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Conference asdg::cmp

Title:	CMP
Notice:	Welcome to the CMP notesfile
Moderator:	FABSIX::B_TOWERLLE

Created:	Tue Oct 31 1995
Last Modified:	Fri Jun 06 1997
Last Successful Update:	Fri Jun 06 1997
Number of topics:	94
Total number of notes:	6381

9.0. "STRASBAUGH CRASH FORMS" by SUBPAC::BJUBINVILLE (CMP-6 Equipment Engineering) Fri Dec 13 1996 04:58

                                                                       REV. 2.0
                                                                       12/9/97

This report to be filled out OPS, Equipment and Process together!!
    
                      CMP.A1 & CMP.A2 WAFER BREAKAGE FORM
                      -----------------------------------

 1) System:  CMP.A1:_____    CMP.A2:_____

 2) Time of incident:____________

 3) Name of Operations Technician:___________

 4) Recipe Name:_____________

 5) Recipe Step #:__________

 6) Time into step:_________

 7) Type of wafers that broke:  PRODUCT:_____   MONITOR:_____

 8) If Product, give:  LOT #:__________     DEVICE #:____________

 9) If Monitors, were they:  PAD BREAKIN/EXERCISE:______    MQC:______

10) Which carrier lost the wafer:   RIGHT:_____   LEFT:_____

                                    BOTH:_____    DON'T KNOW:_____

11) Alarms displayed by polisher:______________________________________________
				 ______________________________________________
				 ______________________________________________

12) # of wafers on pad:_______

13) # of wafers on carrier:______

14) If Product, how many wafers in the lot were polished before the crash:_____

15) Was the PRODUCT lot receiving:  INITIAL POLISH:_____ or  TOUCH UP:_____

16) If Monitors, how many monitors were polished before the crash:______

17) Were any "ASSISTS" recently logged prior to the crash:  YES_____  NO_____

    If yes, what were the "ASSISTS" for:_______________________________________

    ___________________________________________________________________________

18) On previous runs, were the carriers sticking to the pad at the end of

    the polish cycle:   YES:_____   NO:_____

19) Was there plenty of slurry (for step 1&2) or water (step 3) present on
    the table:  YES:_____  NO:_____

20) Please note any and all other unusual circumstances that were noticed
    about the tool at the time of the crash or on any prior runs.  No in-
    formation is too trivial!!

                               



21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.

