| T.R | Title | User | Personal
Name | Date | Lines |
|---|
| 63.1 | CMP PD | STRATA::TDYER | | Mon Nov 06 1995 10:49 | 48 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 4th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
Lock/Mail Stop: HLO1-1/p-11
Matt Vanhenehem
Larry Camiletti
Jim Tooker
Eric Bodensieck
Frank Krupa
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
FAB4:
========
WSTK.1 - Continuing to run machine stacked pad.
WSTK.2 - Polish rate uniformity is hanging around the low end of spec ~-4%.
Rate continue to rise. I can be reached at pager 508-387-1389 if
things come to a stand still.
FAB6
======
A.1 - Both the Strasbaughs continue to break wafers, consumables running
out....again. Polish rates have been running ~1400. A reduced down
of 40lbs (313 - 271) will be tried on A1. If MQCs pass they will run A1
in this condition and monitor for breakage. The reduction of pressure
may or may not cut down on the breakage.
A.2 - Running with 2 SUBA-IV and 1 IC1000.
B.1 - Continue to run ID/OD PAD and PROCESS per Pro Eng.
B.2 - Speedfam B2 facilitation has been completed and signed off. Today we
filled the chiller. We had a couple of leaks, one at the ball valve
entering the polisher, pinched oring, and one on the DI line inside the
fluids cabinet. Five Speedfam reps will be here Monday morning to start
the system up and begin mechanical acceptance.
|
| 63.2 | CMP PD | STRATA::TDYER | | Mon Nov 06 1995 10:51 | 48 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 4th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
Lock/Mail Stop: HLO1-1/p-11
Matt Vanhenehem
Larry Camiletti
Jim Tooker
Eric Bodensieck
Frank Krupa
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
FAB4:
========
WSTK.1 - Continuing to run machine stacked pad.
WSTK.2 - Polish rate uniformity is hanging around the low end of spec ~-4%.
Rate continue to rise. I can be reached at pager 508-387-1389 if
things come to a stand still.
FAB6
======
A.1 - Both the Strasbaughs continue to break wafers, consumables running
out....again. Polish rates have been running ~1400. A reduced down
of 40lbs (313 - 271) will be tried on A1. If MQCs pass they will run A1
in this condition and monitor for breakage. The reduction of pressure
may or may not cut down on the breakage.
A.2 - Running with 2 SUBA-IV and 1 IC1000.
B.1 - Continue to run ID/OD PAD and PROCESS per Pro Eng.
B.2 - Speedfam B2 facilitation has been completed and signed off. Today we
filled the chiller. We had a couple of leaks, one at the ball valve
entering the polisher, pinched oring, and one on the DI line inside the
fluids cabinet. Five Speedfam reps will be here Monday morning to start
the system up and begin mechanical acceptance.
|
| 63.3 | CMP PD | STRATA::TDYER | | Mon Nov 06 1995 19:17 | 42 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 6th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
Lock/Mail Stop: HLO1-1/p-11
Matt Vanhenehem
Larry Camiletti
Jim Tooker
Eric Bodensieck
Frank Krupa
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
FAB4:
========
WSTK.1 - Continuing to run machine stacked pad.
WSTK.2 - Struggled with polish rate uniformity again today. Installed a machine
stacked pad and unif came in at +14%. It looks like we need to
re-evaluate machine or hand stacked. Rodel has been notified today
of their latest instability!
FAB6
======
A.1/A.2 - See Frank's PD
B.1 - Continue to run ID/OD PAD and PROCESS per Pro Eng.
B.2 - System was powered up today, head rotation and oscillation tested. Every
thing initialized except for the paddle. Speedfam is looking at the pad
problem. Speedfam will be working around the clock with TWO crews. EEG
techs work with the reps on startup, don't worry about getting in there
way. Please give an update at your shifts end as to any startup issue.
|
| 63.4 | CMP PD | STRATA::TDYER | | Wed Nov 08 1995 18:31 | 39 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 8th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
Lock/Mail Stop: HLO1-1/p-11
Matt Vanhenehem
Larry Camiletti
Jim Tooker
Eric Bodensieck
Frank Krupa
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
FAB4:
========
WSTK.1 - Continuing to run machine stacked pad.
WSTK.2 - Continuing to run machine stacked pads.
FAB6
======
B.1 - Continue to run ID/OD PAD and PROCESS per Pro Eng.
B.2 - Several minor problems corrected today, scrubber sensors, N2 ps2 switch
and down force. Tonight the Speedfam 2nd shift will button things up
and begin full cycling. This should include a touch down on the primary
pad with one oscillation cycle and touch down on the 2nd table. See Earl
Dowson for touch down wafers. If all goes well tonight, tomorrow morning
we will start the 500 WAFER MECHANICAL ACCEPTANCE.
|
| 63.5 | CMP PD | STRATA::TDYER | | Thu Nov 09 1995 15:05 | 41 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 9th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
Matt VanHanehem Lock/Mail Stop: HLO1-1/p-11
Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - PAD IS AT 600, needs to be changed.
WSTK.2 - unif out of spec, pad at 250+, change pad.
CMP.B1 - Slight vibration with new process, Larry will look into this
problem.
CMP.B2 - System is now running the MECHANICAL ACCEPTANCE test. Currently at
~50 wafers. After the next boat the reps need to verify slot one
of cassette 2. If this is correct the test may be resumed. Should
the robot miss an other wafer from slot 1 of cassette 2, the test
will STOP and counters ZEROED (start over). 2 assist are allowed
through the acceptance marathon. If a failure occurs, the test will
STOP and the reps will fix the problem. Once problem is fixed,
counters ZERORED and test will be re-started. If you have any question
as to whether we have a failure or an assist or to re-start the
test, give me a page on my long range pager, or at home. I will
check in periodically. We are trying to get the Speedfam Process
reps here for the weekend.
|
| 63.6 | CMP PD | STRATA::TDYER | | Fri Nov 10 1995 19:24 | 40 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 10th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
Matt VanHanehem Lock/Mail Stop: HLO1-1/p-11
Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.2 - MONTHLY PM IN PROGRESS.
CMP.B1 - No issues.
CMP.B2 - System ran with no problems up to 450 wafers. At 450 load cup 3
errored for "not up". The sensor was adjusted, not a major problem.
We continued with the acceptance and agreed to run an additional
100 wafers (600 total). At the 525 run, a wafer broke on the primary
pad. The wafer came out of head 3 in pieces and the wafer detect
stopped the table. THE ACCEPTANCE WILL BE RE-STARTED AT ZERO AND
RUN TO 600. EEG, please build 5 new carriers for B2's testing.
We need new carriers and I do not have want the Reps to build
them because they do not build carriers on a regular basis.
Hopefully Mechanical will be completed by Sunday morning at which
time Process acceptance will start.
A.1/A.2 - Please see Jim's and Eric's PD for the Strasbaugh plan. This really
needs everyone's team support.
|
| 63.7 | CMP PD | STRATA::TDYER | | Sat Nov 11 1995 17:37 | 44 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 11th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
Matt VanHanehem Lock/Mail Stop: HLO1-1/p-11
Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
==============================================================================
SUBJECT: CMP PD/B2 UPDATE
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1.2 - RUNNING WITH MACHINE STACKED PADS.
CMP.B1 - No issues.
CMP.B2 - More wafer breakage last night. A couple of problems were found and
corrected; carrier balance pressures was too high, a corrupt file
was found on the hard disk (hardware.500), the conditioner down
force was out of calibration. These items were corrected and wafer
test re-started. At 155 wafers it crashed, 15 seconds into step-3.
Step-3 ramp down force at the same time as ramping table speed from
15 to 29. The recipe was edited to match B1, constant table speed.
The carriers were rebuilt at 5.5-6.5, previously they were at 7.5-8.
The mechanical acceptance is back in full swing AGAIN, currently at
~50 wafers. Please assist the reps as needed. INSPECT WAFERS PRIOR
TO LOADING ON B2. DO NOT POLISH ANY BARE SILICON WAFERS.
THE ACCEPTANCE WILL RUN TO 600. Hopefully Mechanical will be
completed by Sunday morning at which time Process acceptance will
start. I will check in periodically. Please page me if we crash or
finish. There are more oxide wafers lots PA0710 - Pa0717 for B2.
A.1/A.2 - Please see Jim's and Eric's PD for the Strasbaugh plan. This really
needs everyone's attention to detail.
|
| 63.8 | CMP PD | STRATA::TDYER | | Mon Nov 13 1995 18:35 | 40 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 13th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
Matt VanHanehem Lock/Mail Stop: HLO1-1/p-11
Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1. - No issues
WSTK.2 - After monthly PM particles were high and polish rate low. The system
was thoroughly cleaned and particles remained high at 2000. Changed
final process pressure from 1psi to 5 psi and particles came in. This
may be a down force calibration or down force ramp problem. A shift
is looking at these. If particles are still high after cal, check
particles again at 5psi on final. If particles, uniformity and
polish rate are in, run system with 5psi on the final. Contact PSS
for tdco/edco.
CMP.B1 - Crashed wafer. One of the carriers lost a screw, this may have caused
the crash. Also conditioner down force is at 40%, should be at 67%.
New carrier will be installed and conditioner down force changed.
CMP.B2 - Running process acceptance. Speedfam is trying to get the rate and
uniformity in spec at this time. Particles were checked today with
final process, all <600.
|
| 63.9 | CMP PD | STRATA::TDYER | | Tue Nov 14 1995 19:37 | 35 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 14th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1,.2 - No issues. There are 10 22.5" machined stacked pads in the FAB6
CMP room. I some one gets a chance, please bring them to the
WSTK room.
CMP.B1 - High particles. Head-4 shaft and or rotary union is contaminated with
rust. Speedfam will order the "worst case" parts to rebuild head-4's
carrier drive shaft. In the interim, install a carrier on head-4 with
a DF200 film with NO holes, this will act as a plug. Take head-4 off
line, clean the index table, replace the pad and check MQC with 1,2,3,
and 5. Once the parts are in, probably Thursday, we will schedule this
major job, estimated 12+ hours.
CMP.B2 - In process acceptance.
|
| 63.10 | CMP PD | STRATA::TDYER | | Wed Nov 15 1995 17:44 | 50 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 15th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1,.2 - No issues.
CMP.B1 - High particles readings was due to incorrect data from the surfscan.
The surfscan recipe is optimized for 10K, the wafer, post polish,
have been closer to 8K, changing the "defects counted" by the
surfscan. See Pro Eng for the correct recipe.
*** Tomorrow morning CMP.B1 needs to go down for the HEAD-4 repair.***
CMP.A1 - No issues.
CMP.A2 - During lift OFF at the end of a 25 second PMD touch up, a wafer
stuck to the pad instead of to the carrier film. The wafer stayed on
the pad and hit the other head which was still trying to lift OFF.
There has been success with the "idle/ramp up" procedure for reducing
breakage, maybe the lift off step needs to be optimized or the R200
film tested.
CMP.B2 - In process acceptance. A wafer broke today but did NOT cause a crash.
A piece of a wafer from head-4 broke off and landed in the ID of the
pad. The run finished polishing with out crashing and unloaded the
broke wafer into the index table where it was noticed. Cause unknown,
possibly a mis-load. Acceptance continues.
*** 28" SUBA-IV pads are not due in until MONDAY. If we run out, the top pads
ONLY may have to be pulled, leaving one SUBA-IV down on the platen.
Than installing the machine stacked pad on top of the "old" SUBA-IV.
|
| 63.11 | CMP PD | STRATA::TDYER | | Thu Nov 16 1995 17:12 | 49 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 16th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1,.2 - No issues.
CMP.B1 - Head-4 was taken down at 10:45am to repair the rust problem. The
compression fitting just below the rotary union was loose. Water
was leaking by the fitting into the outer tube (drive shaft). The
compression fitting was inspected, the shaft and fittings cleaned
and fitting re-tightened. The system should be turned over for a
PAD CHANGE and MQC's in the next � hour.
* 9 carrier plates are due in tomorrow 10:30am. 3 fully built carriers
are in standby for B1 in the event of a crash. Also If more than 3
new carriers are needed, remove them FROM B2. Again, nine new plates
are due in tomorrow and 10 more on Saturday.
CMP.B2 - In process acceptance. A wafer broke today AGAIN but did NOT cause
a crash. (NO THIS IS NOT YESTERDAY'S PASSDOWN).
A piece of a wafer from head-2 broke off and landed in the ID of the
pad. The run finished polishing with out crashing and unloaded the
broke wafer into the index table where it was noticed. The type of
break (chip) indicates a possible loader problem. The loader was
inspected and we found that most of the load cups were lifting TOO
high. Also the load flipper was adjusted for parallel placement.
Acceptance continues.
*** 28" SUBA-IV pads are not due in until MONDAY. If we run out, the top pads
ONLY may have to be pulled, leaving one SUBA-IV down on the platen.
Than installing the machine stacked pad on top of the "old" SUBA-IV.
|
| 63.12 | CMP PD | STRATA::TDYER | | Fri Nov 17 1995 16:09 | 50 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 17th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1,.2 - No issues.
CMP.B1 - High unif on 1 minute MQC polish. The one minute polish does not
reap the benefits of the ID/OD process because half the time is
spent ramping down in the center of the pad. Pro Eng will check
unif with a two minute polish. The surfscan recipe will need to be
changed or optimized for the new thickness. The touch down location
will also be looked at, see B2 note.
CMP.B2 - A wafer broke again last night 7:00ish .
The breakage was consistently at the notch, a weak spot. Since there
was a breakage after the loader alignment, the loader was ruled out
as a possible cause. The current process touches down on the pad with
half the wafer hanging over the pad. This was suspected as the
breaking Mechanism. Touch down was changed to the center of the pad
and ~400 wafers polished last night on FULL pad with NO problems.
The FULL pad test was all that was remaining of the MECHANICAL
ACCEPTANCE. Last night's work satisfies those conditions, the system
is "mechanically signed off". Process acceptance continues, the
3 minute 50 wafer test remains.
* Should some problem arise with B2 or a serious problem with the other
systems, I can be paged at 508-387-1389.
*** 28" SUBA-IV pads are not due in until MONDAY. If we run out, the top pads
ONLY may have to be pulled, leaving one SUBA-IV down on the platen.
Than installing the machine stacked pad on top of the "old" SUBA-IV.
|
| 63.13 | CMP PD | STRATA::TDYER | | Mon Nov 20 1995 17:25 | 38 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 20th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1,2 - Slurry filter drain valve is leaking, facilities call put in.
Facilities is in "IT'S NOT MY JOB" mode...no surprise. Dan Smith
will replace the PVC valve. If we have any problems the EEG
supervisor (Scott and or Larry ) need to fight it out with
facilities.......bottom line, just get it fixed.
Put filter into BY-PASS for the repair, after the repair replace
the filter with NEW filter after repair.
CMP.B1 - Recovering from yesterday's crash. 5 carrier came in, one was bad.
Do NOT use carrier plate # 418. 6 more carrier plates due in
tomorrow, 10 more on Friday. A shift is performing loader alignments
at this time.
** B1 WILL RUN 50 WAFERS PRIOR TO RUNNING ANY PRODUCT, THIS MAY INCLUDE
BREAKIN AND MQC WAFERS.
CMP.B2 - Process work on hold, NO CARRIERS.
|
| 63.14 | CMP PD | STRATA::TDYER | | Tue Nov 21 1995 15:23 | 40 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 21ST, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Matt VanHanehem
John Maze
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
I WILL BE OUT OF OFFICE THE REMAINDER OF TODAY AND RETURNING TUESDAY 11/28.
PLEASE CONTACT JIM TOOKER AND OR TIM LANDRY AND OR JOHN POURIER FOR FAB6
ISSUES AND JOHN MAZE FOR ANY FAB4 ISSUES.
WSTK.1,2 - No issues today. Could work by A,B shift repairing the slurry
problem.
CMP.B1 - Running with 4 heads. Waiting for a window to install and qualify
the 5th carrier.
CMP.B2 - Process work on hold, NO CARRIERS.
SPEEDFAM HAS BEEN REQUESTED TO CONTINUE TO RUSH IN AS MANY POSSIBLE CARRIERS
AS POSSIBLE UNTIL WE HAVE OUR COMPLETE INVENTORY BACK. WE SHOULD RECEIVE SOME
TOMORROW AND SOME ON FRIDAY.
|
| 63.15 | couple of quickies | SUBPAC::LANDRY | | Wed Nov 22 1995 19:24 | 24 |
| A2 : Slurry lines changed out. Slurry pump calibration performed.
The DI water valve didn't arrive. See NOTE on A2 for shutdown
game plan.
B1 : New pad installed. A fifth head installed. Full set of carriers
built and are ready in the rebuild room.
B2 : A full set of carriers has been built (7.0 - 8.0 extention) and
are in the rebuild room. No need to put them on the system until
Process Engineering is ready to resume development work.
Speedfam: More carrier pressure plates were sent out today. Expecting
more to arrive on Friday. We look to be in pretty good
shape atthis time
Strasbaugh: 4 Carrier plates were shipped out today for Engineering
development work. Plenty of spare plates are in-house
to satisfy the rooms needs. Two new plates in the fab 6
stockroom, should they be needed. If withdrawn, the
helicoils and jack-screw threads need to be checked prior
to introducing them into manufacturing.
Doc / JP
|
| 63.16 | CMP PD | LUDWIG::TDYER | | Mon Nov 27 1995 17:23 | 46 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 27th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Kyle Wooldridge
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - High (center fast) uniformity. After monthly Pm is complete, install
HAND STACKED pads on this system.
WSTK.2 - Westech is here to address the RPC-II failures. They will not take
the system unless a failure actually occurs or if MFG releases the
system. Currently the system is idle and the reps are browsing things
over. They can stop at anytime. They will probably leave for the
night around 8ish. Please support them as needed.
CMP.B1 - Running
CMP.B2 - In process development.
* FAB6 Slurry failed today shutting down all systems. Inadequate FLOW, not
PRESSURE, caused the slurry to solidify in the returns of A2 and B1. Low flow
quickly escalates into clogs which can quickly take down a slurry delivery
system. Doc and Brenden have corrected the clogs, additionally they have set
up CMP.A2 in a series loop like A1. The long term fix for the slurry
problems HAVE been planned by the "slurry team". The upgrade will include
removal of the filters in the chase for increased FLOW and reduced pressure
and a pulsation dampner for spike reduction.
* Carrier plates and pads arrived today.
|
| 63.17 | CMP PD | LUDWIG::TDYER | | Tue Nov 28 1995 16:34 | 33 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 28th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Kyle Wooldridge
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD (JUST FOR YOU LARRY)
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP, NO ISSUES
WSTK.2 - Westech was poking around the system looking at RPC-II errors. Some
they broke the POLISH ARM up sensor. A new sensor is due in tomorrow.
CMP.B1 - Running, assist today, 2 wafers dropped at lift off.
CMP.B2 - In process development, see Frank for details.
* 15 carrier ring guides are on back order at Speedfam.
|
| 63.18 | CMP PD | LUDWIG::TDYER | | Thu Nov 30 1995 17:01 | 52 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: November 30th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Kyle Wooldridge
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP, NO ISSUES
WSTK.2 - Westech reps increased the power supply for the RPC-II INDEXER and
tightened the rs232 cables. The system will be turned back over for
production. If there is no product, please cycle dummies through the
system with a 5 second polish time.,,,,,,,,thanks.
CMP.B1 - Running. As D shift indicated the crash was most likely due to the
loose screws, see notes.
CMP.B2 - Process development has been plagued by multiple hardware failures.
The lifters were fixed toddy, development continues.
****IMPORTANT SPEEDFAM NOTES****
THE CARRIER SCREWS NEED TO BE TORQUED (with torque wrench) PRIOR TO
EVERY MQC CHECK.
THE NEXT TIME THE CARRIERS NEED TO BE REPLACED ON B1, PLEASE INSTALL
TWO OF THE CARRIERS WITH METAL WASHERS. (already built). WE WILL
COMPARE THE METAL WASHER CARRIERS TO THE PLASTIC WASHER CARRIERS.
PRO ENG HAS INSPECTED THE 10 RE-WORKED CARRIER RINGS. FIVE ARE
ACCEPTABLE, THE OTHERS HAVE BEEN DISPOSED OF OR MARKED AS BAD.
********************************
|
| 63.19 | CMP PD | LUDWIG::TDYER | | Fri Dec 01 1995 16:20 | 60 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 1st, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Kyle Wooldridge
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP, Exit cassette errors, last night and this morning. Elevator and
exit slide positions were calibrated.
WSTK.2 - The reps finished up there work on RPC-II. We will not be sure
this unit is fixed until it has run for a week or so with out error.
CMP.B1 - Wafers broke last night, indications were that the wafer cracked
during loading or early in the polish cycle, possibly at touch down.
PLEASE COMPLETE THE FOLLOWING PLAN BEFORE RELEASING TO MFG:
1) Set all load cup heights.
2) Set all load cup speeds
3) Set up load and unload flipper alignment
4) Verify ALL recipes touch down in the center of the pad.
5) Cycle 50 wafers on the brakin recipe, set polish time to
15 seconds or so.
* Curently running two carriers with metal washers.
CMP.B2 - Index table errored today for cup not down, the screen was touched
and the table continued to drive into the unload mushroom. The
mushroom was TOO LOW and was just bearly clearing the fork. A new
UNLOAD mushroom was installed with 3/16" clearance between the
bottom of the mushroom and the cup fork. Retrained the load and
unload flippers. Process development continues.
****IMPORTANT SPEEDFAM NOTE****
THE CARRIER SCREWS NEED TO BE TORQUED (with torque wrench) PRIOR TO
EVERY MQC CHECK.
********************************
If you need to reach me over the weekend, page me at 508 387-1389. There
is no local Speedfam coverage this weekend.
|
| 63.20 | CMP PD | LUDWIG::TDYER | | Tue Dec 05 1995 17:26 | 55 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 5th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Kyle Wooldridge
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - DOWN, Currently having wafer transfer problems.
WSTK.2 - UP.
