarms for missing wafer from the arm and dropping wafers.
Noticed the polish arm gauge was reading only 12. So checked for
problems with the vacuum. The soft water flow was alittle lower than
WSTK.2 so changed the filter out but that didn't make any difference.
Took soleoids 12 &14 off and blew N2 through them and cleaned the
venturi block but all looked okay. The the gauge would read 19 after
30 -45sec. Put a gauge on the line before the 4-way and it climbed
to 19 after about 6sec. Line may need replacing. Ran out of time.
|
| 37.317 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 13 |
| STRATA::REDRIVERS 10 lines 27-OCT-1995 05:24
-< WSTK.1 >-
--------------------------------------------------------------------------------
WSTK.1 - Continued from day shift...put system back together then removed
the vacuum line going to the top of the polish arm and blocked it
off and the vacuum went up to 19Hg. Removed the carrier and button
and noticed the button oring was damaged and that part of the assy
was missing. Took everything off of the carrier area and put it
together the way it should be and noticed that an oring was
missing on the upper part of the carrier assy and the other one
was damaged, replaced the two in the upper part of the carrier
assy and the one on the button. Put on a new carrier and every-
thing ran normally. Ran two cassettes without any errors.
|
| 37.318 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 12 |
| STRATA::WESTPHAL 9 lines 27-OCT-1995 19:34
-< VACUUM POROBLEMS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for vacuum problem, the vacuum gauge to be reading only 5 in of
hg. Pulled the arm cover and found the vac line on the shaft with a
hole worn through it. replaced the same but gauge would only read
13. Checked the pressure before the 4-way (16 Hg) in the arm. Re-
placed the 2 gauges and vac line w/ only a vac line and mounted a
single gauge on the counsel. Still couldn't draw 20 Hg. Found the
venturi block to be leaking, so T-taped the fittings and the vacuum
drew to 19. Put the system to scheduled down for the monthly.
|
| 37.319 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 7 |
| STRATA::WESTPHAL 4 lines 28-OCT-1995 19:36
-< RING ON WAFERS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for rings on wafers. Changed out the carrier but no real
improvement Checked to insure that the vacuum was turning off and it
was. Then changed out the pad an ran some more wafers looks good
but operators are running a polish rate wafer to make sure it is good.
|
| 37.320 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 6 |
| STRATA::FRANCIS 3 lines 28-OCT-1995 22:32
-< WSTK.1 Rings on the wafers. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for rings on the wafers. The previous shift changed the pad
and carrier. Polish rates were run at the beginning of the shift
and they came in. Back up.
|
| 37.321 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 7 |
| LUDWIG::REDRIVERS 4 lines 1-NOV-1995 05:48
-< DROPPING WAFERS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for dropping wafers on primary platen. Replaced the center
Oring in the carrier and balanced the polish arm, it wasn't all
the way down on the platen when the stablizer kicked in. Ran two
cassettes of wafers with out any problems.
|
| 37.322 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 11 |
| STRATA::WESTPHAL 8 lines 1-NOV-1995 19:36
-< low polish >-
--------------------------------------------------------------------------------
WSTK.2 - Down for problems w/ edge uniformity and a low polish rate. Started
on Tim's action plan. Pulled the cover and checked the cam and
knuckle. Both looked good. Shaft height is high at 1.182 but may not
be totally accurate because the shims are rocking. Still needs the
conditioning arm cal.
|
| 37.323 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 6 |
| STRATA::REDRIVERS 3 lines 3-NOV-1995 03:10
-< WSTK.1 SHUTTLE JAM >-
--------------------------------------------------------------------------------
WSTK.1 - Down for shuttle jam sensor. Reset shuttle jam and had to adjust
the mechanical hard stop at the cassette area. The shuttle arm was
hittihg the wafer causing the shuttle sensor to activate.
|
| 37.324 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:15 | 7 |
| STRATA::REDRIVERS 4 lines 9-NOV-1995 02:24
-< WSTK.1 BROKEN WAFER >-
--------------------------------------------------------------------------------
WSTK.1 - Down for broken wafer at exit cassette...removed the exit cassette
assy and broke it down to clean then reassembled it and re-installed
into the system and gave system back to production without any
other problems.
|
| 37.325 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:16 | 7 |
| STRATA::FRANCIS 4 lines 12-NOV-1995 07:14
-< WSTK.1 High uniformity. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for high uniformity of 18%. The Primary pad, the conditioner,
and the carrier were changed before the polish rate was done.
Checked the conditioner down force and it was at 17. Did not try
anything else.
|
| 37.326 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:16 | 9 |
| SCOMAN::JONES 6 lines 12-NOV-1995 20:25
-< WOULDN'T PICK UP WAFERS @ LOAD CUP >-
--------------------------------------------------------------------------------
WSTK.1 System was down for not picking up wafers at the load cup.Found
that the vacuum switch was not working. Removed the switch and
cleaned it,reinstalled back into the system and cycled 5 warm up
wafers without further problems. System is back to production.
Polish rate and uniformity problems are in.
|
| 37.327 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:16 | 7 |
| STRATA::WESTPHAL 4 lines 18-NOV-1995 19:42
-< VACUUM SWITCH >-
--------------------------------------------------------------------------------
WSTK.1 - Down for polish arm not picking wafer from the load cup. Vacuum was
drawing 22" hg. Found that the vacuum switch was not sensing right.
Corrected the same and ran a boat of wafers with out any further
problems so the tool was returned to production.
|
| 37.328 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:17 | 8 |
| STRATA::FRANCIS 5 lines 20-NOV-1995 05:03
-< WSTK.1 Low polish rate and unif. was out. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for uniformity being out of spec and the polish rate was
too low. The Primary pad, carrier and conditioner were replaced
because because of somewhat high counts. The polish rate was
good on the next try. Back to production.
|
| 37.329 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:17 | 13 |
| STRATA::DSMITH 10 lines 20-NOV-1995 18:47
-< leaking ball valve >-
--------------------------------------------------------------------------------
WSTK.1 and 2 -
Systems went down for leaking ball valve in the drain line.
Tim Dyer requested that the drain ball valve that goes to the
filter be replaced. Replaced the valve but did not see anything
wrong with the old one. Set the old ball valve on Tims desk.
Tim also requested the filter be changed. Production had a lot
of work so it wasn't changed. The filter is in the Tech Shop.
Both systems are back to production.
|
| 37.330 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:17 | 10 |
| SCOMAN::JONES 7 lines 21-NOV-1995 06:58
-< Slurry problem >-
--------------------------------------------------------------------------------
WSTK.1 & 2 - Down for slurry high back-pressure, replaced filter and then
bypassed the back-pressure regulator and back-pressure returned
to normal, WSTK.1 slurry pump one had a split in the latex hose,
replaced hose, returned both systems to MFG for full MQC's, both
passed and are up. Could not find a new regulator in the stock
room, rebuilt the old one and it put it on top of the splash proof
box in the WSTK room to be reinstalled.
|
| 37.331 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:17 | 11 |
| STRATA::DEJORDY 8 lines 27-NOV-1995 18:51
-< Vacuum not sensed on carrier. >-
--------------------------------------------------------------------------------
WSTK.1 System was down for uniformity problems and not sensing wafer
on the carrier. Removed and inspected the vacuum switch for
the wafer carrier and found it to have slurry build up inside
of the switch. Reomved and replaced the vacuum switch, tested
for wafer present when vacuum was activated to the carrier,
switched worked without further error. Installed hand hand stacked
pads system needs full MQC's.
|
| 37.332 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:17 | 5 |
| SCOMAN::JONES 2 lines 28-NOV-1995 06:08
-< HIGH UNIFORMITY >-
--------------------------------------------------------------------------------
WSTK.1 - Down for high Uniformity, completed MQC's and they all passed,
returned to MFG.
|
| 37.333 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:17 | 9 |
| LUDWIG::WESTPHAL 6 lines 30-NOV-1995 19:29
-< WAFERS HANGING UP ON UNLOAD SLIDE >-
--------------------------------------------------------------------------------
WSTK.1 - Was put down for the wafers floating out of cassette while in the
unload station. Wafers were hanging up on the water slide. Checked
the level of the elevator and the cassette and found that the angles
are of each are canceling each other out. Tried to adjust the
problem out by tweaking the platform angle set screws. Didn't work
believe the elevator may need to be shimmed.
|
| 37.334 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:18 | 7 |
| STRATA::REDRIVERS 4 lines 1-DEC-1995 07:31
-< WSTK.1 EXIT CASSETTE >-
--------------------------------------------------------------------------------
WSTK.1 - CONTINUED from day shift ...adjusted exit cassette so that the
wafers would stay in the slots when indexing down and so that all
the wafers enter the cassette smoothly ( CASSETTE IS NOT LEVEL AND
IT DOES NOT HAVE TO BE)
|
| 37.335 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:18 | 6 |
| LUDWIG::WESTPHAL 3 lines 1-DEC-1995 10:19
-< UNLOAD PROBLEM >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafers not going into the cassette in the unload station.