T.R	Title	User	Personal Name	Date	Lines
9.1	Crash on CMP.A2	YIELD::SHONG		`Wed Oct 02 1996 01:11`	30
	1) System= CMP.A2 2) Recipe= PMD 3) Step #= #2 4) Time into step= 5 seconds 5) Type of wafers that broke= TM69 product 6) Carrier which wafer slid out of= Right 7) Other carriers that were damaged= Yes 8) Alarms displayed by polisher _None_________________________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _No_, systems____________ 10) Did wafer detect work= No 11) # of wafers on pad= 98 12) # of wafers on carrier= 49 13) Was there any vibration prior to the crash= No 14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on the table= Yes 15) Check step height of the carrier from question #6= -.0065 16) Please note any other unusual circumstances: I questioned the operator on the amps for the table. He wasn't sure what they were at when the wafer crashed. 17) Put this check sheet in CMP note #34
9.2	CMP.A2 CRUNCH	SUBPAC::CLIFFORD		`Sat Oct 05 1996 19:06`	28
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System __CMP.A2_________ 2) Recipe ___PMD________ 3) Step # __2___ 4) Time into step __5sec____ 5) Type of wafers that broke _PRODUCT_JD0547_________ 6) Carrier which wafer slid out of __RIGHT____ 7) Other carriers that were damaged __LEFT______ 8) Alarms displayed by polisher _________NA___TOOL WAS EMO'D__________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash NO__, sysytems____________ 10) # of wafers on pad _108___ 11) # of wafers on carrier __54____ 12) Was there any vibration prior to the crash __NO____ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES_______ 14) Check step height of the carrier from question #6 _60 TO 80(LOT'S OF SILICON DUST ON FILM) 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9
9.3	a1 shift change crash	STRATA::RIDLON	Eliminate the oblivious	`Sun Oct 06 1996 02:17`	26
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System: A1 2) Recipe: unknown 3) Step #: unknown 4) Time into step: unknown 5) Type of wafers that broke: dummies 6) Carrier which wafer slid out of: left 7) Other carriers that were damaged: yes 8) Alarms displayed by polisher: tool emo'd by previous shift. 9) Did any other polisher error for slurry or crash: NO, sysytems____________ 10) # of wafers on pad: 110 11) # of wafers on carrier: half that 12) Was there any vibration prior to the crash: unknown 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES 14) Check step height of the carrier from question #6: ring chewed up, film chewed up, making this impossible. 15) Please note any other unusual circumstances: NONE. 16) Put this check sheet in CMP note #9
9.4	crash a2	FABSIX::R_KELLETT		`Mon Oct 07 1996 06:55`	32
	From: SUBPAC::TOOKER "01-Oct-1996 1236" 1-OCT-1996 12:37:28.47 To: @CMP CC: Subj: Please fill out this form for all wafer breakage on cmp.a1 & cmp.a2 CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System cmp.a2___________ 2) Recipe pmd___________ 3) Step # 2_____ 4) Time into step unknown______ 5) Type of wafers that broke product__________ 6) Carrier which wafer slid out of _unknown_____ 7) Other carriers that were damaged both________ 8) Alarms displayed by polisher __none____________________________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no___, sysytems____________ 10) # of wafers on pad _2_____ 11) # of wafers on carrier _1_____ 12) Was there any vibration prior to the crash __no____ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __quiestable_______ 14) Check step height of the carrier from question #6 _______ 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9
9.5	CMP.A1 CRASH - TWO PRODUCT WAFER	FABSIX::J_SADIN	Freedom isn't free.	`Mon Oct 07 1996 09:41`	34
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) LOT# - JD0559 DEVICE - DC1026EA OPER# - 1978 (CMP AFTER PMD DEP1) WAFERS - 2 PRODUCT WAFERS BROKEN ON PAD 1) System __CMP.A1___ 2) Recipe __PMD______ 3) Step # _3___ 4) Time into step __10__ 5) Type of wafers that broke _PRODUCT (PMD LOT AT TOUCHUP). 6) Carrier which wafer slid out of _LEFT_ 7) Other carriers that were damaged _BOTH___ 8) Alarms displayed by polisher _RIGHT SPINDLE NOT ARRIVING UP________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _NO_, sysytems____________ 10) # of wafers on pad __24__ 11) # of wafers on carrier __87__ 12) Was there any vibration prior to the crash __NO__ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES____ 14) Check step height of the carrier from question #6 _ 7.0mils (APPROXIMATE. CARRIER PRETTY WELL TORN UP) 15) Please note any other unusual circumstances: RIGHT SPINDLE SPINNING VERY SLOWLY ON PAD IN STEP #3. 16) Put this check sheet in CMP note #9 - DONE
9.6	CMP.A1 CRASH	SUBPAC::CLIFFORD		`Sat Oct 12 1996 19:06`	28
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System __CMP.A1_________ 2) Recipe ___MQC________ 3) Step # __2___ 4) Time into step __NA____ 5) Type of wafers that broke _MQC WAFERS_________ 6) Carrier which wafer slid out of __LEFT____ 7) Other carriers that were damaged __RIGHT______ 8) Alarms displayed by polisher _________NA___TOOL WAS EMO'D__________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash NO__, sysytems____________ 10) # of wafers on pad _98___ 11) # of wafers on carrier __186____ 12) Was there any vibration prior to the crash __NO____ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES_______ 14) Check step height of the carrier from question #6 _60 TO 80(LOT'S OF SILICON DUST ON FILM) 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9
9.7	cmp.a1 crash	FABSIX::J_SADIN	Freedom isn't free.	`Sun Oct 13 1996 17:12`	37
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) LOT# - JD0576 DEVICE - DC1026EA OPER# - 1978 (CMP AFTER PMD DEP1) WAFERS - 2 PRODUCT WAFERS BROKEN ON PAD 1) System __CMP.A1___ 2) Recipe __PMD______ 3) Step # _3___ 4) Time into step __25__ 5) Type of wafers that broke _PRODUCT (PMD LOT AT TOUCHUP). 6) Carrier which wafer slid out of _LEFT_ 7) Other carriers that were damaged _BOTH___ 8) Alarms displayed by polisher _ROTATE AXIS ERROR ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _NO_, sysytems____________ 10) # of wafers on pad __58__ 11) # of wafers on carrier __43__ 12) Was there any vibration prior to the crash __NO__ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES____ 14) Check step height of the carrier from question #6 _ 7.0 (SEE QUESTION#15) 15) Please note any other unusual circumstances: FOUND SCREW MISSING FROM WHITE RETAINER RING ON LEFT CARRIER. STEP HEIGHT AT THIS POINT WAS 2.0MIL VS 7.0MIL AROUND THE REST OF THE CARRIER. IT'S VERY POSSIBLE THIS CONTRIBUTED TO THE WAFER LOSS. 16) Put this check sheet in CMP note #9 - DONE
9.8	cmp.a2 crash	FABSIX::J_SADIN	Freedom isn't free.	`Sun Oct 13 1996 19:36`	36
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) LOT# - JD0580 DEVICE - DC1026EA OPER# - 1978 (CMP AFTER PMD DEP1) WAFERS - 2 PRODUCT WAFERS SCRATCHED ON PAD 1) System __CMP.A2___ 2) Recipe __PMD______ 3) Step # _3___ 4) Time into step __2___ 5) Type of wafers that broke _PRODUCT (PMD LOT AT TOUCHUP). 6) Carrier which wafer slid out of _LEFT_ 7) Other carriers that were damaged _BOTH___ 8) Alarms displayed by polisher NONE----------------------------------------- ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _NO_, sysytems____________ 10) # of wafers on pad _322__ 11) # of wafers on carrier _193__ 12) Was there any vibration prior to the crash __NO__ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES____ 14) Check step height of the carrier from question #6 _ 6.5MILS 15) Please note any other unusual circumstances: WITNESSED WAFER SLIP OUT FROM LEFT CARRIER AND SLIDE UNDER RIGHT CARRIER. EMO'D TOOL BEFORE WAFERS BROKE, BUT BOTH WERE SCRATCHED BEYOND SAVING. REPLACING PAD/CARRIERS. 16) Put this check sheet in CMP note #9 - DONE
9.9	A1 crash 10-14-96	FABSIX::R_POIRIER		`Mon Oct 14 1996 06:09`	25
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System __CMP.A1___ 2) Recipe ___PMD_____ 3) Step # __2__ 4) Time into step __unknown____ 5) Type of wafers that broke ____break-in__ 6) Carrier which wafer slid out of _left__ 7) Other carriers that were damaged _right__ 8) Alarms displayed by polisher ___none_______________________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no_, sysytems____________ 10) # of wafers on pad _48___ 11) # of wafers on carrier __24__ 12) Was there any vibration prior to the crash __no__ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __yes____ 14) Check step height of the carrier from question #6 __N/A__(film to damaged) 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9
9.10	CMP.A1 CRUNCH	SUBPAC::CLIFFORD		`Wed Oct 16 1996 19:53`	28
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System __CMP.A1_________ 2) Recipe ___MQC________ 3) Step # __2___ 4) Time into step __NA____ 5) Type of wafers that broke _EXCERCISE_________ 6) Carrier which wafer slid out of __LEFT____ 7) Other carriers that were damaged __RIGHT______ 8) Alarms displayed by polisher _________NA___TOOL WAS EMO'D__________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash NO__, sysytems____________ 10) # of wafers on pad _14___ 11) # of wafers on carrier __91____ 12) Was there any vibration prior to the crash __NO____ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES_______ 14) Check step height of the carrier from question #6 _60 TO 80(LOT'S OF SILICON DUST ON FILM) 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9
9.11	WAFERS CRASHED ON CMP.A2	SUBPAC::BJUBINVILLE	CMP-6 Equipment Engineering	`Fri Oct 18 1996 04:39`	32
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) (2) wafers blown away from lot JL0598 1) System: CMP.A2 2) Recipe: PMD 3) Step #: 3 4) Time into step: (0) end of step 5) Type of wafers that broke: DC1071 6) Carrier which wafer slid out of: N/A 7) Other carriers that were damaged: both 8) Alarms displayed by polisher: NO WAFERS PRESENT 9) Did any other polisher error for slurry or crash: no: sytems____________ 10) # of wafers on pad: 132 11) # of wafers on carriers: 66 ea. 12) Was there any vibration prior to the crash: n/a 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: yes 14) Check step height of the carrier from question #6: right carrier at -5 to -8 15) Please note any other unusual circumstances: Both wafers were left on the table and the bridge went to LOAD and alarmed for NO WAFERS PRESENT. Heavy scratches on both retaining rings. The right carrier had a exposure reading out of spec. The pad was not stuck to the SUBA pad much at all. The pad was practically floating. 16) Put this check sheet in CMP note #9: done...