**WSTK NOTE**
We are continuing to work the Rodel pad problem. In the interim we will
use two pad configurations, MACHINE and HAND stacked. This will be left to
the judgment of the WSTK MFG TECHNICIANS. The basic premise is this; HAND
stack pads is the preferable method, they typical are more stable. However,
if a hand stacked pad has had a short life (<150 wafers) due to negative
uniformity, a MACHINED stacked pad should be installed. MACHINE stacked pads
start with a very CENTER FAST polish rate, for this reason they require ~25
breakin wafers as apposed to the standard 8. I hope this helps clarify the
difference between the two pads and gives you some flexibility. I will
request SR-94 to carry both types.
*************
CMP.B1 - UP, Vacuum problem again today. Pump was replaced and clogged removed
from line.
* Currently running two carriers with metal washers.
CMP.B2 - #1 lifter did not fully lower one of the load cups today. Speedfam
has been requested to fix this re-occurung problem. When they are
done, I would like to cycle wafers through the system ALL night.
Use Franks's process acceptance recipe, change polish time to 17
seconds. Please document ANY errors or assist. I want to make sure
we get the BUGS out before the system is release later this week.
****IMPORTANT SPEEDFAM NOTE****
THE CARRIER SCREWS NEED TO BE TORQUED (with torque wrench) PRIOR TO
EVERY MQC CHECK.
********************************
|
| 63.21 | CMP PD | STRATA::TDYER | | Wed Dec 06 1995 18:57 | 48 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 6th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Kyle Wooldridge
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP
WSTK.2 - UP.
CMP.B1 - Load cup-3 error last night, sensor was restricting movement, good
work by B shift. Elevator-1 failed to index today. A wire was broke
during an inspection earlier in the morning, wire repaired.
CMP.B2 - Last night after the EVAC the system was left to DRY. Please make an
effort to keep ALL the CMP systems in wet mode. If your not sure of
the status of a system, contact the EEG Techs or their supervisor,
thanks. When we tried to initialize the system today, head-5 failed
to home. The rotation infornor fried. A new one is due in tomorrow,
not sure why smoked.
* FIVE COMPLETE SPEEDFAM CARRIERS ARRIVED TODAY. (These are the "owed to
digital for B1's problems" carriers. They can be used on any system.
* THIS NOW GIVES US 25 CARRIERS AND 45 CARRIER PLATES.
****IMPORTANT SPEEDFAM NOTE****
THE CARRIER SCREWS NEED TO BE TORQUED (with torque wrench) PRIOR TO
EVERY MQC CHECK.
*******************************
|
| 63.22 | CMP PD | STRATA::TDYER | | Thu Dec 07 1995 17:27 | 46 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 7th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Larry Camilletti
Jim Tooker
Eric Bodensieck
Frank Krupa
Kyle Wooldridge
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP
WSTK.2 - UP.
CMP.B1 - Inverter errors and vacuum errors last night. Today we looked for
the source of the reoccurring vacuum liner clogging problems. The
vacuum tank was dis-assembled and the popet valve was found to be
leaking by. Brings replaced, vacuum system is back up. Inverter errors
were caused by wafer loss detector-4. The beam was half on carrier
4, causing a false wafer loss condition, beamed moved.
CMP.B2 - Infornor replaced, carrier 5 running OK. After Frank finishes his
work tonight, please cycle wafers through "no-touch". Thanks.
* PAD VIDMAR MOVED INTO THE CMP ROOM AND CARRIER VIDMAR MOVED FROM CMP ROOM
TO CARRIER ROOM. IF ANYONE FEEL AMBITIOUS, THE NEW BIN HOLDERS NEED TO
BOLTED TO THE TABLE IN THE CARRIER ROOM.
****IMPORTANT SPEEDFAM NOTE****
THE CARRIER SCREWS NEED TO BE TORQUED (with torque wrench) PRIOR TO
EVERY MQC CHECK.
*******************************
|
| 63.23 | CMP PD | STRATA::TDYER | | Fri Dec 08 1995 16:46 | 56 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 8th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Jim Tooker
Matt VanHanehem
==============================================================================
SUBJECT: CMP PASSDOWN (please read B2 plan)
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - Down, System is lost. It just polished with 4 heads down, 1 up and
with the table not spinning. Appears to be brain damage. System
reset, rep is looking over system t this time.
CMP.B2 - Down. Index table, load cup and sensors due in tomorrow 8-9am, possibly
later due to the storm. John or Brad, please check with security,
they HAVE been notified that parts are coming in. Please follow the
plan:
Friday night
1) Run Osco and Rosco on ALL heads.
Saturday
1) Receive parts.
2) Install sensor.
3) Measure all ten cut outs in index table with telescopic gauges.
4) Label matching cups.
5) Measure MATCHING load and unload cups outer diameter (make detailed list)
6) Install Index table (do not install cups)
Sunday
1) Check alignment of all heads
Monday
1) Dis-assemble cups
2) Bring cups to machine shop
Tuesday
1) Pick up cups
2) Assemble cups and install
3) Run marathon.
|
| 63.24 | CMP PD | STRATA::TDYER | | Mon Dec 11 1995 16:51 | 48 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 11th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Jim Tooker
Matt VanHanehem
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - up, Brenden did weekly today.
CMP.B2 - Down - Index table installed, sensor replaced. All load and unload
cup shafts were measured and compared to their respective holes
in the index table and to the Speedfam spec. MOST of the shaft were
out of spec, they were too large. The Speedfam spec is 2.480 - 2.484,
most were above 2.484. All shafts were turned to upper spec limit.
Tonight please;
- clean cup parts.
- assemble cups, use blue Loctite.
- install cups in dedicated holes.
- fill with water and check for smooth operation.
- Let index table soak for 4+ hours, recheck for smooth operation.
If OK, run the NO_TOUCH recipe for the remainder of the night.
* If cups show signs of hesitation after they have been soaking,
disassemble the cups and they will be machined again, this time
to the bottom of spec, 2.480".
NOTE: Today we tested the honing method on the old table. Holes which
were oblong to begin with became even worse after honing. DO NOT
USE THE HONNER ON THE INDEX TABLE.
|
| 63.25 | CMP PD | STRATA::TDYER | | Tue Dec 12 1995 19:24 | 45 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 12th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Jim Tooker
Matt VanHanehem
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - up, with elevator-2 off line. Waiting on new dump valve.
FYI, tomorrow we will probably install a new conditioner.
CMP.B2 - Verify - Currently 200 wafers into the marathon....looking good
so far, no it's not a jinx, I'm not superstitious,,, yet.
New pads and two new carriers installed. All cups tested for
smooth operation. The following wafers ran:
150 - NOTOUCH
5 - bin1
5 - bin2
5 - bin3
5 - breakin
30 - mec2-acp
Please continue to cycle wafers through MEC2-ACP all night. Just
make sure there is oxide left on the wafers....thanks.
If all goes well tonight, tomorrow we will check MQCs.
|
| 63.26 | CMP PD | STRATA::TDYER | | Wed Dec 13 1995 16:59 | 40 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 13th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Jim Tooker
Matt VanHanehem
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - up, with elevator-2 off line. The part is in, we just need time
(~1hour) to install and test. Waiting for a window from MFG.
The rep will try again in the morning.
CMP.B2 - Verify - System ran 410 wafers last night with out error. We
started MQCs and the 1st run mis-loaded in head-3. Load cup-3
is the new cup that Speedfam just sent us. It had the wrong type
of springs. They were steel and rusted, restricting the secondary
cup movement, causing the mis-load. Springs replaced with stainless
steel. During the next MQC run the system load two wafers into
one load cup, reason not known. Ran 25 more wafer followed by MQCs.
MQCs failed for high uniformity. Please clean system, clean the
conditioner, etc, replace pad, break in pad and check MQCs. Tomorrow
if MQCs are good Pro Eng will run a lot and check post readings.
|
| 63.27 | CMP PD | STRATA::TDYER | | Thu Dec 14 1995 13:37 | 37 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 14th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Jim Tooker
Matt VanHanehem
==============================================================================
SUBJECT: CMP START UP
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - Replace pads and carrier
WSTK.2 - Replace pads and carrier.
CMP.B1 - Carriers are soaking. Replace both pads.
CMP.B2 - Carriers are soaking, replace pad.
SCRUBBERS - The brushes are going to be removed and soaked in DI. If they
are still moist at start up. Install THESE brushes. IF they are
dry put on new brushes. THIS IS A CHANGE FROM JIM'S PASSDOWN, AFTER
HIS PASSDOWN WENT OUT, WE LOCATED SOME DI WATER. Contact JIM
TOOKER if you have any questions on this.
I can be paged at 508 387-1389 if you have questions.
|
| 63.28 | CMP PD | STRATA::TDYER | | Fri Dec 15 1995 17:44 | 35 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 15th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Jim Tooker
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP
WSTK.2 - Monthly PM completed, good turn around by Brad.
CMP.B1 - Up. Vacuum error today. The blow down was set to 3psi, we have
increased this to 15 psi. B2 is at ~20psi, it has the same hardware,
valves, lines, etc as B1 so there should be no reason why B1 can not
handle the additional pressure. This should produce a more thorough
blow down of the vacuum tank. A new vacuum tank popet valve has also
been ordered. When the valve arrives, please schedule time with MFG
to install it and the elevator-2 quick dump valve.
CMP.B2 - Verify. On Sunday Eric B. will run MQC's and the 1st LOT.
|
| 63.29 | CMP PD | STRATA::TDYER | | Mon Dec 18 1995 17:01 | 31 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 18th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Jim Tooker
Matt VanHanehem
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP
WSTK.2 - UP
CMP.B1 - UP.
CMP.B2 - UP. PLEASE RESPOND TO THIS SYSTEM, IT IS NOW RELEASED TO MFG.
....PASSDOWN WASN'T EVEN WORTH KILLING AN ELECTRONINC TREE OVER
|
| 63.30 | CMP PD | STRATA::TDYER | | Wed Dec 20 1995 16:28 | 53 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: December 20th, 1995
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD and some "STANDING ORDERS"
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP
WSTK.2 - UP
CMP.B1 - UP.
CMP.B2 - UP.
Continued from B shift on load gripper finger problem. The source of
the double loading wafers has been attributed to the fingers sticking
closed. B shift installed a pressure gauge inline with the gripper.
The gripper was cycled, the fingers opened slowly and made a squeaking
noise, also pressure was at 40. B1 fingers move fast and the pressure
is at 60. Increased B2 gripper pressure to 60. Fingers move quicker
but still squeaked. Cleaned and olied guild rails. Cycle 50 wafers
with out error. Returned to MFG.
===========================================================================
IN FAB6 PLEASE ADHERE TO THE FOLLOWING PROCEDURES, STANDING ORDERS IF YOU
WILL, UNTIL FURTHER NOTICE.
1) CMP.B1,2 - PRIOR TO EVERY MQC, THE SYSTEMS NEED TO BE CLEANED OF DRIED
SLURRY. ON B2 MAKE SURE THE SLURRY DELIVERY FOUNTAIN IS SCRUBBED AND
THE SIDES OF THE CARRIERS. The current configuration does not scrub the
carriers. Dried slurry causes scratches.
2) CMP.B1 - UNTIL WE FIX THE ULTIMATE ROOT CAUSE OR UPGRADE THE VACUUM
SYSTEM, I WOULD LIKE THE CHECK VALVE, NEEDLE VALVE AND PUMP FILTER
CLEANED PRIOR TO EVERY MQC. (This should happen at least once every
24 hours). I want us to be pro-active hear until we can make a permanent
fix. It will be quicker if the check valve is replaced with a spare
and then the old clean for the next change out.
|
| 63.31 | CMP PD | STRATA::TDYER | | Tue Jan 02 1996 16:13 | 63 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 2nd, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP
WSTK.2 - UP
CMP.B1 - UP.
- The system did not want to cooperate today during MQCs. Head-4
failed to rotate, Tim L. found the connector loose on DCX bd-2.
The conditioner failed to go home. A broker wire was found on the
connector for the "conditioner at home" sensors. Eventually we
ran MQC's. High particles were described as a "streak" by B shift.
We noticed that some of the wafers today after polish had a steak,
a 1" by 3" stripe of THIN oxide. This may be a film quality
issues from the CVD tools. The oxide may be less dense in the
striped area and polished faster. The thinner oxide causes problems
when reading on the Tencor. All MQCs passed.
CMP.B2 - UP.
- Continued with high uniformity. The carriers were removed and checked
by Pro Eng (TJB) on the P2. The curvature was ~ -15u, it should be
closer to -2u. The carriers were replaced, the bad plates marked
as bad. MQC's passed with the new plates.
*** NOTE: IF MQCs FAIL ON THE SPEEDFAMS, TRY ADJUSTING THE OD IN THE RECIPE.
INCREASE THE OD IF THE REMOVAL IS TOO CENTER SLOW, DECREASE IF THE
REMOVAL IS TOO CENTER FAST. ***
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
IN FAB6 PLEASE ADHERE TO THE FOLLOWING PROCEDURES, (STANDING ORDERS IF YOU
WILL) UNTIL FURTHER NOTICE.
1) CMP.B1,B2 - PRIOR TO EVERY MQC, THE SYSTEMS NEED TO BE CLEANED OF DRIED
SLURRY. ON B2 MAKE SURE THE SLURRY DELIVERY FOUNTAIN IS SCRUBBED AND
THE SIDES OF THE CARRIERS. The current configuration does not scrub the
carriers. Dried slurry causes scratches.
2) CMP.B1 - UNTIL WE FIX THE ULTIMATE ROOT CAUSE OR UPGRADE THE VACUUM
SYSTEM, I WOULD LIKE THE CHECK VALVE, NEEDLE VALVE AND PUMP FILTER
CLEANED PRIOR TO EVERY MQC. (This should happen at least once every
24 hours). I want us to be pro-active hear until we can make a permanent
fix. It will be quicker if the check valve is replaced with a spare
and then the old clean for the next change out. (Parts due in 1/21)
|
| 63.32 | CMP PD | STRATA::TDYER | | Thu Jan 04 1996 17:22 | 35 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 4th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP.
WSTK.2 - UP
CMP.B1 - down external.
- Waiting on new (good) carrier plates from Speedfam.
- The infranor re-wire upgrade was completed successfully today and the
Scrubber upgrade is almost complete.
CMP.B2 - Verify, running MQCs, 5 plates arrived today.
- The load gripper failed to open at the load cup. Since the mechanical
movement of the gripper is actualy smooth, the problem may actualy
be the DI not comanding or the soliniod not opening. Please monitor
the DI for LOAD GRIPPER OPEN and the soliniod durring transfers
tonight.
|
| 63.33 | CMP PD | STRATA::TDYER | | Fri Jan 05 1996 16:18 | 35 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 5th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP.
WSTK.2 - UP
CMP.B1 - 5 plates arrived, Brad is building carriers.
CMP.B2 - Vacuum errors today after exiting the MAPPER page. During mapping the
system blows down the vac tank. It than takes approximately 9-11
seconds to regain full (18") of vacuum. The vacuum blow down time may
be too long. This may be set to 10-15seconds. To change blow down time,
in DOS, edit "CDATA", there is a line for blow down time. Also the
vacuum sensor on the tank should be set for ~17" NOT 13".
* 5 plates due in tomorrow, 10 on Monday *
|
| 63.34 | CMP PD | STRATA::TDYER | | Mon Jan 08 1996 12:54 | 36 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 8th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD/PLAN FOR START UP AFTER PLANT CLOSURE
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - Put in wet idle.
WSTK.2 - Put in wet idle.
CMP.B1 - Crashed wafers today while running on 4 heads. Head 3 will NOT
rotate under LOAD conditions. We swapped out the rotation infranor
with B2's head-2 rot. Rotation needs to be test under load (377lbs).
If head-3 fails under load, remove the carrier and let them run with
4 heads. Speedfam will address it when the weather lets them arrive.
CMP.B2 - Continued wafer loss problem. Tried B1's loss pcb in B2, same problem.
Removed DO 30,31,32,33,34 one at a time, a false detect was still
present. This confirms what B shift found, it is a wiring or 24v
problem. The wafer detect is jumpered out and system in wet mode.
Please do not run product with no wafer loss detection with out
contacting me first. I have requested a faxed schematic of the wafer
loss bcp, it may arrive some time today.
|
| 63.35 | CMP PD | STRATA::TDYER | | Tue Jan 09 1996 17:28 | 36 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 8th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP.
WSTK.2 - UP.
CMP.B1 - We replaced ALL the lugs at head-3's infanor connector and it worked
under load. Head-4 also would not work under load today. At the
terminal board on the left side of the multi-head, we swapped the
3 motor phases. We swapped them at this location because access
is best. Originally the phases from top to bottom on the terminal
board was U, V, W (Sine, com, Cosine). They are now wired V, W, U
(com, Cosine, Sine). ALL heads tested OK, MQCs pass and system is
up. I will schedule some time and we will re-label the wires in their
current location.
CMP.B2 - Still NO wafer detection. A split lot will be run tonight for
Pro ENg on this system. Please watch ALL runs closely. Do not run
any other product on this with out Engineering permission.
Speedfam WILL be in tomorrow to adress this problem.
|
| 63.36 | CMP PD | LUDWIG::TDYER | | Wed Jan 10 1996 18:02 | 31 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 10th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP.
WSTK.2 - UP. Monthly completed.
CMP.B1 - Scratches today. Bevels were cut on the ID of the pad and B2's
conditioner installed. Scratches appear to be under control.
CMP.B2 - Wafer detection is fixed. The reps still need to look at the
intermittent load gripper problem and intermittent head-1 not rotating
error. They may or may not address these last two items tonight. After
they leave please turn the system over for FULL mqcs. Thanks.
If B2 mqc's show scratches, the conditioner (from B1) is bad and we
will be forced to rush qual blocky.
|
| 63.37 | CMP PD | LUDWIG::TDYER | | Thu Jan 11 1996 19:40 | 50 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 11th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - Down for part. Needs 24v valve for vac system.
WSTK.2 - UP.
CMP.B1 - Scratches today. Earlier in the day scratches were reviewed under a
scope, they appear to be slurry particles and not scratches. After
several more experiments we reviewed more wafers and found DEFINITE
scratches cut into the oxide.
The following has been eliminated:
1) Loader
2) Scrubber
3) conditioner wheel.
Please follow the following action plan:
* Slurry filter just changed
* keep carriers wet in cart.
1) Calibrate conditioner down force.
2) Clean entire MULTIHEAD, remove covers as required.
3) Clean carriers and conditioner with plastic brush and DI.
4) Install all covers including the TOP cover which has been off
for months.
5) Install pad, carriers and recheck mqcs
CMP.B2 - Wafer detection fixed, lifter to carrier alignment corrected.
Vacuum system upgraded. Back to MFG. Looks like it should be going
up shortly.
|
| 63.38 | CMP PD | LUDWIG::TDYER | | Fri Jan 12 1996 18:00 | 42 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 12th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - Down for part. Needs 24v valve for vac system.
WSTK.2 - UP.
CMP.B1 - Scratches cont.
While a plan was being formulated, the reps completed the VACUUM
system upgrade. Today we calibrated the conditioner down force
77lbs at 100%. Calibrated all carrier down force, cleaned the
conditioner bearings and gave the multi head a high pressure
blow down. Lots of metal and slurry particle "rained" down onto
the table. Particles from the pad sample from last night, were
reviewed under the scope. They appear to be metallic in color and
have the shape of metal shavings. After the system is wiped down
and pad installed, please run normal break-in of all mqc pass
run system. If they fail for scratches, install a BLOCKY
diamond conditioner (there in the yellow cabinet). Replace pad,
break in and recheck. If scratches are Ok with blocky, contact
engineering at home before committing product. If bad again. remove
pad. Extract ~2-3gls of slurry from A1,2 or B2. Plumb up the manual
pump and bucket of slurry to deliver to the Madonna cup. Replace
pad, break in and check with manual slurry system.
CMP.B2 - UP.
|
| 63.39 | CMP PD | LUDWIG::TDYER | | Mon Jan 15 1996 18:44 | 47 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 15th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP.
WSTK.2 - UP.
CMP.B2 - UP.
CMP.B1 - Scratches cont.
The bypass slurry experiment and "no edge" process experiment was
completed today. Also all head's DI was sprayed into a wipe and
particles reviewed under the scope.
We know TWO things for sure at this point; (1), heads 1,3,5 are
blowing rust through the vacuum/blow off line, and (2) scratches
are less if we do not touch the edge of the pad with the wafer.
The contamination (rust) WILL scratch the wafers. This is going
to be addressed 1st. It may be possible that the contamination is
collecting on the outer edge of the pad and thus scratches
increase if we polish in that area.
PLAN: Speedfam is ordering 5 complete sets of parts to rebuild all 5 heads.
This will include new rotary unions, tubing, fittings and gauges.
It is late in the day, the parts may not arrive until Tuesday.
If that is the case, we will have them complete as many OPEN
upgrades as possible on Tuesday.
TONIGHT: Begin disassembly of the multi head: remove all five quick
disconnect fixtures and bellows. Remove the "T", gauges, clear
tubing and lower 2 solenoid valves. Clean quick disconnects.
Please keep all the parts organized in bins or trays.
|
| 63.40 | CMP PD | LUDWIG::TDYER | | Tue Jan 16 1996 18:39 | 53 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 16th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP.
WSTK.2 - UP.
CMP.B2 - Scratches. With standard process scratches were very high 100mm+.
Wafers were polished with out touching the edge of the pad, only
one wafer was scratched ~5mm. The pad was beveled and a standard
MQC was run, lots of scratches. All carriers were removed, totally
dis-assembled and wafer chips and dirt removed. Index table and
polish area cleaned and new carriers built. A standard ID/OD pad with
inside and outside edges beveled was installed. Running normal breakin
at this time, followed by full mqcs.
PLAN: If there are scratches, set the manual condition pressure to 100% and
run 300sec of conditioning. Change the PAD CONDITION recipe for the
IO_MQC recipe to 100% also. Run 10 breakin and recheck MQCs.
If there are still scratches, install the IC1000/GS100 pad (cut to
standard ID/OD, remove burs), run normal breakin and re-test. This
is an old IC 1000 it will rule out a Rodel pad process change or
pad problem.
CMP.B1 - Scratches cont.