Made a slight adjustment to the slide and ran a boat and a half of
wafers without any problem.
|
| 37.336 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:18 | 7 |
| STRATA::FRANCIS 4 lines 3-DEC-1995 21:35
-< WSTK.1 Slurry buildup on the carrier. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for losing a wafer from the carrier. Found a small slurry
buildup on the carrier, so it was replaced. Some wafers were
run through and the vacuum was good. Back to production.
|
| 37.337 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:18 | 6 |
| STRATA::REDRIVERS 3 lines 4-JAN-1996 23:10
-< WSTK.1 DROPPING WAFERS >-
--------------------------------------------------------------------------------
WSTK.1 - Down for dropping waters...replaced carrier,button and oring
and ran several wafers and vaccuum went from(16in hg to 22in hg). System
is back to production.
|
| 37.338 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:18 | 22 |
| STRATA::FRANCIS 19 lines 7-JAN-1996 07:22
-< WSTK.1 Vacuum errors. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for losing vacuum. Checked the 24 VDC from the Digital output
module for Solenoid 12 that is for the vacuum, and there wasn't any
voltage when the wafer release was highlighted. Replaced the Digital
output module and there was voltage present at wire 122 rail 1 posi-
tion 29. Then TB7 position 12 connection had to be tightened which
is for the protection diode for Solenoid 12, because it was very
loose. Also pulled the carrier off and found a nick in the fat oring
that the gimble fits into on the carrier. Ran a boat of wafers and
without any vacuum problems.
The system went down again for a change of the Primary and Secondary
pads. There are also some large wafer pieces on the bottom of the
Primary platen basin but was not able to get them out.
The system went down for not picking up from the load cup. There
was a lot of slurry buildup on the load cup. Pulled it apart and
cleaned the assembly off with scotchbrite since the white center
piece that lifts the wafer into the carrier was binding some. Ran
some wafers from the load station to the unload station and then some
using the DecCmos5 recipe. Did not receive anymore vacuum errors.
Back to production.
|
| 37.339 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:18 | 6 |
| LUDWIG::FRANCIS 3 lines 8-JAN-1996 02:24
-< WSTK.1 Bad limit switch. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for a transport error. The limit switch for the Shuttle
to the elevator was broken. Put in a new one and ran some wafers
without a problem. Back to production.
|
| 37.340 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:18 | 10 |
| LUDWIG::WESTPHAL 7 lines 11-JAN-1996 19:44
-< LOOSING WAFERS ON THE PRIMARY PAD >-
--------------------------------------------------------------------------------
WSTK.1 - Down for losing wafers when lifting off the primary pad. Ran wafers
until the problem reoccurred. Found that the vacuum would not drawl
at all. Checked all vacuum lines for leaks or loose fittings and
trouble shot down to solenoid 15 which was stuck closed. Could not
find the same or compareable part in stock (94 or 6). the tool is at
part and the engineer will order the same tomorrow.
|
| 37.341 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:18 | 10 |
| LUDWIG::WESTPHAL 7 lines 13-JAN-1996 19:35
-< VACUUM PROBLEM >-
--------------------------------------------------------------------------------
WSTK.1 - Down at part. The solenoid was listed as zero quality in stock but
found what we believe to be the correct part in in the wrong bin.
installed the same and the solenoid worked. Still had a leak so the
button and carrier were changed out. The tool is at verify running
wafers.
|
| 37.342 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:19 | 28 |
| STRATA::FRANCIS 25 lines 14-JAN-1996 04:58
-< Vacuum problem. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer missing errors and for dropping wafers as the
Polish arm lifted from the Primary pad. We found dried slurry
on the carrier. Pulled the carrier off and put on another one.
The second wafer fell off as the arm was lifting off the pad.
Checked all the fittings of the vacuum line. The swagelock
fitting at the elbow near the vacuum switch needed a little
tightening. Pulled the carrier off and placed a finger over
the hole on the shaft, and the vacuum went to 23" of mercury.
Toggled the vacuum on and off 10 times with the same result.
Put the carrier back on and the 1st wafer fell and scratched
the carrier. Replaced it with another carrier and slowed down
the raising speed of the Polish arm. Put a wafer on the carrier
and turned the vacuum on but the gauge wouldn't go beyond 3"
of mercury. Tried a few more wafers with the same result. Pulled
the carrier off and took the center piece off the back of the
carrier and replaced the large oring (viton 240). Also replaced
the thick smaller oring (viton 216) on the carrier along with
the very small oring on the gimbling button (viton 015). Ran a
boat of wafers with just loading and unloading them without a
problem. The vacuum was getting up to 20" of mercury before the
polish arm made it over to the Polish platen. Then a boat of
wafers was run using the Dec-Comos5 with a 10 second polish
time on the Primary. All the wafers ran without vacuum problem.
Put the system back up to Verify.
|
| 37.343 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:19 | 9 |
| LUDWIG::DSMITH 6 lines 14-JAN-1996 14:53
-< wafers dropping during polish >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer missing errors and for dropping wafers as the
Polish arm lifted from the Primary pad. 7 wafers were run using
the Dec-Comos5 recipe. All the wafers ran without vacuum problems.
Put the system back up to Verify.
|
| 37.344 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:19 | 13 |
| STRATA::FRANCIS 10 lines 15-JAN-1996 02:34
-< WSTK.1 Vacuum issues. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for loosing wafers off the carrier. We put some bodine oil
on the shaft of the piston for raising and lowering the Polish
arm. We also changed the pad which had over 300 wafers run on it
since the Polish arm was jerking up after about 5 seconds from
the pad when trying to come up because of the suction from the
slurry. We ran some wafers using the DEC-CMOS5 recipe and there
were no problems with the vacuum or missing wafers. The only other
problem was that some wafers were not being sensed at the load
station. After several attempts, we were able to get all the wafers
and spaces sensed. Back to production.
|
| 37.345 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:19 | 14 |
| STRATA::WESTPHAL 11 lines 18-JAN-1996 19:40
-< Still dropping wafers. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for loosing wafers on the primary pad. While running wafers to
determine the problem we caught the wafer flying out and noticed that
the vacuum (20 in/Hg) was present before the wafer was lost. It was
also noticed that there was alot of surface tension. Tried adjusting
the polish limit off the platen alittle more but there is still allot
obvious surface tension. Tried experimenting w/ speeding and slowing
the carrier speed and found that the faster the carrier was spinning
the more likely it was to drop wafers. Engineering suspected the
rotary may be leaking the same was swapped out ran more than a boat of
wafers before dropping one. Ran out of time. Also the wetting ring
was changed out.
|
| 37.346 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:19 | 9 |
| STRATA::POOLE 6 lines 19-JAN-1996 08:16
-< Dropping wafer/ not enough oxide >-
--------------------------------------------------------------------------------
System was dropping wafers on the primary pad. Checked wafer that
dropped and it did not any any oxide on it. Checked the boat
that was loaded on the system and the amount of oxide varied from
wafer to wafer some were bare silicon. The wafers must have 10 K
angstroms of oxide or they stick to the pad and can cause transfer
problems.
|
| 37.347 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:19 | 7 |
| LUDWIG::FRANCIS 4 lines 21-JAN-1996 07:27
-< WSTK.1 Dropping wafers. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for dropping and breaking a wafer during a maintenance
check. Put on a different pad from Rodel that Tim wanted on.