9.12	PRODUCT CRASH ON CMP.A2	FABSIX::R_TRAN		`Thu Oct 24 1996 07:23`	42
	-< cmp.a2 crash >- -------------------------------------------------------------------------------- CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) LOT# - JD0602 DEVICE - DC1026 OPER# - 1978 (CMP AFTER PMD DEP1) WAFERS - 2 PRODUCT WAFERS SCRATCHED ON PAD 1) System __CMP.A2___ 2) Recipe __PMD______ 3) Step # _3___ 4) Time into step __100___ 5) Type of wafers that broke _PRODUCT (PMD LOT AT FULL RUN-110 SEC.) 6) Carrier which wafer slid out of _RIGHT_ 7) Other carriers that were damaged _BOTH___ 8) Alarms displayed by polisher NONE----------------------------------------- ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _NO_, sysytems____________ 10) # of wafers on pad _28__ 11) # of wafers on carrier _193__ 12) Was there any vibration prior to the crash __NO__ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES____ 14) Check step height of the carrier from question #6 _ N/A 15) Please note any other unusual circumstances: WAFER SLIP OUT FROM RIGHT CARRIER AND SLIDE UNDER LEFT CARRIER. EMO'D TOOL AFTER WAFERS BROKE, BUT LEFT WERE SCRATCHED BEYOND SAVING. REPLACING PAD/CARRIERS. 16) Put this check sheet in CMP note #9 -
9.13	CMP.A2 WAFER CRASH 10-26-96	FABSIX::E_DAWSON		`Thu Oct 24 1996 18:29`	37
	-< CMP.A2 CRASH>- -------------------------------------------------------------------------------- CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) LOT# - XD0561 DEVICE - TM69 OPER# - 1985 (CMP_ILD DEP2) WAFERS - 2 PRODUCT WAFERS BROKE ON THE PAD 1) System __CMP.A2___ 2) Recipe __ILD______ 3) Step # _3___ 4) Time into step __60___ 5) Type of wafers that broke _PRODUCT (ILD1....LOT HAD JUST RAN FOR 6 MIN) 6) Carrier which wafer slid out of -?_ 7) Other carriers that were damaged _BOTH___ 8) Alarms displayed by polisher...CMP.A2 ALARMED WHEN SEG #3 ENDED 9) Did any other polisher error for slurry or crash _NO_, sysytems____________ 10) # of wafers on pad _60__ 11) # of wafers on carrier _30/30__ 12) Was there any vibration prior to the crash __NO__ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES____ 14) Check step height of the carrier from question #6 _ FINE 15) Please note any other unusual circumstances: Well one comes to mind, tool crashes and five seconds later Ashland calls and asked if we have losty slurry? Hmmmmm, I think that may fall under "unusal circumstances". 16) Put this check sheet in CMP note #9
9.14	CMP.A2 WAFER CRASH 10-25-96	FABSIX::E_DAWSON		`Fri Oct 25 1996 19:49`	38
	-< CMP.A2 CRASH>- -------------------------------------------------------------------------------- CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) LOT# - JL0593 DEVICE - DC1030 OPER# - 1992 (CMP_ILD1) WAFERS - 2 PRODUCT WAFERS BROKE ON THE PAD 1) System __CMP.A2___ 2) Recipe __ILD______ 3) Step # _3___ 4) Time into step __?___ 5) Type of wafers that broke _PRODUCT (ILD1....LOT WAS RUNNING FOR FIRST 3 MIN...10 ,WAFER HAD ALREADY RAN.) 6) Carrier which wafer slid out of -?_ 7) Other carriers that were damaged _BOTH___ 8) Alarms displayed by polisher...CMP.A2 ALARMED WHEN SEG #3 ENDED 9) Did any other polisher error for slurry or crash _NO_, sysytems____________ 10) # of wafers on pad _136__ 11) # of wafers on carrier _68/68__ 12) Was there any vibration prior to the crash __YES__ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __NO SLURRY WAS PRESENT ON THE TABLE____ 14) Check step height of the carrier from question #6 _ FINE 15) Please note any other unusual circumstances: Tool breaks wafers and two seconds later Ashland calls and asked me to stop polish'n they have a cloged filter. I say "You know I will". A day late and 2 product short. 16) Put this check sheet in CMP note #9
9.15	cmp.a2 crash	FABSIX::J_SADIN	Freedom isn't free.	`Tue Oct 29 1996 18:01`	34
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) JD0619 DC1026EA PMD OP# 1978 2 WAFERS SCRAPPED (FROM 24WFR DOWN TO 22WFRS) 1) System _cmp.a2____ 2) Recipe _pmd_______ 3) Step # _4___ 4) Time into step _10___ 5) Type of wafers that broke _product___ 6) Carrier which wafer slid out of _right_ 7) Other carriers that were damaged _left___ 8) Alarms displayed by polisher _right carrier not arriving up________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no_, system______________ 10) # of wafers on pad _110__ 11) # of wafers on carrier _55___ 12) Was there any vibration prior to the crash _no___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _yes_____ 14) Check step height of the carrier from question #6 _carrier too trashed__ 15) Please note any other unusual circumstances: RIGHT SPINDLE WAS STUCK TO PAD WITH FULL VACUUM ON (2.6psia). 16) Put this check sheet in CMP note #9 - done.
9.16	cmp.a2 dummy crash	FABSIX::J_SADIN	Freedom isn't free.	`Mon Nov 04 1996 12:45`	30
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 dummy wafers crashed on pad. 1) System _cmp.a2____ 2) Recipe _pmd_______ 3) Step # _3___ 4) Time into step _30___ 5) Type of wafers that broke _dummy___ 6) Carrier which wafer slid out of _left_ 7) Other carriers that were damaged _right___ 8) Alarms displayed by polisher _none_________________________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no_, system______________ 10) # of wafers on pad _138__ 11) # of wafers on carrier _70___ 12) Was there any vibration prior to the crash _no___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _yes_____ 14) Check step height of the carrier from question #6 _carrier too trashed__ 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9 - done.
9.17	CMP.A1 CRASHS REPORT	FABSIX::E_DAWSON		`Sat Nov 16 1996 17:49`	47
	-< CMP.A1 CRASH>- -------------------------------------------------------------------------------- CMP.A1 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) LOT# - JL0675 DEVICE - DC1044 OPER# - 1984 CMP_L_PMD WAFERS - 2 PRODUCT WAFERS BROKE ON THE PAD 1) System __CMP.A1___ 2) Recipe __PMD______ 3) Step # _3___( 20 SEC RINSE ) 4) Time into step __2 SEC___ 5) Type of wafers that broke _PRODUCT (PMD / DC1044...15 SEC TOUCH UP.) 6) Carrier which wafer slid out of -?_ 7) Other carriers that were damaged _BOTH___ 8) Alarms displayed by polisher...NONE IT JUST KEPT ON GO'IN AND GO'IN... 9) Did any other polisher error for slurry or crash _NO_, 10) # of wafers on pad _60__ 11) # of wafers on carrier _30/30__ 12) Was there any vibration prior to the crash __NO__ 13) Was there plenty of water (step 3) present...UNABLE TO DETERMINE 14) Check step height of the carrier from question #6 _ FINE 15) Please note any other unusual circumstances: YOU MAY WANT TO CHECK DI FLOW IN SEG#3....?#13 16) Put this check sheet in CMP note #9...DONE
9.18	.a1 crash	FABSIX::S_MCREYNOLDS		`Mon Nov 18 1996 04:14`	30
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 dummy wafers crashed on pad. 1) System _cmp.a1____ 2) Recipe _MQC_______ 3) Step # _3___ 4) Time into step _30___ 5) Type of wafers that broke _dummy___ 6) Carrier which wafer slid out of _right_ 7) Other carriers that were damaged _left___ 8) Alarms displayed by polisher _none_________________________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no_, system______________ 10) # of wafers on pad _141__ 11) # of wafers on carrier _70___ 12) Was there any vibration prior to the crash _no___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _yes_____ 14) Check step height of the carrier from question #6 _carrier too trashed__ 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9 - done.
9.19	.A2 crash	FABSIX::J_SADIN	Freedom isn't free.	`Wed Nov 20 1996 15:17`	35
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 product wafers crashed JL0677 DC1044 PMD (op# 1984) 24 wafers down to 22 1) System _cmp.a2 2) Recipe _pmd_______ 3) Step # _5___ 4) Time into step _9___ 5) Type of wafers that broke _product__ 6) Carrier which wafer slid out of _???_ 7) Other carriers that were damaged _both___ 8) Alarms displayed by polisher _rotate axis error____________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no_, system______________ 10) # of wafers on pad _152__ 11) # of wafers on carrier _221__ 12) Was there any vibration prior to the crash _no___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _yes_____ 14) Check step height of the carrier from question #6 _carrier too trashed__ 15) Please note any other unusual circumstances: rotate axis error. had run ok until this. 16) Put this check sheet in CMP note #9 - done.
9.20	cmp.a1 crash	FABSIX::J_SADIN	Freedom isn't free.	`Wed Nov 20 1996 18:24`	36
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 product wafers crashed JL0669 DC1030 PMD (op# 1984) 24 wafers down to 22 1) System _cmp.a1 2) Recipe _pmd_______ 3) Step # _5___ 4) Time into step _10___ 5) Type of wafers that broke _product__ 6) Carrier which wafer slid out of _???_ 7) Other carriers that were damaged _both___ 8) Alarms displayed by polisher _none. ____________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no_, system______________ 10) # of wafers on pad _196__ 11) # of wafers on carrier _221__ 12) Was there any vibration prior to the crash _no___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _yes_____ 14) Check step height of the carrier from question #6 _carrier too trashed__ 15) Please note any other unusual circumstances: bridge thought it had vacuum and moved to the load station before realising it was missing wafers. 16) Put this check sheet in CMP note #9 - done.
9.21	CMP.A1 crash	FABSIX::J_SADIN	Freedom isn't free.	`Sun Nov 24 1996 18:44`	29