All 5 head totally disassembled, head TWO would not come apart, it the
spline shaft was RUSTED inside and rusted to the quick dis-connect.
Speedfam has ordered a new spline shaft. The other heads will be re-
assembled tonight. We do not expect the system to be ready for test
until late Wednesday night.
+ New vacuum tank installed, this completes the vacuum system upgrade.
+ Cassette elevator controllers re-wired today.
*** 10 Speedfam plates due in tomorrow ***
|
| 63.41 | CMP PD | STRATA::TDYER | | Wed Jan 17 1996 17:58 | 48 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 17th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP. Weekly completed
WSTK.2 - UP. Weekly completed
CMP.B2 - Scratches last night. We ran a wafer transfer and noticed that one of
the wafers (while in the carrier) scratch on the top of the load cup.
The heads moved in before the cup was all the way down. The load cup
sensor-3 was replaced. SYSTEM RUNNING WITH 4 HEADS ONLY UNTIL WIP
CLEARS. THE RESOLVER CABLE BETWEEN THE TB AND THE RESOLVER/MOTOR
HAS AN OPEN AT THE BEND NEAR THE BOTTOM OF THE MOTOR.
Plan for tonight:
Run standard MQCs with lift off in the center of the pad. If they
are good, run 12 (4X3) and repeat MQCs. If they are good change ALL
recipes to center lift. If they fail than Install the IC1000/GS100
pad (it's on the xformer). If this fails cut a standard pad to the
following specs: remove 1 inch from the outer Diameter, and cut a
14" ID. Breakin and test.
IF THERE ARE ANY HARDWARE PROBLEMS ON B2, PAGE DARREN, 800-823-6094
CMP.B1 - Four of the five heads are 95% complete. Head-3 is waiting on a new
shaft, due tomorrow. Please see Darren for what he would like done
and NOT done overnight.
*** 10 Speedfam plates due in tomorrow ***
|
| 63.42 | CMP PD | LUDWIG::TDYER | | Fri Jan 19 1996 16:32 | 59 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 19th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
==============================================================================
SUBJECT: B1, B2 WEEKEND PLAN.
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP.
WSTK.2 - UP.
CMP.B2 - Should be up here shortly....
Low slurry flow today and last night. Supply and return valves were
adjusted to increase flow to B2. Once again we are at the limitations
of the parallel loop system. If the flow becomes a problem over the
weekend, replace the filter and purge the two 1/2 supply and
return lines and valves from the box under the floor to the back of
B2. Also today, the delivery tube cracked, it has been welded it
back together and is being instaled at this time.
WHEN B1 COMES UP, THE RESOLVER CABLE BETWEEN THE LEFT SIDE TERMINAL
BLOCK AND THE ROTATION MOTOR, NEEDS TO BE REPLACED.
CMP.B1 - All 5 heads are completely assembled and down force calibrated.
During initialization the loader robot failed. We had no luck
making repairs on-site. Speedfam has hand carried the robot and
controller to ADE in Newton Mass. We hope to get this back no later
than tomorrow. After the robot is up and running the multi-head
needs to be tested. The multi-head needs to cycle wafers with
NO vacuum errors or leaks, no other errors (rotation, etc).
Once the integrity of the multi-hed is verified. Clean the system,
install a standard ID/OD pad and breakin. Perform TWO mqc checks,
one with the standard mqc recipe and one with CENTER lift off
MQC. If there are no scratches on the standard recipe, product
may be run. If there are scratches on the standard and not on the
center lift, change ALL recipes to center lift and release for
production.
DO NOT WET THE CARRIERS ON B1 UNTIL WE ARE READY TO TRANSFER WAFERS, THEY ARE
BRAND NEW, ONCE THEY ARE WET THEY MUST STAY WET.
IF THERE ARE ANY HARDWARE PROBLEMS ON B1,2, PAGE DARREN, 800-823-6094. I CAN
BE REACHED AT HOME.
*** 20 Speedfam scrubber brushes due in tomorrow ***
|
| 63.43 | CMP PD | STRATA::TDYER | | Wed Jan 24 1996 16:39 | 29 |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 24th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - Down for robot. The robot has returned from ADE, the reps are
installing it at this time. They will test the robot with the
PC and software ~1000x.
CMP.B2 - up
|
| 63.44 | CMP PD | STRATA::TDYER | | Thu Jan 25 1996 16:45 | 30 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 25th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - Down for robot AGAIN. Z axis failed today. Speedfam is on their way
back to ADE to pick up another robot. While they are out please take
a look at the squeaking carrier and PULL the robot and controller out.
After the robot is installed cycle 100 wafers though transfer.
CMP.B2 - up
|
| 63.45 | CMP PD | STRATA::TDYER | | Fri Jan 26 1996 17:42 | 34 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 26th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - VERIFY. Needs mqcs. If mqc look horrible, replace ALL the carriers
and the pad. 3rd robot installed, calibrated and aligned today.
The is a spare robot and controller in the chase.
CMP.B2 - VERIFY. Needs mqc. Running on 4 heads until a head-5's load cylinder
arrives tomorrow. Brad, please try to schedule time around noonish to
replace the cylinder.
* I WILL BE OUT MONDAY, SEE JIM TOOKER FOR FAB6 ISSUES AND BOB DEJORDY FOR
FAB4 ISSUES *
|
| 63.46 | CMP PD | STRATA::TDYER | | Tue Jan 30 1996 17:02 | 47 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 30th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - Down, Platen rinse ring is cracked. Ring needs to be poly-welded.
WSTK.2 - up
CMP.B1 - up
CMP.B2 - Down. The index table alignment to the 5 carrier heads is NOT
repeatable. This is causing the wafers to mis-load into the
carriers, at touch down this cause the wafers to slip out and
CRASH. The following components that make up the index table
sub-system have been replaced and tested:
DXC control PCB
Ifranor
Power supply, infranor
A new motor and resolver is on order , due in tomorrow.
- Monitor the index table DCX/Infranor ckt with an O-scoope. Look for
spikes after re-setting DCX (sliding door open than close). Check
at the input to the infranor, out from the infranor, resolver input
to the infranor and power supply input too the infranor.
- While the system is down, if time permits, please complete any PMs
which are due. Also the system could use a good cleaning.
* DO NOT RELEASE CMP.B2 TO MFG WITH THIS CONDITION *
|
| 63.47 | CMP PD | STRATA::TDYER | | Wed Jan 31 1996 18:32 | 35 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: January 31st, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - Down, Platen rinse ring is cracked. Ring needs to be poly-welded.
Westech has not been able to ship this part yet.
WSTK.2 - up
CMP.B1 - up
CMP.B2 - Down. System is not expected to come up anytime soon, maybe sometime
Friday. B2 continues to have index table problems. The cause for the
table jerking is a noise signal 2vpp. We have not been able to
isolate the noise, except for the fact that it can be toggled on and
off with the DCX channel enable for the index table. Tonight:
check all earth grounds, install NEW DCX board, wait for further
instructions from Speedfam Phoenix. I have requested immediate
additional support from Phoenix......waiting.
|
| 63.48 | CMP PD | STRATA::TDYER | | Thu Feb 01 1996 19:24 | 38 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 1st, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - up
CMP.B2 - Down. Isolated index table problem today. The infranor which was
installed during trouble shooting was also bad, so we moved on to
other components. Today we revisited the infranor and determined it
as well as head-4 rotation was bad. Neither infranor was holding
auxiliary power to the servo motors, so when the infranor were re-
activated (closing the doors) the infranor would send a ~60v
spike. We are waiting on two new infranor, due in tomorrow.
Tonight, please clean up the tool, install carriers on heads-1,2,3
and put in wet mode. Tomorrow an Engineer from INFRANOR will be here
to view the problem in person.
|
| 63.49 | CMP PD | STRATA::TDYER | | Wed Feb 07 1996 18:06 | 47 |
|
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 7th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - Down, failed MQCs for unif, two heads are ~11% center fast. Carrier
screws will be re-tightened and MQC will be re-checked. If it fails
for scratches, please replace pad and clean system, dump index table
and clean conditioner ring.
CMP.B2 - Sched_Down for scrubber upgrade, ~2 hours of work remaining.
*** NOTE FOR FAB6 ***
SPEEDFAM CARRIER RETAINING RING BOLTS PLASTIC WASHERS ARE BEING REPLACED WITH
A STEEL FLAT WASHERS AND A STEEL LOCK WASHER. IF ANY CARRIERS ARE REBUILT,
PLEASE USE THIS COMBINATION. ONCE ALL CARRIERS ARE OUTFITTED WITH THE STEEL
WASHERS, I WILL DISPOSE OF THE PLASTIC ONES. FYI, TOQUE WRENCH IS SET TO
5LBS.
DO NOT POWER AND SPEEDFAM UP FOR 2 MINUTES AFTER ANY POWER DOWN OR EMO.
INFRANOR ENGINEERS SUSPECT CAPACITOR DISCHARGE WITH IN THE INFRANOR CAUSING
REDUCED LIFE TIME OF THE INFRANOR AMPLIFIERS.
If the are any Speedfam issues, page Daniel Carter.
|
| 63.50 | CMP PD | STRATA::TDYER | | Thu Feb 08 1996 16:57 | 54 |
|
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 8th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - Down for Scrubber upgrade and to repair the head-1 failure problem.
The scrubber upgrade will have to be put off, most of the time
has been spent on the head-1 problem.
CMP.B2 - Failed MQCs for particles. A new pad has been installed, running
break-in.
** THE TOOLS ARE GENERALLY FILTHY, THE POLISHERS MUST BE SCRUBBED DOWN
PRIOR TO EVERY MQC. IF WE DON'T CLEAN THEM FREQUENTLY, THE FILTH
WILL GET AWAY FROM US AND OUT OF CONTROL **
The carrier film is either expanding upward or the retaining ring is
being pulled downward after several days of sitting idle. Last night
several carriers were found at .009-.012", ALL of these carriers
were verified by several individuals last Friday as being .007 - .008.
We will monitor the situation. If the ring is being compressed
downward due to the spring tension in the lock washer, we will have to
go back NO lock washers and possibly add lock-tite. If the film is
absorbing moisture and expanding, we may be require to put carriers
in a controlled environment or building them on demand. A decision will
be made tomorrow evening.
*** IF ANY WAFERS SLIDE OUT TONIGHT, CHECK EXPOSURE, IF IT IS >.008, REPLACE
ALL THE STEEL WASHERS WITH THE STANDARD PLASTIC WASHERS AND SET HEIGHTS
FOR .007-.0008". ***
DO NOT POWER AND SPEEDFAM UP FOR 2 MINUTES AFTER ANY POWER DOWN OR EMO.
INFRANOR ENGINEERS SUSPECT CAPACITOR DISCHARGE WITH IN THE INFRANOR CAUSING
REDUCED LIFE TIME OF THE INFRANOR AMPLIFIERS.
|
| 63.51 | CMP PD | STRATA::TDYER | | Fri Feb 09 1996 18:47 | 58 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 9th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up, MONTHLY COMPLETED.
WSTK.2 - up
CMP.B1 - Down for head-1 troubleshooting. The system will be returned in the
next hour with FOUR heads. Here's what we found today:
Swapped the motor and resolver cables for head 1 and 5 on the
RIGHT side of tb-13.
* The problem moved to head-5 (head-5 stalled)
We put the wires back to normal on TB13
Swapped mtr-3 cable (head-1 rot) with mtr-12 cable (head-5 rot) and
their respective resolver cables on the LEFT side of the bulk-
head connections under the polish area.
* The problem moved to head-5.
* So, we have a bad cable between the bulk head connector and the
INFRANOR for head-1 rotation. (the infranor was already replaced)
The connector itself could be bad,please inspect. If nothing
obvious is found, put system back together with heads 2-4 ONLINE.
The reps will replace the cable next week.
- At one point both head-5 and head-1 stalled, for this reason I have
also request a flex track motor cable.
CMP.B2 - UP.
********NOTES**********
THERE WAS NO NOTABLE MOVEMENT ON THE CARRIERS BUILT YESTERDAY WITH METAL
AND PLASTIC WASHERS. WE ARE BUILDING UP A SET OF METAL WASHER CARRIERS
AND A SET OF METAL LOCK + PLASTIC WASHER CARRIERS. ONE SET WILL BE INSTALLED
AND EACH SYSTEM AND MONITOR. NOTE, WHEN THE FILM IS WET IT DOES EXPAND AND
THE READINGS WILL BE DIFFERENT THAN WHEN ORIGINALLY DRY.
DO NOT POWER AND SPEEDFAM UP FOR 2 MINUTES AFTER ANY POWER DOWN OR EMO.
INFRANOR ENGINEERS SUSPECT CAPACITOR DISCHARGE WITH IN THE INFRANOR CAUSING
REDUCED LIFE TIME OF THE INFRANOR AMPLIFIERS.
|
| 63.52 | CMP PD | STRATA::TDYER | | Mon Feb 12 1996 16:18 | 33 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 12th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - UP WITH 4 HEADS, waiting on parts and time to repair head-5.
CMP.B2 - Sched_Down. Oscillation calibration completed today, tool cleaned
and new pad and carriers installed. This system will stay Sched
down for the next THREE days for Pro Eng work with Speedfam Reps.
SYSTEM HAS BEEN SITTING IDLE ALL AFTERNOON WAITING FOR WARM UP WAFERS!
|
| 63.53 | CMP PD | STRATA::TDYER | | Tue Feb 13 1996 19:06 | 35 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 13th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - Down, scrubber failed, unit upgraded, upgrade is complete, reps are
calibrating unit. A pot was broken off the Amp pcb, if there are
no scrubber amp pcb in stock, re-solder a new pot onto the board.
CMP.B2 - Sched_Down. Running Eng exp with SF, also load gripper height is
being tweaked in by Doc at this time.
* ALL SPEEDFAM CARRIERS ARE TO BE BUILT WITH A FLAT METAL WASHER AND A
METAL LOCK WASHER *
|
| 63.54 | CMP PD | STRATA::TDYER | | Fri Feb 16 1996 18:02 | 48 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 16th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - sched_Down. After Pro Eng finishes experiments, run MQCs. If scratches
show on wafer, replace the pad. Break in and re-test. If there is
still scratches, replace pad and install STANDARD conditioner,
break in and re-test.
CMP.B2 - Verify. We had TWO types of wafer LOSS today; at touch down, and
at lift off. The lift off problem was due to extreme surface tension
and head-5 had a small vacuum leak. The leak has been fixed and the
recipe lift off speed has been changed to help reduce the surface
tension. The (head-5) TOUCHDOWN problem is a handler issue, possibly
the load cup. Load cup five was placed into slot-1, where it moves
a little smoother, and cup-1 in slot-5. 25 wafers ran without
problems. If a wafer slips out of head-5 or head-1 at TOUCHDOWN
take that head OFFLINE for the weekend. SF will address on Monday when
new loader parts arrive.
* ANY SPEEDFAM PROBLEMS WHICH REQUIRE ASSISTANCE OVER THE WEEKEND,
PAGE TONY AT 800-516-4197
* ALL SPEEDFAM CARRIERS ARE TO BE BUILT WITH A FLAT METAL WASHER AND A
METAL LOCK WASHER *
|
| 63.55 | CMP PD | STRATA::TDYER | | Mon Feb 19 1996 16:27 | 50 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 19th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up
WSTK.2 - up
CMP.B1 - Verify, pad change. Frank and Erik are testing different ID lift-offs.
CMP.B2 - Down. Lost wafer out of head-5 at touch down......loader problem.
Doc, Brenden, Mich, Bob, and Roger please work with the reps and
keep somewhat to this plan:
1) Isolate the cause for mis-loading, fix if possible, if it requires
new inside shaft, leave that head off line until parts arrive
tomorrow.
2) Replace carrier-5 with a 28 hole carrier.
3) Set ALL vacuum sensors higher (~21") test for errors by partially
loading wafers, adjust as required to detect mis-load but not
faults errors.
4) Run ~100-150 wafers on the MQC recipe with a primary polish time of
20 seconds.
If Erik and Frank have success on B1 with lift off, the recipes on B2
will be changed and the 2nd table will be turned back on.
* ANY SPEEDFAM PROBLEMS WHICH REQUIRE ASSISTANCE PAGE TONY AT 800-516-4197
* ALL SPEEDFAM CARRIERS ARE TO BE BUILT WITH A FLAT METAL WASHER AND A
METAL LOCK WASHER *
|
| 63.56 | CMP PD | STRATA::TDYER | | Tue Feb 20 1996 18:28 | 53 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 20th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - PM in progress.
WSTK.2 - up
CMP.B1 - Verify, pad change after scratches. Frank reduced the conditioner DF
to 67%, TABLE SPEED 37, TIME 71S. A segment was added between 3-4
to reduce vibration at table ramp.
* OSCILLATION CHANGES TO B1'S RECIPES SHOULD BE MADE TO SEG 5,6 NOT 4,5.
TIME CHANGES SHOULD BE MADE TO SEG 5.
CMP.B2 - UP - All the inner shafts of the load cups were replaced today. Load
cup-5's outer shaft was machined back into spec. The system has been
released to MFG with out head-5. If MFG can release B2 for 1 minute
and has time to re-check MQCs, install CUP-5. Test for smooth
operation. If any wafers come out a touch down, leave the SYSTEM
down, 5 COMPLETE NEW load cups are due in tomorrow. Frank reduced
the conditioner DF to 67%, TABLE SPEED 37, TIME 71S.
* OSCILLATION CHANGES TO B2'S RECIPES SHOULD BE MADE TO SEG 4,5.
TIME CHANGES SHOULD BE MADE TO SEG 4.
* PLEASE KEEP AN EYE ON LIFT-OFF, IF ANY WAFERS DROP, PLEASE NOTE WHICH
TYPE OF WAFERS THEY ARE, IE BARE SILICON, OXIDE, PRODUCT?
* ANY SPEEDFAM PROBLEMS WHICH REQUIRE REP ASSISTANCE PAGE TONY AT
800-516-4197
* ALL SPEEDFAM CARRIERS ARE TO BE BUILT WITH A FLAT METAL WASHER AND A
METAL LOCK WASHER *
|
| 63.57 | CMP PD | STRATA::TDYER | | Wed Feb 21 1996 16:26 | 53 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 20th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up.
WSTK.2 - up
CMP.B1 - Verify. Frank was able to eliminate scratches and reduce particles by
doing CENTER lift off with SLURRY on.
CMP.B2 - DOWN. Load flipper box has been repair. All LOAD and UNLOAD cups have
been replaced with new. Index table honed to match GO/NOGO gauges.
TONIGHT:
1) Install new cup locking pins
2) Set ALL cup to carrier head heights
3) Align ALL head to CUPS with fixtures
4) Align gripper to load/unload cups
5) Cycle 50 wafers through NO_TOUCH
6) Cycle 100 wafers through QUIK_TCH
If NO wafers slip out or crash, the system can be released to MFG.
ALL 5 heads should be enabled and the 2nd table.
* PLEASE KEEP AN EYE ON LIFT-OFF, IF ANY WAFERS DROP, PLEASE NOTE WHICH
TYPE OF WAFERS THEY ARE, IE BARE SILICON, OXIDE, PRODUCT?
* ANY SPEEDFAM PROBLEMS WHICH REQUIRE REP ASSISTANCE PAGE TONY AT
800-516-4197
* ALL SPEEDFAM CARRIERS ARE TO BE BUILT WITH A FLAT METAL WASHER AND A
METAL LOCK WASHER *
5 SF plates arrived today and 50 2nd table pads.
|
| 63.58 | EEG | NETRIX::"[email protected]" | Tim | Mon Feb 26 1996 15:01 | 2 |
| This is a www entry test.
[Posted by WWW Notes gateway]
|
| 63.59 | t2 | NETRIX::"netrix::"@t.tdyer.hlo.dec.com" | td | Mon Feb 26 1996 16:04 | 2 |
| t2 www
[Posted by WWW Notes gateway]
|
| 63.60 | CMP PD | STRATA::TDYER | | Tue Feb 27 1996 17:01 | 48 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 27th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up.
WSTK.2 - up
CMP.B1 - up. The mapper failed, boards re-seated and now it is working
again. This is the second time in 3 weeks which the mapper unit has
failed and has mysteriously gone away. A request to SF for a new
mapper controller has been made, purchasing is addressing.
- Should the mapper fail tonight, page SF, manually map the wafers
until the new controller arrives.
- MQCs will be conducted with the edge lift at 125, if they pass all
recipes need to be modified.
CMP.B2 - UP. The flipper to load cup alignment was adjusted today. The alignment
is still not prefect, a compromise between opposite load cups was
settled on Speedfam needs to address LONG-TERM.
- EDGE LIFT is back on...... The high speed high flow water process was
modified to lift off at 125, no scratches present.
- Running with pre-cut pad.
* ANY SPEEDFAM PROBLEMS WHICH REQUIRE REP ASSISTANCE PAGE TONY AT
800-516-4197
* 10 SF plates due in tomorrow and 5 due in on Thursday.
* 10 bad plates need to be shipped back to SF tomorrow.
|
| 63.61 | CMP PD | STRATA::TDYER | | Thu Feb 29 1996 16:42 | 45 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: February 28th, 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up.
WSTK.2 - up
CMP.B1 - Verify. Old mapper re-installed with NEW cables. Should the mapper
fail, go into the MANUAL mode and continue running. We will address
with SF in the morning. Slurry pump-1 was replaced today. Should the
system loose slurry during processing with no explanation, page SF,
replace the supply V70,71 (there is one in the SF cabinet).
- Both slurry channels were calibrated today for 500ml with a 500ml
set point.
CMP.B2 - UP.
Please do not discard carriers if the polish rate uniformity
is CENTER fast, adjust the ID/OD and re-test. Center fast is indicated
by +++++ in the center of the one dimensional map or a hump upward
in the center on the 3d map. See Pro Eng for more details regarding
this issue.