A new conditioner was also put on. Didn't have the time to
address further.
|
| 37.348 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:20 | 11 |
| STRATA::DSMITH 8 lines 21-JAN-1996 18:39
-< dropping wafers >-
--------------------------------------------------------------------------------
WSTK.1 - Down for dropping wafers.
Removed the carrier and button. Found nothing wrong with the o-rings.
Put my finger on the hole were the button pushes up inside
and got vacuum of 20 Hg off the gauge. Replaced the button and o-ring.
Put the carrier together and ran 5 wafers thru the polish cycle.
No wafers were dropped. Gave system back to production.
Later had High Particles. Flush out DI lines with H2O2 and sprayed
the Final and Primary pads with the spray gun. System is at Verify-U
|
| 37.349 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:20 | 10 |
| STRATA::FRANCIS 7 lines 22-JAN-1996 07:29
-< WSTK.1 High particles. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for particles. We flushed the system out with H2O2, as did
the previous shift, and wiped and sprayed off the unload station.
A particle check on the whole system was out at 235. A particle
check was done on just the load station to the unload station
and it was out at over 1900. The shuttle and loadcup was cleaned
along with the unload station. The operator was going to do the
particles on the load and unload stations again.
|
| 37.350 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:20 | 9 |
| STRATA::DEJORDY 6 lines 22-JAN-1996 19:33
-< High particles. >-
--------------------------------------------------------------------------------
WSTK.1 System was down for high particles.Completed the monthly pm and
removed the load cup. Cleaned the load cup and shuttle assembly.
Vacuumed out the load station area and wiped it out with ISO.
Reinstalled the load cup and gave system back to production for
full MQC's. All MQC's passed even the particles came in at 21.
|
| 37.351 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:20 | 7 |
| SCOMAN::JONES 4 lines 29-JAN-1996 03:57
-< CRACKED PRIMARY SPRAY RING >-
--------------------------------------------------------------------------------
WSTK -1 Down for water leaking into basement, investigated and found the
primary spray ring (PN# 372-44219-1)was cracked at the water supply
fitting. Tried to order one from stock using 94-30650-00, none were
on hand, put in a shortage request, system still down.
|
| 37.352 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:20 | 8 |
| STRATA::DSMITH 5 lines 31-JAN-1996 16:50
-< leaks >-
--------------------------------------------------------------------------------
WSTK -1 Down for water leaking
The water ring was not leaking but the fitting underneath
was. Tightened and re-taped the fittings. No more leaks.
System is back to production.
|
| 37.353 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:20 | 7 |
| STRATA::DEJORDY 4 lines 18-FEB-1996 19:04
-< Pad wetting spray arm. >-
--------------------------------------------------------------------------------
WSTK.1 System went down for the pad wetting supply arm was spraying
the deck of the system. Bent the tab at the end of the arm down
more and the spray was now in the center of the platten.
|
| 37.354 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:20 | 7 |
| SCOMAN::GILMAN 4 lines 20-FEB-1996 15:05
-< TUBING BURST >-
--------------------------------------------------------------------------------
WSTK.1 - Down for the Tubing inside Slurry Pump#1 bursting. Replaced the
tubing and ran the Flush Cycle with no problem. Put back into
Production.
|
| 37.355 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:20 | 10 |
| STRATA::DEJORDY 7 lines 21-FEB-1996 15:40
-< Flow block,wiring,leaks,selenoids. >-
--------------------------------------------------------------------------------
WSTK.1 System went schedual down for the flow block needed to be re-
attached to the top deck. Reconnected the flow block and fixed
leak at fitting for the exit water track. Butt spliced 20 wires
to many different selenoids in the fluids cabinet.Remounted the
selenoide # 12 and the flow block,also mounted the selenoide for
the vacuum venturie. Ran out of time to check the leak at the dump
valve for the exit station.
|
| 37.356 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:21 | 6 |
| STRATA::REDRIVERS 3 lines 20-MAR-1996 05:38
-< WSTK.1 UNLOAD PROBLEM >-
--------------------------------------------------------------------------------
WSTK.1 Wafers would not transfer from exit tray to exit cassette. Wafers
were hitting the top of the slots, adjusted the cassette up switch
up about 1/64 of an inch.
|
| 37.357 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:21 | 8 |
| STRATA::STANDING 5 lines 23-MAR-1996 19:04
-< Low uniformity >-
--------------------------------------------------------------------------------
WSTK.1 Down due to polish rate uniformity being NEG. Checked WSTK.2
uniformity and say that it was going NEG. Checked the pads and they
were lot number JX5RC8, which they been put on early in week. Told
them to change the pads with a different lot number and uniformity came
in on number #1 and I put it up.
|
| 37.358 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:21 | 8 |
| STRATA::STANDING 5 lines 5-APR-1996 19:14
-< Conditionar arm, Pump slurry >-
--------------------------------------------------------------------------------
WSTK.1 Went down for conditioning arm not moving across the pad, and
slurry pump tubbing rupturing. Took apart conditioning arm and
tightened the shaft gear that had become loose. Replaced the pump
ruptured tubbing with a new one. Returned to production.
|
| 37.359 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:21 | 6 |
| SCOMAN::JONES 3 lines 9-APR-1996 06:59
-< high particles >-
--------------------------------------------------------------------------------
WSTK.1 - Down for particles, flushed system with H2O2, including wiping down
all wafer contact surfaces, load blade and cup and exit slide and QDR,
system is at verify.
|
| 37.360 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:21 | 9 |
| STRATA::DSMITH 6 lines 28-APR-1996 17:13
-< water track >-
--------------------------------------------------------------------------------
WSTK.1 - Down for not ejecting wafer from water track.
Adjusted D.I. flow to the bowl jets. And also adjusted the
leveling screw for the slide. Ran several wafers without
any errors. back to production.
|
| 37.361 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:22 | 5 |
| FABSIX::D_SMITH 2 lines 30-APR-1996 19:10
-< filter change >-
--------------------------------------------------------------------------------
Filter change completed on Slurry bulk lines.
|
| 37.362 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:22 | 7 |
| STRATA::STANDING 4 lines 1-MAY-1996 14:37
-< Polish arm position error. >-
--------------------------------------------------------------------------------
WSTK.1 Down for polishing arm position error. Went into manual arm
position and could not raise the arm up in the clean station. Rebooted
system and checked mechanical encoder, OK. Ran a boat of wafers with
no problem. Returned to production.
|
| 37.363 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:22 | 5 |
| SCOMAN::JONES 2 lines 5-MAY-1996 01:26
-< SLURRY PUMP ONE RUPTURE >-
--------------------------------------------------------------------------------
WSTK.1 - Down for slurry pump 1 hose rupture, replaced hose, test sat,
returned to MFG.
|
| 37.364 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:22 | 17 |
| <<< SCOMAN::SILVER$:[NOTES$LIBRARY]ETCH.NOTE;4 >>>
-< ETCH >-
================================================================================
Note 96.405 WESTECH PASSDOWN 405 of 437
STRATA::FRANCIS 10 lines 7-MAY-1996 07:07
-< WSTK.1 Uniformity problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for a high edge uniformity. Found the Axial sweep off at
0.010". The spec is 0.005". Also adjusted the arm leveling, the
carrier runout, and the down force. The down force was 20 lbs
less on the screen compared to the meter. The carrier shaft
height was good. Put on another set of pads and gave the system
back to production for MQCs. The particles, polish rate, and
edge uniformity was good, but the overall uniformity was high
and out at 19% (UCL:15%). The operator ran 10 warmup wafers
before the polish rate. He's going to run another set of warmup
wafers and try another polish rate which will be done ~ 7:45am.
|
| 37.365 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:22 | 17 |
| STRATA::DSMITH 14 lines 7-MAY-1996 19:09
-< vacuum problem and unif. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for a high edge uniformity. And for no vacuum during pick up.
Vacuum problem: Good vacuum was traced all the way through lines.
Only thing found wrong was the Button was nicked on the side.
