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Conference asdg::cmp

Title:CMP
Notice:Welcome to the CMP notesfile
Moderator:FABSIX::B_TOWERLLE
Created:Tue Oct 31 1995
Last Modified:Fri Jun 06 1997
Last Successful Update:Fri Jun 06 1997
Number of topics:94
Total number of notes:6381

41.0. "CMP.D1 EQUIP PASSDOWNS" by STRATA::TDYER () Tue May 06 1997 09:35

    THIS NOTE IS FOR EQUIPMENT ENGINEERING PASSDOWNS ON CMP.D1
T.RTitleUserPersonal
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41.38conditioner modifiedYIELD::TDYERFri May 09 1997 16:3512
    
    MODIFIED CONDITIONER PLUMBING:
    
    1/4" N2 line replaced with 3/8" tubing from valve to conditioner. 1/2"
    water line ran from valve to conditioner. Also both air actuated valves
    are stowed in the cabinet and the door can shut. Currently the digital
    output for "slurry-3" actuates the N2 valve for the conditioner. If Pro
    Eng requires DI durring conditioning, simply connect the "T" from the 
    N2 valve to the DI valve. All tubing and valves are clearly labeled.
    
    Tim
                       
41.39check valvesSUBPAC::CMPTue May 13 1997 20:284
    There are 3 check valves installed on the DI water line to the 3 way
    valve that also controls metals slurry. The reason this is there is to
    keep the slurry from backing into the DI water system. This is due to a
    leaky valve.
41.40safety upgradeSUBPAC::CMPTue May 13 1997 20:313
    Today we installed a MHTA saety stop assy. This device keeps the
    multi-head locked preventing an movement. To use the device, insert
    under the multi-head lock lever when in the up position. 
41.41TIM'S HIT LIST COMPLETE.FABSIX::B_WESTPHALBradley BP#661 EXT# 6610Sat May 17 1997 20:505
CMP.D1 - Pads (both) were replaced and process area cleaned up.  Service covers
	 were installed.


41.42todays activitiesFABSIX::R_GEEMon May 19 1997 20:0910
	- Replaced the pad and carriers. 
	- Adjusted the wafer lose sensors.
	- Replaced the air line for the solenoid that actuates the
	  scrubber brush DI water.  
	- Adjusted the conditioner service position.


				A shift & Tim D.


41.43Wafer lose sencor brackets modified\FABSIX::R_GEETue May 20 1997 20:138
	We've had problems keeping the wafer lose detection sensors
	adjusted properly. Modified all five sensor brackets so the
	sensors are within 5" from the table, previously the distance
    	was around 8".
    
    					A shift 
	

41.44Memorial Day Shutdown ChecksheetASDG::POIRIERFri May 23 1997 18:1851



                        CMP.D SHUT DOWN CHECK SHEET
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
								 INIT / DATE
1) SCRUB SIDES OF CARRIERS					  JP  / 5-23
2) RUN CARRIER BLOW OFF FOR 30 SECONDS	                          JP  / 5-23
3) REMOVE ALL CARRIERS						  JP  / 5-23 *
4) PLACE WIPES UNDER CARRIER FILMS AND LAY CARRIERS DI TANK	  JP  / 5-23
5) IF POWER TO SLURRY SYSTEM IS GOING TO BE LOST, CONTACT                    *
   ASHLAND CHEMICAL AND HAVE SLURRY SYSTEM PURGED AND CHARGED 
   WITH DI WATER.				                   
6) CLEAN ENTIRE SYSTEM OF DRIED SLURRY 			        JP-MS / 5-23
7) CYCLE/RINSE ALL DI FUNCTIONS: SPRAY NOZZLES, SLURRY PUMPS,
   CONDITIONER RINSE, ELEVATOR TANKS.				JP-MS / 5-23
8) SHUT OFF DI BEHIND SYSTEM (ROTATE 3W VLV TO FULL RETURN)     JP    / 5-23 
9) DRAIN ELEVATOR AND CONDITIONER TUBE				JP-MS / 5-23
10) REMOVE PADS, AND CLEAN AND DRY TABLES			JP-MS / 5-23
11) REMOVE SCRUBBER BRUSHES AND SOAK IN DI		        JP-MS / 5-23 *
12) DRY ENTIRE SYSTEM OF ANY STANDING WATER			JP-MS / 5-23
 
  COMMENTS:

          Item #3: The spindles lifted the carriers up during carrier unload
                   on all 5 spindles. After a few seconds, all 5 carriers 
                   dropped to the table. Two carrier films were damaged.
                   The remaining 3 carriers are in the sink.
 
          Item #5: System slurry is on day tanks.

         Item #11: Scrubber brushes look dirty, should be replaced at start-up.

             Misc: The conditioner hard stop was bumped during cleaning. It 
                   was rebonded to the tub with RTV.

             Misc: The water track in unload elevator "A" was full of silicon
                   particles.

                        CMP.D START UP CHECK SHEET
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
                                                                 INIT / DATE
1) TURN ON DI WATER (ROTATE 3W VLV TO FULLY TO POLISHER.	______/______
2) CYCLE/RUN ALL DI FUNCTIONS FOR 15 MINUTES			______/______
3) WIPE DOWN SYSTEM CLEAN ALL DRIED SLURRY	                ______/______
4) INSTALL SCRUBBER BRUSHES					______/______
5) INSTALL CARRIERS						______/______
6) RUN WET IDLE PROGRAM FOR 15 MIN. (ENOUGH TO CLEAN CARRIERS)  ______/______
7) PUT IN WET IDLE AND TURN OVER TO MFG FOR MQC			______/______

41.45D1 startupFABSIX::B_FINNTue May 27 1997 19:3413

                        CMP.D START UP CHECK SHEET
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
                                                                 INIT / DATE
1) TURN ON DI WATER (ROTATE 3W VLV TO FULLY TO POLISHER.	BF,TL/ 5/27/97
2) CYCLE/RUN ALL DI FUNCTIONS FOR 15 MINUTES			BF,Tl/ 5/27/97
3) WIPE DOWN SYSTEM CLEAN ALL DRIED SLURRY	                BF,Tl/ 5/27/97
4) INSTALL SCRUBBER BRUSHES					BF/Tl/ 5/27/97
5) INSTALL CARRIERS					        BG/TL/ 5/27/97
6) RUN WET IDLE PROGRAM FOR 15 MIN. (ENOUGH TO CLEAN CARRIERS)  BG/TL/ 5/27/97
7) PUT IN WET IDLE AND TURN OVER TO MFG FOR MQC			   BG/ 5/27/97

41.46Scrubber Brushes ChangedSUBPAC::DAWSONThu May 29 1997 17:295
    
    	Particle checks were performed on CMP.D1. Scrub brush imprints, 3
     different circles were noticed. Brushes were chaged out.
    
    WCMP
41.47Head #3 downforce checked / wafer detect #1FABSIX::R_GEEMon Jun 02 1997 19:579
	* Checked head #3 downforce per. EE.

	  Point to point setpoint 377 lbs, actual 354 lbs. All set.

	* After around 30 wafers we needed to calibrate wafewr lose sensor
	  #1.

					A shift	

41.48Sensor replaced/Robot adjustedFABSIX::B_WESTPHALBradley BP#661 EXT# 6610Thu Jun 05 1997 20:386
CMP.D1 - Down for wafer handling problems in the load station.  The robot 
	 pick and place positions to cassette A and prealigner were
	 recalibrated.  The same was tested with no problems.  The Wafer loss 
	 sensor (#5) was replaced, adjusted and tested as requested by EE.