* ANY SPEEDFAM PROBLEMS WHICH REQUIRE REP ASSISTANCE PAGE TONY AT
800-516-4197
leap day!~$!~$!%
|
| 63.62 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Mar 09 1996 15:31 | 38 |
| CMP Equipment Engeering Passdown for:
9-MAR-1996 15:26:16.66
CMP Down Equipment listing for Fab6
====================================
CMP.A2 REPAIR
CMP.B1 UNSCHED_DOWN
--------------------------------------------------------------------------------
DOWN EQUIPMENT:
--------------------------------------------------------------------------------
HIGHLIGHTS:
TEST MESSAGE
_______________________________________________________________________________
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 D W RR 3/6/96 107.359
CMP.A2
CMP.B1 A W BD 3/3/96 116.170
CMP.B2
CMP.B3 C M MT 3/8/96 108.275
CMP_SCRUB.A1 A BW EG 3/5/96 113.81
CMP_SCRUB.A2 C M KF 3/8/96 106.353
|
| 63.63 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Mar 09 1996 15:33 | 38 |
| CMP Equipment Engeering Passdown for:
9-MAR-1996 15:26:16.66
CMP Down Equipment listing for Fab6
====================================
CMP.A2 REPAIR
CMP.B1 UNSCHED_DOWN
--------------------------------------------------------------------------------
DOWN EQUIPMENT:
--------------------------------------------------------------------------------
HIGHLIGHTS:
TEST MESSAGE
_______________________________________________________________________________
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 D W RR 3/6/96 107.359
CMP.A2
CMP.B1 A W BD 3/3/96 116.170
CMP.B2
CMP.B3 C M MT 3/8/96 108.275
CMP_SCRUB.A1 A BW EG 3/5/96 113.81
CMP_SCRUB.A2 C M KF 3/8/96 106.353
|
| 63.64 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Mar 09 1996 19:40 | 36 |
| CMP Equipment Engeering Passdown for:
9-MAR-1996 19:34:34.31
CMP Down Equipment listing for Fab6
====================================
CMP.A2 REPAIR
--------------------------------------------------------------------------------
DOWN EQUIPMENT:
CMP.B1 - Tool went down for low removal rates. The pad was replaced and
process area was cleaned up by production. While getting ready
to run the breakins we received a carrier #4 rotation error. No
breakers were tripped but the infranor was reading motor over temp
error. Reset the system and the carrier ran without any further
errors. Currently running MQCs.
_______________________________________________________________________________
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 B W RG 3/3/96 6.23
CMP.A2 D M BJ 3/7/96 8.21
CMP.B1 D W BJ 3/5/96 18.25
CMP.B2 A W TL 3/4/96 20.16
CMP.B3
CMP_SCRUB.A1 D W BJ 3/4/96 37.23
CMP_SCRUB.A2 D W BJ 3/6/96 39.21
================================================================================
|
| 63.65 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Thu Mar 14 1996 19:36 | 45 |
| CMP Equipment Engeering Passdown for:
14-MAR-1996 19:30:22.24
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
--------------------------------------------------------------------------------
DOWN EQUIPMENT:
CMP.A1 - Down for broken wafers on the polish table. Could not determine any
definite cause. Pulled the pad and cleaned up the process area. The
carriers were replaced and the conditioning disc was checked and
cleaned.
Carriers assembled and ready for use:
Speedfam:
12 carriers ready,
8 new plates in the room,
8 used plates packed and ready for shipment,
1 Speedfam link up assembly packed and ready to be shiped for repair.
2 secondary housings cleaned and ready for assembly.
_______________________________________________________________________________
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 B W RG 3/11/96 6.24
CMP.A2 B W RG 3/10/96 8.22
CMP.B1 B W PR 3/13/96 18.26
CMP.B2 SA
CMP.B3
CMP_SCRUB.A1 D W BJ 3/11/96 37.24
CMP_SCRUB.A2 D SA BJ 3/14/96 39.22
================================================================================
|
| 63.66 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Fri Mar 15 1996 19:48 | 69 |
| CMP Equipment Engeering Passdown for:
15-MAR-1996 19:39:29.77
CMP Down Equipment listing for Fab6
====================================
CMP.A1 PART
CMP.A2 REPAIR
--------------------------------------------------------------------------------
DOWN EQUIPMENT:
CMP.A1 - Tool is down for robot pickup/handling problems. The robot vacuum
switch was recalibrated and the handling problems disappeared for
a few hours only to reappear later in the shift.
Strasbaugh was contacted and they suspect we have a vacuum leak
somewhere between sol #44 and the robot end effector. Trace hose
# 94 for leaks.
NOTE: A new slurry filter was installed on the tool today.
CMP.A2 - Down for breaking wafers during polish. Originally Suspected poor
slurry flow to be the problem. The filter was checked and it was
heavily clogged with slurry. The filter was Changed out with a new
one that was sent in FEDEX. The polish area was cleaned and pad and
carriers were changed by production. The problem reoccurred while ops
was tring to run there breakins. Pulled the pad and cleaned up the
mess. Checked the carriers for any obvious defects, none were found.
O-rings between the spindle and carrier. The same seemed good. Ran
out of time. The tool presently sets with 2 new carriers and no pad
on the table.
CMP.B1 - Down for breaking a wafer from carrier #3 in segment 5. Suspect that
the problem was caused by a dip in slurry flow due to the operator
reports of a loud vibration previous to the crash. The slurry filter
was checked and looked good but was replaced as requested by engineer-
ing. The slurry flow for both pumps was out by about 100ml/min. The
same was corrected. The process area was cleaned up, pad replaced w/
a prestamped. The index table was drained and wiped out. Only
carrier #3 needed to be changed out. Gave the tool back to
production.
CMP.B2 - The tool had a problem with scratches on wafers from head #1. The
load/unload cups were wiped out and the index table drained, the
carrier inspected and the final polish pad was changed out to adress
this problem. Still had what appeared to be scratches but process
found it to be dried slurry. Tool was allowed to run.
_______________________________________________________________________________
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 B W RG 3/11/96 6.24
CMP.A2 B W RG 3/10/96 8.22
CMP.B1 B W PR 3/13/96 18.26
CMP.B2 SA
CMP.B3
CMP_SCRUB.A1 D W BJ 3/11/96 37.24
CMP_SCRUB.A2 D SA BJ 3/14/96 39.22
================================================================================
|
| 63.67 | CMP PD | STRATA::TDYER | | Tue Mar 19 1996 16:41 | 36 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: March, 19th 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up.
WSTK.2 - up
CMP.B1 - Up with warning, 4 heads. The reps spent some time today
trouble shooting both problems. The mapper problem was not
identified. It has been put back on line, keep an eye on it. The
reps have ordered diagnostic software for the pc. They will directly
connect the PC to the mapper and trouble shoot the problem. The
head-4 rotation problem is believed to be the resolver cable inside
multi-head. Head-4 will stay off line until the new cable arrives.
CMP.B2 - UP.
|
| 63.68 | CMP PD | STRATA::TDYER | | Wed Mar 20 1996 18:10 | 32 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: March, 20th 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up.
WSTK.2 - up
CMP.B1 - up, on 4 heads and manual mapper. PLEASE MANUALLY DUMP THE VACUUM TANK
EVERY 50 WAFERS.
CMP.B2 - DOWN. Wafer crash, after vibration. Looks like another SLURRY flow
problem. Please check the B2 loop frequently for proper flow.
|
| 63.69 | CMP PD | STRATA::TDYER | | Thu Mar 21 1996 16:46 | 32 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: March, 21st 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
cc: Frank Krupa
Larry Camilletti
Eric Bodensieck
Dennis Goodwin
==============================================================================
SUBJECT: CMP PD
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - up.
WSTK.2 - up
CMP.B1 - Down, reps working on head-4 and mapper problem. If mapper does not
come up, continue with manual vacuum tank dump.
CMP.B2 - UP. John and or Reps, check exit track-2, several wafers mis-loaded
into cassette two today.
|
| 63.70 | CMP PD | STRATA::TDYER | | Fri Mar 22 1996 09:02 | 27 |
|
+---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: March, 22nd 1996
From: Timothy P. Dyer
Dept: Engineering
Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: SPEEDFAM PAGER
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
The ONSITE Speedfam reps have a Digital INHOUSE pager. Please page them
in the event of a down Speedfam polisher in addition contact our technicians
if they are not in the room.
The Speedfam pager is 361.
After hours, if there are problems which require rep assistance, page them
long range.
3/18-4/1 Ian Lowbridge 1-800-514-0541
|
| 63.71 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Thu Mar 28 1996 19:48 | 85 |
| CMP Equipment Engeering Passdown for:
28-MAR-1996 19:40:21.22
CMP Down Equipment listing for Fab6
====================================
CMP-SCRUB. EXTERNAL
CMP-SCRUB. EXTERNAL
CMP.A1 EXTERNAL
CMP.A2 EXTERNAL
CMP.B1 EXTERNAL
CMP.B2 EXTERNAL
--------------------------------------------------------------------------------
DOWN EQUIPMENT:
*General note
The following CMP room modifications have been completed. The CMP systems
are officially released to MFG at 9:00pm tonight. Prior to 9:00pm, the
pads, carriers and scrub brushes can be installed and break/test wafers
run. DO NOT RUN ANY PRODUCT PRIOR TO 9:00PM.
system purpose task/results
DI Increased pressure t- Remove fixed udr orifices and tie to
larger DI supply header.
r- increased pressure and flow at all
systems. Pressure at the scrubbers
is 43psi. Polishers are at 41psi.
SLURRY Increased flow t- Re-route piping to series loop
reduce clogs t- Remove local filters
reduce pulsation t- Install pulsation dampner
r- Increased flow, reduced pulsation.
?- Connection to CMP.B3 still needs to
be evaluated 4/5/96.
GCW prevent back ups t- Replace 2" drain line with 3" line
r- Improved flow.
PCW tie in for CMP.B3 Done
-Tim D.
CMP.B1 - The resolver cables to all the carrier rotation motors were swapped
with a more durable type of cable. The system was checked out by
SF by exercising the carriers w/ the ROTGO command. The tool
presently sets needing consumables, brushes, breakins and MQCs.
CMP.B2 - The resolver cables to all the carrier rotation motors were swapped
with a more durable type of cable. Circuit breaker # 10 was upgraded
from a .5 amp to a 1 amp breaker. The chiller was hooked up for
interface with the tool. The resolver cables were checked out by
SF by exercising the carriers w/ the ROTGO command. The chiller still
needs to be calibrated by SF. The tool presently sets needing
consumables, breakins and MQCs.
CMP.A1 - The tool needs the consumables replaced and the breakins and MQCs
performed.
CMP.A2 - The tool needs the consumables replaced and the breakins and MQCs
performed.
________________________________________________________________________________
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1
CMP.A2
CMP.B1
CMP.B2
CMP.B3
CMP_SCRUB.A1
CMP_SCRUB.A2
================================================================================
|
| 63.72 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Fri Mar 29 1996 19:47 | 49 |
| CMP Equipment Engeering Passdown for:
29-MAR-1996 19:40:24.99
CMP Down Equipment listing for Fab6
====================================
CMP.B1 UNSCHED_DOWN
--------------------------------------------------------------------------------
DOWN EQUIPMENT:
CMP.B1 - Down for Carrier rotation errors. Both carriers #1 & #5 recieved the
errors but carrier #1 was still turning. Checked to insure that all
of the cables to the DCX board & the wires to the infranors were in
place. The problem still occured. The down force and slurry flows
were checked. The same were good. The pad was changed and motor 5
was swapped out with another motor, still had the problem. The mother
DCX board was then swapped out. Sill got the carrier rotation errors.
The reps are presently swapping the infranor.
Cmp.B2 - Has a warning for elevator #2 wafer handling problems that will be
addressed when we can get the tool.
SCRUB.A1 -
The Inside Brush Station Shaft/Arm Assembly has been removed
from WL-Scrub.A1 in the Wet Lab and installed into CMP-Scrub.A1
in CMP. CMP-Scrub.A1 is currently running verification wafers.
We will WUP the system after another sucessful run of 25 wafers.
This latest run will be completed at 7:25 p.m.
________________________________________________________________________________
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1
CMP.A2
CMP.B1
CMP.B2
CMP.B3
CMP_SCRUB.A1
CMP_SCRUB.A2
================================================================================
|
| 63.73 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Mar 30 1996 19:42 | 67 |
| CMP Equipment Engeering Passdown for:
30-MAR-1996 19:38:32.88
CMP Down Equipment listing for Fab6
====================================
CMP-SCRUB. REPAIR
================================================================================
DOWN EQUIPMENT:
CMP.B1 - The tool was put up with an assist in reference to a moisture sensor
alarm. Found The drip pan under the unload station with water in it.
The leak was coming from where the fitting on the quick dump drain
screws into the main drain. This was caused by a tie wrap anchor
coming loose allowing the tubing to fall into the path of the
elevators' travel. The QD drain & cascade drain tubing were securly
tie wrapped out of the way and the pan and sensor were cleaned up.
CMP.B1 -
IT NOW APPEARS THAT DUE TO THE MANY ARM 3 ROTATION ERRORS THAT THE
INFRANOR WE REPLACED WAS ALSO BAD. I REPLACED ARM 3 ROTATION INFRANOR
(WHICH WAS ORIGINALLY ARM 5'S) WITH A KNOWN BRAND NEW ONE.
RAN 25 WAFERS ALL O.K. NOW EARL IS RUNNING MQC'S
IAN LOWBRIDGE(SPEEDFAM)
CMP.B2 -
TOOK A LOOK AT CROSS-SLOTTING PROBLEM ON ELEVATOR 2 AND FOUND 2
PROBLEMS.
1. C CLAMP THAT HOLDS THE FIBRE OPTIC CABLES IN PLACE, WHICH IS
LOCATED TO THE REAR OF THE FLOAT SWITCHES WAS CAUSING THE FLOAT TO
STICK DOWN. THIS MADE THE QUICK FILL SWITCH ON AND CHANGE THE WATER
LEVEL IN THE ELEVATOR, SO CAUSING CROSS SLOTTING.
I ROTATED THE CLAMP ON BOTH ELEVATORS 180 DEGREES SO THAT CABLES WERE
ROUTED FURTHUR AWAY FROM FLOAT.
2. THE CASSETTE PRESENT SWITCHES WERE LOOSE AND WERE ALLOWING THE
CASSETTES TO MOVE ON THE EVEVATOR DUE TO THEIR LOOSE FIT. THIS WAS
CAUSING MINOR ERRORS WITH SOFTWARE THINKING THE CASSETTE WASN'T PRESENT
BECAUSE THE SWITCHES WERE NOT ALWAYS BEING MADE.
READJUSTED THE SENSOR CLAMPS NEARER TO CASSETTE TO ENSURE POSITIVE
SWITCH ACTION AND MAKE CASSETTE A TIGHTER FIT ON BOTH ELEVATORS
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 B WEEKLY RP 03/27/96 6.26
CMP.A2 B WEEKLY RP 03/24/96 8.24
CMP.B1 D WEEKLY BJ 03/25/96 18.28
CMP.B2 A WEEKLY BF 03/24/96 20.20
CMP.B3
CMP_SCRUB.A1 B WEEKLY RP 03/24/96 37.26
CMP_SCRUB.A2 B WEEKLY RP 03/24/96 39.26
================================================================================
|
| 63.74 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Wed Apr 03 1996 20:38 | 42 |
| CMP Equipment Engeering Passdown for:
3-APR-1996 19:32:11.41
CMP Down Equipment listing for Fab6
====================================
CMP.A1 UNSCHED_DOWN
CMP.A2 UNSCHED_DOWN
================================================================================
DOWN EQUIPMENT:
CMP.A1 - Down for losing wafers from the right carrier. The tool twice lost
wafers from the right carrier. While inspecting the carrier strings
of what appeared to be film debris was left on the pad. Decided to
start from scratch by changing out both carriers, conditioner disc and
the pad. The tool now failed MQCs for a center slow uniformity.
CMP.A2 - Down for failing MQCs for poor uniformity. Changed the pad and had
the same problem. I believe the pads to be the culprit because CMP.A2
has the same problem and they both had the same lot# pad on. The
suspected bad lot# is 6CU-JP1. The tool presently sets with a new pad
installed (6CB-JQ1) needing MQCs to verify a fix.
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 B WEEKLY RG 04/02/96 6.27
CMP.A2 B WEEKLY BF 03/31/96 8.25
CMP.B1 D MONTHLY TL 04/02/96 18.29
CMP.B2 A WEEKLY BJ INCOMPLETE 20.22
CMP.B3
CMP_SCRUB.A1 B WEEKLY TL 04/02/96 37.27
CMP_SCRUB.A2 B WEEKLY RP 04/02/96 39.27
================================================================================
|
| 63.75 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Thu Apr 04 1996 20:39 | 32 |
| CMP Equipment Engeering Passdown for:
4-APR-1996 19:32:27.09
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
CMP.A1 - Down for breaking wafers on the polish table. Broke wafers while
Process Engineering was performing experiments. Cleaned up the mess
and replaced the pad. The tool is back to production.
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 B WEEKLY RG 04/02/96 6.27
CMP.A2 B WEEKLY BF 03/31/96 8.25
CMP.B1 D MONTHLY TL 04/02/96 18.29
CMP.B2 A WEEKLY BJ 04/04/96 20.22
CMP.B3
CMP_SCRUB.A1 B WEEKLY TL 04/02/96 37.27
CMP_SCRUB.A2 B WEEKLY RP 04/02/96 39.27
CMP_SCRUB.A2
================================================================================
|
| 63.76 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Fri Apr 05 1996 20:36 | 31 |
| CMP Equipment Engeering Passdown for:
5-APR-1996 19:31:22.97
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
NO ISSUES
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 B WEEKLY RG 04/02/96 6.27
CMP.A2 B WEEKLY BF 03/31/96 8.25
CMP.B1 D MONTHLY TL 04/02/96 18.29
CMP.B2 A WEEKLY BJ 04/04/96 20.22
CMP.B3
CMP_SCRUB.A1 B WEEKLY TL 04/02/96 37.27
CMP_SCRUB.A2 B WEEKLY RP 04/02/96 39.27
CMP_SCRUB.A2
================================================================================
|
| 63.77 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Apr 06 1996 20:38 | 45 |
| CMP Equipment Engeering Passdown for:
6-APR-1996 19:31:58.18
CMP Down Equipment listing for Fab6
====================================
CMP.A1 UNSCHED_DOWN
CMP.B2 REPAIR
================================================================================
DOWN EQUIPMENT:
CMP.B2 - Down for no wafers on carriers and DI leaking from the unload station.
Tool was down from this morning for DI leaking from the unload
station. The previous shift had siliconed the leak and asked for us
to verify the fix. Found it to still be leaking from the new silicone
weld. Stopped working on this issue because Production asked for the
tool. When the wafers were picked from the index station a "wafer
missing from carriers 1,2,3,4,5" error was recieved. Vacuum could be
felt on the wafer. Checked the vacuum and it was pulling 22 inches in
the pnuematics cabinet and 18 the multihead. The wafers seemed to be
loaded ok but the alignments were Checked anyway. The alignments
looked good but a small adjustment was made carriers #3 (15 out) and
#5 (20 out). Ran 5 more wafers and recieved the same alarm. Ran out
of time.
CMP.A1 - Needs a pad change.
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 B WEEKLY RG 04/02/96 6.27
CMP.A2 B WEEKLY BF 03/31/96 8.25
CMP.B1 D MONTHLY TL 04/02/96 18.29
CMP.B2 A WEEKLY BJ 04/04/96 20.22
CMP.B3
CMP_SCRUB.A1 B WEEKLY TL 04/02/96 37.27
CMP_SCRUB.A2 B WEEKLY RP 04/02/96 39.27
CMP_SCRUB.A2
================================================================================
|
| 63.78 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Thu Apr 11 1996 20:37 | 42 |
| CMP Equipment Engeering Passdown for:
11-APR-1996 19:31:51.76
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
CMP.A2 - Slipping wafers. Changed the pad and ran Barry's modified breakin
method. where 200 lbs. of down force was applied for 4 wafers than
250, 260, 270, 280, 290 300, 313. This was done because the fly outs
were thought to be caused by the pad not breaking in. Process also
extended the rate of ramp to help aliminate friction on the pad.
CMP.B2 - Down for scratches. Cleaned conditioners and process area but did not
pull pads as requested by process. Also drained and pulled the load
cups and wiped out the index table and unload tracks. The scrubber
brushes were checked and rinsed. Tool is presently getting MQCs
.
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 D WEEKLY BJ 04/08/96 6.28
CMP.A2 B MONTHLY RP 04/10/96 8.26
CMP.B1 D WEEKLY BJ 04/10/96 18.30
CMP.B2 D WEEKLY BJ 04/10/96 20.23
CMP.B3
CMP_SCRUB.A1 D WEEKLY BJ 04/08/96 37.28
CMP_SCRUB.A2 B WEEKLY RP 04/08/96 39.26
CMP_SCRUB.A2
================================================================================
|
| 63.79 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Fri Apr 12 1996 20:22 | 34 |
| CMP Equipment Engeering Passdown for:
12-APR-1996 19:15:39.86
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
NO ISSUES
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 D WEEKLY BJ 04/08/96 6.28
CMP.A2 B MONTHLY RP 04/10/96 8.26
CMP.B1 D WEEKLY BJ 04/10/96 18.30
CMP.B2 D WEEKLY BJ 04/10/96 20.23
CMP.B3
CMP_SCRUB.A1 D WEEKLY BJ 04/08/96 37.28
CMP_SCRUB.A2 B WEEKLY RP 04/08/96 39.26
CMP_SCRUB.A2
================================================================================
|
| 63.80 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Wed Apr 17 1996 20:49 | 37 |
| CMP Equipment Engeering Passdown for:
17-APR-1996 19:43:30.20
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
The software on CMP.B2 has been upgraded from 492 to 493c. This version
should have corrected several bugs of 492. Should you discovery more bugs
please fill out a SOFTWARE BUG FORM from CMP note #32 and post in note 32.
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 A WEEKLY BF 04/16/96 6.29
CMP.A2 B WEEKLY BF 04/14/96 8.27
CMP.B1 D WEEKLY LS 04/17/96 18.31
CMP.B2 D MONTHLY INCOMPLETE
CMP.B3
CMP_SCRUB.A1
CMP_SCRUB.A2 D WEEKLY LS 04/16/96 39.27
================================================================================
|
| 63.81 | CMP PD | STRATA::TDYER | | Thu Apr 18 1996 18:01 | 23 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: April 17th 1996
From: Timothy P. Dyer
Dept: Engineering
cc: Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
Scrub.a2 - New upper arm will be in tomorrow.