Pulled the button off and put my finger on the hole. The vacuum
gauge was at 20. Put new button on and changed the carrier
and still will not pick up wafer at load station. Put the old carrier
back on. Noticed D.I. Load Spray was not enough to prewet wafer.
Changed the time from 2.0 to 2.3. It now picks up wafer continously.
Uniformity issue: The Operations Tech. found that the wrong wafers
were used for MQC's. Uniformity is now in spec.
System back to production.
|
| 37.366 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:22 | 12 |
| <<< SCOMAN::SILVER$:[NOTES$LIBRARY]ETCH.NOTE;4 >>>
-< ETCH >-
================================================================================
Note 96.407 WESTECH PASSDOWN 407 of 437
STRATA::FRANCIS 5 lines 8-MAY-1996 01:52
-< WSTK.1 Vacuum problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Was down for vacuum errors at the lift cup. Found the air lines
for the lift cylinders and the lines going to the lift cup were
caught between the 2 cylinders. The upper cylinder had to be
rotated CCW to get them out. Ran 2 boats of wafers and they ran
fine. The system was put up.
|
| 37.367 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:22 | 11 |
| STRATA::DSMITH 8 lines 8-MAY-1996 18:35
-< conditioner arm home switch >-
--------------------------------------------------------------------------------
WSTK.1 - Conditioner arm was not at home position.
Operator also noticed that is was skipping across table.
Removed the covers from the conditioner arm and removed
conditioner arm assembly. Found the Home position switch
pushed in and held in from slurry build-up. Replaced switch
and put everything back together. Ran 5 times with no problems.
System is back to production.
|
| 37.368 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:23 | 6 |
| STRATA::REDRIVERS 3 lines 10-MAY-1996 07:17
-< WSTK.1 POLISH RATES >-
--------------------------------------------------------------------------------
WSTK.1 - Down for low polish rates. Ran polish rate test and they were good
but edge uniformities were high. Replaced the button and adjusted
the counter weights. All MQC's came in.
|
| 37.369 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:23 | 9 |
| STRATA::STANDING 6 lines 11-MAY-1996 19:02
-< WSTK.1 Load cup problem. >-
--------------------------------------------------------------------------------
WSTK.1 Down for not picking up the wafers from the load cup properly.
Removed load cup for inspection, found nothing. Noticed that the cup
was not coming up enough to meet the polish arm. Found nothing wrong
with the polish arm, so I added a washer/spacer under load cup
retaining bolt. This fixed problem. Production then ran tool to bring
polish rates down in order to pass.
|
| 37.370 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:23 | 9 |
| SCOMAN::JONES 6 lines 19-MAY-1996 08:03
-< vacuum switch replaced >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer not sensed on polishing arm, vacuum was 23.5 0n the
vacuum gauge, flushed the carrier for several minutes to try and
improve, had no increase in vacuum, replaced the carrier and this also
had no effect, checked all the vacuum lines were tight and then
shorted out the vacuum switch to see if the indication would change,
it did, replaced with a new switch, system is at verify.
|
| 37.371 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:23 | 8 |
| SCOMAN::JONES 5 lines 26-MAY-1996 00:36
-< SLURRY PUMP FAILURE >-
--------------------------------------------------------------------------------
WSTK.1 - Down for primary slurry pump hose rupture, the tool had not been used
for a few days and when the operator started MQC's the hose ruptured,
also found the primary heat exchanger cooling water supply was
isolated, opened the supply valve and replaced the slurry hose,
returned system to MFG to finish MQC's.
|
| 37.372 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:23 | 7 |
| SCOMAN::GALLANT 4 lines 30-MAY-1996 00:38
-< Pads replaced >-
--------------------------------------------------------------------------------
WSTK.1 Manufacturing requested to have the primary and final pads
changed. Replaced pads and returned system.
|
| 37.373 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:23 | 8 |
| STRATA::STANDING 5 lines 30-MAY-1996 15:00
-< Conditioner arm set screws loose. >-
--------------------------------------------------------------------------------
WSTK.1 Down for unstable uniformity rates. Found the pad conditioner
not working properly. It would not sweep the pad fully. Found the fly
wheel set screws had worked loose. Tightened same. Returned to
manufacturing for MQC's after running 6 warm ups.
|
| 37.374 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:24 | 8 |
| STRATA::STANDING 5 lines 1-JUN-1996 19:15
-< High uniformity >-
--------------------------------------------------------------------------------
WSTK.1 Down for completion on monthly PM. After MQS Uniformity came
in at -12. Removed carrier and the button fell out in my hand.
Replaced button and carrier. Uniformity came back high at 15. Could
not find anything wrong. Had operator run 12 warm ups and recheck.
Results not done yet.
|
| 37.375 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:24 | 22 |
| STRATA::FRANCIS 19 lines 3-JUN-1996 07:19
-< WSTK.1 Polish rate problems. >-
--------------------------------------------------------------------------------
WSTK.1 - Originally down for high edge uniformity. The operator had to
replace the primary pad since only the top pad was on it. The
suba4 pad wasn't put on. After having to scotchbrite the platen
because of a lot of glue, he put on both layers of pads and ran
the MQCs. The polish rate was very low at 368. Pulled the cover
off and had to adjust the safety cam away from the major vertical
shaft. He ran 10 more warmups before the polish rate, and the
overall uniformity was the only thing out at 16.4. He ran 10 more
warmups, and the polish rate was the only data out at 871. The
overall and edge uniformities were close to being out at 14.7 and
13.3, respectively. The conditioner, carrier, and pads were new
before the MQCs. Decided to pull the primary pad and check the
down force cal. At 200 psi, the actual was 10 psi lower. Cal'd
the down force and saved it to the config. Checked the primary
platen temp on the process temp page and it was at CNTL for 90 F.
The analog data page was staying at 67 F. Checked the actual temp
and it was at 72 F. Cal'd the primary platen temp and saved it to
the config. Replaced the pad and the operator is going to run the
MQCs again.
|
| 37.376 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:24 | 6 |
| STRATA::FRANCIS 3 lines 4-JUN-1996 06:05
-< WSTK.1 Low polish rate and high uniformity. >-
--------------------------------------------------------------------------------
WSTK.1 - Down for high overall uniformity of 24 with a low polish rate
of 780. A full boat of wafers was put on. Production will run
the polish rate afterwards. The system is at Verify.
|
| 37.377 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:24 | 13 |
| SCOMAN::TDYER 10 lines 4-JUN-1996 08:03
-< entry from 6/3 >-
--------------------------------------------------------------------------------
ENTRY FROM 6/3
WSTK.1 - Poor edge uniformity, lower rate removal and center fast unif.
Calibrated conditioner ACTUAL downf force for 7lbs @15psi
(as original POR). Noted conditioner was not sitting flat on
pad, replaced, also adjusted gimble. Carrier button was
inspected, it had a plastic shavings on it, replaced.
Installed a fab6 Speedfam pad.
|
| 37.378 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:24 | 10 |
| STRATA::STANDING 7 lines 4-JUN-1996 18:50
-< Poor Uniformity and polish rate. >-
--------------------------------------------------------------------------------
WSTK.1 Down due to poor uniformity and polish rate. Removed pad and
installed a machine stacked IC1000 pad. Polish rate and uniformity came
back low and high. Checked down force, reballanced arm and installed
new stacked pads. Also ran with old carrier from WSTK.2 to see if it
would make a difference, it didn't make a hole lot. Tim Dyer asked
that a 20um carrier be made up. Production has yet to finish the
carrier.
|
| 37.379 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:24 | 20 |
| STRATA::FRANCIS 17 lines 5-JUN-1996 05:49
-< WSTK.2 Polish arm hitting conditioner arm. >-
--------------------------------------------------------------------------------
WSTK.1 - The operator noticed that the polish arm was hitting the conditioner
arm on its way over from the clean station to the Final pad. Checked
the Clean station panel of the Pad maintenance panel, and the Primary
wafer clean time was set to 4 seconds. It was changed to 6 seconds.
Now the polish arm passes over the primary when the condition arm is
all the way over to the platen edge. Checked DCS and the Primary wafer
clean is supposed to be set at 30 seconds for the DEC-CMOS5 recipe.