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 dummy wafers crashed 1) System _cmp.a1 2) Recipe _mqc_______ 3) Step # _3___ 4) Time into step _10___ 5) Type of wafers that broke _dummy_ 6) Carrier which wafer slid out of _left_ 7) Other carriers that were damaged _both___ 8) Alarms displayed by polisher _none. ____________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no_, system______________ 10) # of wafers on pad _128__ 11) # of wafers on carrier _228__ 12) Was there any vibration prior to the crash _no___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _yes_____ 14) Check step height of the carrier from question #6 _carrier too trashed__ 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9 - done.
9.22	cmp .a1 crash sheet 11/25/96	FABSIX::M_PROVENCHER		`Mon Nov 25 1996 07:53`	37
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 breakin wafers crashed ild recipe 90 seconds in interval #2 1) System _cmp.a1 ___ 2) Recipe _ ILD _____ 3) Step # _5___ 4) Time into step __ 0 ___ 5) Type of wafers that broke _breakin wafer w/@30k on it__ 6) Carrier which wafer slid out of _ right _ 7) Other carriers that were damaged _ only the right carrier was affected ___ 8) Alarms displayed by polisher _ wafer not on carrier _______________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _ no _, system_see_comment__________ 10) # of wafers on pad _ 86 __ 11) # of wafers on carrier _ 43 __ 12) Was there any vibration prior to the crash _ no ___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _ yes _____ 14) Check step height of the carrier from question #6 _ carrier too trashed __ 15) Please note any other unusual circumstances: * There was a power glitch @ 7:00 am. a1, and a2 were running at the time. bridge on both tools would not home. had to power down and reset. On first set of breakin wafers, in interval #5 the left carrier lifted, the right one didn't. The wafer in the right carrier slid out and crashed into the carrier it once was on. 16) Put this check sheet in CMP note #9 - done.
9.23	CMP.A1 CRASH	SUBPAC::CLIFFORD		`Fri Nov 29 1996 19:56`	28
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System __CMP.A1_________ 2) Recipe ___PMD________ 3) Step # __2___ 4) Time into step __5-10sec's____ 5) Type of wafers that broke _EXCERCISE WAFERS_________ 6) Carrier which wafer slid out of __LEFT____ 7) Other carriers that were damaged __RIGHT______ 8) Alarms displayed by polisher _________NA___TOOL WAS EMO'D__________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash NO__, sysytems____________ 10) # of wafers on pad _~50___ 11) # of wafers on carrier __~250____ 12) Was there any vibration prior to the crash __NO____ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES_______ 14) Check step height of the carrier from question #6 (LOT'S OF SILICON DUST ON FILM) 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9
9.24	WAFER BREAKAGE, CMP.A2	SUBPAC::BJUBINVILLE	CMP-6 Equipment Engineering	`Sat Nov 30 1996 02:36`	36
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 product wafers crashed JD0652 DC1026 PMD (op# 1978) 24 wafers down to 22 1) System _CMP.A2 2) Recipe _PMD_______ 3) Step # _3___ 4) Time into step _?___ 5) Type of wafers that broke _product__ 6) Carrier which wafer slid out of _LEFT_ 7) Other carriers that were damaged _BOTH___ 8) Alarms displayed by polisher _NO VACUUM, LEFT SPINDLE______________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _NO_, system______________ 10) # of wafers on pad _66__ 11) # of wafers on carrier _62__ 12) Was there any vibration prior to the crash _NO___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _YES_____ 14) Check step height of the carrier from question #6: LEFT CARRIER -4.5 to -7.0 15) Please note any other unusual circumstances: NO 16) Put this check sheet in CMP note #9 - done.
9.25	crash 12-4-1996	FABSIX::S_MCREYNOLDS		`Wed Dec 04 1996 05:26`	20
	1) System _CMP.A1_____ 2) Recipe __PMD______ 3) Step # __2___ 4) Time into step _unknown_____ 5) Type of wafers that broke __Break ins___ 6) Carrier which wafer slid out of _Left___ 7) Other carriers that were damaged _right___ 8) Alarms displayed by polisher __left spindle not arriving up___ _______________________________________________ _______________________________________________ 9) Did any other polisher error for slurry or crash __no__, systems____________ 10) Did wafer detect work __n/a____ 11) # of wafers on pad _108_____ 12) # of wafers on carrier _229L 227R _on both____ 13) Was there any vibration prior to the crash __no____ 14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on the table __yes_______ 15) Check step hight of the carrier from question #6 __n/a_____ 16) Please note any other unusual circumstances:n/a
9.26	cmp.a2 crash 12/04/96	FABSIX::M_PROVENCHER		`Wed Dec 04 1996 07:14`	33
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 product wafers crashed pmd recipe 0 seconds in interval #3 1) System _cmp.a2 ___ 2) Recipe _ pmd _____ 3) Step # _3___ 4) Time into step __ 0 ___ 5) Type of wafers that broke _product jl0691 (x2)__ 6) Carrier which wafer slid out of _ left _ 7) Other carriers that were damaged _ both ___ 8) Alarms displayed by polisher _ no alarm was sounded _______________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _ no _, __________ 10) # of wafers on pad _ 112 __ 11) # of wafers on carrier _ l-241 r-242 __ 12) Was there any vibration prior to the crash _ no ___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _ yes _____ 14) Check step height of the carrier from question #6 _ carrier too trashed __ 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9 - done.
9.27	PRODUCT WAFER BREAKAGE ON CMP.A1	SUBPAC::BJUBINVILLE	CMP-6 Equipment Engineering	`Wed Dec 04 1996 21:03`	32
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 product wafers crashed JD0702 - TYPE-DC1026 PMD recipe 1) System _CMP.A1 ___ 2) Recipe _ PMD _____ 3) Step # _3___ 4) Time into step __ 120 ___ 5) Type of wafers that broke _ DC1026 (x2)__ 6) Carrier which wafer slid out of _ RIGHT _ 7) Other carriers that were damaged _ LEFT ___ 8) Alarms displayed by polisher: RIGHT SPINDLE NOT ARIVING UP ________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _ NO ___________ 10) # of wafers on pad _ 114 __ 11) # of wafers on carrier _ 57 ON BOTH __ 12) Was there any vibration prior to the crash _ NO ___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _ YES _____ 14) Check step height of the carrier from question #6: -6.5 to -7.5 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9 - DONE!
9.28	CMP.A1 CRASH	STRATA::WESTPHAL		`Fri Dec 06 1996 19:25`	38
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System _CMP.A1__________ 2) Recipe _STI-RWK__________ 3) Step # _?____ 4) Time into step __?____ 5) Type of wafers that broke _STI__________ 6) Carrier which wafer slid out of _LEFT_____ 7) Other carriers that were damaged _RIGHT_______ 8) Alarms displayed by polisher ___WAFER MISSING ON LEFT SPINDLE______________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _NO_, sysytems_N/A________ 10) # of wafers on pad _248__ 11) # of wafers on carrier _124__ 12) Was there any vibration prior to the crash _NO___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table ___?_____ 14) Check step height of the carrier from question #6 _N/A___ 15) Please note any other unusual circumstances: found one of the slurry tubes partially clogged. BW THE WAFERS WERE FROM LOT XD0593 THERE WAS TWO WAFERS ONE SLIPPED OUT OF THE LEFT CARRIER AND BROKE. THE WAFER IN THE RIGHT CARRIER STAYED IN THER CARRIER BUT WAS BROKEN. THERE WAS 4 EXCERCISE WAFERS RUN BEFORE THE TWO PRODUCT WAFERS WERE RUN. THE MACHINE WAS RUNNING STI WAFERS. IT WAS NOT NOTED AT WHAT TIME THE WAFER SLIPPED OUT OF THE CARRIER. WAFER COUNT ON THE PAD WAS 248 CARRIER COUNT WAS 124. NOTE: THERE WAS DRIED SLURRY ALL OVER THE POLISHING AREA. Eric 16) Put this check sheet in CMP note #9
9.29	cmp.a2 crash report 12/09/96	FABSIX::M_PROVENCHER		`Mon Dec 09 1996 03:07`	34
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 product wafers crashed ild recipe seconds in interval # 1) System _cmp.a2 ___ 2) Recipe _ ild _____ 3) Step # _ 2/3 ___ 4) Time into step __ ___ 5) Type of wafers that broke _product xd0618 ild1 (x2)__ 6) Carrier which wafer slid out of _ left _ 7) Other carriers that were damaged _ both ___ 8) Alarms displayed by polisher _ no alarm was sounded until after crash _____ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _ no _, __________ 10) # of wafers on pad _ 54 __ 11) # of wafers on carrier _ l-256 r-256 __ 12) Was there any vibration prior to the crash _ no ___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _ yes _____ 14) Check step height of the carrier from question #6 _ carrier too trashed __ 15) Please note any other unusual circumstances: breakin wafers ran, with no problem. this was the first 180 sec, and the first two product wafers, from this lot to touch pad. 16) Put this check sheet in CMP note #9 - done.
9.30	cmp.a2 crash	FABSIX::R_ANDERSON		`Mon Dec 09 1996 12:41`	30
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 2 product wafers crashed from lot XD0618 ILD1 OPERATION 1981 24 WAFERS DOWN TO 22 WAFERS 1) System _cmp.a2 2) Recipe ___ILD____ 3) Step # _? 4) Time into step _?___ 5) Type of wafers that broke _PRODUCT 6) Carrier which wafer slid out of _? 7) Other carriers that were damaged _both___ 8) Alarms displayed by polisher _none.????????? ____________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _no_, system______________ 10) # of wafers on pad _??? 11) # of wafers on carrier ???__ 12) Was there any vibration prior to the crash _????___ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table _?????? 14) Check step height of the carrier from question #6 ???????????? 15) Please note any other unusual circumstances: this happened on b shift no details availiable..... 16) Put this check sheet in CMP note #9 - done.
9.31	crash cmp.a1 12/10/96	FABSIX::M_PROVENCHER		`Tue Dec 10 1996 04:55`	68