CMP.B2 - Software has been reverted back to 492, the 493 software had a delay
in the handler routine, SF to address.
- The monthly PM will be pushed out to next week, perform a weekly in
place.
|
| 63.82 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Thu Apr 18 1996 20:37 | 38 |
| CMP Equipment Engeering Passdown for:
18-APR-1996 19:31:50.11
CMP Down Equipment listing for Fab6
====================================
CMP-SCRUB. PM
================================================================================
DOWN EQUIPMENT:
Scrub.a2 - New upper arm will be in tomorrow.
CMP.B2 - Software has been reverted back to 492, the 493 software had a delay
in the handler routine, SF to address.
- The monthly PM will be pushed out to next week, perform a weekly in
place.
TD
PM SCHEDULE FOR WW36
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 A WEEKLY BF 04/16/96 6.29
CMP.A2 B WEEKLY BF 04/14/96 8.27
CMP.B1 D WEEKLY LS 04/17/96 18.31
CMP.B2 D MONTHLY INCOMPLETE
CMP.B3
CMP_SCRUB.A1 C WEEKLY BW/JS 04/18/96 37.29
CMP_SCRUB.A2 D WEEKLY LS 04/16/96 39.27
================================================================================
|
| 63.83 | CMP PD | STRATA::TDYER | | Fri Apr 19 1996 09:37 | 28 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: April 19th 1996
From: Timothy P. Dyer
Dept: Engineering
cc: Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: FAB6 CMP PM CHECK SHEETS
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
Please pull blank CMP.B PM check sheets from note 16 for ALL CMPB tools.
These are the ONLY approved current rev check sheets.
Also, I have added a note (#45) for in-complete PMs. IF you have started a
PM and have not finished by shifts end, post your partially complete check
sheet in note 45. The relieving shift will pull your sheet from note 45,
complete the PM and post under the tool specific note.
These procedures are ISO9000 correct, we have used them for the past 3 years
in FAB4, they work well and keep us in compliance.
|
| 63.84 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Fri Apr 19 1996 20:46 | 38 |
| CMP Equipment Engeering Passdown for:
19-APR-1996 19:40:04.64
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
CMP.B2 - Down for wafers not found on carriers 1-5. There was 26 inches of
mercury at the main vacuum and 24 at the carriers. The digital inputs
were checked and vacuum was being detected at all of the switches.
The vacuum switches at the carriers were detecting vacuum at 22 inch.
The pump could not draw the vacuum down that far before the system
sampled for vacuum. This was giving the error. All of the switches
for each carrier were adjusted to sense at 20 inches of mercury. The
tool was returned to production with no further problems.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 A WEEKLY BF 04/16/96 6.29
CMP.A2 B WEEKLY BF 04/14/96 8.27
CMP.B1 D WEEKLY LS 04/17/96 18.31
CMP.B2 D WEEKLY LS 04/19/96 20.24
CMP.B3
CMP_SCRUB.A1 C WEEKLY BW/JS 04/18/96 37.29
CMP_SCRUB.A2 D WEEKLY LS 04/16/96 39.27
================================================================================
|
| 63.85 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Apr 20 1996 20:39 | 36 |
| CMP Equipment Engeering Passdown for:
20-APR-1996 19:33:50.56
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
NO ISSUES
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 A WEEKLY BF 04/16/96 6.29
CMP.A2 B WEEKLY BF 04/14/96 8.27
CMP.B1 D WEEKLY LS 04/17/96 18.31
CMP.B2 D WEEKLY LS 04/19/96 20.24
CMP.B3
CMP_SCRUB.A1 C WEEKLY BW/JS 04/18/96 37.29
CMP_SCRUB.A2 D WEEKLY LS 04/16/96 39.27
================================================================================
|
| 63.86 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Thu Apr 25 1996 21:11 | 42 |
| CMP Equipment Engeering Passdown for:
25-APR-1996 20:05:24.30
CMP Down Equipment listing for Fab6
====================================
CMP.A1 VERIFY-U
CMP.B1 UNSCHED_DOWN
================================================================================
DOWN EQUIPMENT:
CMP.B1 - Down for slipping wafers from the previous shift. Pad was changed and
the tool was cleaned up. The alignments were checked and the index
table and all carriers were adjusted. The tool slipped another wafer
at lift of but no wafers were broke. The reps. suspected that there
was a problem w/ the pads, so they tried breaking the pad in using a
modified conditioning recipe. Fifty wafers were run and It seemed to
have worked. While running MQCs 2 wafers came out of heads 1&5.
inverter errors were recieved and the screen locked up all at once.
The tool presently sets rebooted with all wafers off the system in wet
idle.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 MONTHLY
CMP.A2 A WEEKLY BF 04/22/96
CMP.B1 D WEEKLY TL 04/24/96 18.32
CMP.B2 WEEKLY
CMP.B3
CMP_SCRUB.A1 D WEEKLY LS 04/24/96 37.30
CMP_SCRUB.A2 D WEEKLY LS 04/24/96 39.28
================================================================================
|
| 63.87 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Wed May 01 1996 20:46 | 44 |
| CMP Equipment Engeering Passdown for:
1-MAY-1996 19:40:05.61
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
CMP.A1 - Down for a leaking slurry line on pump #1 and a DI water leaking from
the spray nozzle. Replaced the slurry line and repaired the DI
nozzle.
CMP.B3 - FYI. Process chilled water and DI are turned on.
CMP.B1 - Tool had scratches earlier today on the wafer that was in head #5.
The primary polish area was cleaned up the index table was drained and
wiped out. The load/unload cups were checked for contamination, none
found. The water tracks were also cleaned out. The MQCs were
rechecked and the particle problem got worse the tool was given
another quick wiped down but there is no time for process to recheck
the MQCs. Tim asked that if the tool fails again that the pad be
changed.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 A WEEKLY TL 04/28/96 6.31
CMP.A2 A WEEKLY TL 04/30/96 8.29
CMP.B1 D MONTHLY BJ 05/01/96 18.33
CMP.B2 WEEKLY
CMP_SCRUB.A1 B WEEKLY RP 04/29/96 37.31
CMP_SCRUB.A2 D WEEKLY BJ 04/30/96 39.29
================================================================================
|
| 63.88 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Thu May 02 1996 20:53 | 32 |
| CMP Equipment Engeering Passdown for:
2-MAY-1996 19:46:07.42
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
CMP.B1 - Down for scratches. The problem was evaluated by engineering and it
was determined that the scratches were actually slurry residue .
Process engineering decided to return the tool to production.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 A WEEKLY TL 04/28/96 6.31
CMP.A2 A WEEKLY TL 04/30/96 8.29
CMP.B1 D MONTHLY BJ 05/01/96 18.33
CMP.B2 WEEKLY
CMP_SCRUB.A1 B WEEKLY RP 04/29/96 37.31
CMP_SCRUB.A2 D WEEKLY BJ 04/30/96 39.29
================================================================================
|
| 63.89 | CMP PD | STRATA::TDYER | | Fri May 03 1996 17:47 | 64 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: May 3rd 1996
From: Timothy P. Dyer
Dept: Engineering
cc: Dennis Goodwin Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN WHILE I'M OUT.
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
*** DO NOT TOUCH ANY OF THE MAIN SLURRY VALVES UNDER THE FLOOR WITH OUT
CONTACTING MYSELF OR ASHALN CHEM. THE BACK PRESSURE HAS BEEN SET UP TO
MEET CMP.B3'S NEEDS. WE ARE ON THE EDGE OF STALING THE PUMP AND NOT
REACHING B3. ***
CMP.B1 - Running.
What were thought to be scratches were noted today, they were
actually slurry particles. Should this come up again, the particles
should be ZOOMED in on the SS. Pro Eng is going to put pictures in the
FAB of "slurry" particles which appear to be scratches. MFG and the
PSS should zoom in on the SS or review the wafer under a scope.
CMP.B2 - Down for vacuum errors and debugging 493c. There is a leak on one of the
heads or carriers, this must be fixed first. Also the vacuum pump
needs to be rebuild, it's quite gummed. After the vacuum problem is
fixed, Alan will investigate 493c problems, until MFG needs the tool
back.
The Speedfam software Engineer will be in again tomorrow morning. The plan is
to get on B1 or B2 in the morning and than the other polisher in the afternoon.
On B2 he will be debugging 493c, on B1 he will be verifying that 493c works
Ok on this system. B1 will be RELEASED with 491 and B2 with 492 until I get
back.
CMP.B3 - Doc is working on the Start-up of B3. He is here today and will be
in next week. If there are items which can be passed on to the night shifts,
Doc will do so. At this time most of the work is being done by the reps during
8-5. Currently the system has cycled wafers through load and un-load with out
any problems. They will begin cycling through the carriers heads late today or
Monday. If the reps get to a point where they are done testing the system,
Doc will start the 500 wafer mechanical acceptance. The wafers are in the
room marked with my name. They are allowed 2 assist, no failures. Use the
following recipes; Run 50 wafers on NOTOUCH
50 wafers on touch_80
50 wafers on touch_250
50 wafers on touch_375
50 wafers on io_mqc
50 wafers on io_410
the rest on touch_80.
There is only ONE 2nd table pad for B3, it is in the cabinet under process
eng. I ordered 50 more 2nd table pads two weeks ago.....waiting on the
pads.
|
| 63.90 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Fri May 03 1996 20:43 | 65 |
| CMP Equipment Engeering Passdown for:
3-MAY-1996 19:36:44.98
CMP Down Equipment listing for Fab6
====================================
CMP.B2 SCHED_DOWN
================================================================================
DOWN EQUIPMENT:
CMP.B3 - Reps. continued to working to get the tool ready for digital's
mechanical and process exceptance. Handling alignments were verifed
by running a boat of wafers. Minor adjustments were also made to
various flows.
CMP.B2 -
First thing this morning, the system broke a wafer on the polish
table. The wafer was from head #4, segment unknown. Both tables
got new pads and the multihead was fitted with 5 new carriers. The
system also received a thourough clean prior to installing above
items.
Carrier to cup alignments were performed on all five heads. All five
heads were good. Head #4 was a bit less than perfect, but still
within it's acceptabilty.
After normal pad break-in procedures (conditioning and B_IN recipes),
the system rested awhile. At this time, SPEED493C was loaded into
the computer. The system was run to check/confirm it's performance.
Vacuum errors began to pop up at this time. They were random in that
the errors occurred on different heads at different times. Covers
were removed to check the vacuum gauges. Each time the system checked
and reported what carrier was the problem, the vacuum gauge confirmed
it to be actually low (usually between the 15-20 " Hg range). The
wafers appear to be in the carrier extension ring fine each time.
Checked the vacuum line from the pump to the MHTA, a collapsed line
was found at the bulkhead junction located under the flextrack on
pump side of the system (where the black line mates with the clear
line). The black line was the collapsed side. This allowed the
vacuum gauge at the pump to read very good, but the gauges at the
head to be substantially lowerer (8-12 " Hg). It was cut back to
elinimate the collapsed section. Testing is currently going on.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 A WEEKLY TL 04/28/96 6.31
CMP.A2 A WEEKLY TL 04/30/96 8.29
CMP.B1 D MONTHLY BJ 05/01/96 18.33
CMP.B2 D WEEKLY BJ 05/01/96 20.26
CMP_SCRUB.A1 B WEEKLY RP 04/29/96 37.31
CMP_SCRUB.A2 D WEEKLY BJ 04/30/96 39.29
================================================================================
|
| 63.91 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat May 04 1996 20:21 | 38 |
| CMP Equipment Engeering Passdown for:
4-MAY-1996 19:16:00.14
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
CMP.A2 - Down for a slurrry leak. Pump #1 slurry line had a crack in it.
Removed and cleaned both pump heads and replaced the lines. Tool
was returned to production.
CMP.B3 - Reps continue with there installation checks and alignments. The down
force for the carriers and the conditioner were calibrated. Final
platen run out was noted. Pressures and flows were also checked
and corrected as needed. A pad was also put on as requested by
SPEEDFAM.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1 A WEEKLY TL 04/28/96 6.31
CMP.A2 A WEEKLY TL 04/30/96 8.29
CMP.B1 D MONTHLY BJ 05/01/96 18.33
CMP.B2 D WEEKLY BJ 05/01/96 20.26
CMP_SCRUB.A1 B WEEKLY RP 04/29/96 37.31
CMP_SCRUB.A2 D WEEKLY BJ 04/30/96 39.29
================================================================================
|
| 63.92 | CMP PD | STRATA::TDYER | | Thu May 09 1996 17:31 | 57 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: May 9th 1996
From: Timothy P. Dyer
Dept: Engineering
cc: Dennis Goodwin Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN and CMP.B3 update.
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
*** Today we noticed that the slurry pressure gauge on B3 would go to ZERO
every 30 seconds for 5 seconds. Contacted Ashland and requested they
swap pumps, problem went away. Ashlan Chem will address the problem, ie
change the pump.
*** DO NOT TOUCH ANY OF THE MAIN SLURRY VALVES UNDER THE FLOOR WITH OUT
CONTACTING MYSELF OR ASHLAN CHEM. THE BACK PRESSURE HAS BEEN SET UP TO
MEET CMP.B3'S NEEDS. ***
CMP.B1 - Up.
CMP.B2 - Down for Unload flipper errors and CRASH. JP and SF adjusted sensors
on the unload flipper. During testing 3 wafers came out at TOUCH DOWN,
There were 10 wafers on the pad...double load, needs pad change.
CMP.B3 - INSTALLATION and EQUIPMENT START UP are complete. We have started the
EQUIPMENT ACCEPTANCE portion (500 wafer marathon). The marathon will
continue into the night until the SF reps leave and will resume in
the morning. One DEC EEG tech must work with the reps to monitor
assist and or failures. I have allowed for 3 assist and no failures.
If a wafer STICKS to the pad during LIFT OFF (only) this can be
counted as an assist. Currently we have ONE assist logged, (wafer
stuck at lift off), this allows for TWO more possible assist.
wafer count assist failures recipe
50 1 0 IO_MQC, IO_410, Bin1,2,3
100 0 0 IO_bin1
150 IO_bin1
200 IO_bin1
250 IO_bin1
300 IO_bin1
350 IO_bin1
400 IO_bin1
450 IO_bin1
500 IO_bin1
There is only ONE 2nd table pad for B3, it is on the tool. More pads are
due in tomorrow.
|
| 63.93 | CMP PD | STRATA::TDYER | | Fri May 10 1996 17:19 | 37 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
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Semiconductor
I N T E R O F F I C E M E M O
To: CMP.dis Date: May 10th 1996
From: Timothy P. Dyer
Dept: Engineering
cc: Dennis Goodwin Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN and CMP.B3 update.
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
*** DO NOT TOUCH ANY OF THE MAIN SLURRY VALVES UNDER THE FLOOR WITH OUT
CONTACTING MYSELF OR ASHLAN CHEM. THE BACK PRESSURE HAS BEEN SET UP TO
MEET CMP.B3'S NEEDS. ***
CMP.B1 - Up, 493c installed, tested and released to MFG.
CMP.B2 - Up. Wafer stuck to pad today at lift off and slammed into an other
carrier.
CMP.B3 - In start up. Wafer count reset this morning after the elevator dump
valve failure. Current count is 250 with no failures and one assist
due to the cassette not being placed properly. John S. will be
monitoring the progress of the marathon. Please call me with an
update after the reps leave for the night, upon completion tomorrow
and if there is a FAILURE. thanks.
There is only ONE 2nd table pad for B3, it is on the tool. The pads did
NOT arrive.
|
| 63.94 | CMP PD | STRATA::TDYER | | Fri May 24 1996 15:46 | 41 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: May 24th 1996
From: Timothy P. Dyer
Dept: Engineering
cc: Jim Tooker Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.2 - DOWN for loading problems. Load cup and shuttle are lost.
CMP.B1 - DOWN for head rotation errors. Once any one of the heads fail to
rotate, the other heads will be turned OFF and the system will error
for "head-1 not rot, head-2 not rot, head-3, etc". So, please isolate
which head is actually failing for rotation. If necessary, run with
one head on-line at a time and run with 400lbs of df. Once the head
is isolated, troubleshoot, it may require replacing the infranor.
WEEKEND PASSDOWN FOR FAB6.
SHOULD CMP.B2 ERROR FOR VACUUM, REPLACE THE VACUUM TANK POPET AND CHECK VALVE.
THE HARDWARE IS LOCATED IN THE 3RD DRAW IN THE SPEEDFAM OFFICE. IF B2 DOES
NOT FAIL OVER THE WEEKEND, PLEASE REPLACE THESE COMPONENTS AT START UP
(MICH, BOB G.)
SHOULD B1 REQUIRE MORE INFRANORS, PAGE THE REPS LONG RANGE, THEY HAVE SOME
AT PACKAGING PLUS I THE SHAW'S PLAZA.
I CAN BE REACHED AT HOME THIS WEEKEND. (I may however be participating in
the annual memorial day weekend beverages)
|
| 63.95 | CMP PD | STRATA::TDYER | | Thu May 30 1996 17:28 | 33 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: May 30th 1996
From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP, conditioner repaired today.
CMP.B1 - UP, at MQC. Head-1 is OFF LINE.
The motor cables were swapped at the bulkhead plate with no change.
When motor cables for head 1 and 5 were swapped at the MHA terminal
board, the problem moved to head-5 (head-5 stalled). The flex track
motor cable for HEAD-1 is broke. The new cables are due in tomorrow.
CMP.B2 - Up, new pad installed.
CMP-Scrub.a2 - Up with warning, monitor the loader. Load elevator was rigged
until the correct parts arrive tomorrow.
CMP-Scrub.a2 - UP, lower outside motor brush motor replaced today.
|
| 63.96 | CMP PD | STRATA::TDYER | | Fri May 31 1996 17:04 | 35 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: May 31st 1996
From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - DOWN, PM. The alignments have been completed (with in 0 -.002"). The
system needs to be put back together and PM finished up.
WSTK.2 - UP
CMP.B1 - DOWN - Replacing cable for head-1. Please give me a ring around
10:00pm ish with an update or with questions.
CMP.B2 - Up.
CMP.B3 - Idle.
CMP-Scrub.a2 - Up with warning, monitor the loader. Load elevator was rigged
Once stock room unit is repaired, pick up parts under my name
and install, also pick up remaining parts tomorrow from security
tomorrow.
|
| 63.97 | CMP PD WSTK USERS TAKE NOTE | STRATA::TDYER | | Tue Jun 04 1996 18:17 | 58 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: June 4th 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - DOWN: Low polish rates, with high unif ie slow edge rate.
Low rates could be caused by; BAD PAD, BAD SLURRY (low solids),
LOW DOWN FORCE, CAM FOLLOWER SET UP (restrict downward stroke),
LOW CARRIER SPEED, LOW TABLE SPEEDS, CONDITIONER WORN, CONDITIONER DOWN
FORCE, INCORRECT SHAFT HEIGHT, LOW SLURRY FLOW, BAD WAFERS (reclaim),
BAD CARRIER (uniformity so bad that it throws out the mean).
- Slurry solids OK because WSTK.2 rates are good
- Down force was checked OK
- Cam follower OK
- Carrier and table speed OK
- Conditioner down force, diamond plate and set up OK
- Shaft height OK
- Slurry flow OK
- Wafers are good.
- Carrier ring height was in spec.
We replaced the pad with a standard hand stack pad, and set
conditioner DF to 18psi. A known GOOD carrier (#868) from
WSTK.2 was also installed on WSTK.1. Prior to replacing the pad
with a standard, and the carrier with 868, the removal rate was;
RR 680, edge 15%, unif 18%. After replacing the pad and carrier
the rate increased to 1050, edge still high at 15 and unif still
high at +25. A reduction in carrier curvature should reduce the
center to edge uniformity.
PLAN FOR TONIGHT, CALL ME WITH RESULTS 699-4905.
1) Build carrier 868 with 20u base plate,
2) Install on WSTK.1, run 15 break ins and re-check.
WSTK.2 - UP
CMP.B1 - UP - Head-1 rotation errors may still intermittent, will be looked at
after B2 comes up.
CMP.B2 - Down - Main water line in flex track ruptured today, parts due in
tomorrow.
CMP.B3 - Main table motor and gear box assy (850lbs) pulled and replaced
today. The unit will be re-connected and plumbing re-installed
tomorrow. Good job by the Speedfam reps and Hollamar!
|
| 63.98 | CMP PD | STRATA::TDYER | | Mon Jun 24 1996 17:56 | 38 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: July 24th 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - A pad change was also required today after only ~150 wafers.
WSTK.2 - Unif was at -6% after only ~150 wafers. Installed a F6 machine
stacked pad, unif was +30%! Pad had bubble replaced with an other
machine stacked pad, same results. Installed a new lot of suba-iv
(6fv-da6) and an ic1000 (6av-re3). Ran 10 minutes of conditioning
at 8 break in wafers, unif came in at +3% 1100a/m. If unif drops out
tonight please run 10 minutes of manual conditioning with conditioner
down force set to 1.5psi. Please return the idle recipe back to
45sec and .5 psi and save when down. If the unif and rate does not
recover after the conditioning, a pad change may be required...again.
If the 10 minute conditioning does recover the PR and unif, tomorrow
we will look closer at RPC-II calibration and condition process
optimization.
CMP.B1 - UP
CMP.B2 - up
CMP.B3 - up. Failed for particles today, the tool was THOROUGHLY cleaned and
everything came in spec. ID/OD was also adjusted for better unif.
|
| 63.99 | CMP PD | STRATA::TDYER | | Tue Jun 25 1996 17:40 | 48 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: July 25th 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
SUBJECT: CMP PASSDOWN
++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
WSTK.1 - UP. IF UNIF DROPS OUT, INSTALL AN OTHER HAND STACKED PAD.
