| T.R | Title | User | Personal
Name | Date | Lines |
|---|
| 32.1 | B1 CRASH 9/14 | STRATA::TDYER | | Wed Sep 18 1996 10:03 | 34 |
| -< cmp.b1 crash info 9/14/96 4:00a.m. >-
Sequence of events:
* Rocket lot JD0497 ran w/no incidence
* Tool sat idle approximately 50 minutes
* 5 almost new 50k breakins used (approx. 200 sec polish time on wafers)
* PMD recipe selected
* Segment 7(not sure of time)
* Heavy vibration
* Wafer slipped out of carrier 2 and hit carrier 1 which hit carrier 5
* Process stopped and tool alarmed (carriers 1-5 no wafer detected)
* Tool EMO'D and EE called
note: Since operator did not witness crash, no other details about the
carriers, polish table or fluid delivery are available at time of
crash.
Additional Information:
* Pad count: 65
Carrier count: 1...13
2...13
3...284
4...284
5...284
* Same carrier/spindle(s) involved as crash on 9/13/96
* Crash on 9/13/96 was in segment 5, not segment 7
* Idle times were approximately the same in both crashes
* Crash on 9/13/96 used recipe BREAKIN
* Segment 7 does not involve slurry
* CMP.B2 was running at the time of this crash
|
| 32.2 | B1 CRASH | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Thu Sep 19 1996 09:19 | 24 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B1
2) Recipe: PMD
3) Step: # 6 INTO 7
4) Time into step: 0
5) Type of wafers that broke: NONE
6) Carrier which wafer slid out of: 1, AT EMO'ING OF THE TOOL
7) Other carriers that were damaged: NONE
8) Alarms displayed by polisher: NONE- tool was just severly vibrating
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: NEVER GOT A CHANGE, TOOL WAS EMO'ED IN TIME
11) # of wafers on pad: N/A
12) # of wafers on carrier: N/A
13) Was there any vibration prior to the crash: YES
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: N/A - THERE WAS WATER EVIDENT AFTER TOOL WAS POWERED BACK UP
15) Check step hight of the carrier from question #6: NO
16) Please note any other unusual circumstances:
|
| 32.3 | Dummy wafer break | FABSIX::R_POIRIER | | Tue Oct 01 1996 06:10 | 31 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _ CMP.B2 _
2) Recipe _ 1P_ILD1 _
3) Step # _ 4 _
4) Time into step _ 2 _
5) Type of wafers that broke _ dummy _
6) Carrier which wafer slid out of _ 4 _
7) Other carriers that were damaged _ 5 _
8) Alarms displayed by polisher _ Carrier 4 rotation error
_ Carrier 5 rotation error
9) Did any other polisher error for slurry or crash _yes_, sysytems_A1,A2,B3
10) Did wafer detect work _ yes _
11) # of wafers on pad _ 1160 _
12) # of wafers on carrier _ 277 _
13) Was there any vibration prior to the crash _ yes _
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table _ no _
15) Check step hight of the carrier from question #6 .0075 - .008
16) Please note any other unusual circumstances:
After the crash we noticed that there was some slurry on the table,
but not much and there wasn't any slurry in the line. Thats when B3 slipped
a wafer due to low slurry.
We lost slurry for about an hour.
17) Put this check sheet in CMP note #
|
| 32.4 | CMP.B2 SLIDE-OUT @ 05:30, 10/2/96 | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Wed Oct 02 1996 07:06 | 23 |
|
1) System: CMP.B2
2) Recipe: TUP200
3) Step #: 5
4) Time into step: 1 SEC
5) Type of wafers that broke: none, just scratched
6) Carrier which wafer slid out of: 5
7) Other carriers that were damaged: no
8) Alarms displayed by polisher: Wafer detection detected wafer loss
9) Did any other polisher error for slurry or crash: no
10) Did wafer detect work: yes
11) # of wafers on pad: 335
12) # of wafers on carrier: 91
13) Was there any vibration prior to the crash: no
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: yes
15) Check step hight of the carrier from question #6: -.0075 - -.0085
16) Please note any other unusual circumstances: air bubbles in slurry line
Doug, Steve + BJ
|
| 32.5 | CMP.B1 CRASH | FABSIX::B_LAZZARA | Like a rock | Wed Oct 02 1996 08:54 | 27 |
|
CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together)
1) System __cmp.b1
2) Recipe __I.O.BIN3_
3) Step # __5
4) Time into step _7 SECONDS
5) Type of wafers that broke __BREAKIN
6) Carrier which wafer slid out of _SLID OUT OF 4, UNDER 3, AND HIT CARRIER 2
7) Other carriers that were damaged _2
8) Alarms displayed by polisher _LOW VACUUM_
CARRIERS 1-5 NOT ROTATING______
______________________________________________
9) Did any other polisher error for slurry or crash NA_, sysytems____________
10) # of wafers on pad _15
11) # of wafers on carrier _CARRIERS 2-4 ALL HAD 21 WAFERS
12) Was there any vibration prior to the crash _YES,HEAVY__
13) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table _YES_
14) Check step height of the carrier from question #6 _______
15) Please note any other unusual circumstances:
16) Put this check sheet in CMP note #9
|
| 32.6 | CMP.B1 Crash on 10/2/96 | ASDG::POIRIER | | Wed Oct 02 1996 18:21 | 33 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B1
2) Recipe: P/VIB_.1
3) Step #: 5
4) Time into step: 17 sec
5) Type of wafers that broke: 12k monitors
6) Carrier which wafer slid out of: #4
7) Other carriers that were damaged: #'s 3,2 &1.