The operator said that the time was changed to fix wafer vacuum
problem. So, the time was left at 6 seconds. The change was saved to
the DEC-CMOS5 recipe. Checked the Particle, Warmup, and Idle recipes,
and they were set to 30 seconds. We noticed that the carrier wasn't
going down into the clean station for wetting when using the Idle
recipe. Checked the same Clean station panel and the Carrier wetting
time and Carrier wetting interval time were set at 0. In DCS, they
are set at 10 and 120 seconds, respectively. Changed both of them and
then saved the changes to the Idle recipe. Gave the system back to
production and it passed all the MQCs.
|
| 37.380 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:25 | 12 |
| SCOMAN::GALLANT 9 lines 7-JUN-1996 02:02
-< Glycol Leak >-
--------------------------------------------------------------------------------
Completed W-pm
Repaired leak on the heat exchanger circulator pump. Replaced worn
PVC fittings and checked for leaks. None found. System was released
back to manufacturing.
|
| 37.381 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:25 | 12 |
| STRATA::STANDING 9 lines 7-JUN-1996 17:41
-< Broke wafer on primary pad >-
--------------------------------------------------------------------------------
WSTK.1 Down for breaking a wafer on the primary platen. When I came in on
the tool there was a boat of product wafers still in the unload
station and the Idle recipe loaded, also found the process timers
set for zero and the slurry pump turned off. When operator came
back into the room she stated that she had put the tool into the
idle mode. After running 10 wafers and finding nothing wrong,
changed out the both pads as per Matt Vanhanehem request. Ran 10
more wafers before turning over to production for MQC's.
|
| 37.382 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:25 | 15 |
| SCOMAN::GALLANT 12 lines 8-JUN-1996 07:10
-< High Uniformity >-
--------------------------------------------------------------------------------
WSTK.1
System went down for high uniformity. Checked temperature on the final
manifold which was low (56F). Removed the fill plug on the heat exchanger
and noticed pressure build-up. Installed plug and loosened bleed on top
of heat exchanger cylinder. Let stabilize and checked temperature again,
which was increasing. Manufacturing ran uniformity tests with good results.
|
| 37.383 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:25 | 7 |
| STRATA::FRANCIS 4 lines 11-JUN-1996 02:41
-< WSTK.1 Conditioner arm popping up. >-
--------------------------------------------------------------------------------
WSTK.1 - The conditioner arm was popping up when it was at the center of
the pad. Adjusted the end efector so that it was parallel with
with the pad. Ran the conditioner 5 times and it didn't pop up
at all. Gave the system back to production.
|
| 37.384 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:25 | 13 |
| SCOMAN::GALLANT 10 lines 14-JUN-1996 05:27
-< Wafer releasing from carrier unexpectedly. >-
--------------------------------------------------------------------------------
WSTK.1 During the primary polish cycle the wafer would release
from the carrier. According to the vacuum gauge, vacuum
appeared to be operating correctly. Replaced carrier
assembly and oring. Cycled 10 wafers on the process
recipe that was releasing the wafer with no problems.
The carrier that was removed from the the system has
been labeled and located in the chase.
|
| 37.385 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:25 | 8 |
| LUDWIG::STANDING 5 lines 20-JUN-1996 19:13
-< Rotary union failed. >-
--------------------------------------------------------------------------------
WSTK.1 Down for glycol leaking from the rotary union. Replacing the
rotary union involved removing the platen and part of the glycol port
on top of the spindle. Installed new rotary union, filled glycol
reserve and started tool up. Found no leaks. Checked platen run out
it was .008, ran out of time to reseat platen.
|
| 37.386 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:25 | 9 |
| LUDWIG::REDRIVERS 6 lines 21-JUN-1996 06:01
-< WSTK.1 RUNOUTS >-
--------------------------------------------------------------------------------
WSTK.1 - Continued fromday shift.. Had to remove platen and tighten the
four mounting bolts under the platen assy and the three screws that
hold the spindle cap on were loose. Replaced the cap and the platen and
the runout was in at 0.004. Tried to home the robot and it would not
move because it had no referance. Found a broken wire on the home
switch underneath the tool.
|
| 37.387 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:26 | 13 |
| STRATA::STANDING 10 lines 21-JUN-1996 16:40
-< Primary platen not commin up to temp. >-
--------------------------------------------------------------------------------
WSTK.1 Continued from previous shift. Primary platen not displaying
any temp. Checked TC it was OK. Found broken wire on TC connector,
repaired same. Ramped up plated temp to 110 deg platen did not go
above 72 deg. Tried to Cal it no change. Noticed primary chill water
to heat exchange had a constant flow, indicating that the mixing valve
was open. Checked voltage to sol21 it was zero, sol21 was stuck open.
Checked stock room for new one, none in stock, submitted a shortage
request. Disassembled old one and cleaned it up. Reassembled and
reinstalled. This time it worked, but for how long? Set platen temps
to 70 deg and returned tool to production.
|
| 37.388 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:26 | 5 |
| SCOMAN::JONES 2 lines 24-JUN-1996 05:45
-< slurry hose blow out >-
--------------------------------------------------------------------------------
WSTK.1 - Down for Slurry pump 1 line rupture, replaced tube and tested,
returned to MFG.
|
| 37.389 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:26 | 6 |
| STRATA::STANDING 3 lines 24-JUN-1996 11:01
-< Replaced Mixing valve >-
--------------------------------------------------------------------------------
WSTK.1 Replaced sticking sol21 the heat exchanger mixing valve.
Returned tool to production.
|
| 37.390 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:26 | 5 |
| SCOMAN::JONES 2 lines 25-JUN-1996 06:28
-< CHANGED CARRIER >-
--------------------------------------------------------------------------------
WSTK.1 - Down for wafer not picked up at load, operator rebuilt carrier and
it retested sat returned to MFG.
|
| 37.391 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:26 | 10 |
| SCOMAN::GALLANT 7 lines 27-JUN-1996 05:44
-< Conditioner arm failures >-
--------------------------------------------------------------------------------
WTSK.1 System went down for conditioner arm failures. Found broken
wire and repaired. Rerouted wire to alleviate the stress tention
that was present. Cycled twenty wafers with no problems.
|
| 37.392 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:26 | 5 |
| SCOMAN::JONES 2 lines 30-JUN-1996 07:25
-< out of slurry >-
--------------------------------------------------------------------------------
WSTK.1 - Down for being out of slurry, put town to Bulk Chem, message was left
for them.
|
| 37.393 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:26 | 7 |
| SCOMAN::GILMAN 4 lines 30-JUN-1996 15:50
-< No bulk chem. >-
--------------------------------------------------------------------------------
WSTK.1 & WSTK.2 - Down for No Bulk Slurry. A problem was found with a Pump
down in Bulk Chemical. The on-call Tech was called and he fixed the
problem. Both systems were put back up.
|
| 37.394 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:27 | 8 |
| STRATA::FRANCIS 5 lines 7-JUL-1996 07:04
-< WSTK.2 Scratched carrier. >-
--------------------------------------------------------------------------------
WSTK.1 - The carrier dropped a wafer while rising from the Primary pad.
Removed the wafer and tried to run some more wafers. The next
couple of wafers came up missing wafers. Pulled the carrier
off and found 2 scratches. The operator replaced the carrier.
The tool was returned to production.
|
| 37.395 | | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Oct 17 1996 06:27 | 7 |
| STRATA::STANDING 4 lines 15-JUL-1996 17:40
-< Conditionar arm erratic >-
--------------------------------------------------------------------------------
WSTK.1 Down for conditioner arm acting erratic. Removed
conditioner unit and found the motor flywheel loose. Tightened and
added lock tight. Lubed flywheel shaft. Returned tool to production.
|
| 37.396 | day tanks cleaned | FABSIX::T_LANDRY | | Tue Nov 05 1996 19:21 | 21 |
|
Per request........
We emptied both slurry day tanks today. We then proceeded to chisel
away the Aqueous slurry from in, on top and around the day tank. Oh
ya, the containment pan was an extra special treat. Thank God for that
little propeller in the sink. It came in real handy when used as a
rheaming device to clean out the clogged drain. Once the slurry was
finally removed, we refilled the tank with water and circulated for
several minutes. We then drained this residue (which drained well now
that the "chunks" were out of the drain). Again, we filled the tank
with water and have left it circulating until new slurry is installed.