WSTK.2 - UP. If unif drops out we need to run some test to help understand
the PAD problems and possible come up with some relief. RUN MFG
WIP ON WSTK.1 DURRING WSTK.2 TESTING. Currently
the hand stack pads start with unif at the UCL (+15) and after only
~150 wafers, end up at the LCU (-5%). When a machine stack pad is
installed unif is much too high at ~35% center fast. So, if, no, make
that when the current pad on WSTK.2 fails do the following:
1) install a MACHINE stacked pad.
2) Run 25 wafers check unif, if above UCL goto 3, if under LCL,
replace with a hand stacked.
3) Run 25 wafers check unif, if under LCL, abort test and install
hand pad. If unif is anywhere above -5% continue the testing
process, 25, retest, 25 retest, etc.
This testing will collect data and help us to understand where the
machine stack pads level off at.....Do they level off in spec,
between +15 and -5% ? Thanks for your help.
CMP.B1 - UP
CMP.B2 - up
CMP.B3 - up.
FAB6 SLURRY SYSTEM was taken down at 11:00am for a tank modification. The
work was completed and back online by 1:30pm! Ashland Chem will be performing
twice a day purges, these should be transparent to the CMP tools.
|
| 63.100 | CMP PD | STRATA::TDYER | | Tue Jul 09 1996 17:59 | 53 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: July 9th 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP PASSDOWN
==============================================================================
WSTK.1 - 8" Conversion complete, cycling wafers.
WSTK.2 - Start with a 20u carrier when a MACHINE STACKED pad is installed.
Start with a 30u carrier when a HAND STACKED pad is installed.
CMP.B1 - Index table upgrade in progress. Infranor replaced, table rotates
smoothly.
Get detailed passdown from Doc and Reps. Please verify ALL leaks
are fixed, spray undertable area basin with lots of water, check
inside main frame for leaks.
CMP.B2 - UP
1 wafer broke on CMP.B2. Wafer slipped out of carrier 3 on low
downforce recipe w/no vacuum on.
- Clean the mess on B2.
- Change pad & carrier 3.
- Breakin w/B3's conditioner ring and perform std MQCs.
- If MQCs are in spec run it.
- If MQCs show high removal rate call Frank at home 508-865-9220.
On ALL CMPB tools:
Eric - Change all "low-downforce-1-second-recipes" so vacuum NEVER shuts off
on ALL speedfams...ie anything less than 377 lbs for 1 second.
CMP.B3 - Removal rate was high out of spec(~3450A/min; spec
UCL=3400A/min). The tool has been running high for some time.
Plan:
- Switch the conditioner rings between B2&B3.
- Run 10 breakins followed by MQCs on B3.
- If removal rate drops in spec run it this way.
- If removal rate is still high; EE perform downforce calibration on
all heads and condition (record old and new data). Repeat MQCs.
Call Frank after 7:30 if you have any questions, i can also be reached at
home if you need something.
|
| 63.101 | CMP PD | STRATA::TDYER | | Wed Jul 10 1996 18:34 | 48 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: July 10th 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP PASSDOWN
==============================================================================
WSTK.2 - 3 lots will be split TONIGHT for the evaluation of the ID/OD process.
- IT IS VERY IMPORTANT THAT ALL THREE 1/2 LOTS BE COMPLETED BY 8:00AM.
DO NOT PROCESS ANY OTHER MATERIAL TONIGHT. DAVE ENMAN SUPPORTS
THIS WORK.
MFG will run the EVEN portion of ALL three lots on the standard
process. Treat these 3 HALF lots as whole lots, with pilots, dip,
nitride readings etc. Leave completed lots in WSTK room for Eng.
Hold the ODD portion for ENG, they will be processed in the morning.
- Do NOT remove the current pad on WSTK.2. If the unif fails tonight
during these lots, give me a call.
lots
04 0335 STI CMP B52834-01 24 DC0275-KA Prod 0710
04 0335 STI CMP B52836-01 24 DC0275-KA Prod 0710
04 0335 STI CMP B52838-01 24 DC0275-KA Prod 0710
CMP.B1 - Index table upgrade in progress. There are still leaks from the table
area. Troubleshoot as follows:
- Turn all water off in INDEX table area and dry.
- Pour or spray water individually around each pedestal station.
Use wipes to isolate as a dam if required.
- Wait several minutes and check inside system, if no
leaks move onto next pedestal station.
* Repair as required.
CMP.B2 - Remove conditioner and put BACK onto CMP.B3. Install the new spare
conditioner (in the pad cabinet) onto CMP.B2
CMP.B3 - BEFORE evening MQCs, check, record and calibrate all 5 head's DF.
|
| 63.102 | CMP PD | STRATA::TDYER | | Wed Jul 10 1996 18:40 | 62 |
| +---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: July 10th 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP PASSDOWN
==============================================================================
WSTK.2 - 3 lots will be split TONIGHT for the evaluation of the ID/OD process.
- IT IS VERY IMPORTANT THAT ALL THREE 1/2 LOTS BE COMPLETED BY 8:00AM.
DO NOT PROCESS ANY OTHER MATERIAL TONIGHT. DAVE ENMAN SUPPORTS
THIS WORK.
MFG will run the EVEN portion of ALL three lots on the standard
process. Treat these 3 HALF lots as whole lots, with pilots, dip,
nitride readings etc. Leave completed lots in WSTK room for Eng.
Hold the ODD portion for ENG, they will be processed in the morning.
- Do NOT remove the current pad on WSTK.2. If the unif fails tonight
during these lots, give me a call.
lots
04 0335 STI CMP B52834-01 24 DC0275-KA Prod 0710
04 0335 STI CMP B52836-01 24 DC0275-KA Prod 0710
04 0335 STI CMP B52838-01 24 DC0275-KA Prod 0710
CMP.B1 - Index table upgrade in progress. There are still leaks from the table
area. Troubleshoot as follows:
- Turn all water off in INDEX table area and dry.
- Pour or spray water individually around each pedestal station.
Use wipes to isolate as a dam if required.
- Wait several minutes and check inside system, if no
leaks move onto next pedestal station.
* Repair as required.
CMP.B2/CMP.B3 plan:
Please perform the following tonight on CMP.B2 and CMP.B3 to help us better
understand the removal-rate and pad cut-rate performance w/new vs. old
conditoners and B2 vs. B3.
- Calibrate DF on all fives heads on CMP.B3
- On CMP.B2 and CMP.B3 perform MQCs, however, run 10 oxide breakin wafers
followied by 5 pre-measured oxide wafers.
- Record results.
- Remove CMP.B3's conditoner and place it in the cabinet labled
"used blocky ring".
- Remove CMP.B2's conditioner ring and place it on CMP.B3.
- Install a new blocky conditioner ring on CMP.B2.
- On both CMP.B2 and CMP.B3 perform MQCs...run 10 oxide breakin wafers
followied by 5 pre-measured oxide wafers.
- Record results...if all is in spec run product. If anything
is out of spec call Frank at home.
|
| 63.103 | CMP PD | STRATA::TDYER | | Thu Jul 11 1996 20:50 | 108 |
|
+---+---+---+---+---+---+---+
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Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: July 11th 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP PASSDOWN
==============================================================================
WSTK.2 - SPLIT LOT STATUS: (system at PRO until splits are finished)
Last night the standard 1/2 of b52834-01 was processed.
This morning we stared ID/OD process characterization and
optimization. See data below. The monitor marathon was
completed at 5:30pm and the 1st of the NON-STANDARD lots was
then started. The non-standard lots will be finished tonight,
followed by a PAD CHANGE and then the standard portion.
Please perform 100% nitride readings on ALL wafers, then randomize
the lots before moving to next operation.
SPLIT LOT NON-STANDARD PORTION (odd wafers) INSTRUCTIONS:
1) Process odd portion on recipe "TIM_CMOS5" on ID/OD pad.
*****************************************************************
*** USE 1.15 AS MULTIPLICATION FACTOR FOR NON-STANDARD WAFERS ***
*****************************************************************
2) If ending monitor uniformity is below -2.0 or above +9% an ID/OD
adjustment will be required. The current setting for OSCILLATION
RANGE is 20mm, change this to 25mm, or 30mm to make uniformity more
POSITIVE or decrease to 10mm or 15mm to make uniformity more
NEGATIVE. (THIS IS THE BEAUTY OF THE ID/OD PROCESS.) Recheck polish
rate uniformity and continue with next lot if in the above limits.
lots
04 0335 STI CMP B52834-01 24 DC0275-KA Prod 0710 *HOT LOT*
04 0335 STI CMP B52836-01 24 DC0275-KA Prod 0710
04 0335 STI CMP B52838-01 24 DC0275-KA Prod 0710
////////////////////////////////////////////////////////////////////////////////
DATA
ID/OD RECIPE
DOWN FORCE = 7.0 psi
CARRIER SPEED = 23
PLATEN SPEED = 23
CENTER POLISH 165mm
OSCILLATION = 20mm (ADJUSTABLE PARAMETER)
OSC RATE = 10mm/s
CONDITION PSI = 1.0psi
CONDITION TIME = 35sec
RATE UNIF EDG OSC/RATE
1010 -3 2 STD, WHOLE PAD
cut pad, to ID = 8.0", OD = 21.0"
1203 4.4 7 5/5 ID/OD
ran 10 warm ups.
1179 -1.4 10 5/5
run 3 breakins 10/5
1186 -1.9 6 10/5
run 3 breakins 10/5 (pol lim = 4536 to 5252)
1143 -5 13 10/5 10/5
run 3 breakins 20/10 (change polish pos to 170mm) to center ID/OD
1163 -4 8.7 20/10
run 1 breakin 30/10
1162 -5 14 30/10
run 1 breakin 30/10 (change pol pos to 180) to center ID/OD
1140 3.4 7 30/10 (pol pos = 180)
ran 1 breakin 40/10 (pol pos = 185) to center ID/OD
1143 -3 9.6 40/10
run 1 breakin 30/10 (pol pos = 180)
1145 -4 5.7 30/10
put 30u carrier (420) on system
ran 3 breakins 10/5 (pol pos = 165)
778 12.9 12 10/5
802 10 9 30/10 (pol pos = 180)
20u carrier installed
1201 30 10 60/10 (put pol pos to a fixed setting 165)
1164 24 8 60/10
1201 26 5 50/10
1154 12 11 40/10
1185 7.5 2.4 30/10
1196 4 13 20/10
985 8.6 10 std recipe (6.1psi, 5/2)
1216 7 6 10/10
1240 5 9 10/10
1193 8 8 15/10
1213 11 8 20/10
1179 5.6 10 20/10
start monitor marathon pad count at this time = 70
pr,4,pr,4,pr,4,pr,4,pr,4,pr 20/10
1050 15.6 6 20/10
1191 5.0 15.1 20/10
1182 5.5 12.5 20/10
1199 6.0 8.7 20/10
1133 6.6 8.7 20/10
1148 6.6 7.8 20/10
start ODD portion of b42834-01 HOT LOT, PILOT WAFER#15, REMAINING NIT =1352
decrease time by 8 seconds and changed factor to 1.5
continued lot.
|
| 63.104 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Thu Jul 18 1996 20:57 | 37 |
| CMP Equipment Engeering Passdown for:
18-JUL-1996 19:54:07.76
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
DOWN EQUIPMENT:
CMP.A1 - DOWN FOR PROBLEMS WITH UNIFORMITY AND PARTICLES. THE CONSUMABLES
WERE SWAPPED OUT, AN O-RING OFF THE LEFT SPINDLE WAS REPLACED, THE
LEFT SCRUB BRUSH ADJUSTED, AND THE TOOL WAS CLEANED UP AND RETURNED TO
PRODUCTION.
CMP.B3 - DOWN FOR THE CARRIER #4 NOT ROTATING. THE INFRANOR WAS REPLACED AND
THE TOOL WAS RETURNED TO PRODUCTION.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1
CMP.A2
CMP.B1
CMP.B2
CMP.B3
CMP_SCRUB.A1
CMP_SCRUB.A2
================================================================================
|
| 63.105 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Jul 20 1996 20:35 | 50 |
| CMP Equipment Engeering Passdown for:
20-JUL-1996 19:32:08.25
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
EQUIPMENT HIGHLIGHTS:
CMP.A2 - Down for high particles on the right carrier. The particles were at
3000. Changed out the right brush and the particles came in at 1100.
Returned the tool to production.
CMP.B2 - Down for high particles. The scrub brushes were not rotating. The
scrub assembly was pulled and the gear on the motor shaft was found
to be stripped. Some bearings are also bad and most of the screws
were damaged. The upper and lower scrub assemblies were swapped with
CMP.B3's because it was down. Speedfam has been notified and the
parts will be ordered. The tool was cleaned up and returned to
production.
CMP.B3 - Down the carrier#1 not going down at 2nd table and wafers sliding out
on the primary table (same head). Believe that the EP regulator is
out of calibration. Waited for most of the day to receive a
procedure from SF. A procedure was found in the SF office and
followed. The down force for head #1 will need to be done over. The
tool presently sets at PART waiting for the upper and lower scrub
assemblies that were put on CMP.B2. Speedfam has been notified about
the scrubber and they are ordering the appropriate parts.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1
CMP.A2
CMP.B1
CMP.B2
CMP.B3
CMP_SCRUB.A1
CMP_SCRUB.A2
================================================================================
|
| 63.106 | CMP PD | STRATA::TDYER | | Thu Jul 25 1996 19:05 | 49 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: July 25th 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP PASSDOWN
==============================================================================
WSTK.2 - UP
CMP.B1 - Down. One of the door sensors tripped, this caused the system to
continually polish the wafers until the problem was noticed.
5 wafers from a hot lot have been scraped.
- Doors have been fixed, currently running particle experiments.
- See "particle update"
CMP.B2 - UP, see "particle update"
CMP.B3 - Original scrubber installed and scrubber continues to stall.
Troubleshooting at this time.
Speedfam particle update:
- Problems were identified today. The incoming film thickness
on the monitors is low, this change effects the optimized target
on the surfscan possibly contributing to erroneous readings.
Kyle is working with DRG to make 5k SS program.
- The MQC wafers were inspected on a review station. The surfscan counts
were 2500-3000, the inspection determine there to be at least a full
magnitude less (~200-500). The particles detected by the surfscan have
been false. This may be due to the FILM THICKNESS or FILM QUALITY.
The Novelus folks are making up new 12k monitors. Also we 25 12k
wafers being made u on the 5000s.
- TONIGHT: RUN MQCs ON CMP.B3 AND B1 WITH 5 STANDARD 12K NOVELUS WAFERS
AND 5 5000s 12K WAFERS, IF EITHER PASS THE SYSTEM CAN BE RUN. IF THEY
FAIL CHECK WAFERS ON REVIEW STATION. IF THEY ARE FALSE PARTICLES
THE SYSTEM CAN BE RUN.
|
| 63.107 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Jul 27 1996 20:45 | 47 |
| CMP Equipment Engeering Passdown for:
27-JUL-1996 19:42:51.40
CMP Down Equipment listing for Fab6
====================================
CMP.A1 REPAIR
================================================================================
EQUIPMENT HIGHLIGHTS:
CMP.B1 - Down for high particles. The tool was put to Process engineering
because it was determined on CMP.B2 that the particle problem was
not real. The tool was later returned to production.
CMP.B2 - Down for high particles. All efforts to find the particle problem
w/ the tool were exhausted. The issue was handed over to process
engineering. Several MQCs failed for particles w/ MQC wafers that
were generated from different tools (5000, novellus). Later particles
were read from product wafers that were run on CMP.B2 & CMP.B3 both
were clean the tool was returned to production.
CMP.B3 - Down for a Pad change due to low removal rates. Both pads were
changed and the conditioner and process area were cleaned. The
particles came in but the removal rates are still low (1100). Run out
time.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1
CMP.A2
CMP.B1 All PMs completed.
CMP.B2
CMP.B3
CMP_SCRUB.A1
CMP_SCRUB.A2
================================================================================
|
| 63.109 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Aug 03 1996 20:21 | 47 |
| CMP Equipment Engeering Passdown for:
3-AUG-1996 19:17:14.02
CMP Down Equipment listing for Fab6
====================================
CMP.B1 UNSCHED_DOWN
================================================================================
EQUIPMENT HIGHLIGHTS:
CMP.B1 - Down for high particles and install of new ball bearings in the
conditioner arm. The tool never came up from the PM. Pulled all the
cups and cleaned the index table. Cleaned the conditioner and process
area. Swapped out the pad with a prestamped one from stock. The ball
bearings for the conditioner arm came in this morning and were
installed but we also need the seal which protects the bearings. This
was never ordered. Speedfam was notified about the seal and will
order it ASAP. Until the old seal was cleaned and reinstalled until
the new part arrives. MQCs were run on the toolbut they failed for
high particles. Process Engineering was contacted and they requested
that a filter be placed inline with the tool and the pad changed again
and the MQCs repeated.
CMP.B3 - Down for high particles. Changed both pads. Cleaned the conditioner
ring and process area up. Scrubbed the carriers. Returned the tool to
production. It passed MQCs.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1
CMP.A2
CMP.B1 All PMs completed.
CMP.B2
CMP.B3
CMP_SCRUB.A1
CMP_SCRUB.A2
================================================================================
|
| 63.110 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Wed Aug 07 1996 20:40 | 47 |
| CMP Equipment Engeering Passdown for:
7-AUG-1996 19:36:52.66
CMP Down Equipment listing for Fab6
====================================
CMP-SCRUB. UNSCHED_DOWN
CMP.B1 UNSCHED_DOWN
================================================================================
EQUIPMENT HIGHLIGHTS:
CMP.B3 - Down for high particles. The tool was at engineering most of the day.
Slurry was drawn directly out of a 55 gallon drum to eliminate the
slurry system. The particles failed. The pad was changed and MQCs
rechecked. The MQCs failed for particles again. MQCs were checked
using a recipe with an extended 2nd polish time but the tool still
failed. Please follow Engineering's action plan sent out by Krupa.
CMP.B1 - Down for high particles. The issue was never addressed.
SCRB.1 - Down for problems with the spin station.
SCRB.3 - Down for errors for no wafer at the outside brush station. The belts
in the load station were off the pullies. Corrected the same
rebooted and ran with no further problems.
PM SCHEDULE
--------------------------------------------------------------------------------
TOOL SHIFT TYPE PM DUE TECH. DATE COMPLETED NOTE FILE #
--------------------------------------------------------------------------------
CMP.A1
CMP.A2
CMP.B1 All PMs completed.
CMP.B2
CMP.B3
CMP_SCRUB.A1
CMP_SCRUB.A2
================================================================================
|
| 63.111 | CMP PD | STRATA::TDYER | | Thu Aug 08 1996 18:22 | 46 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: August 8th, 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP PARTICLE
==============================================================================
Particle update:
The surfscan was calibrated today by DRG. They found no problems and made no
changes to our recipes, we are reading the wafers correctly and have REAL
particles. We have ruled out the following items; the WAFERS, the PAD, the
BULK DELIVERY SYSTEM and the 3 ONTRACKs. We have details around this if
needed. Some other test run today:
test delta particles (adders)
120lbs/SLURRY/1S seg5 +500 +500 +500 +500 +500
80lbs/WATER/1s seg5 (same wafers) -200 -245 -205 -250 -240
scrubber/slurry dip test (3 wafers) +52 +79 +69
REPEAT -31 -19 -11
slurry ph = 10.5
slury soldis 12.5%
Because the 80/DI polish removed 50% of the particles from the wafers we would
like MQC run on recipe "EXT_80lbs" on B1. This recipe has an extended time in
step 6 of 90 seconds. Should this pass particles, change the time to B2, B3 MQC
recipe prior to running MQC. Should this be effective in removing the
particles change ALL recipes (step-6) on ALL CMP.B tools.
If this failed, connect a barrel to B1, mix the slurry with one pump and use a
2nd pump to pump the slurry through the little blue 5u filters and to the sol
valves (2). Should this pass particles, re-connect bulk system and verify that
it fails again.
|
| 63.112 | CMP PD | STRATA::TDYER | | Fri Aug 09 1996 19:29 | 69 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: August 9th, 1996
Jim Scott From: Timothy P. Dyer
Frank Krupa
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP PARTICLE
==============================================================================
Particle update:
Check specific gravity of DI, appeared to be OK at .94, PH of slurry was
10.5 FAB4, 10.5 FAB6. Specific gravity of FAB6 slurry was 1.07.
Test run today on B1: H-1 H-2 H-3 H-4 H-5
- Slurry lift off = 4511,4652,4350,4360,3212
- 377 DI rinse 15 sec = 2295,2899,3916,2311,2360
- 377 DI rinse 50 sec = 564 866
- 377 DI rinse 50 sec = 908, 878, 874, 975, 978
Test run on CMP.Scrub.A1:
- Reinstalled spray manif = (run B1) 3916,2311,2360
Test run on B3:
- Slurry lift, slurry 2nd T = 1624 972, 1007
- Water lift, slurry 2nd T = 1039, 511 849
- NH40H on 2nd T = failed miserably
- 377 DI rinse 50 sec = 1895, 2085, 1834 * (scratches)
* filler dummies polished to bare si, tool vibrated in DI-377 step,
dropped wafer 4 at lift-off, repeated test.
- 377 DI rinse 50 sec = 714, 672, 1062(dropped)
- FAB4 slurry, std MQC = 457, 258, 463
- FAB4 slurry, std MQC = 605, 908, 959
SUMMARY:
The 377 lbs DI water scrub step on the primary table removes enough of the
particles to put the wafers back in spec. This is patch for the problem which
may be implemented over the weekend. The FAB4 slurry test showed the best
results with particle levels back down to about 400.
ACTION PLAN FOR WEEKEND/TEST:
Collect two gallons of FAB4 slurry, unfiltered. Connect to CMP.B3 and run
standard MQC. Two gl is only enough slurry for 5 warm ups and 5 MQC wafers!
RECORD data in CMP.B3 notes file and in SPC. We can not make major changes
to the FAB6 slurry system tonight.
MFG PLAN: Change ALL recipes STEP 6, from 80lbs, 13 sec to 377lbs, 50s
(compare to "377_DI" on CMP.B3). Frank and I can be reached at home.
*NOTE* DO NOT POLISH WAFERS TO BARE SI WITH 377_DI RECIPE, IT WILL BREAK
WAFERS.
*note* If B3 is dropping wafers at lift off change ID&OD to 131 in steps 8&9.