8) Alarms displayed by polisher: Wafer Loss Detection tripped.
9) Did any other polisher error for slurry or crash: NO, sysytems: NO
10) Did wafer detect work: When the wafer initially slipped out of carrier #4,
it broke into a large fragment and spun inwards on the table missing the
wafer detect sensor between heads 3 & 4. This fragment then hit heads 3 &2
eventually tripping the wafer detect sensor between heads 1 &2.
11) # of wafers on pad: 25
12) # of wafers on carrier Heads: 1 & 5 = 577 wafers. Heads 2, 3 & 4 = 24
13) Was there any vibration prior to the crash: Yes, moderate vibration.
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: Yes, there was suffucient slurry flow.
15) Check step hight of the carrier from question #6: .007"
16) Please note any other unusual circumstances: We were running P/VIB_.1 as
as test for the vibration problem during the crash event.
Also, the down force spiked up to 425 lbs on head #4 during the downforce
ramp in segment 5 just prior to the flyout on head #4.
17) Put this check sheet in CMP note #34
|
| 32.7 | CMP.B1 PAD BREAK-IN WAFER CRASH | SUBPAC::BJUBINVILLE | CMP-6 Equipment Engineering | Sat Oct 05 1996 06:46 | 25 |
|
CMP.A1 & CMP.A2 WAFER CRASH FORM (to be filled out by MFG/EEG/PSS, together)
1) System __CMP.B1
2) Recipe __BIN3_
3) Step # __3
4) Time into step _5 SECONDS
5) Type of wafers that broke __BREAKIN
6) Carrier which wafer slid out of _ #3
7) Other carriers that were damaged _#2
8) Alarms displayed by polisher __CARRIER #3 NOT ROTATING
9) Did any other polisher error for slurry or crash__ NO, sytems__NO
10) # of wafers on pad _10
11) # of wafers on carrier _ BOTH #2 and #3 HAD 31 WAFERS
12) Was there any vibration prior to the crash _NO__
13) Was there plenty of slurry (for step 1&2) or water (step 3) present on
the table _YES_
14) Check step height of the carrier from question #6 _OK... -.0085 ON BOTH
15) Please note any other unusual circumstances: IT WASN'T A FULL MOON
16) Put this check sheet in CMP note #9
|
| 32.8 | CMP.B1 CRASH (MONITOR WAFERS) | FABSIX::J_SADIN | Freedom isn't free. | Tue Oct 15 1996 20:43 | 29 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _CMP.B1____
2) Recipe _I_OBKIN3__
3) Step # _5___
4) Time into step __30__
5) Type of wafers that broke _MONITORS__
6) Carrier which wafer slid out of _FIVE_
7) Other carriers that were damaged _FOUR___
8) Alarms displayed by polisher _TABLE ROTATION ERROR FOLLOWED BY A LOAD______
_FLIPPER MISSED WAFER ERROR (FOLLOWED BY______
_THE CRASH).__________________________________
9) Did any other polisher error for slurry or crash NO__, sysytems____________
10) Did wafer detect work _YES__
11) # of wafers on pad _1160
12) # of wafers on carrier _350__
13) Was there any vibration prior to the crash _YES__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __YES____
15) Check step hight of the carrier from question #6 7.0~MILS
16) Please note any other unusual circumstances:
NEW SOFTWARE WAS INSTALLED TODAY.