	REV. 2.0 12/9/97 CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:__ x ___ CMP.A2:_____ 2) Time of incident:___ 4:30 am _ 12/10/96 __________ 3) Name of Operations Technician:_ M_Provencher _________ 4) Recipe Name:__ pmd _____ 5) Recipe Step #:__ 3/4 ____ 6) Time into step:___ 0 ____ 7) Type of wafers that broke: PRODUCT:_ x ___ MONITOR:_____ 8) If Product, give: LOT #:____ xd0625 ____ DEVICE #:__ t-69 ____ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__ n/a __ MQC:__ n/a __ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:__ x ___ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_left carrier not arriving up ________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:__ 58 ____ 13) # of wafers on carrier:__ l-118/r-206 __ 14) If Product, how many wafers in the lot were polished before the crash:_ 24 _ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__ x __ 16) If Monitors, how many monitors were polished before the crash:__ n/a __ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__ x __ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__ x __ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__x __ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! Two screws were missing from the left carrier, (where wafer slid out). They were found in the carrier clean station. step height was performed on the left carrier. it measured -.004. 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.32	CMP.A2 SLIDE-OUT NO SCRAPPED WAFERS!	SUBPAC::BJUBINVILLE	CMP-6 Equipment Engineering	`Fri Dec 13 1996 04:57`	69
	This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__X__ 2) Time of incident: 04:00 3) Name of Operations Technician: Mike C. 4) Recipe Name: PMD 5) Recipe Step #: 2 6) Time into step: 3 7) Type of wafers that broke: None - Product wafer slid of of the right carrier and OPS hit the EMO before it crashed. 8) If Product, give: LOT #: JD0692 DEVICE #: PMD1026 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:__X__ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher: None 12) # of wafers on pad: 42 13) # of wafers on carrier: 126 14) If Product, how many wafers in the lot were polished before the crash: 2 15) Was the PRODUCT lot receiving: INITIAL POLISH:__X__ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:__0___ NOTE: A product lot of 24 wafers just finished polishing before the the next lot (JD0692) was run on the tool. 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__X__ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__X__ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__X__ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! amps were up to ~30 prior to slide-out 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.33	CMP.A2 SLIDE-OUT CRASH PREVENTED!	SUBPAC::BJUBINVILLE	CMP-6 Equipment Engineering	`Fri Dec 13 1996 05:01`	69
	This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__X__ 2) Time of incident: 04:00 3) Name of Operations Technician: Mike C. 4) Recipe Name: PMD 5) Recipe Step #: 2 6) Time into step: 3 7) Type of wafers that broke: None - Product wafer slid of of the right carrier and OPS hit the EMO before it crashed. 8) If Product, give: LOT #: JD0692 DEVICE #: PMD1026 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:__X__ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher: None 12) # of wafers on pad: 42 13) # of wafers on carrier: 126 14) If Product, how many wafers in the lot were polished before the crash: 2 15) Was the PRODUCT lot receiving: INITIAL POLISH:__X__ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:__0___ NOTE: A product lot of 24 wafers just finished polishing before the the next lot (JD0692) was run on the tool. 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__X__ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__X__ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__X__ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! amps were up to ~30 prior to slide-out 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.34	cmp.a2 CRASH 12/14/96	FABSIX::G_ISAACS		`Sat Dec 14 1996 08:54`	69
	REV. 2.0 12/9/97 CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__XXXXX 2) Time of incident:__8:39 3) Name of Operations Technician:_Gwen 4) Recipe Name:__PMD 5) Recipe Step #:___2_ 6) Time into step:__4.2 sec 7) Type of wafers that broke: PRODUCT:_X_ MONITOR:_____ 8) If Product, give: LOT #:XD0632 DEVICE #:_PMD 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:_XXXX LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:__NO ALARMS AMPS SPIKED UP TO 35 THRU 48 ______________________________________________ ______________________________________________ 12) # of wafers on pad:_106 13) # of wafers on carrier:__59 14) If Product, how many wafers in the lot were polished before the crash:_24 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:XXX 16) If Monitors, how many monitors were polished before the crash:______ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO_XXX If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:XXXX 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_____ NO:_____YOU CAN NOT SEE THE SLURRY FLOW FROM THE OPERATORS POSITION IN FRONT OF THE TOOL. VIEW IS BLOCKED BY CARRIERS. 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! The amps on the tool have been going very high just before a wafer slides out. I was watching the tool when the wafer slid out. Brad was with me also watching the tool. We were looking at the amps just as the wafer slid out but unable to emo the tool in time to stop the wafer from crashing into the carrier. 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.35	CMP.A1 CRASH REPORT	FABSIX::E_DAWSON		`Sat Dec 14 1996 14:41`	67
	CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_X____ CMP.A2:_____ 2) Time of incident:__14:30__________ 3) Name of Operations Technician:____EARL_______ 4) Recipe Name:_____PMD________ 5) Recipe Step #:____2_____ 6) Time into step:___?______ 7) Type of wafers that broke: PRODUCT:__X___ MONITOR:_____ 8) If Product, give: LOT #:__JD0710________ DEVICE #:__DC1026__________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:___NA___ MQC:__NA____ 10) Which carrier lost the wafer: RIGHT:__?___ LEFT:__X___ WAFERS WERE POLISHING IN SEG#2 WHAEN I NOTICED THE BREAK'GE. BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:___NA.....I'LL ASSUME THERE SHOULD BE________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:___14____ 13) # of wafers on carrier:__183/62____ 14) If Product, how many wafers in the lot were polished before the crash:__6 WITH 4 BREAK'IN PRIOR...THIS LEADS ME TO BE LEAVE THERE WERE MORE WAFERS ON THIS PAD THAN THE COUNTER SHOWED.___ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_XXX____ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:__NA____ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__XX___ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__XX___ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__XX___ NO:_____...? 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.36	CMP.B2 breakin wafer broke	FABSIX::R_GEE		`Sun Dec 15 1996 18:16`	67
	CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__X__ 2) Time of incident:__16:30__________ 3) Name of Operations Technician:____J.R._______ 4) Recipe Name:_____PMD________ 5) Recipe Step #:____Conditioning____ 6) Time into step:___?______ 7) Type of wafers that broke: PRODUCT:_____ MONITOR:__X___ 8) If Product, give: LOT #:_____________ DEVICE #:___________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:___XX___ MQC:______ 10) Which carrier lost the wafer: RIGHT:__X___ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:___NONE_______________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:___117____ 13) # of wafers on carrier:__58____ 14) If Product, how many wafers in the lot were polished before the crash:__NA 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:_2____ 17) Were any "ASSISTS" recently logged prior to the crash: YES__X___ NO_______ If yes, what were the "ASSISTS" for:_ Robot Error, homed system.___________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__XX___ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__XX___ NO:_____...? 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! Left the wafer on the pad and the conditioner conditioned the wafer. Inspected the carrier and found a pinched vacuum line. Carrier top plate barbed fitting was pointing 180% away from the center, usually is setup 90%. Vacuum lines needed to be re-configured also. 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.37	cmp.a1 crash	FABSIX::R_ANDERSON		`Wed Dec 18 1996 15:27`	66
	REV. 2.0 12/9/97 CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:__x___ CMP.A2:_____ 2) Time of incident:__14:20__________ 3) Name of Operations Technician:__bob anderson_________ 4) Recipe Name:_____________mqc 5) Recipe Step #:__________2 6) Time into step:_________?????? 7) Type of wafers that broke: PRODUCT:_____ MONITOR:__x___ 8) If Product, give: LOT #:__________ DEVICE #:____________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:__x____ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:_____x BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:____no__________________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:_______82 13) # of wafers on carrier:_____3_ 14) If Product, how many wafers in the lot were polished before the crash:_____ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:__2____ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__x___ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:_____x 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_x____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! new carrier just put on and 3 wafers into mqc run left carrier lost wafer. eng had been running tool all day up until then. They were running poly runs. 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.38	CMP.A1 CRASH	FABSIX::R_ANDERSON		`Sun Dec 22 1996 10:02`	64