As for the metal slurry, it was a candy job compaired to the Aqueous.
Just a matter of rinsing, filling, draining, filling, etc. As with the
other tank, this one has been filled with water and is circulating.
Both tank feeds/returns were flushed in this procedure. And, the water
continues to cycle through the system as well.
A shift
|
| 37.397 | final table padconditioner installed | LUDWIG::FINN | | Tue Jan 07 1997 19:19 | 11 |
|
Wired and installed new final pad conditioner arm. Aligned to system
for clearance height and sweep. tested aok.
Please note that tool has been added to the equipment tracking system
and is now available for logging to proper states. Tool official name
is CMP.C1. System is currently IDLE.
A shift
|
| 37.398 | Ready for MQC | STRATA::KRUPA | | Fri Jan 17 1997 08:18 | 3 |
| New carrier installed with DF200 film. 20L of slurry mixed. PANW pad
installed. New drum of SC112 brought upstairs. Ready for MQC testing
and defect baseline.
|
| 37.399 | Conditioner / carrier lift-off position | FABSIX::R_GEE | | Tue Jan 21 1997 19:08 | 9 |
| The conditioner arm wasn't returning to the home position.
Adjusted the sweep-out speed up. Left the system in wet
cycle.
Still need to adjust the final table lift-off position &
up speed.
A shift
|
| 37.400 | EDGE LIFT OFF TROUBLE | FABSIX::B_WESTPHAL | | Wed Jan 22 1997 19:43 | 22 |
|
CMP.C1-7 - Down for problems with lift off on the final polish. Surface
tension would not allow the polish arm to lift off the final table with
the edge lift off activated. The edge lift off was checked and we
attempted to adjust ELO position. Several variations of carrier and
platen speeds were tried and a smaller pad was also used to increase
the ELO. The problem was still there. Suspected that the arm up/down
cylinder might be bad. Replaced the same but this didn't seem to make
a difference. Tim reconfigured the tool so that it will not use an edge
lift off and made various adjustments to air flows and table & carrier
speeds. The tool seems to be operating better. Its lifting off
smoothly but some additional adjustments and verification may be
necessary tomorrow. There was also a problem with the final platen's
conditioner not sweeping out properly. The problem seemed to be with
the C. arm's up limit switch being out of adjustment. That is working
properly now.
|
| 37.401 | CONDITIONER MOD, LIFT OFF | STRATA::TDYER | | Thu Jan 23 1997 15:33 | 22 |
|
CMP.C1-7 - Continue edge lift and conditioner test today.
- The lift off process we found to work on an IC1000 on the 2nd
table is: CENTER LIFT
OSCILLATING
CAR = 4, PLAT = 4
DI WATER
- If in fact the IC1000 is selected for permanent use, we may want
to try modifying the carrier vacuum holes and cutting the table
top for greater edge lift.
- Lift off on the suba-500 pad required no special requirements.
- The 2nd table conditioner was modified today and the "old" style
1X2" TBW end effector installed. 25 wafers cycled through in
CONTINUOUS mode with NO problems. A permanent, more robust end
effector will be designed in the near future.
|
| 37.402 | FINAL PLATEN NOT HEATING | FABSIX::B_WESTPHAL | | Fri Jan 24 1997 19:43 | 3 |
| CMP.C1 - Final platen not heating up. Believe that the heater element is bad.
Ordered a new part it should be here tomorrow.
|
| 37.403 | temp problem /leak | LUDWIG::FINN | | Mon Jan 27 1997 19:38 | 19 |
|
Continued troubleshooting final platen temp problem. Checked V32 in
side heat exchanger with a meter as front screen is toggled between heat and
cool. Valve opens and closes in this mode. Suspect problem further back. Tried
to verify tc and temp readings. Inadvertently changed temp calibration on both
final and Primary platens due to our confusion on which screen we were on.
Thought we were changing set point.
Before we continue we need to recalibrate. We followed the procedures
in the book ( actually pretty straight forward, Unfortunately, actual temp would
not change to match our fluke temp display as we adjusted the analog variables.
Also noted ( as we were under the system hooking up the tc to the
fluke) that the Final platen rotary union is leaking. Next item on list.
A shift
|
| 37.404 | temp problem | LUDWIG::FINN | | Tue Jan 28 1997 18:48 | 43 |
|
Continued trouble shooting temp platen problem. Final temp display was now
stable, but the drift problem had mysteriously switched to the primary platen
display, huh? It exhibited the same drift that the final platen had displayed
yesterday ?? Analog inputs to opto22 were switched between channel 15 and 8,
(final and primary tc inputs). Primary channel was always dead even with
Final tc as input. Withdrew an opto22 analog brain board and and control
board.
While that was on order we removed and cleaned v32 seat. The solenoid was
working but the valve seat was always open, not allowing the heater to come to
temp setpoint. (Just like you said Brad!). Adjusted Float switch so arm will
raise and lower with water level. Ohmed out heater and it was comparable with
the other two heaters (~20 Ohms). Added Glycol.
Fired the puppy up and it heated to temp and past. Both temps were now
displayed. We did not install the boards. We put all covers back on in the
event it was temp related, but drift did not return. Returned boards to stock.
Spent the rest of the day calibrating both Primary and Finial platens, so
that set displayed readings are the same as actual temp. Also verified
Temp/pressure variables IE sample rate and band width are appropriate for
good response with minimal overshoot control. They are all within
Factory recommended limits.
Currently, the system is up and idle in wet mode/continuous with the
following temps
Primary Final
_____________________________
Setpoint 65 91
Display 66 91
Actual 66.9 90.6
A Shift and Tim
|
| 37.405 | Slurry pump sprang leak. | STRATA::STANDING | | Thu Feb 06 1997 16:36 | 7 |
| CMP.C1-7 The primary slurry pump had a rupture in the pump tubing.
Replaced tubing and started back up. Pump then ruptured again.
Replaced tubing again and ran the pump unloaded. It ran fine. Hooked
it up to the slurry filter housing(filter was removed) and unhooked the
output of filter housing. Did not get any flow out of housing.
Removed housing and found a clog in the input hole. Cleaned housing
and reinstalled same. Tested OK. Returned tool back to ENG.
|
| 37.406 | Arm not arriving up | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Fri Feb 07 1997 04:02 | 9 |
|
The tool was down for "arm not arriving" at shift change.
Since I don't even have a clue as to even how to turn the tool
on, I called upon the spiritual guidance of Red Rivers. Red found
that the arm UP switch wasn't being made and adjusted it to get
to work. The tool was verified and put back into WET MODE.
BJ
|
| 37.407 | Vacuum Switch. | FABSIX::B_WESTPHAL | | Thu Feb 20 1997 19:49 | 4 |
| CMP.C1 - Yesterday the tool would not sense a wafer on the carrier.
Tried to adjust the switch but could not get it to sense. took the
switch apart and found it to be corroded. Replaced and adjusted the
same.
|
| 37.408 | CMP-C1-7 SLURRY TANKS | FABSIX::E_DAWSON | | Sat Feb 22 1997 16:06 | 10 |
|
Came in to find slurry tank #1 spitting slurry. Shut down pump,
drained slurry, cleaned and cycled DI through slurry line, refill w/DI.
Pump turned back on. Slurry Tank #1 has DI water in it.
Slurry Tank #2 was no circulating. Slurry had settled overnight.
Shut down pump, drained slurry, cleaned and cycled DI through slurry
line, refill w/DI. Pump turned back on. Slurry Tank #2 has DI water in
it.
|
| 37.409 | PUMP-SYS STALLS | YIELD::TDYER | | Mon Feb 24 1997 11:38 | 14 |
|
LOCAL PUMPING SYSTEMS PROBLEMS:
Investigated both pump chattering and stalling problems. The return line
for both pumps is coiled to improve mixing. However, this creates a
significant whirlpool in the center of the tank and allows AIR to
enter the pump input. The AIR has been causing the stalling. We put
an obstruction in the center of the tank to disturb the whirlpool. This
stopped all air from entering the pump. Immediately the pumps sounded
quieter, smoother. The tungsten pump still charters slightly. I will
order and replace this pump. When the Polishers becomes idle, we will
drain the two tanks and weld a plastic "dam" in the center.