17) Put this check sheet in CMP note #34 - DONE
|
| 32.9 | cmp.b3 crash | FABSIX::J_SADIN | Freedom isn't free. | Wed Oct 23 1996 20:11 | 22 |
| SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _CMP.B3____
2) Recipe _IO_MQC__
3) Step # _7___
4) Time into step _10_
5) Type of wafers that broke _MONITORS__
6) Carrier which wafer slid out of _FOUR_
7) Other carriers that were damaged _THREE___
8) Alarms displayed by polisher _ Wafer Loss Detection (FOLLOWED BY______
_THE CRASH).__________________________________
9) Did any other polisher error for slurry or crash NO__, sysytems____________
10) Did wafer detect work _YES__
11) # of wafers on pad _140
12) # of wafers on carrier _18__
13) Was there any vibration prior to the crash _YES__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __YES____
15) Check step hight of the carrier from question #6 7.0~MILS
16) Please note any other unusual circumstances:
17) Put this check sheet in CMP note #34 - DONE
|
| 32.10 | b3 crash | LUDWIG::RIDLON | Eliminate the oblivious | Sun Oct 27 1996 04:32 | 29 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _cmp.b3____
2) Recipe _tup_175___
3) Step # __5__
4) Time into step __1__
5) Type of wafers that broke _product_
6) Carrier which wafer slid out of __2___
7) Other carriers that were damaged ___1___
8) Alarms displayed by polisher _Wafer loss alarm on pad______________________
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _No_, sysytems____________
10) Did wafer detect work _Yes__
11) # of wafers on pad _160__
12) # of wafers on carrier _25___
13) Was there any vibration prior to the crash __No__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __Yes___
15) Check step hight of the carrier from question #6 _8.5-9.0_
16) Please note any other unusual circumstances:
17) Put this check sheet in CMP note #34
|
| 32.11 | 10-28-96 | FABSIX::S_MCREYNOLDS | | Mon Oct 28 1996 23:33 | 20 |
|
1) System _CMP.A2_____
2) Recipe __PMD______
3) Step # __2___
4) Time into step _unknown_____
5) Type of wafers that broke __Break ins___
6) Carrier which wafer slid out of _Left___
7) Other carriers that were damaged _right___
8) Alarms displayed by polisher __time out on left carrier______
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash __no__, systems____________
10) Did wafer detect work __n/a____
11) # of wafers on pad _160_____
12) # of wafers on carrier _264_on both____
13) Was there any vibration prior to the crash __no____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __yes_______
15) Check step hight of the carrier from question #6 __n/a_____
16) Please note any other unusual circumstances:n/a
|
| 32.12 | 10-28-96 | FABSIX::S_MCREYNOLDS | | Tue Oct 29 1996 03:51 | 20 |
|
1) System _CMP.A2_____
2) Recipe __PMD______
3) Step # __2___
4) Time into step _unknown_____
5) Type of wafers that broke __Break ins___
6) Carrier which wafer slid out of _Left___
7) Other carriers that were damaged _right___
8) Alarms displayed by polisher __no alarm, was halted brfore alarm went off___
_______________________________________________
_______________________________________________
9) Did any other polisher error for slurry or crash __no__, systems____________
10) Did wafer detect work __n/a____
11) # of wafers on pad _60_____
12) # of wafers on carrier _30_on both____
13) Was there any vibration prior to the crash __no____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __yes_______
15) Check step hight of the carrier from question #6 __n/a_____
16) Please note any other unusual circumstances:n/a
|
| 32.13 | CMP.B1 CRASH FORM | FABSIX::D_CAUSE | | Fri Nov 01 1996 04:58 | 28 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B1
2) Recipe: ILD2
3) Step #: 7
4) Time into step: 1 sec
5) Type of wafers that broke: (1) monitor, (1) DC1026
6) Carrier which wafer slid out of: #2
7) Other carriers that were damaged: #1
8) Alarms displayed by polisher: ROTATIONAL TOLERANCE OUT OF SPEC
9) Did any other polisher error for slurry or crash: No
10) Did wafer detect work: yes
11) # of wafers on pad: 165
12) # of wafers on carrier: 60
13) Was there any vibration prior to the crash: yes
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: yes
15) Check step hight of the carrier from question #6:
16) Please note any other unusual circumstances: The tool had a heavy short
vibration, then the rotation alarm came up.
17) Put this check sheet in CMP note #34
|
| 32.14 | CMP.B2 CRASH FORM | FABSIX::D_CAUSE | | Sat Nov 02 1996 02:54 | 28 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B2
2) Recipe: IO BKIN
3) Step #: 3
4) Time into step: 10 secs
5) Type of wafers that broke: (1) monitor
6) Carrier which wafer slid out of: #5
7) Other carriers that were damaged: #4
8) Alarms displayed by polisher: wafer loss detection
9) Did any other polisher error for slurry or crash: No
10) Did wafer detect work: yes
11) # of wafers on pad: 110
12) # of wafers on carrier: 1
13) Was there any vibration prior to the crash: no
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: yes
15) Check step hight of the carrier from question #6:
16) Please note any other unusual circumstances: This carrier had just been
replaced after 2 slideouts.
17) Put this check sheet in CMP note #34
|
| 32.15 | Fly out problems | FABSIX::O_WHITFORD | Quticherwhinin' | Sat Nov 02 1996 05:41 | 10 |
| Prior to wafer crash, a fly out occurred from carrier # 5 at lift off. No
breakeage had occurred, so carrier #5 was replaced. On the first break in
run, another fly out from carrier #5 which wiped out the wafer under
carrier #4. Cleaned up, replaced pad and carrier #4 and investigated
some potential problems with carrier & arm #5. We DID find that at the
load position, carrier #5 needed to come "out" another 384 motor steps
which we adjusted. Ran a series of 25 wafers with no futher problems.
turned over to ops for MQC's.
Dave & Leon
|
| 32.16 | cmp b2 crash checklist | FABSIX::M_PROVENCHER | | Sun Nov 03 1996 06:32 | 26 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _CMP.B2____
2) Recipe _tup_a.46__
3) Step # __3__
4) Time into step __3_
5) Type of wafers that broke _product_(2)_jd0553
6) Carrier which wafer slid out of _5__
7) Other carriers that were damaged _one (#4)___
8) Alarms displayed by polisher _ Wafer Loss Detection (FOLLOWED BY______
_THE CRASH).__________________________________
9) Did any other polisher error for slurry or crash NO__, systems____________
10) Did wafer detect work _YES__
11) # of wafers on pad _415
12) # of wafers on carrier ___
13) Was there any vibration prior to the crash _no__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __YES____
15) Check step hight of the carrier from question #6 no
16) Please note any other unusual circumstances:breakin wafer did not download
causing head #5 to "double load" one wafer on top of another.