	REV. 2.0 12/9/97 CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:__X___ CMP.A2:_____ 2) Time of incident:__9:50 AM__________ 3) Name of Operations Technician:_BOB ANDERSON__________ 4) Recipe Name:_____________PMD 5) Recipe Step #:__________2 6) Time into step:_________??????? 7) Type of wafers that broke: PRODUCT:__X___ MONITOR:_____ 8) If Product, give: LOT #:JD0732__________ DEVICE #:__DC1026__________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:_X____ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:___________NONE___________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:_______46 13) # of wafers on carrier:_____176_ 14) If Product, how many wafers in the lot were polished before the crash:_4____ 15) Was the PRODUCT lot receiving: INITIAL POLISH:__X___ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:______ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__X___ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__X 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__X___ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.39	CMP.A1 CRUNCH	SUBPAC::CLIFFORD		`Fri Jan 10 1997 15:24`	27
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System __CMP.A1_________ 2) Recipe __NEWPAD________ 3) Step # __?___ 4) Time into step __?____ 5) Type of wafers that broke _EXCERCISE WAFERS_________ 6) Carrier which wafer slid out of __RIGHT____ 7) Other carriers that were damaged __LEFT______ 8) Alarms displayed by polisher ______ __"LEFT SPINDLE VACUUM NOT FOUND"______ ______________________________________________ 9) Did any other polisher error for slurry or crash NO__, sysytems____________ 10) # of wafers on pad _2___ 11) # of wafers on carrier __1____ 12) Was there any vibration prior to the crash __NO____ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES_______ 14) Check step height of the carrier from question #6 55-60 15) Please note any other unusual circumstances: PRE PUNCH HOLES ON FILM NOT ALIGNED PERFECTLY TO PLATE. 16) Put this check sheet in CMP note #9
9.40	CMP.A2 WAFER BREAK ON LOAD STATION	FABSIX::J_SADIN	Freedom isn't free.	`Mon Jan 13 1997 08:27`	35
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) LOT# - Jl0845 DEVICE - DC1031 OPER# - 1984 (CMP AFTER PMD DEP1) WAFERS - 1 WAFER BROKE IN LOAD STATION 1) System __CMP.A2___ 2) Recipe __PMD______ 3) Step # _NONE___ 4) Time into step __??___ 5) Type of wafers that broke _PRODUCT (PMD LOT). 6) Carrier which wafer slid out of _BROKE ON LEFT STATION_ 7) Other carriers that were damaged _NONE___ 8) Alarms displayed by polisher NONE----------------------------------------- ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _NO_, sysytems____________ 10) # of wafers on pad _66__ 11) # of wafers on carrier _33__ 12) Was there any vibration prior to the crash __NO__ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES____ 14) Check step height of the carrier from question #6 _ N/A 15) Please note any other unusual circumstances: WAFER BROKE IN THE LEFT LOAD CUP. IT SNAPPED CLEAN INTO 3 PIECES (DID NOT SHATTER). NOT SURE WHY. PAD AND CARRIERS NOT DAMAGED. 16) Put this check sheet in CMP note #9 - DONE
9.41	CMP.A2 Crash	SUBPAC::CLIFFORD		`Sat Jan 18 1997 08:56`	28
	CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together) 1) System __CMP.A2_________ 2) Recipe ___PMD________ 3) Step # __2___ 4) Time into step __NA____ 5) Type of wafers that broke _PRODUCT_________ 6) Carrier which wafer slid out of __LEFT____ 7) Other carriers that were damaged __RIGHT______ 8) Alarms displayed by polisher _______NO VACUUM FOUND ON LEFT SPINDLE________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash NO__, systems____________ 10) # of wafers on pad _34___ 11) # of wafers on carrier __216____ 12) Was there any vibration prior to the crash __NO____ 13) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table __YES_______ 14) Check step height of the carrier from question #6 (CARRIERS ALL CHEWED UP) 15) Please note any other unusual circumstances: 16) Put this check sheet in CMP note #9
9.42	a-shift breakage cmp.a2	FABSIX::B_SAVAGEAU		`Sun Jan 19 1997 09:33`	66
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__XX___ 2) Time of incident:____08:10________ 3) Name of Operations Technician:Bsavageau___________ 4) Recipe Name:____PMD_________ 5) Recipe Step #:____2______ 6) Time into step:____?_____ 7) Type of wafers that broke: PRODUCT:_____ MONITOR:__XX___ 8) If Product, give: LOT #:__________ DEVICE #:____________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__XX____ MQC:______ 10) Which carrier lost the wafer: RIGHT:__XX___ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_______NONE___________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:__42_____ 13) # of wafers on carrier:__21____ 14) If Product, how many wafers in the lot were polished before the crash:_____ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:__NONE____ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO_____ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_XX____ NO:_____ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_XX____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.43	CMP.A2 CRASH	FABSIX::D_CAUSE		`Wed Jan 22 1997 06:48`	65
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__XX___ 2) Time of incident:____06:30________ 3) Name of Operations Technician:KIM WANG___________ 4) Recipe Name:____PMD_________ 5) Recipe Step #:____2______ 6) Time into step:__TIME SET WAS ONLY 5 SECS____ 7) Type of wafers that broke: PRODUCT:__1___ MONITOR:__1___ 8) If Product, give: LOT #:_JL0875___ DEVICE #:__DC1031__ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__XX____ MQC:______ 10) Which carrier lost the wafer: RIGHT:__XX___ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_______NONE___________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:__132__ 13) # of wafers on carrier:_111_ 14) If Product, how many wafers in the lot were polished before the crash:_22__ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:_XX_ 16) If Monitors, how many monitors were polished before the crash:__NONE____ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__XX__ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:_XX__ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_XX____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!!WAS IN THE PROCESS OF TOUCHUP ON THE LAST 2 WAFERS THE ONLY RUN WITH A BREAKIN WAFER. THIS WAFER WAS NOT AN EXCEL AND HAD PLENTY OF OXIDE BUT WAS THE ONE THAT SLIPPED OUT. 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.44	CMP.A2 CRASH	FABSIX::B_SAVAGEAU		`Sun Jan 26 1997 18:07`	66
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__XX___ 2) Time of incident:____14:50________ 3) Name of Operations Technician:Bsavageau___________ 4) Recipe Name:____PMD_________ 5) Recipe Step #:____3______ 6) Time into step:____?_____ 7) Type of wafers that broke: PRODUCT:_____ MONITOR:__XX___ 8) If Product, give: LOT #:__________ DEVICE #:____________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__XX____ MQC:______ 10) Which carrier lost the wafer: RIGHT:__XX___ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_______NONE___________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:__337_____ 13) # of wafers on carrier:_331____ 14) If Product, how many wafers in the lot were polished before the crash:_____ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:_XX____ 16) If Monitors, how many monitors were polished before the crash:__NONE____ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__XX___ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_XX____ NO:_____ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_XX____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.45	crash a2 01/27/97	FABSIX::M_PROVENCHER		`Mon Jan 27 1997 05:25`	65
	REV. 2.0 12/9/97 CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:__ ___ CMP.A2:__ x ___ 2) Time of incident:___ 4:10 am 01/27/97 __________ 3) Name of Operations Technician:_ M_Provencher _________ 4) Recipe Name:__ pmd _____ 5) Recipe Step #:__ 3/4 ____ 6) Time into step:___ 0 ____ 7) Type of wafers that broke: PRODUCT:_ x ___ MONITOR:_____ 8) If Product, give: LOT #:____ xd0585 ____ DEVICE #:__ t-69 ____ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__ n/a __ MQC:__ n/a __ 10) Which carrier lost the wafer: RIGHT:__ x ___ LEFT:__ ___ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_right carrier not arriving up ________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:__ 80 ____ 13) # of wafers on carrier:__ l-40/r-40 __ 14) If Product, how many wafers in the lot were polished before the crash:_ 24 _ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__ x __ 16) If Monitors, how many monitors were polished before the crash:__ n/a __ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__ x __ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:__ x ___ NO:__ __ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__ x __ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! right carrier was intermitantly sticking for no longer than 1 second. 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.46	WAFER CRASH ON CMP.A2, BOTH PRODUCT WAFERS	SUBPAC::BJUBINVILLE	CMP-6 Equipment Engineering	`Wed Jan 29 1997 22:50`	66
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__X__ 2) Time of incident: 22:15 3) Name of Operations Technician: Mike Cadieux 4) Recipe Name: PMD 5) Recipe Step #: 3 6) Time into step: n/a 7) Type of wafers that broke: PRODUCT:__X__ MONITOR:_____ 8) If Product, give: LOT #: JLO952 DEVICE #: DC1064 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:__X__ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher: LEFT SPINDLE NO VACUUM 12) # of wafers on pad: 146 13) # of wafers on carrier: L-198, R-155 14) If Product, how many wafers in the lot were polished before the crash: 14 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__X__ 16) If Monitors, how many monitors were polished before the crash: 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__X__ If yes, what were the "ASSISTS" for: 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__X__ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__X__ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! Due to the end results of the location of the broken wafer, it looks like that the wafer slid out the left carrier just prior to the right carrier lifting off. Upon removal of the pad, several small bubbles were noticed under the IC1000 pad. 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.47	(2) wafer monitor crash, no product lost	SUBPAC::BJUBINVILLE	CMP-6 Equipment Engineering	`Thu Jan 30 1997 22:37`	62