CMP.B1 IS STAYING AT ENG
SF PRO ENG and EEG (Marie and Dave) will be in tomorrow, to run several test
CMP.B1, providing B2 and B3 are up. Any problems or question call Frank or I.
|
| 63.113 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Fri Aug 09 1996 20:23 | 31 |
| CMP Equipment Engeering Passdown for:
9-AUG-1996 19:22:03.02
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
EQUIPMENT HIGHLIGHTS:
CMP.B3 - Down for high particles and testing by process engineering. For the
full passdown please refer to Tim Dyer's passdown. Had some handling
problems with the unload flipper manually exercised the flipper and no
further problems were experienced. Started to follow engineering's
particle get well plan. Ran the test using the unfiltered fab4
slurry. The results were as follows:
PRE POST
---------------------------------
1. 13-37-0 | 343-1344-0
2. 11-35-0 | 272- 918-0
3. 6-34-0 | 333-1303-0
CMP.B2 - The monthly has been wavied until next week.
================================================================================
|
| 63.114 | CMP PD | STRATA::TDYER | | Mon Aug 12 1996 18:54 | 27 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: August 12th, 1996
Jim Scott From: Timothy P. Dyer
Frank Krupa
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP Passdown
==============================================================================
FAB6 CMP room was shut down today at 12:30, back on line at 6:00pm. All
tools will need MQCs. STEP 6 on the CMP.B tools should be 377lbs for 30 sec.
All TOUCH UP recipes step 6 should match step 5 down force and time set to
30sec. This should keep tools inside TDCO limits.
More particle experiments will be run tomorrow.
|
| 63.115 | CMP PD | STRATA::TDYER | | Tue Aug 13 1996 18:24 | 44 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: August 13th, 1996
Jim Scott From: Timothy P. Dyer
Frank Krupa
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP Passdown
==============================================================================
WSTK.2 - Down for vacuum errors.
: Check carrier wet time, make sure there is enough water sprayed onto
the back of the wafer. Check vacuum on gauge, should sense wafer
at ~15", adjust switch as required. If total vacuum is low, check
with out carrier, cap end of carrier shaft with hand and turn on
vacuum, gauge should hit 20". If not, check all hoses, replace SOFT
WATER filter.
CMP.B systems: Particle problem continues to be relived by the DI step-6.
ALL recipes have been set up by Engineering, no changes are required
tonight. THE POLISHERS SHOULD NOT VIBRATE, UNLESS WAFERS ARE POLISHED
TO BARE SILICON.....AVOID THIS!
FYI, the recipes look as follows:
RECIPE STEP-6
IO_MQC 377lbs/30s/vac off
BREAKIN# 80lbs/13s/vac off
IO_MQC 377lbs/30s/vac off
ILD# 377lbs/30s/vac off
PMD 377lbs/17s/vac off
TOUCHUP# 377lbs/17s/vac off
TUP### 80lbs/13s/vac ON
# is a variable in the recipe name, ie A,B,1,2,3, etc.
|
| 63.116 | CMP PD | STRATA::TDYER | | Wed Aug 14 1996 19:41 | 37 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: August 14th, 1996
Jim Scott From: Timothy P. Dyer
Frank Krupa
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP Passdown
==============================================================================
CMP.B systems: Wafer breakage problem: Source of breakage attributed to the
step-6 DI process, this problem becomes more prevalent with bare
SI wafers but has also occurred on good oxide wafers. Step-6 has been
modified. It is now two step (6,7) step 6 is at 10 seconds and 377,
step 7 is at 20 seconds, 300 and VACUUM ON. Process tested on CMP.B2
today. CMP.B2 and B3 recipe's have been modified. Please MATCH
CMP.B1's recipes to B2 or B3 before running breakins, MQC, etc.
If you have any questions regarding the recipes, call FRANK at home.
CMP.B1- Software corrupted, hardware.cmp file indicated METALS tool.
Needs recipe changes and MQCs.
CMP.B2 - Crashed last night, recipes modified and tested, MQCs ALL in spec.
CMP.B3 - Belt was skipping. Central pulley assy upper bolts were loss, idler
assy shift and belts loosened......tightened same. Recipes modified
needs MQCs.
|
| 63.117 | CMP PD | STRATA::TDYER | | Thu Aug 22 1996 18:27 | 37 |
| +---+---+---+---+---+---+---+
| d | i | g | i | t | a | l |
+---+---+---+---+---+---+tm-+
Semiconductor
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: August 22th, 1996
Jim Scott From: Timothy P. Dyer
Dept: Engineering
cc: CMP.dis Ext: 5072
Node: Scoman::Tdyer
==============================================================================
CMP ENGINEERING PASSDOWN
==============================================================================
CMP.B1 - Still down for head rotation problems. During troubleshooting, the
CPU crashed. A new CPU and HARD DRIVE where installed, the system would
not boot. It appears the hard drive is NOT loaded with software.
Before we can troubleshoot the head failure problem, the system
must be booted up and ALL software loaded. If this is successful
tonight, run ROTGO before running any other test. SPEEDFAM Phoenix
has been notified of our situation, I have requested more help.
Please call me at shift change with a status. For starters it would
help if the motor phase signals (A,V,W) matched the schematics. If
your unable to get the software working, trace UVW from the infranors
to the all 5 rotation motors. Note any discrepancies.
CMP.B2 - Down for dropping wafers. Several wafers dropped from HEAD-5. The
carrier from 5 was swapped with 4. HEAD-% dropped a wafer with
carrier-4 installed. There is a leak in head-5's vacuum system,
fix same.
|
| 63.118 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Aug 24 1996 20:47 | 80 |
| CMP Equipment Engeering Passdown for:
24-AUG-1996 19:45:24.87
CMP Down Equipment listing for Fab6
====================================
CMP.B1 REPAIR
================================================================================
CMP.B1-
Head #1 rotation failure problem:
--------------------------------
It appears that the problem is with the analog control loop wiring
for head #1's down force control. We have sucessfully run a full
cassette of wafers at 377 lbs of down force. (IO_BKIN recipe)
D shift removed and retightened every connection on terminal boards
14,15, & 16 last night. They also removed and reconnected cable #2
on the right side lower bulkhead . They sucessfully completed 1/2
cassette of wafers and passed down to us this morning. We continued
with a verification run and experienced a head #1 rotation error on
the fourth run.
Richie from Speedfam arrived this morning with a new Analog I/O cable
for cable #2 ( head #1's feedback cable). The cable was run outside
the tool from the right bulkhead connector to terminal board #16 on
the Multihead. We have just finished running a full cassette of
wafers at 377 lbs. of down force with NO head #1 rotation errors.
However, head #5 slipped out a wafer near the end of segment 5 and
it broke under carrier #4. We are now in the process of cleaning up
and resuming the verification run. We will need to run at least 4
cassettes of wafers before we're satisfied that we've got resolution
on this problem.
This passdown is being sent out early because I'm leaving at 4:00 p.m.
today. Check out Bradley's passdown at 8:00 p.m. for the latest info
on the head #1 rotation error saga.
Recovered from the crash. All the carriers were good except for #4.
Replaced carrier #4 and all other consumables. Ran the conditioning and
breakin with no problems. Ran 2 boats of wafers and on the last run
carrier#1 locked up again ran out of time.
NOTICE
------
The IO_BKIN recipe on CMP.B1 has been modified. The time in segment #5
has been reduced to 20 seconds from 120 seconds. We did this to reduce
the amount of oxide we were removing from the wafers. We weren't able
to obtain fresh 50K wafers until 2:30 this afternoon. Please remeber
to change the time back to 120 seconds before returning the tool to
manufacturing.
CMP.A2-
Right Spindle Leaving Wafers On Pad:
-----------------------------------
The right spindle has been repeatedly leaving wafers on the pad at
lift off today. This condition eventually ended in wafer breakage.
The 2nd o-ring (counting from the center outward) on the right hub
was replaced. The system is now running MQC's.
CMP.B2-
Wafer Misload:
-------------
The system failed to load a wafer on Head #3 this afternoon. We didn't
see exactly what happened. Its possible that Load Cup #3 may be
sticking or the lift cylinder might be degrading. We can't get the tool
at this time to check it out.
WSTK.1- Replaced the bellows boot over the unload station dump
valve. After assembling the valve with no leaks, the valve did not
cycle back up to fill the tub. Located TR2,3 and relay cr17 inside
the fluids cabinet, under the top lip. Found that TR2 was not
opening due to the time delay resistor not making good contact
inside the spade terminals. Crimped spade connector and connection
was reestablished. Dump valve then started working normally.
|
| 63.119 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Fri Aug 30 1996 21:13 | 80 |
| CMP Equipment Engeering Passdown for:
24-AUG-1996 19:45:24.87
CMP Down Equipment listing for Fab6
====================================
CMP.B1 REPAIR
================================================================================
CMP.B1-
Head #1 rotation failure problem:
--------------------------------
It appears that the problem is with the analog control loop wiring
for head #1's down force control. We have sucessfully run a full
cassette of wafers at 377 lbs of down force. (IO_BKIN recipe)
D shift removed and retightened every connection on terminal boards
14,15, & 16 last night. They also removed and reconnected cable #2
on the right side lower bulkhead . They sucessfully completed 1/2
cassette of wafers and passed down to us this morning. We continued
with a verification run and experienced a head #1 rotation error on
the fourth run.
Richie from Speedfam arrived this morning with a new Analog I/O cable
for cable #2 ( head #1's feedback cable). The cable was run outside
the tool from the right bulkhead connector to terminal board #16 on
the Multihead. We have just finished running a full cassette of
wafers at 377 lbs. of down force with NO head #1 rotation errors.
However, head #5 slipped out a wafer near the end of segment 5 and
it broke under carrier #4. We are now in the process of cleaning up
and resuming the verification run. We will need to run at least 4
cassettes of wafers before we're satisfied that we've got resolution
on this problem.
This passdown is being sent out early because I'm leaving at 4:00 p.m.
today. Check out Bradley's passdown at 8:00 p.m. for the latest info
on the head #1 rotation error saga.
Recovered from the crash. All the carriers were good except for #4.
Replaced carrier #4 and all other consumables. Ran the conditioning and
breakin with no problems. Ran 2 boats of wafers and on the last run
carrier#1 locked up again ran out of time.
NOTICE
------
The IO_BKIN recipe on CMP.B1 has been modified. The time in segment #5
has been reduced to 20 seconds from 120 seconds. We did this to reduce
the amount of oxide we were removing from the wafers. We weren't able
to obtain fresh 50K wafers until 2:30 this afternoon. Please remeber
to change the time back to 120 seconds before returning the tool to
manufacturing.
CMP.A2-
Right Spindle Leaving Wafers On Pad:
-----------------------------------
The right spindle has been repeatedly leaving wafers on the pad at
lift off today. This condition eventually ended in wafer breakage.
The 2nd o-ring (counting from the center outward) on the right hub
was replaced. The system is now running MQC's.
CMP.B2-
Wafer Misload:
-------------
The system failed to load a wafer on Head #3 this afternoon. We didn't
see exactly what happened. Its possible that Load Cup #3 may be
sticking or the lift cylinder might be degrading. We can't get the tool
at this time to check it out.
WSTK.1- Replaced the bellows boot over the unload station dump
valve. After assembling the valve with no leaks, the valve did not
cycle back up to fill the tub. Located TR2,3 and relay cr17 inside
the fluids cabinet, under the top lip. Found that TR2 was not
opening due to the time delay resistor not making good contact
inside the spade terminals. Crimped spade connector and connection
was reestablished. Dump valve then started working normally.
|
| 63.120 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Aug 31 1996 20:40 | 27 |
| CMP Equipment Engeering Passdown for:
31-AUG-1996 19:37:26.61
CMP Down Equipment listing for Fab6
====================================
CMP.B2 PM
CMP.C1's Hit List Update
------------------------
1. Load alignments
ok 2. Unload alignments.
ok 3. Chillers filled
ok 4. Check if platens come up to temperature
needs to be checked 5. Repair the final wetting ring
6. Arm alignments
CMP.C1 - The final platen was not heating. The chiller had a low glycol level
and the indicator lamp was burned out. The bulb was replaced and the
chiller topped off. Platen heated with out a problem. The upgraded
shuttle jam sensor was installed but there was not enough time to
properly adjust it. The water track to cassette alignment was also
completed. Tool sets still needing the load handler and arm
alignments. Mike Standing and Myself will be in on Tuesday to do
them. Tool power and DI is off.
|
| 63.121 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Sep 07 1996 20:18 | 20 |
| CMP Equipment Engeering Passdown for:
7-SEP-1996 19:17:31.48
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
================================================================================
EQUIPMENT HIGHLIGHTS:
CMP.A1 - Down for poor uniformity. Replaced the pad.
CMP.A2 - Down for slipping wafers from the right carrier on every lift off.
replaced the carrier plate O-ring and ran 6 wafers with no further
problems.
CMP.B2 - Weekly PM is in the incomplete note file.
|
| 63.122 | CMP PD | STRATA::TDYER | | Thu Sep 19 1996 18:50 | 68 |
|
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: September 9th, 1996
cc: Jim Scott From: Timothy P. Dyer
Dept: Equipment Engineering
Weekly.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASS DOWN
-----------------------------------------------------------------------------
cmp.b2 - Dump valves modified to pressures close.
cmp.b3 - Several inverter errors, see John S. note entry.
CMP.B1 - Vibration problem:
Created 3 recipes, vib_1 (step7=300), vib-2 (step7=313) and vib-3
(step-7=330). Ran 5 wafers on each recipe results were:
vib-1 = vibrated in step 7 head4
vib-2 = no vibration
vib-3 = no vibration
Notice all offset were the same except head-4, decide DF on 4 may be out.
Calibrated DF on all 5 heads, head4 WAS out by ~20lbs.
Ran the following:
vib-1=vibration head2
vib-2=vibration head1
vib-1=vibration head3
Created an MQC recipe "270_mqc" with 270lbs of DF in the clean step, step-7.
NO vibrations, particle were: tot lrg ~scrL
425 79 .2
220 70 .24
249 79 .9
274 58 .6
292 60 .4
Create a MQC recipe with 250lbs of DF in clean step, particles were:
tot lrg ~scrL
425 79 .2
220 70 .24
249 79 .9
274 58 .6
292 60 .4
Repeated the 250lb test results were:
413 112 0
290 90 0
341 109 0
204 70 0
406 97 0
Repeated the 250lb test again results were:
362 91 0
294 66 0
330 82 0
441 71 0
291 84 0
No hardware discrepancies were found. The table and or carrier shaft bearings
on this older tool may be wearing down and make the tool more susceptible to
vibration. DF in step-7 will be lowered to 250lbs in In ALL recipes with a
313lb STEP7. We will continue to monitor and research the problem in conjunction
with the head-1 rotation problem.
|
| 63.123 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Sep 21 1996 20:47 | 34 |
| CMP Equipment Engeering Passdown for:
21-SEP-1996 19:42:57.86
CMP Down Equipment listing for Fab6
====================================
CMP-SCRUB. REPAIR
CMP.A2 UNSCHED_DOWN
CMP.A1 - Down for problems w/ the conditioner. Tool never came up from
yesterday when the conditioners's end effector fell off. After
putting the arm back together there was excessive play in the C.arm
while Oscillating. Previous shift suspected that the shaft was bent.
The shaft did'nt appear bent to me so I cleaned everything and put new
split pins in and reassembled the arm. Cycled the conditioner about
30-40 times in all w/ no problems. Put the old brushes and carriers
back on the tool w/ a new pad. Conditioned and broke in the pad. The
tool sets needing only MQCs.
CMP.A2 - Down for heads not lifting off the table. Never had time to touch it.
CMP.B1 - Down for robot errors. The robot kept deservoing. Tried move robot
on the cal screen. Tried reseting the robot controller w/ no luck.
Powered the tool down for a few minutes and checked the cables,
Everything seemed alright. Powered it back up and had no more
troubles.
SCRUB1 - Down for a loud Squeak in the OB, OB upper motor errors and the wafer
riding over the top of the rollers in the OB station. Found the
Squeak to be coming from the back roller took the shaft apart and
cleaned and adjusted belt tension. The roller heights and motor issue
still needs to be addressed. Ran out of time.
FYI - Slurry to the whole room was lost for about an hour today.
|
| 63.124 | CMP PD | STRATA::TDYER | | Mon Sep 30 1996 20:24 | 68 |
|
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: September 9th, 1996
cc: Jim Scott From: Timothy P. Dyer
Dept: Equipment Engineering
Weekly.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASS DOWN
-----------------------------------------------------------------------------
cmp.b2 - Dump valves modified to pressures close.
cmp.b3 - Several inverter errors, see John S. note entry.
CMP.B1 - Vibration problem:
Created 3 recipes, vib_1 (step7=300), vib-2 (step7=313) and vib-3
(step-7=330). Ran 5 wafers on each recipe results were:
vib-1 = vibrated in step 7 head4
vib-2 = no vibration
vib-3 = no vibration
Notice all offset were the same except head-4, decide DF on 4 may be out.
Calibrated DF on all 5 heads, head4 WAS out by ~20lbs.
Ran the following:
vib-1=vibration head2
vib-2=vibration head1
vib-1=vibration head3
Created an MQC recipe "270_mqc" with 270lbs of DF in the clean step, step-7.
NO vibrations, particle were: tot lrg ~scrL
425 79 .2
220 70 .24
249 79 .9
274 58 .6
292 60 .4
Create a MQC recipe with 250lbs of DF in clean step, particles were:
tot lrg ~scrL
425 79 .2
220 70 .24
249 79 .9
274 58 .6
292 60 .4
Repeated the 250lb test results were:
413 112 0
290 90 0
341 109 0
204 70 0
406 97 0
Repeated the 250lb test again results were:
362 91 0
294 66 0
330 82 0
441 71 0
291 84 0
No hardware discrepancies were found. The table and or carrier shaft bearings
on this older tool may be wearing down and make the tool more susceptible to
vibration. DF in step-7 will be lowered to 250lbs in In ALL recipes with a
313lb STEP7. We will continue to monitor and research the problem in conjunction
with the head-1 rotation problem.
|
| 63.125 | CMP PD | STRATA::TDYER | | Tue Oct 01 1996 17:51 | 29 |
|
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 1st, 1996
cc: Jim Scott From: Timothy P. Dyer
Dept: Equipment Engineering
Weekly.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASS DOWN
-----------------------------------------------------------------------------
WSTK.2 - waiting on parts.
CMP.B1 - Down for reoccurring rotation failure problems. the following game plan
is in progress with DEC and SF:
1) Calibrate all DF fairchilds
2) Calibrate DF with BOTH cal meters, note discrepancies, use the
new meter for final set up.
3) Run test wafers
4) Replace head-1 rotation gear box.
5) Run test wafers
6) Clean tool, replace pad, log to verify.
|
| 63.126 | CMP PD | STRATA::TDYER | | Wed Oct 02 1996 10:11 | 27 |
|
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 2ND, 1996
cc: Jim Scott From: Timothy P. Dyer
Dept: Equipment Engineering
Weekly.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP.B1 VIBRATION/CRASH ACTION PLAN.
-----------------------------------------------------------------------------
CMP.B1 - REOCCURRING CRASHES DUE TO EXCESSIVE FRICTION/VIBRATION.
1) Replace slurry pump-1 (#2 already replaced)
2) Inspect slurry lines for restrictions
3) Calibrate DF on all heads.
4) Break i pad, than begin 100W test. Use recipe VIB_TEST,
*** Make sure you have GOOD OXIDE wafers ****
If NO vibration occurs, return to MFG. IF ANY vibration occurs, page
me immediately.
|
| 63.127 | CMP PD | STRATA::TDYER | | Wed Oct 02 1996 20:08 | 52 |
|
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| d | i | g | i | t | a | l |
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 2ND, 1996
cc: Jim Scott From: Timothy P. Dyer
Dept: Equipment Engineering
Weekly.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
WSTK.1 -Down for RPC-II problems.
A new EPRV was installed today in in the DF slot. The arm is still
functioning properly. There appears to be a zero cal stored in the
software which can NOT be reset, also the other prev appears to be
bad.
WSTK field service will be here at 8:00am, they have access to reset
the zero cal and will bring an other eprv with them.
also on order gxl-h81 pv660010
CMP.B1 - REOCCURRING CRASHES DUE TO EXCESSIVE FRICTION/VIBRATION.
done 1) Replace slurry pump-1 (#2 already replaced)
done 2) Inspect slurry lines for restrictions
done 3) Calibrate DF on all heads.
done 4) Check/calibrate ALL wafer loss sensors with a scraped product wafer.
done 5) Break in pad, than begin 100W test. Use recipe VIB_TEST,
*** Make sure you have GOOD OXIDE wafers ****
- Monitor DF on screen, note any over shoot
- Watch all heads closely
- Monitor IM on infranor for head-1
If NO vibration occurs, return to MFG. IF ANY vibration occurs, page
me immediately.
We had solved a vibration problem on the Speedfam tools in 11/95. This
problem was caused by ramping the table and carrier oscillation at the
same time. One possibility is that the table has not completed it's ramp up
in step-4. We extended step-4 by 4 seconds in the VIB_TEST recipe. We also
noticed that in step-5 there is a ramp rate by we are NOT ramping pressure.
If this runs 100 wafers OK, calibrate the table ramp rates. Have your
supervisor and or security, REMOVE our TACHOMETER from the cal lab. Use this
to check and monitor the table speed. Call me after the 100 wafer test.
*** PLEASE, PLEASE PLEASE MAKE SURE THERE IS OXIDE ON THE WAFERS ***
*** SUPERVISORS, PLEASE HELP US WITH WAFERS, WE ARE RUNNING LOW***
|
| 63.128 | CMP PD | STRATA::TDYER | | Thu Oct 03 1996 19:48 | 60 |
| +---+---+---+---+---+---+---+
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 3rd, 1996
cc: Jim Scott From: Timothy P. Dyer
Dept: Equipment Engineering
Weekly.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
WSTK.2 -In MQC. RPC-2 was repaired earlier by IPEC FS. During MQCs the down
sensor drifted. Since the conditioner did not know that it was down,
it cut off the down force. The sensor was adjusted, tested and MQC
are in progress. Should there be a problem with MQC or RPC-II,
give me call.