17) Put this check sheet in CMP note #34 - DONE
|
| 32.17 | cmp.b2 crash report | FABSIX::K_JUBINVILLE | | Sun Nov 10 1996 18:43 | 24 |
|
crash report for dummy wafers broken on cmp.b2
1) System cmp.b2 ___________
2) Recipe breakin___________
3) Step # 5_____
4) Time into step 9 seconds______
5) Type of wafers that broke dummies___________
6) Carrier which wafer slid out of 5______
7) Other carriers that were damaged 3,4,5 ________
8) Alarms displayed by polisher wafer loss______________________________________________
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash no____, systems_no___________
10) Did wafer detect work yes______
11) # of wafers on pad 345______
12) # of wafers on carrier 427,343,343______
13) Was there any vibration prior to the crash yes______
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table yes_________
15) Check step hight of the carrier from question #6 too damaged._______
16) Please note any other unusual circumstances:none
Thanks
Steve
|
| 32.18 | cmp.b1 crash | FABSIX::K_JUBINVILLE | | Sun Nov 17 1996 17:13 | 24 |
| crash report for product wafers broken in unload station on cmp.b1.
Lot # jd0617, two broken wafers at operation 1985; 24 wafers down to 22.
1) System cmp.B1 ___________
2) Recipe ild2__________
3) Step # n/a____
4) Time into step n/a_____
5) Type of wafers that broke product__________
6) Carrier which wafer slid out of n/a_____
7) Other carriers that were damaged none________
8) Alarms displayed by polisher wafer loss_did not alarm__________________
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash no____, systems_no_________
10) Did wafer detect work no_____
11) # of wafers on pad n/a_____
12) # of wafers on carrier n/a_____
13) Was there any vibration prior to the crash n/a_____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table n/a________
15) Check step hight of the carrier from question #6 n/a______
16) Please note any other unusual circumstances: machine did not alarm.scrubber
did not release wafers into unload cassette causing breakage.
|
| 32.19 | CMP.B1 CRASH REPORT | FABSIX::E_DAWSON | | Thu Nov 21 1996 15:01 | 40 |
| -< CMP.B1 CRASH>-
--------------------------------------------------------------------------------
LOT# - OXIDE MONITORS
DEVICE - NA
OPER# - NA
WAFERS - NA
1) System __CMP.B1___
2) Recipe __IO_BRKN______
3) Step # _5___
4) Time into step __4___
5) Type of wafers that broke _OXIDE MONITORS
6) Carrier which wafer slid out of 3 INTO 4
7) Other carriers that were damaged _3 & 4___
8) Alarms displayed by polisher...BAD NEWS , WAFER BROKE
9) Did any other polisher error for slurry or crash _NO_,
sysytems____________
10) # of wafers on pad _1065__
11) # of wafers on carrier _276__
12) Was there any vibration prior to the crash __YES__
13) Was there plenty of slurry___YES__
14) Check step height of the carrier from question #6 _ NA
15) Please note any other unusual circumstances:__VIBRATION
16) Put this check sheet in CMP note #9___DONE___
|
| 32.20 | B1 - wafer outta carrier 3 | SUBPAC::LANDRY | | Mon Nov 25 1996 15:42 | 26 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B1
2) Recipe: IO_MQC
3) Step #: 5
4) Time into step: 6 seconds
5) Type of wafers that broke: MQC Wafers
6) Carrier which wafer slid out of: #3
7) Other carriers that were damaged: #2
8) Alarms displayed by polisher: NO ROTATION, CARRIER #3
9) Did any other polisher error for slurry or crash NO, systems -----
10) Did wafer detect work: YES
11) # of wafers on pad: 640
12) # of wafers on carrier: 404
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: YES
15) Check step hight of the carrier from question #6: 8.0
16) Please note any other unusual circumstances: NO ROTATION ON CARRIER 3 ONLY
17) Put this check sheet in CMP note #: OKEY-DOKEY
|
| 32.21 | B1 christmas crash. | FABSIX::L_SHKOLNIKOV | | Thu Dec 26 1996 03:29 | 28 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B1
2) Recipe: IO_MQC
3) Step #: 5
4) Time into step: 5 seconds
5) Type of wafers that broke: MQC Wafers
6) Carrier which wafer slid out of: #5
7) Other carriers that were damaged: #4
8) Alarms displayed by polisher: NO ROTATION, CARRIER #3
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: NO
11) # of wafers on pad: 690
12) # of wafers on carrier: 165
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: YES
15) Check step hight of the carrier from question #6: 6.5-7.5
16)** Please note any other unusual circumstances: NO ROTATION ON CARRIER 3
ONLY. The wafer slid out from #5 and hit #4 but the wafer detect
system wasn't activate at this point ?
17) Put this check sheet in CMP note #: OKEY-DOKEY
** Screen reading for head #5 was 378 lb at the moment of the crash.
|
| 32.22 | CMP.B3 CRASH | FABSIX::J_SADIN | Freedom isn't free. | Sun Dec 29 1996 18:56 | 28 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B3
2) Recipe: ILD1
3) Step #: ?????????
4) Time into step: ????????????