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__X__ 2) Time of incident: 22:15 3) Name of Operations Technician: Mike Cadieux 4) Recipe Name: PMD 5) Recipe Step #: 3 6) Time into step: n/a 7) Type of wafers that broke: PRODUCT:_____ MONITOR:__X__ 8) If Product, give: LOT #: DEVICE #: 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__X___ MQC:______ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:_____ BOTH:__X__ DON'T KNOW:_____ 11) Alarms displayed by polisher: LEFT SPINDLE NOT ARRIVING UP 12) # of wafers on pad: 13) # of wafers on carrier: L-, R- 14) If Product, how many wafers in the lot were polished before the crash: 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:____ 16) If Monitors, how many monitors were polished before the crash: 0 17) Were any "ASSISTS" recently logged prior to the crash: YES____ NO__X__ If yes, what were the "ASSISTS" for: 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:_____ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__X__ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! The tools appears to have lost vacuum in the left carrier during polishing. The carrier came off and slammed into the right carrier. Both wafers were distroyed. 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.48	Product crash, not on polish table!!!	SUBPAC::BJUBINVILLE	CMP-6 Equipment Engineering	`Fri Jan 31 1997 04:58`	63
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__X__ 2) Time of incident: 04:40 3) Name of Operations Technician: Mike Cadieux 4) Recipe Name: PMD 5) Recipe Step #: n/a 6) Time into step: n/a 7) Type of wafers that broke: PRODUCT:__X__ MONITOR:_____ 8) If Product, give: LOT #: JLO939 DEVICE #: DC1031 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher: none 12) # of wafers on pad: n/a 13) # of wafers on carrier: n/a 14) If Product, how many wafers in the lot were polished before the crash: n/a 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:____ 16) If Monitors, how many monitors were polished before the crash: n/a 17) Were any "ASSISTS" recently logged prior to the crash: YES____ NO_____ If yes, what were the "ASSISTS" for: 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:_____ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! After the robot dropped the wafer off at the left receive station, surface friction caused the wafer to come back out with the robot. When the robot went to swing around to the load cassette, CRASH! SLAM! BAM! No more wafer... 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.49	robot crashes wafer	FABSIX::J_SWENSON		`Sat Feb 01 1997 18:56`	68
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:_____X 2) Time of incident:____________0735 3) Name of Operations Technician: m_cadieux 4) Recipe Name:_____________ pmd 5) Recipe Step #:__________n/a 6) Time into step:_________n/a 7) Type of wafers that broke: PRODUCT:_____X MONITOR:_____ 8) If Product, give: LOT #: JL0952 DEVICE #: 1064 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:_____ NIETHER BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher: no info passed on ______________________________________________ ______________________________________________ 12) # of wafers on pad:_______ 50 13) # of wafers on carrier:______ 103 14) If Product, how many wafers in the lot were polished before the crash:13____ 15) Was the PRODUCT lot receiving: INITIAL POLISH: X or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:______n/a 17) Were any "ASSISTS" recently logged prior to the crash: YES____ NO_____x If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:_____n/a 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! Passed down from D-shift Robot crashed into the right send cassette breaking one wafer. 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.50	Another bites the dust.	FABSIX::B_CONNOLLY		`Tue Feb 04 1997 00:22`	65
	REV. 2.0 12/9/97 CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:__ ___ CMP.A2:__ x ___ 2) Time of incident:___ 23:55 pm 02/03/97 __________ 3) Name of Operations Technician:_ B_Connolly _________ 4) Recipe Name:__ pmd _____ 5) Recipe Step #:__ 3 ____ 6) Time into step:___ 0 ____ 7) Type of wafers that broke: PRODUCT:__ x __ MONITOR:__ __ 8) If Product, give: LOT #:____ xd0947 ____ DEVICE #:__ tm69 ____ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__ n/a __ MQC:__ n/a __ 10) Which carrier lost the wafer: RIGHT:__ x ___ LEFT:__ ___ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_right carrier not arriving up ________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:__ 34 ____ 13) # of wafers on carrier:__ l-203/r-203 __ 14) If Product, how many wafers in the lot were polished before the crash:_ 10 _ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__ x __ 16) If Monitors, how many monitors were polished before the crash:__ n/a __ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__ x __ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:__ ___ NO:__ X __ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__ x __ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! right carrier was intermitantly sticking for no longer than 1 second. 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.51	cmp.a2 crash	FABSIX::B_SAVAGEAU		`Mon Feb 10 1997 19:20`	66
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__XX___ 2) Time of incident:____18:25________ 3) Name of Operations Technician:Bsavageau___________ 4) Recipe Name:____PMD_________ 5) Recipe Step #:____?______ 6) Time into step:____?_____ 7) Type of wafers that broke: PRODUCT:_XX____ MONITOR:_____ 8) If Product, give: LOT #:__JD0960________ DEVICE #:_DC1073______ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:__XX___ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_______NONE___________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:_110_____ 13) # of wafers on carrier:__67___ 14) If Product, how many wafers in the lot were polished before the crash:_____ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:_XX____ 16) If Monitors, how many monitors were polished before the crash:__NONE____ 17) Were any "ASSISTS" recently logged prior to the crash: YES__XX___ NO____ If yes, what were the "ASSISTS" for:_Right carrier sticking_______________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_XX____ NO:_____ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_XX____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.52	cmp.a2 crash	FABSIX::B_SAVAGEAU		`Tue Feb 11 1997 13:30`	66
	\ REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__XX___ 2) Time of incident:____13:25________ 3) Name of Operations Technician:Bsavageau___________ 4) Recipe Name:____mqc_________ 5) Recipe Step #:____4______ 6) Time into step:____?_____ 7) Type of wafers that broke: PRODUCT:_____ MONITOR:__XX___ 8) If Product, give: LOT #:__________ DEVICE #:_______ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__XX____ MQC:______ 10) Which carrier lost the wafer: RIGHT:__XX___ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:______rotate axis error_______________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:_40_____ 13) # of wafers on carrier:__20___ 14) If Product, how many wafers in the lot were polished before the crash:_____ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:______ 16) If Monitors, how many monitors were polished before the crash:__NONE____ 17) Were any "ASSISTS" recently logged prior to the crash: YES__XX___ NO____ If yes, what were the "ASSISTS" for:Left carrier sticking_______________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_XX____ NO:_____ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_XX____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.53	offset adjustment cmp.b2 02/26/97	FABSIX::M_PROVENCHER		`Wed Feb 26 1997 02:05`	17
	System: CMP.B2 Date 02/26/97 OLD NEW HEAD OFFSET OFFSET ---- ------ ------ 1 1 -12 2 -3 12 3 -2 -4 4 -8 -3 5 8 4 Reason for change: removal range >300 (484). mqc's failed for high range 2nd set of mqc's running
9.53	.a1 crash	FABSIX::B_SAVAGEAU		`Sun Mar 09 1997 12:56`	66
	\ REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_XX____ CMP.A2:____ 2) Time of incident:____12:24________ 3) Name of Operations Technician:Bsavageau___________ 4) Recipe Name:____PMD_________ 5) Recipe Step #:____?slurry was flowing______ 6) Time into step:____?_____ 7) Type of wafers that broke: PRODUCT:_____ MONITOR:__XX___ 8) If Product, give: LOT #:__________ DEVICE #:_______ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__XX____ MQC:______ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:_XX____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_________________None________________________- ______________________________________________ ______________________________________________ 12) # of wafers on pad:_82_____ 13) # of wafers on carrier:__L:264 R:55___ 14) If Product, how many wafers in the lot were polished before the crash:_____ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:______ 16) If Monitors, how many monitors were polished before the crash:__NONE____ 17) Were any "ASSISTS" recently logged prior to the crash: YES__XX___ NO____ If yes, what were the "ASSISTS" for:Left carrier sticking_______________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_XX____ NO:_____ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_XX____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.54	crash 3/27/97	FABSIX::G_ISAACS		`Thu Mar 27 1997 18:47`	63