TD/DANO
|
| 37.410 | wall welded / leaks found | SUBPAC::LANDRY | | Wed Feb 26 1997 19:20 | 25 |
| The system was not using the Metal slurry today, so we drained the
tank, cleaned it out thouroughly, and welded a wall in the bottom of
the tank. This welded wall has stopped the whirlpool phenomina that
was exhibited prior to the weld job. Please be aware that this wall
is fairly fragile and can easily break. Please be careful when
performing any maintenance in this tank. By the way, we were unable to
find the proper welding rod to adhere this wall. But, with a bit of
A shift brainstorming, we were able to accomplish the feat!
Later in the day, the contractors hooking up the Auriga notified us of
chemical (tested as an acid) on the floor around their plumbing job.
After intense investigation, we found no chemical leak. But, it's
obvious someone along the line had a major metal slurry leak of some
kind, as the evidence of streaking, dried slurry was around the pumps,
on the poly deck and down the side of the system. We also found water
leaking in several spots on the system. One was near the unload
cassette area. We had to use RTV to seal this up. The second source
of water was in the plenum around the primary table. Much water was
found. It was cleaned up and all tubing in the general area was
checked for leaks, with none found. It may have come from the rinse
ring/plexi cover area. Please be aware, it may need to be rechecked
soon.
A shift
|
| 37.411 | CMP.C1 Update 3/4/97 | SUBPAC::DANOCONNOR | | Tue Mar 04 1997 16:56 | 10 |
|
Both Pads have been replaced to allow for processing of lot XE0555 tomorrow.
There is a slight water leak at the connection for the Primary plateum ring
rinse so the water has been shut off. The leak will be repaired tonight if
possible.
Tomorrow morning the system will need to be conditioned and qualified before the
lot can be processed.
/DRO
|
| 37.412 | CMP-C1 Update 3/4/97 | SUBPAC::DANOCONNOR | | Tue Mar 04 1997 17:00 | 5 |
|
The filter for the Fe(NO3)3 slurry has been changed today and a 10.0um filter
installed.
/DRO
|
| 37.413 | water leak update | SUBPAC::LANDRY | | Tue Mar 04 1997 19:17 | 12 |
| Located a water leak on the primary side of the system. The tub rinse
ring's feedthrough (which penetrates the polydeck) had a fitting on the
bottom side of the feedthrough that was leaking. We have re-taped the
pipe threads and re-installed. Time will tell if this comes back.
And yes, the water to the ring is back on.
Please be aware, that this may not be the only leaking fitting under
the poly decking. Please monitor it if possible.
A shift
|
| 37.414 | TIM'S HIT LIST FOR .C1 | FABSIX::B_WESTPHAL | | Sat Mar 08 1997 20:31 | 47 |
|
CMP.C1 needs a few adjustment.
1) Loader alignment; shuttle is hitting and missing wafers
* I checked how the shuttle was picking the wafers from the cassette.
The shuttle was moving to far in so moved the hard stop out. While
running wafers I noticed that the cassette is sitting back on an angle
so that the bottom wafers hit the heel of the shuttle and the top wafers
are closer to the toe. This might be because of the little homemade
block supporting the back of the cassette. It might need to be shaved down.
While trying to adjust the hard stop I broke the cassette sense lever off
the micro switch. This happened at the end of the shift so I didn't have
time to replace it. The tool presently sits w/ the switch removed, needing
a new one and loader alignment incomplete. Sorry about that.
2) Shuttle jam sensitivity, shuttle is NOT stopping during a jam, needs
calibration
* Checked it and it was not working. I found that 1 of the 2 bolts holding
the shuttle together was loose(bottom). Tightened the same and tested it
4 or 5 times.
3) Arm down movement in AUTOMATIC is too HARD; when the arm is lowing to
the final table, it slams the wafer down, when it is unloading in the
water track it slam the wafer down.....
4) The wafer sensor in the unload cup is intermittently no sensing wafers,
please make sure the sensor head is staying clean and the N2 is keeping
keeping it purge, make sensor gain adjustments as necessary.
* I checked the load cup wafer sensor several times with a shinny tungsten
wafer, an oxide wafer and a patterned wafer. It sensed every time. The
N2 blow off also seemed to be working good.
5) Down force alarms, I'll take care of this one
6) Temp alarms, I'll take care of this also
7) W-Slurry tank dam is TOO big. Bob Gee, can you please shrink down to a
~ 2X4" damm ?
Please leave a very good pass down, I will follow up on any open issues on
Monday.
Thanks,
Tim
CC: FABSIX::B_GEE,KRUPA,DANO,FABSIX::E_DAWSON
|
| 37.415 | cassette sensor and more | FABSIX::R_GEE | | Mon Mar 10 1997 19:26 | 11 |
| - Replaced the two broken sensors, (cassette present & shuttle at
cassette.
- Adjusted the shuttle at cassette position.
- Replaced the time delay module for the wafer load module, wafer
present sensor blowoff.
- Slowed the down travel at final polish speed down 1/4 turn (fv6)
so the head lands softer.
- Adjusted the head balance.
- Ran test wafers with no problems.
A shift
|
| 37.418 | Slurry tanks / tool functionality | FABSIX::R_GEE | | Mon Mar 17 1997 09:28 | 16 |
|
- Cut down the slurry tank baffles at the bottom of both
tanks to an upside down "V" and placed a top on them to
reduce the whirlpool and solids buildup. If this corrects
the problem it will be poly welded in place, so far it
looks good. Filled both tanks with water.
- Cleaned the metal slurry buildup on the wafer unload water track.
(between the two poly plates).
- Repaired an air line leak under the unload cassette.
- Cycled 50 wafers Manually thru the system with no errors.
|
| 37.419 | spindles not rotating / vacuum / recieve dump/fill | FABSIX::R_GEE | | Mon Mar 17 1997 19:30 | 11 |
| - Called in because the spindles wouldn't rotate. Brendan powered
down the tool, reset all the breakers,(none looked tripped) and
let sit for 2 min. to let everything de-energize. Powered backup,
tested o.k.
- Errored for "no wafer on arm". Removed, cleaned and adjusted the
vacuum sensor, all set.
- The Unload cassette water would dump but not fill. Traced the
problem to a bad connection on the jumper at TR2. Soldered the
wire and tested, all set.
A shift
|
| 37.420 | weekend hit list | YIELD::TDYER | | Fri Mar 21 1997 16:11 | 18 |
|
This weekends adventure planed for W-CMP.....
CMP.C1
-The Slurry tank lids need to be trimed to fit over the return
tubes.
-The 2nd table dispence arm is leaking by the end plugs, please seal
with PVC glue.
-The polisher needs a real good scrubing, especialy the unload area
and the loader cup needs to be dis-assembled and cleaned.
-The vacuum switch triger point needs to be lowered. Currently it
needs to see ~15" of vaccum to detect a wafer, causing errors just
just prior to lift off from polish table. Please lower this to
trip at ~5-10" of vacuum.
Thanks,
Tim
|
| 37.421 | Tim's hit list completed. | FABSIX::B_WESTPHAL | | Sat Mar 22 1997 19:57 | 32 |
| weekend hit list
--------------------
CMP.C1
DONE -The Slurry tank lids need to be trimmed to fit over the return
tubes.
1. Lids are trimmed.
2. Drained the SC112 tank as requested by the P.E.T..
DONE -The 2nd table dispense arm is leaking by the end plugs, please seal
with PVC glue.
1. Put 4 coats of the PVC glue on. The same is drying.
2. Pads are off the tool as the P.E.T. requested. We didn't bother
to put the pads back on because we didn't know what was needed
on the primary.
DONE -The polisher needs a real good scrubbing, especially the unload area
and the loader cup needs to be disassembled and cleaned.
1. The tool was scrubbed with acetone.
2. The loader was disassembled cleaned. Adjustments were made to
the both sensors on the wafer lift assembly.