5) Type of wafers that broke: dummy wafers
6) Carrier which wafer slid out of: #1
7) Other carriers that were damaged: all
8) Alarms displayed by polisher: PLACE WAFER IN SCRUBBER
9) Did any other polisher error for slurry or crash NO, systems -----
10) Did wafer detect work: NO *(SEE COMMENTS)*
11) # of wafers on pad: 385
12) # of wafers on carrier: ANYWHERE FROM 1000 TO 90 WAFERS, DEPENDING ON
WHICH CARRIER. CARRIER ONE HAD 1000WFRS.
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: YES
15) Check step hight of the carrier from question #6: CARRIER TRASHED.
16) Please note any other unusual circumstances:
WAFER DETECT DID NOT WORK DUE TO THE FACT THAT IT WAS JUST A
PIECE OF A WAFER THAT CAME OFF OF THE CARRIER ON HEAD ONE.
17) Put this check sheet in CMP note #32: DONE
|
| 32.23 | cmp.b2 crash | FABSIX::S_MCREYNOLDS | | Sun Dec 29 1996 21:57 | 24 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B2
2) Recipe: bin1
3) Step #: 5
4) Time into step: 5 seconds
5) Type of wafers that broke: dummy Wafers
6) Carrier which wafer slid out of: #2
7) Other carriers that were damaged: #yes, all
8) Alarms displayed by polisher: n/a was EMO'd before alarm
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: NO
11) # of wafers on pad: 1310
12) # of wafers on carrier: 273
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: YES
15) Check step hight of the carrier from question #6: 6.5-7.5
16)** Please note any other unusual circumstances: eeg was verifying operation
of tool due to having to EMO prior run (ild3). Tool was EMO'd because
unload flipper missed wafer and multihead lost home.
17) Put this check sheet in CMP note #32: done
|
| 32.24 | cmp.b2 crash | FABSIX::S_MCREYNOLDS | | Tue Dec 31 1996 04:11 | 40 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B2
2) Recipe: TUP_D
3) Step #: 4
4) Time into step: ?
5) Type of wafers that broke: 1 dummy 4 product 11,12,17,18
6) Carrier which wafer slid out of: #5
7) Other carriers that were damaged: #yes, all
8) Alarms displayed by polisher: n/a was EMO'd before alarm
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: NO
11) # of wafers on pad: 304
12) # of wafers on carrier: 60
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: no, but plenty of slurry in delivery tube
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances:
System alarmed with no error message displayed on screen. Both Ops
and EE personnel observed carrier 5 stuck to the pad while the others
were up. The table was spinning at the desired speed but the carriers
were not rotating. EE's first thought for an explanation was that
the wafer loss detect board didn't operate properly. This was tested
using the same recipe and 4 dummies (carrier 5 was trashed). While the
carriers were on the pad a wafer was manually placed under the wafer
loss sensor. The wafer loss board led lit up for the sensor being
tripped but the wafer loss detect led didn't light up. The table and
carriers kept spinning and stayed on the table. With this in mind our
next thought was that maybe the wafer came out in step 3 while vacuum
was still on. The alarm could have been main vac low which may cause
the carriers to lift off the pad and possibly stop the slurry pumps.
Which would explain all observations seen. At any rate the wafer loss
board will be replaced and tested for functionality.
B-shift EE.
17) Put this check sheet in CMP note #32: done
|
| 32.25 | CRASH REPORT | FABSIX::E_DAWSON | | Sat Jan 04 1997 16:44 | 54 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B2
2) Recipe: TUP_F
3) Step #: (WAFER BROKE DURING LIFT OFF WE THINK.)
4) Time into step: SEG #10 / TIME ?
5) Type of wafers that broke: Monitor wafer broke
6) Carrier which wafer slid out of: #5
7) Other carriers that were damaged: #yes, all
8) Alarms displayed by polisher: POLISHER DID NOT ALARM TILL BROKEN WAFER WAS
TO BE UNLOADED FROM UNLOAD CUP #5
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: NA/ wafers broke on 2nd table
11) # of wafers on pad: 45
12) # of wafers on carrier: 70
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: yes
15) Check step height of the carrier from question #6: UNABLE, CARRIER HAD
SILCON IN THE FILM.
16)** Please note any other unusual circumstances:
From: SUBPAC::BODENSIECK "03-Jan-1997 1609"
Wafer from carrier 5 broke on 2nd table but did not come out of the
carrier. Only a piece of the wafer came out. The wafers then Unloaded and
picked up 5 more wafers. Brought the other 5 wafers over to the 1st table
and polished them. It is believed that when the carrier lifted of the primary
table (table1) the wafer came out of the carrier just enough so that it would
not cause a vacuum error. It then went over to the secondary table (table2)
and broke off a piece of wafer. The piece of wafer then caused scratches
on the product wafer being run. Wafers were unloaded then loaded 5 more wafers.
The next 5 wafers polished and pieces of the broken wafer scratched the 5
wafers that where being polished.