	REV. 2.0 12/9/97 CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__XXXXX 2) Time of incident:__6:20 pm 3) Name of Operations Technician:_Gwen 4) Recipe Name:__PMD 5) Recipe Step #:__??? 6) Time into step:_????sec 7) Type of wafers that broke: PRODUCT:____ MONITOR:__X___ 8) If Product, give: LOT #:JD1177 DEVICE #:____ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__XX____ MQC:______ 10) Which carrier lost the wafer: RIGHT:_XXXX LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:__NO ALARMS ______________________________________________ ______________________________________________ 12) # of wafers on pad:____ 13) # of wafers on carrier:___ 14) If Product, how many wafers in the lot were polished before the crash:___ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:__ 16) If Monitors, how many monitors were polished before the crash:______ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO_XXX If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:__X but tool didn't alarm___ NO:____ carrier did lift up. 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_X____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.55	CMP.B3	FABSIX::R_TRAN		`Fri Mar 28 1997 17:20`	29
	SPEEDFAM WAFER CRASH FORM 1) System __CMP.B3____ 2) Recipe ___TUP-B___ 3) Step # __3___ 4) Time into step __3SEC.____ 5) Type of wafers that broke __PRODUCTS_____ 6) Carrier which wafer slid out of __#4____ 7) Other carriers that were damaged #3___ 8) Alarms displayed by polisher __WAFER DETECTOR ALARMS 9) Did any other polisher error for slurry or crash _NO__, systems____________ 10) Did wafer detect work YES 11) # of wafers on pad _1495 12) # of wafers on carrier _#3=705,#4=650___ 13) Was there any vibration prior to the crash __NO____ 14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on the table ____YES_____ 15) Check step height of the carrier from question #6 __NA_____ 16) Please note any other unusual circumstances: 17) Put this check sheet in CMP note #9
9.56	CMP.A1 BREAKAGE FORM	FABSIX::R_ANDERSON		`Mon Apr 07 1997 19:25`	66
	REV. 2.0 12/9/97 CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:__X___ 2) Time of incident:__-- AM__10:35________ 3) Name of Operations Technician:_BOB ANDERSON__________ 4) Recipe Name:_____________PMD 5) Recipe Step #:__________UNLOADING WAFERS 6) Time into step:_________AT UNLOADING WAFERS 7) Type of wafers that broke: PRODUCT:__X___ MONITOR:_____ 8) If Product, give: LOT #:JL1269__________ DEVICE #:__DC1071__________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:___________NONE___________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:_______ 13) # of wafers on carrier:______ 14) If Product, how many wafers in the lot were polished before the crash:_____ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_____ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:______ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__X___ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__X___ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! IT DID NOT HAPPEND ON THE PAD IT HAPPEN IN THE UNLOADING OF WAFERS INTO THE OUTPUT CASSETTE EQUIPMENT SAID THE CASSETTE STEP HIGH HAD TO BE ADJUSTED TO MEET THE ROBOT..... 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.
9.57	.B4 4/12/97	FABSIX::G_ISAACS		`Sat Apr 12 1997 20:47`	30
	SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together) 1) System ___B4________ 2) Recipe ILD1 ID-OD 3) Step # _7____ 4) Time into step--- 10 SEC 5) Type of wafers that broke _PRODUCT__ 6) Carrier which wafer slid out of ______#4 7) Other carriers that were damaged _______#3_ 8) Alarms displayed by polisher ____NO ALARMS SOUNDED AT TIME OF CRASH__________________________________________ ______________________________________________ ______________________________________________ 9) Did any other polisher error for slurry or crash _NO___, sysytems____________ 10) Did wafer detect work __YES____ 11) # of wafers on pad __260____ 12) # of wafers on carrier ______ 13) Was there any vibration prior to the crash __NO____ 14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on the table __RINSE SEG______ 15) Check step hight of the carrier from question #6 ____NO 16) Please note any other unusual circumstances: 17) Put this check sheet in CMP note #
9.58	CMP.A1 Crash	SUBPAC::CLIFFORD		`Thu Apr 17 1997 17:11`	67
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:__X___ CMP.A2:_____ 2) Time of incident:____3:45PM Thurday "C" Shift________ 3) Name of Operations Technician:___Barry Clifford________ 4) Recipe Name:_____PMD________ 5) Recipe Step #:____??______ 6) Time into step:___??______ 7) Type of wafers that broke: PRODUCT:__2___ MONITOR:_____ 8) If Product, give: LOT #:_JD1460_________ DEVICE #:__1039__________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:__X___ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:__NONE. Wafers continued to polish.__________ __Until dust noticed on polish table._________ ______________________________________________ 12) # of wafers on pad:__114_____ 13) # of wafers on carrier:__416____ 14) If Product, how many wafers in the lot were polished before the crash:_24__ 15) Was the PRODUCT lot receiving: INITIAL POLISH:__X__ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:______ 17) Were any "ASSISTS" recently logged prior to the crash: YES__X___ NO_____ If yes, what were the "ASSISTS" for:__Wafer not seating at left load_______ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__X__ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__X___ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! A 24 wafer lot was just touched up prior to running these two send ahead wafers from this lot. 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.59	CMP.A2	FABSIX::R_TRAN		`Fri Apr 25 1997 19:13`	66
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:_____ CMP.A2:_X____ 2) Time of incident:____4:30PM 4/25/97 "C" Shift________ 3) Name of Operations Technician:___RICH TRAN________ 4) Recipe Name:_____PMD________ 5) Recipe Step #:____??______ 6) Time into step:___??______ 7) Type of wafers that broke: PRODUCT:__2___ MONITOR:_____ 8) If Product, give: LOT #:_XD1292_________ DEVICE #:__TM69__________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:______ MQC:______ 10) Which carrier lost the wafer: RIGHT:_____ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:__WAFER NOT FOUND ON ROBOT__________ __________ ______________________________________________ 12) # of wafers on pad:__128_____ 13) # of wafers on carrier:_46____ 14) If Product, how many wafers in the lot were polished before the crash:___ 15) Was the PRODUCT lot receiving: INITIAL POLISH:____ or TOUCH UP:_____ 16) If Monitors, how many monitors were polished before the crash:______ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO_____ If yes, what were the "ASSISTS" for:__Wafer not seating at left load_______ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:____ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:_____ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! ROBOT CRASHED INTO THE RIGHT SEND CASS. 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.60	crash on .a1	FABSIX::B_CONNOLLY		`Mon May 12 1997 02:29`	67
	REV. 2.0 12/9/97 This report to be filled out OPS, Equipment and Process together!! CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.A1:__X__ CMP.A2:_____ 2) Time of incident:__11:30 PM______ 3) Name of Operations Technician:_CONNOLLY______ 4) Recipe Name:_NEWPAD_ 5) Recipe Step #:_STEP 2__ 6) Time into step:_8__ 7) Type of wafers that broke: PRODUCT:_____ MONITOR:__X__ 8) If Product, give: LOT #:__________ DEVICE #:____________ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:___X__ MQC:______ 10) Which carrier lost the wafer: RIGHT:__X__ LEFT:_____ BOTH:_____ DON'T KNOW:_____ 11) Alarms displayed by polisher:_____NONE_____________________________________ ______________________________________________ ______________________________________________ 12) # of wafers on pad:__NEW__ 13) # of wafers on carrier:_NEW_ 14) If Product, how many wafers in the lot were polished before the crash:_NOT_ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_NOT_ or TOUCH UP:_NOT_ 16) If Monitors, how many monitors were polished before the crash:__0___ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__X__ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__X__ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__X__ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! Pad had a chunk ripped out from crash. 21) Enter this form as a reply to NOTE #9 in the ASDG::CMP notesfile.
9.61	CMP.B2 5-24-97	FABSIX::B_NEWELL		`Sat May 24 1997 16:52`	61
	CMP.A1 & CMP.A2 WAFER BREAKAGE FORM ----------------------------------- 1) System: CMP.B2 __ ___ 2) Time of incident15:20PM ___ 05-24-97 3) Name of Operations Technician:_ B_NEWELL_________ 4) Recipe Name:__ BRK_IN 5) Recipe Step #:__ 4 6) Time into step:___ 4 7) Type of wafers that broke: EXERSIZE WAFERS 8) If Product, give: LOT #:____ ____ DEVICE #:__ ____ 9) If Monitors, were they: PAD BREAKIN/EXERCISE:__YES __ __ __ 10) Which carrier lost the wafer: RIGHT:__ ___ LEFT:__ ___ BOTH:_____ DON'T KNOW:_____X 11) Alarms displayed by polisher:________________________ None _______________ _____________________________________ _____________________________________ 12) # of wafers on pad:__ 200 ____ 13) # of wafers on carrier:__R NA/L NA __ 14) If Product, how many wafers in the lot were polished before the crash:_ _ 15) Was the PRODUCT lot receiving: INITIAL POLISH:_ __ or TOUCH UP:______ 16) If Monitors, how many monitors were polished before the crash:__ 5 __ 17) Were any "ASSISTS" recently logged prior to the crash: YES_____ NO__ x __ If yes, what were the "ASSISTS" for:_______________________________________ ___________________________________________________________________________ 18) On previous runs, were the carriers sticking to the pad at the end of the polish cycle: YES:_____ NO:__ X __ 19) Was there plenty of slurry (for step 1&2) or water (step 3) present on the table: YES:__ x __ NO:_____ 20) Please note any and all other unusual circumstances that were noticed about the tool at the time of the crash or on any prior runs. No in- formation is too trivial!! 21) Enter this form as a reply to NOTE #9 in the FABSIX::CMP notesfile.