DONE -The vacuum switch trigger point needs to be lowered. Currently it
needs to see ~15" of vacuum to detect a wafer, causing errors just
just prior to lift off from polish table. Please lower this to
trip at ~5-10" of vacuum.
1. Adjusted the switch to 10".
Thanks,
Tim
|
| 37.422 | POOR UNIFORMITY | FABSIX::B_WESTPHAL | | Thu Mar 27 1997 19:50 | 5 |
| CMP.C1 - Down for poor uniformity. Found that all alignments were out. The
carrier gearbox .0015. Tried to bring it back in by various shim
arrangements but could not get in. Ran out of time will continue
tomorrow.
|
| 37.423 | Continued alignments | LUDWIG::STANDING | | Fri Mar 28 1997 19:37 | 8 |
| CMP.C1-7 Continued with the alignments. Primary platen runout was .01
out of tolerance. Removed platen and cleaned under it. Checked it
again and it was .0035 Next checked the secondary platen and it was
very shaky at .01 also. Cleaned under platen and rechecked it came in
at .007 Checked the carrier sweep on both platens, primary was
adjusted to .005, the secondary was adjusted to .006. Ran out of time
to finish adjustment on the carrier runout. (previously done on the
primary platen when it was out of tolerance) Will continue tomorrow.
|
| 37.424 | Alignments are out. | FABSIX::B_WESTPHAL | | Sat Mar 29 1997 19:33 | 6 |
|
CMP.C1 - Still down for poor uniformity issues. We tried all day to get the
arm sweep in on both platens but couldn't do it. Tool presently sets
with the primary runout at .003, the 2nd table at .01 and the sweeps
and gear box way out. Ran out of time.
|
| 37.425 | alignments | SUBPAC::LANDRY | | Mon Mar 31 1997 20:03 | 12 |
| Ahhhhh, what a delight to once again spend the entire day with this
system! It doesn't get any better than this......To cut to the chase,
this is a brief synopsis of the day's festivities.
It took us the enitre day to finally get the alignments in. Great
learning experience for us A shifters, but not fun! After the
alignments were completed, we began to re-assemble the components that
were removed during this process. The system sits idle. It will need
new pads and a carrier, as the carrier on the system is a used one just
used to perform the final adjustments.
A shift
|
| 37.426 | System Update 4-1-97 | SUBPAC::DANOCONNOR | | Tue Apr 01 1997 17:55 | 19 |
|
Not a great day for processing on the Westec - System is down pretty
hard.
Installed new pads and reinstalled the "good" carrier.
- The system would not go into wet mode
- The secondary platen would not turn
- Water or coolent started leaking out of the center of the secondary
platen.
Turned the system over to the Doctor after pulling off the carrier
and placing it in the hood with water flowing.
Tomorrow is another day
/Dan
|
| 37.427 | leak in final table | FABSIX::J_SADIN | Freedom isn't free. | Tue Apr 01 1997 20:42 | 10 |
|
Called over for bubble in final table pad (bubble in center). Found
table chiller water seeping up through table nut. Tightened nut with no
change. Removed nut, installed platen seal and retightened nut. No
change. Not sure of problem source. It's leaking bad enough that
something may be missing. Passing down to next shift (out of time).
a_shift
|
| 37.428 | Both platen started leaking and they alignments went out | LUDWIG::STANDING | | Wed Apr 02 1997 20:31 | 10 |
| CMP.C1-7 Down for the final platen leaking glycol from the spindle nut.
Removed nut and was unable to remove bearing seal so We had to pull
the platen to remove a pinched O-ring. Replaced O-ring(size .022
KALREZ) and checked alignments, all were out. Repositioned the
platen several times to get the best reading for platen run out of
.010 sweep .006 and gearbox was .010 The started to run wafers and
noticed a big bubble forming under the primary pad. It was glycol
leaking out from the same spot. Had to pull the platen to get the
O-ring out. Checked alignments they are platen runout .010 , sweep
.014 gearbox was +.030. Ran out of time to continue.
|
| 37.429 | SHUT DOWN COMPLETED | FABSIX::B_WESTPHAL | Bradley BP#661 EXT# 6610 | Fri May 23 1997 14:52 | 20 |
|
CMP.C SHUT DOWN CHECK SHEET
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
INIT / DATE
1) REMOVE CARRIER __BW__/23MAY97
2) PLACE WIPES UNDER CARRIER FILMS AND LAY CARRIERS DI TANK __BW__/23MAY97
3) CLEAN ENTIRE SYSTEM OF DRIED SLURRY __BW__/23MAY97
4) REMOVE CONDITIONER AND CLEAN * Soaking in sink __BW__/23MAY97
5) SHUT OFF DI BEHIND SYSTEM (ROTATE 3W VLV TO FULL RETURN) __BW__/23MAY97
6) DRAIN ELEVATOR AND CONDITIONER TUBE __BW__/23MAY97
7) DRY ENTIRE SYSTEM OF ANY STANDING WATER __BW__/23MAY97
CMP.C START UP CHECK SHEET
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
INIT / DATE
1) TURN ON DI WATER (ROTATE 3W VLV TO FULLY TO POLISHER. ______/______
2) INSTALLL CARRIER ______/______
3) PUT WET MODE PROGRAM ______/______
|
| 37.430 | startup | FABSIX::B_FINN | | Tue May 27 1997 19:29 | 10 |
|
CMP.C START UP CHECK SHEET
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
INIT / DATE
1) TURN ON DI WATER (ROTATE 3W VLV TO FULLY TO POLISHER. ED,BF/BG/TL - 5/27/97
2) INSTALLL CARRIER ED,BF/BG/TL - 5/27/97
3) PUT WET MODE PROGRAM ED,BF/BG/TL - 5/27/97
|
| 37.431 | pump hose | FABSIX::J_SADIN | Freedom isn't free. | Mon Jun 02 1997 20:00 | 6 |
|
replaced primary peristoltic pump hose (old one blew out).
a-shift
|
| 37.432 | DF, Knife, Vacuum switch, tubing | SUBPAC::LANDRY | | Tue Jun 03 1997 20:20 | 34 |
| The system had a problem today with the air/H2O knife. The flow of air
was deemed in-adequate, dispite the 89 PSI pressure observed (when
capped off) in between the check valve and the knife. Intense trouble
shooting took place to increase the flow. ALL valves, regulator, Nozzles,
tubing were checked out and/or cleaned. NO restrictions were found other
than a couple of clogged nozzles. But, that said, the flow rate should
have been increased in the openly flowing nozzles, which was not the case.
We tried using a different piece of tubing, running straight from the back
of the system directly to the knife. The flow rate was indeed more than
adequate at this point. We then starting adding on the individual compo-
nents one by one. We eventually lost pressure (minimal) as we added on.
We found some short pieces of tubing were stretched/twisted/restricted as
well. We also noticed that the tubing we used to test with, had a bigger
inner diameter than what was on the system. Therefore, we changed over to
said tubing (with all the components hooked in line) and the flow was good.
We achieved a pressure reading of 45 PSI on a gauge (with the tubing open
ended through the nozzle) to confirm the status. With the original tubing,
we could only achieve ~35 PSI max.
Down force was also checked today. It was 10 lbs low. It was recalibrated.
The valving for the slurry/water was checked to assure now dilution was
taking place. This was checked due to the poor removal rate currently being
seen from the system.
The vacuum switch was erratic as well today. This was changed out, tested,
adjusted, and retested. A different style switch was installed per Tim D's
request. It is now functioning as should.
Also, the tubing for slurry pumps #1 & 2 was changed out. What a technicians
dream those old fashion pump heads are!
A shift
|
| 37.433 | Sv changed | FABSIX::B_WESTPHAL | Bradley BP#661 EXT# 6610 | Thu Jun 05 1997 20:37 | 7 |
|
CMP.C1 - Slurry SV22 was swapped out with a new part because it was leaking.
Slurry motor #1 is presently out of the tool. The shaft is bent and
will be replaced tomorrow. Engineering requested That the shaft
height be set to .760. This will be done in the morning. Ran out of
time.
|