17) Put this check sheet in CMP note #32: done
|
| 32.26 | One more for CMP.B3 | FABSIX::B_CONNOLLY | | Sat Jan 25 1997 23:22 | 28 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _cmp.b3____
2) Recipe _TUP_A___
3) Step # __?__
4) Time into step __?__
5) Type of wafers that broke _Product_
6) Carrier which wafer slid out of _None___
7) Other carriers that were damaged _None__
8) Alarms displayed by polisher _Scrubber time out. Wafer has not cleared_____
_Wafer track._________________________________
______________________________________________
9) Did any other polisher error for slurry or crash ___, sysytems____________
10) Did wafer detect work _No__
11) # of wafers on pad _580__
12) # of wafers on carrier ___
13) Was there any vibration prior to the crash __No__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __Yes___
15) Check step hight of the carrier from question #6 ___
16) Please note any other unusual circumstances:
The wafer did not clear the wafer track before another wafer was brought
over to get unloaded from the paddle.
|
| 32.27 | .b2 break | FABSIX::S_MCREYNOLDS | | Sat Jan 25 1997 23:26 | 33 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B2
2) Recipe: TUP_175
3) Step #: n/a
4) Time into step: n/a
5) Type of wafers that broke: 1 product #15
6) Carrier which wafer slid out of: n/a
7) Other carriers that were damaged: n/a
8) Alarms displayed by polisher: scrubber time out
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: n/a
11) # of wafers on pad:1200/1225
12) # of wafers on carrier: 1039
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: n/a
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances:
This wafer broke on the scrubber, it wasn't seated correctly and got
caught on the top scrubbing pad
B-shift EE.
17) Put this check sheet in CMP note #32: done
|
| 32.28 | B1 Crash | SUBPAC::CLIFFORD | | Wed Feb 19 1997 16:02 | 33 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System __CMP.B1____
2) Recipe __ILD3____
3) Step # __11___
4) Time into step __liftoff____
5) Type of wafers that broke __monitior_____
6) Carrier which wafer slid out of __5____
7) Other carriers that were damaged __all___
8) Alarms displayed by polisher ___Main vacuum low____________________________
___This was after liftoff. Monitor had broke_
___while polishing inside carrier. Turning
wafer into dust. Wafer detection system
unable to detect dust and small pieces.
Thus, effecting all carriers including three
product wafers from lot XD0869 ILD3.
9) Did any other polisher error for slurry or crash _NO__, sysytems____________
10) Did wafer detect work _NO, because wafers were dust.
11) # of wafers on pad _655___
12) # of wafers on carrier _460___
13) Was there any vibration prior to the crash __NO____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ____YES_____
15) Check step height of the carrier from question #6 __NA_____
16) Please note any other unusual circumstances:
17) Put this check sheet in CMP note #34
|
| 32.29 | B1 wafer crash | FABSIX::B_JUBINVILLE | | Fri Feb 21 1997 10:24 | 33 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System __CMP.B1____
2) Recipe __MQC____
3) Step # __11___
4) Time into step __liftoff____
5) Type of wafers that broke __monitior_____
6) Carrier which wafer slid out of __4____
7) Other carriers that were damaged __all___
8) Alarms displayed by polisher ___Main vacuum low____________________________
___This was after liftoff. Monitor had broke_
___while polishing inside carrier. Turning
wafer into dust. Wafer detection system
found jumped out so it couldn't stop
the crash.
9) Did any other polisher error for slurry or crash _NO__, systems____________
10) Did wafer detect work _NO, because it was physically jumped out.
11) # of wafers on pad _300___
12) # of wafers on carrier _60___
13) Was there any vibration prior to the crash __NO____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ____YES_____
15) Check step height of the carrier from question #6 __NA_____
16) Please note any other unusual circumstances:
17) Put this check sheet in CMP note #34
|
| 32.30 | CMP.B2 CRASH | FABSIX::D_CAUSE | | Wed Mar 12 1997 20:50 | 25 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System __CMP.B2____
2) Recipe __TU_C____
3) Step # __?___
4) Time into step __?____
5) Type of wafers that broke __PRODUCT_____
6) Carrier which wafer slid out of __N/A____
7) Other carriers that were damaged _NONE___
8) Alarms displayed by polisher __LOOKING FOR WAFER AT UNLOAD
9) Did any other polisher error for slurry or crash _NO__, systems____________
10) Did wafer detect work N/A
11) # of wafers on pad _N/A
12) # of wafers on carrier _N/A___
13) Was there any vibration prior to the crash __NO____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ____YES_____
15) Check step height of the carrier from question #6 __NA_____
16) Please note any other unusual circumstances:EQUIPMENT HAD ALARMED AT LEAST
3 OTHER TIMES DURING THE DAY, ACCORDING TO THE DAYSHIFT, FOR THE UNLOAD
FLIPPER. ONLY ONE PRODUCT WAFER BROKEN.LOT # JD1031 M3.
|
| 32.31 | CMP | FABSIX::R_TRAN | | Thu Mar 13 1997 17:11 | 28 |
|
SPEEDFAM WAFER CRASH FORM
1) System __CMP.B3____
2) Recipe __TU_C____
3) Step # __5___
4) Time into step __1____
5) Type of wafers that broke __PRODUCT_____
6) Carrier which wafer slid out of __N/A____
7) Other carriers that were damaged _YES___
8) Alarms displayed by polisher __N/A
9) Did any other polisher error for slurry or crash _NO__, systems____________
10) Did wafer detect work N/A
11) # of wafers on pad _N/A
12) # of wafers on carrier _N/A___
13) Was there any vibration prior to the crash __NO____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ____YES_____
15) Check step height of the carrier from question #6 __NA_____
16) Please note any other unusual circumstances:
17) Put this check sheet in CMP note #32
|
| 32.32 | B3 crash - no product | SUBPAC::BJUBINVILLE | CMP Equipment Engineering | Sat Mar 15 1997 08:16 | 35 |
|
SPEEDFAM WAFER CRASH FORM
1) System __CMP.B3____
2) Recipe __TUP_B____
3) Step # __5___
4) Time into step __10____
5) Type of wafers that broke __monitor_____
6) Carrier which wafer slid out of __5____
7) Other carriers that were damaged _YES___
8) Alarms displayed by polisher __none
9) Did any other polisher error for slurry or crash _NO__, systems____________
10) Did wafer detect work - yes
11) # of wafers on pad _500
12) # of wafers on carrier _100___
13) Was there any vibration prior to the crash __yes____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ____no_____
15) Check step height of the carrier from question #6 _ok_____
16) Please note any other unusual circumstances:
TUP_C recipe was corrupt and was giving eronious results.
All of the parameters in the segments were ok but the tool
was not doing what it was suppose to. This is most likely
the cause of Thursdays crash. I already deleted TUP_B and
copied over the IO/MQC recipe but according to the Thursday's
crash report, it was TUP_C so I am going to have OPS delete
all of the TUP recipes and re-copy them over from the IO_MQC
recipe.
17) Put this check sheet in CMP note #32
|
| 32.33 | cmp crash.b3 | FABSIX::J_BLAIS | You have read | Tue Apr 01 1997 19:12 | 22 |
| 1) System _cmp.b3__________
2) Recipe _tup b_____
3) Step # _5___
4) Time into step __1___
5) Type of wafers that broke _1 dummy that took out 1 product total of 2.
6) Carrier which wafer slid out of __3___
7) Other carriers that were damaged __2_____
8) Alarms displayed by polisher ____wafer loss detected sending carriers up.__
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash no__, systems____________
10) Did wafer detect work _yes__
11) # of wafers on pad _900__
12) # of wafers on carrier 178___
13) Was there any vibration prior to the crash _yes__
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ___yes___
15) Check step hight of the carrier from question #6 _carrier toated
16) Please note any other unusual circumstances: none
|
| 32.34 | CMP.B1 CRASH | SUBPAC::CLIFFORD | | Thu Apr 03 1997 10:50 | 27 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System __CMP.B1____
2) Recipe __TUP_B____
3) Step # __3___
4) Time into step __9 OUT OF 13 SECONDS____
5) Type of wafers that broke __2 PRODUCT JD1176_____
6) Carrier which wafer slid out of __4____
7) Other carriers that were damaged __3 & 4___
8) Alarms displayed by polisher ___ALL CARRIERS NOT ROTATING
FOLLOWED BY NO VACUUM
9) Did any other polisher error for slurry or crash _NO__, sysytems____________
10) Did wafer detect work _YES_
11) # of wafers on pad _65___
12) # of wafers on carrier 662____
13) Was there any vibration prior to the crash __NO____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table ____YES_____
15) Check step height of the carrier from question #6 __65-85_____
16) Please note any other unusual circumstances:
17) Put this check sheet in CMP note #34
|
| 32.35 | CMP.B1 Crash | SUBPAC::LANDRY | | Sun Apr 06 1997 10:41 | 26 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B1
2) Recipe: ILD2
3) Step #: 3
4) Time into step: 4 seconds
5) Type of wafers that broke: Product
6) Carrier which wafer slid out of: #3
7) Other carriers that were damaged: #2
8) Alarms displayed by polisher: "carrier #3 not rotating"
9) Did any other polisher error for slurry or crash: NO sysytems: N/A
10) Did wafer detect work: YES
11) # of wafers on pad: 210
12) # of wafers on carrier: 42
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: YES
15) Check step height of the carrier from question #6: carrier ring too
severly damaged
16) Please note any other unusual circumstances: Found carrier #3 to have
four screws missing from the
extention ring.
17) Put this check sheet in CMP note: Done
|
| 32.36 | CMP.B2 | FABSIX::R_TRAN | | Sat Apr 19 1997 09:48 | 28 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System CMP.B2___________
2) Recipe _BREAK-IN__________
3) Step # _7____
4) Time into step _6 SEC._____
5) Type of wafers that broke _DUMMY_WAFER_________
6) Carrier which wafer slid out of _4_____
7) Other carriers that were damaged _3_______
8) Alarms displayed by polisher _WAFER LOST DETECT ALARMS.____________________________________________
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _NO___, sysytems____________
10) Did wafer detect work _YES_____
11) # of wafers on pad _130_____
12) # of wafers on carrier _42_____
13) Was there any vibration prior to the crash _YES_____
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table __YES_______
15) Check step hight of the carrier from question #6 .0085_______
16) Please note any other unusual circumstances:
17) Put this check sheet in CMP note # 32
|
| 32.37 | crash .b2 | FABSIX::S_MCREYNOLDS | | Sat Apr 19 1997 23:51 | 29 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B2
2) Recipe: ild3
3) Step #: n/a
4) Time into step: n/a
5) Type of wafers that broke: 1 product #8
6) Carrier which wafer slid out of: #2 or 3
7) Other carriers that were damaged: n/a
8) Alarms displayed by polisher: time out for wafer unload
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: no, this happened on secondary table
11) # of wafers on pad:100/360
12) # of wafers on carrier: 1,2,5=62 3,4=20
13) Was there any vibration prior to the crash: NO
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: n/a
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances:
wafers broke out of carrier 2 or 3 and took out 2 or 3.
also a product wafer broke on polish table while manually removing the
wafers
B-shift EE.
17) Put this check sheet in CMP note #32: done
|
| 32.38 | cmp.b3 2 wafers broke | FABSIX::M_PROVENCHER | | Mon Apr 21 1997 00:10 | 31 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System _ cmp.b3 __
2) Recipe _ tup 200 __
3) Step # __ n/a ____
4) Time into step _ n/a __
5) Type of wafers that broke _ product __
6) Carrier which wafer slid out of _ n/a _
7) Other carriers that were damaged _ none _
8) Alarms displayed by polisher _ none ________________________________________
______________________________________________
______________________________________________
9) Did any other polisher error for slurry or crash _n/a, sysytems___ n/a ____
10) Did wafer detect work _ n/a __
11) # of wafers on pad _ n/a __
12) # of wafers on carrier _ n/a _
13) Was there any vibration prior to the crash _ n/a _
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table _ n/a ____
15) Check step hight of the carrier from question #6 _ n/a __
16) Please note any other unusual circumstances: 2 wafers broke on the re-
-ceive cassette (#1). slot #1, and estimating #13. it looks like the wafers
were either cleaved, or broke, perpendicular to wafer notch, on both wafers
.lot jd1296, ILD2 #2,#15 are the wafers Identified. receive cassette area,
and the scrubber, that the lot was placed in was, cleaned out.
17) Put this check sheet in CMP note #32? __ done ___
|
| 32.39 | .b3 crash | FABSIX::S_MCREYNOLDS | | Sun May 11 1997 01:13 | 27 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B3
2) Recipe: touch-up-a
3) Step #: 5
4) Time into step: 3sec
5) Type of wafers that broke: 2 product
6) Carrier which wafer slid out of: 4
7) Other carriers that were damaged:3
8) Alarms displayed by polisher: none
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: yes
11) # of wafers on pad:140
12) # of wafers on carrier:1132
13) Was there any vibration prior to the crash: yes
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: yes
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances: tool had MAJOR vibrations
before it crashed.
B-shift EE.
17) Put this check sheet in CMP note #32: done
|
| 32.40 | .B3 Crash | FABSIX::S_MCREYNOLDS | | Sun May 11 1997 08:31 | 27 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B3
2) Recipe: touch-up-c
3) Step #: 3
4) Time into step: 1sec
5) Type of wafers that broke: 3 product
6) Carrier which wafer slid out of: 5
7) Other carriers that were damaged:all
8) Alarms displayed by polisher: none
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: yes
11) # of wafers on pad: this tool crashed earlier tonight, it had a fresh
12) # of wafers on carrier: pad and all new carriers
13) Was there any vibration prior to the crash: yes
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: yes
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances: tool had MAJOR vibrations
before it crashed. Due to the time of the crash i could not get the broken
wafer #'s
B-shift EE.
17) Put this check sheet in CMP note #32: done
|
| 32.41 | (3) product wafers crashed on B3 | SUBPAC::BJUBINVILLE | CMP Equipment Engineering | Thu May 15 1997 08:31 | 25 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B3
2) Recipe: touch350
3) Step #: 3
4) Time into step: 1sec
5) Type of wafers that broke: 3 product
6) Carrier which wafer slid out of: #4
7) Other carriers that were damaged: #3
8) Alarms displayed by polisher: WAFER LOSS DETECTED
9) Did any other polisher error for slurry or crash: NO
10) Did wafer detect work: yes
11) # of wafers on pad: 370
12) # of wafers on carrier: 231 ON BOTH
13) Was there any vibration prior to the crash: yes
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: yes
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances: #4 never blew off
previous wafer and double stacked at load.
17) Put this check sheet in CMP note #32: done
|
| 32.42 | B3 WAFER CRASH IN SCRUB STATION | SUBPAC::BJUBINVILLE | CMP Equipment Engineering | Sat May 31 1997 09:19 | 25 |
|
SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)
1) System: CMP.B3
2) Recipe: ILD_2
3) Step #: N/A
4) Time into step: N/A
5) Type of wafers that broke: 1 product YE0263 ILD1 (2) MORE IN QUESTION
6) Carrier which wafer slid out of: N/A
7) Other carriers that were damaged: N/A
8) Alarms displayed by polisher: WAFER DID NOT BREAK BEAM SENSOR
9) Did any other polisher error for slurry or crash: N/A
10) Did wafer detect work: N/A
11) # of wafers on pad: N/A
12) # of wafers on carrier: N/A
13) Was there any vibration prior to the crash: N/A
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
the table: N/A
15) Check step hight of the carrier from question #6: n/a
16)** Please note any other unusual circumstances: SEE 21.L
17) Put this check sheet in CMP note #32: done
|