CMP.B1 - REOCCURRING CRASHES DUE TO EXCESSIVE FRICTION/VIBRATION.
* THERE HAS BEEN TWO DIFFERENT VIBRATION/CRASH PROBLEMS
1) VIBRATION AND CRASHES DURING THE MAIN POLISH STEP, STEP-5
2) VIBRATION AND CRASHES DURING THE RINSE STEPS-6,7
There has been NO vibration in STEP-5 since the fairchilds and DF was
calibrated, however vibration continued in step6. We speculated that
the water was causing vibrations on B1, but why not on B2 or B3?
In STEP-6 B2 and B3 take approximately 5 seconds longer to purge the
slurry off the table than does B1. We determined that tube between the
rinse/slurry valve and the end of the dispense tube on B1 is ~5', on
B2 and B3 it's ~15',3 times longer. This causes a much faster slurry
to water transition on B1. Step-6 on B1 has been decrease to
compensate for the hardware difference (shorter line). Initial 35w test
look good. Particles look good all totals are ~600.
PLAN FOR TONIGHT:
1) Run 50 more wafers through no_crash, if OK go to step-2
2) Replace pad, clean tool and put system UP, then to MQC,
3) Breakin pad, check MQCs, if OK start product.
FAB6 SLURRY PASSDOWN FROM KYLE:
A new batch of slurry (lot #2h-16-96-1) was manually pumped to
CMP.A2 due to the problems we are currently having with low rates.
The results were:
head 1-1300
head 2-1115
Directly after this, the slurry from the day tank was hooked back up
and the results were as follows:
head 1-1132
head 2-1054
Based on the above, I have asked Ashland Chemical to dump the current
day tank and replenish the slurry with the new batch. We should have
new slurry by 6pm or 7pm tonight. The change over should be transparent
to operations. Unfortunately, there is only enough slurry of this
batch to tide us over through the weekend. Then a new batch will have
to come on line.
- Kyle
|
| 63.129 | CMP PD | STRATA::TDYER | | Fri Oct 04 1996 18:04 | 60 |
| +---+---+---+---+---+---+---+
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 4th, 1996
cc: Jim Scott From: Timothy P. Dyer
Dept: Equipment Engineering
Weekly.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
WSTK.2 -UP.
CMP.B1 - THE REOCCURRING CRASHES DUE TO EXCESSIVE VIBRATION HAS BEEN FIXED,
NOW IT'S TIME TO MOVE ON TO THE HEAD-1 STALLING PROBLEM.
TESTING CONDUCTED TODAY:
1) Connected a chart recorder to the input of the down force EPRVs.
2) Connected multi meter head-1 infranor and monitored the Im (motor
current)
3) Monitored actual down force displayed on the screen
FINDINGS:
1) Head-1 EPRV has a higher voltage input for a longer period of
time. This means that the EPRV will put out higher pressure to
head-1 for a longer period of time.
2) IM on head-1 spikes up to 4-5v, the other heads are closer to 2v.
We can conclude that the EPRV is working, it is sending out higher
pressure to head-1 and is causing the motor to pull more current.
3) The actual DF displayed for head-1 shoots up to ~450lbs, and
slowly drops to 377. The other heads overshoot much less and
return to set point much quicker. Head-5 constantly goes to 380,
than with in seconds drops to set point of 377, it runs flat line
for the entire polish,,,,,,,a model head!
Analog out put PCB has been replaced. Head-1 IM is still high around
5v, the EPRV is intermittently spiking to, actual DF on the screen
for head-1 is spiking upto ~415lbs. We witnessed a stall on all 5
heads all PRV signals spiked high.
Held a conference call with SF Phoenix, presented above findings.
QUOTES FROM SPEEDFAM PHOENIX: "OH YEH, HEAD-5 DOES RUN BETTER THAN
1-4. WE DISCOVERED THIS SOFTWARE BUG SEVERAL WEEKS AGO, WE HAVE A
FIX. WE CAN STOP THE OVER SHOOTING ON ALL HEADS AND HAVE THEM RUN
LIKE HEAD 5. THERE IS AN ERROR IN THE CODING FOR HEADS 1-4."
So, what do we do. After checking one last item, head down sensors,
the tool will be released to MFG with a warning. Should the head stall
at touch down, the recipe will need to be restarted. If it errors mid
polish, record time, unload, make recipe with remaining time.
On Tuesday we will upgrade the software and test the system.
|
| 63.130 | CMP PD | STRATA::TDYER | | Fri Oct 18 1996 18:00 | 36 |
| +---+---+---+---+---+---+---+
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 18th, 1996
cc: From: Timothy P. Dyer
Dept: Equipment Engineering
CMP.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
The BAG filtration unit is running if there are any problems contact ASHLAN
Chemical, they will replace the bag with an other 10u bag.
CMP.B1 - Head-1 rebuild is complete, the DF is being calibrated at this time.
Once Speedfam and Digital Techs are satisfied with the integrity of
the polisher a 100W marathon will be run at 400lbs of DF for 30seconds
in step 5.
Call me at the start and Finish of the marathon, I will RELEASE the
system from home. (508-699-4905) OR PAGED (508-387-1389).
** REMINDER FOR SUPERVISORS **
IF THE SPEEDFAMS ARE DOWN FOR >4 HOURS, SPEEDFAM IS TO BE PAGED AT
THE 24h RESPONSE LINE # 800-276-9149, THEY WILL CONTACT OUR REPS.
AND SUPPORT WILL BE VIA PHONE.
Onsite coverage after 8pm can only be authorized by the supervisors.
If Speedfam works past 8pm or on weekends on their own behalf or to finish
up on existing problems, it will not be billable.
|
| 63.131 | CMP PD | STRATA::TDYER | | Mon Oct 21 1996 19:33 | 29 |
| +---+---+---+---+---+---+---+
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 21st, 1996
cc: From: Timothy P. Dyer
Dept: Equipment Engineering
CMP.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
CMP.B1 - Still down for head-1 work. All analog input values were showing max
at 4095. Problem isolated to chiller channel. Head-1 work continues.
- Speedfam will have 5 reps here tomorrow and go into shift work.
CMP.B3 - High particles. The 10u bag filter was replaced with a 5u filter,
still high particles. The osmonic filter was put on line. Particles
were tested on the ENG_MQC recipe with the osmonic filter online for
45min. This test also failed. Bag filter put back on line @5u.
Particle test will be repeated with the standard MQC recipe and the
ENG2_MQC recipe. If the ENG2_MQC passes and the standard fails, all
recipes will require 2 seconds added to step-6. Should this not pass,
try a local 5u catridge filter.
|
| 63.132 | CMP PD | STRATA::TDYER | | Tue Oct 22 1996 19:10 | 41 |
| +---+---+---+---+---+---+---+
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 22nd, 1996
cc: From: Timothy P. Dyer
Dept: Equipment Engineering
CMP.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
WSTK.2 - SHUT DOWN FOR PROCESS/SPEED ISSUES.
CMP.B1 - SEE BRENDENS UPDATE.
HIGH PARTICLES ON ALL CMP TOOLS SUMMARY/UPDATE:
Task/test results
- Switch from 10u to 5u bag filter.......................bad
- Switched back to osminic filter ....................... bad
- Switch back to 5u bag + extended rinse step.............bad
- Dump and rinsed day tank, refilled with 2I-1796-16......bad
- Installed local filters.................................bad
- Tested lot 2I-1796-22 locally on A1.....................good
- Tested lot 2I-1796-16 locally on A1......................good
- Flushed complete slurry system, filled with -22.........good
All tools passed particles, we need to retry -16 lot, in a controlled manner,
on the bulk system. Based on the data it appears the BULK system itself was
contaminated. A WEEKLY flush may be necessary. A 4 hour a week shut down
is easier to deal with than 2 days of troubleshooting followed by a 4 hour
shut down? This is the 2 time we have been forced to flush the slurry system
for particles in the last 6 weeks. A discussion with Ashlan and MFG will held.
|
| 63.133 | CMP PD | STRATA::TDYER | | Wed Oct 23 1996 20:03 | 51 |
| +---+---+---+---+---+---+---+
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 23rd, 1996
cc: From: Timothy P. Dyer
Dept: Equipment Engineering
CMP.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
CMP.B1 - SEE BRENDENS UPDATE. (motor due in 11pm, will need 200 wafer
marathon @400lbs)
HIGH PARTICLES ON CMP.B TOOLS SUMMARY/UPDATE:
The A tools passed well below the ucl. We focused today on the cleaning steps
on the B tools. B3 crashed while attempting a 21sec 337lb step 6. The final
process which ran with out vibration and passed particles on B2 was as follows:
step 1-5 NO CHANGE
step-6 377df, 19sec, water, no osc=11.5/11.5
step-7 277df, 30sec, water, no osc=11.5/11.5
step-8 20df, 13sec, water, no osc=11.5/11.5
step-9 20df, 7sec, water, no osc=11.5/11.5
step-10 lift off no osc=11.5/11.5
results repeated, last counts were:
head-1 lrg total sct
189 614 0
181 621 0
177 601 0
166 539 0
169 559 0
Plan:
1) match B3's MQC recipe to B2, check mqcs.
2) check uniformity on B2,,,,,was not checked today.
3) Change step6-10 on B2 and B3 for the following recipes:
all ILD recipes
TUP_A
. TUP_b
. TUP_c
. TUP_d
. TUP_e
. TUP_f
|
| 63.134 | CMP PD | STRATA::TDYER | | Wed Oct 23 1996 20:14 | 71 |
| +---+---+---+---+---+---+---+
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: October 23rd, 1996
cc: From: Timothy P. Dyer
Dept: Equipment Engineering
CMP.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
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CMP PASSDOWN
-----------------------------------------------------------------------------
WSTk.1 - still shut down.....
CMP.B1 - SEE BRENDENS UPDATE. (motor due in 11pm, will need 200 wafer
marathon @400lbs)
HIGH PARTICLES ON CMP.B TOOLS SUMMARY/UPDATE:
** added section, details on the B tools **
Our standard mqc recipe uses a 10 second rinse step-6 with DI water. Only
the last 2 seconds have full water on the table. We timed the transition today
and found it to be 17 seconds. This lead us to the experiments around increase
rinse time. After finding a step that would not vibrate, we still had particle
levels close to the ucl. A center lift off was combined with an extended
step-6.
The change in transition time from 6 to 17 seconds is not fully understood.
The slurry tubes were replace don B2 and B3 last week. Although the tubes appear
the same, the new style tubes have a very thin Teflon lining on the id of the
tubbing?@#$@#%....
Now that the B tools are performing like the A tools for particle counts,
should there be a slurry issues, both system should fail on the same day,
making trouble shooting easier. If slurry does go adrift, the plan is to
perform a KoH extended purge, and start up on the osminic filter.
****
The A tools passed well below the ucl. We focused today on the cleaning steps
on the B tools. B3 crashed while attempting a 21sec 337lb step 6. The final
process which ran with out vibration and passed particles on B2 was as follows:
step 1-5 NO CHANGE
step-6 377df, 19sec, water, no osc=11.5/11.5
step-7 277df, 30sec, water, no osc=11.5/11.5
step-8 20df, 13sec, water, no osc=11.5/11.5
step-9 20df, 7sec, water, no osc=11.5/11.5
step-10 lift off no osc=11.5/11.5
results repeated, last counts were:
head-1 lrg total sct
189 614 0
181 621 0
177 601 0
166 539 0
169 559 0
Plan:
1) match B3's MQC recipe to B2, check mqcs.
2) check uniformity on B2,,,,,was not checked today.
3) Change step6-10 on B2 and B3 for the following recipes:
all ILD recipes
TUP_A
. TUP_b
. TUP_c
. TUP_d
. TUP_e
. TUP_f
|
| 63.135 | C SHIFT CMP PASSDOWN | FABSIX::B_WESTPHAL | | Sat Oct 26 1996 20:45 | 40 |
| CMP Equipment Engeering Passdown for:
26-OCT-1996 19:43:26.30
CMP Down Equipment listing for Fab6
====================================
No Equipment Down
CMP.B1 - Down for "ROTATION OUT OF TOLERANCE" errors and some voltage readings
that needed to be taken by SFAM. Rep in formed me that the error
response time needed to be adjusted temporarily to correct the error
problem. John H. & Rich B. hooked up an O-scope and a Dranetz
analyzer to the power in on various carrier rotation motors. Tool was
put to END_REPAIR.
CMP.B3 - Down for head to head removal being out (head 2). Swapped the carrier
and process rechecked the MQCs. They failed. The DF was checked.
The EP regulators and DF were adjusted for each head.
PRE POST
381.5 377.2
371.9 377.2
373.1 377.8
369.9 376.9
371.2 377.0
The tool was set to verify-U to have the MQCs rechecked. The MQCs
passed so the repair was ended.
*Note - Slurry system was shut down for the filter change at 4pm this
afternoon. The next filter change is now scheduled at 8:30am tomorrow (per
Ashland). We were also notified that they are out of Ossmonics filters as of
8:30am tomorrow.
**Note - Slurry sensors for the B tools were checked to verify proper
operation as requested by Process Engineering.
***Note - All pm completed.
|
| 63.136 | CMP PD | STRATA::TDYER | | Mon Nov 04 1996 16:15 | 28 |
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I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: November 4th, 1996
cc: From: Timothy P. Dyer
Dept: Equipment Engineering
CMP.dis Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
CMP.B1 - False rotation alarms continued through out the day. The software
is being switched over to 493c, with head-1 and 3 irms @ 14v and
intv loop at 75. If head-1 fails during testing, we will be forced
to live with 494-dec. Please move the entire 494d directory and
rename, save all recipes. Move 493cc back into the Speedfam
directory, and all it's recipes. Test breakin-1,2,3, IO_MQC and
ild-1 recipes with oxide wafers. Make sure step-6 time coincides with
1-2 seconds of water at the very end of step-6.
|
| 63.137 | CMP PD | STRATA::TDYER | | Fri Nov 15 1996 15:26 | 32 |
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I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: November 15th, 1996
cc: cmp.dis From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
CMP.B1 - up
CMP.B2 - down. Investigate head-5 alignment drift problem. Plan:
1 Replace infranor................motor still shakes
2 Replace DCX dughter pcb.........
3 Replace DCX mother pcb..........
4 Replace osc motor (do not go to this step with out contacting me)
Between each step, cycle head-5 in and out several times, move the
multi-head, trip the door interlocks, and VERIFY head-5 load cup
alignment. Do this 10-15 times, if it is repeatable, put the system
up, if it is not continue with next step.
If there are any slid outs from head-5, proceed to next step.
CMP.B3 - up.
|
| 63.138 | CMP PD | STRATA::TDYER | | Mon Nov 25 1996 16:18 | 26 |
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I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: November 25th, 1996
cc: cmp.dis From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
CMP.B1 - verify. Monitors crashed due to head-3 stall.
CMP.B2 - up
CMP.B3 - up. Slurry-3 reconnected, DI water is flowing to 2nd table.
Osmonic filters remove today and the FILTER-RITE was installed. Ashlan will
monitor pressure and we will monitor particle. Should either fail, the
Osmonic will be put back on line.
|
| 63.139 | Updated EEG passdown, change to CMP.B1 | FABSIX::R_GEE | | Mon Nov 25 1996 19:06 | 37 |
| <<< ASDG::DISK$SYS_DATA:[NOTES$LIBRARY]CMP.NOTE;1 >>>
-< CMP >-
================================================================================
Note 63.138 EEG CMP DAILY PD 138 of 138
STRATA::TDYER 26 lines 25-NOV-1996 16:18
-< CMP PD >-
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(semiconductor)
I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: November 25th, 1996
cc: cmp.dis From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
CMP.B1 - up. Monitors crashed due to head-3 stall.
NOTE: If head #3 stalls again, take it off-line and run
another set of MQC's using 4 heads only. Head #3
will stay off-line until further notice, per Engineering.
CMP.B2 - up
CMP.B3 - up. Slurry-3 reconnected, DI water is flowing to 2nd table.
Osmonic filters remove today and the FILTER-RITE was installed. Ashlan will
monitor pressure and we will monitor particle. Should either fail, the
Osmonic will be put back on line.
|
| 63.140 | CMP PD | STRATA::TDYER | | Tue Nov 26 1996 15:58 | 39 |
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I N T E R O F F I C E M E M O
To: Dennis Goodwin Date: November 25th, 1996
cc: cmp.dis From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
HAPPY THANKSGIVEN TO ALL, EAT WELL AND RELAX AS THE COWBOYS
KICK SOME BUTT!
CMP.B1 - UP. Modified motor tested in head-3, the motor failed, original
was re-installed.
IF HEAD-3 HAS ANY INSTANCES OF ROTATION STALLING, TAKE HEAD-3 OFF
LINE AND RE-MQC WITH 4 HEADS AND RELEASE TO MFG. WE DO NOT WANT TO
RISK BREAKING PRODUCT WAFERS.
CMP.B2 - up
CMP.B3 - up.
FILTER-RITE is still running on slurry loop. Ashlan will continue to monitor
pressure and we will monitor particle. Should either fail, the Osmonic will
be put back on line. If particles fail on one SPEEDFAM polisher, verify tool
is clean and check a 2nd SPEEDFAM polisher for particle levels. Should a 2nd
tool fail, the slurry is confirmed as the source. Contact Engineering (Jim T
will be here 11/27, I can be reached 11/29-12/1 at home or pager) and contact
Ashlan and request the y put the Osminics back on line. Enter time/date,
problem, ie pressure, clog or particles in notes file.
I WILL NOT BE IN TOMMOROW 11/27, PLEASE SEE JIM TOOKER FOR ANY ISSUES.
|
| 63.141 | CMP PD | STRATA::TDYER | | Wed Dec 04 1996 18:05 | 34 |
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I N T E R O F F I C E M E M O
To: cmp.DIS Date: December 4th, 1996
cc: cmp.dis From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
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CMP.PD
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cmp.b1 - Verify. wafer detect tripped erroneously. A shift calibrated same.
cmp.b2 - up
cmp.b3 - THE MAIN MOTOR REPLACEMENT JOB IS COMPLETED AND ACCEPTED.
Belt tension, alignment, runout all look good, the motor and belts
were quiet under full load conditions. During the mini-marathon,
we noticed slurry-2 intermittently turned off. Once slurry-2 is up
and verified working CMP.B3 can be released to MFG for MQCs and
product if everything comes in spec. EEG monitor underside of polisher
for any leaks, strange noises, etc.
SLURRY - The milipore filter is online in the basement. Should particles
fail on more than one Speedfam or the filter clog, switch over
to the osmonics filter.
|
| 63.142 | CMP PD | STRATA::TDYER | | Fri Dec 20 1996 13:52 | 38 |
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I N T E R O F F I C E M E M O
To:Dennis Goodwin Date: December 20th, 1996
cc: cmp.dis From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP.PD
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cmp.b1 - UP. If head 2,4,5 stall, please note the actual down force on the
screen. If you did not witness the stall load some oxide dummies.
and run the and watch the actual DF on the screen, RECORD ALL
OBSERVATIONS IN THE NOTES FILE. If there is excessive overshoot,
>450lbs, page Speedfam. They will need to determine why B1 is
overshooting more than B2,3. If the df does no spike high,
replace the infranors for the stalling heads, set IRMs to 12.5V
and test the tool at 425 lbs of DF with 50 wafers.
cmp.b2 - up
cmp.b3 - Down - 2nd table drive failed, lower shaft bearings failed and are
being replaced.
Speedfam is leading this project, please work with them, they will be
in close contact with Phoenix. A couple specific instructions:
1) JP will manually tap the 6 bolt holes in the 2nd table.
2) Speedfam will locate the alignment procedure and align the 2nd table
drive shaft assembly prior to running any test wafers.
3) Speedfam will get the belt tension specification and set the
correct belt tensions prior to running any wafers.
4) Give me a call or page if there are any complications and prior to
release.
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| 63.143 | CMP PD | STRATA::TDYER | | Fri Jan 03 1997 17:04 | 37 |
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I N T E R O F F I C E M E M O
To: FAB6 CMP Date: January 3rd, 1997
cc: Dennis Goodwin From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
CMP.B1,2,3 - OEM vacuum filters to be installed, and gauge put on BOTH sides
of element for DP readings. The filters from SR-94 have changed,
for reasons unknown and are clogging in 1-2 days.
CMP.B2 - 8 wafers from lot xd0590 broke/scratched on 2nd table. The ONLY
time we have experienced crashes on 2nd table is when an out of
pocket condition occurs during the lift off from the 1st table.
Test this theory by stopping the polisher immediately after lift
off from the primary table. Inspect all wafers for out of pocket
conditions. If they are in fact out, the vacuum must be improved or
the surface tension reduced.
DEC and SF reps will work to isolate a potential low vacuum problem.
The collapsing tubing in the multihead will be replaced, the vacuum
filter replaced and the pump rebuilt. This should improve the
vacuum at the carriers to ~25". If vacuum is in spec and wafers
continue to come out of pocket, change the last two step of the
recipes to 12.9 (from 12.7) and retest. If wafers remain in pocket,
check MQCs. If MQCs pass run marathon.
INCLUDING BREAKIN AND MQC WAFERS, CMP.B2 IS TO RUN A 100 WAFER MARATHON
BEFORE RELEASING TO MFG. THIS SYSTEM HAS BROKEN 12 PRODUCT WAFERS IN 4 DAYS
ANY QUESTIONS, GIVE ME A CALL.
|
| 63.144 | CMP PD | STRATA::TDYER | | Fri Jan 17 1997 16:19 | 50 |
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I N T E R O F F I C E M E M O
To: FAB6 CMP Date: January 17th, 1997
cc: Dennis Goodwin From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
**** I no longer have a long range pager ****
CMP.B1,2,3 - No issues. If head stalls occur on B1, document every possible
detail and give me a call
CMP.B4 - Mechanical acceptance testing will be run this weekend with a
barrels connected locally to each slurry channel. Once Speedfam
has completed their testing and set up, they will inform Brian J.
and he will start the marathon. The following test and recipes
will be run.
wafers recipe
5 bin-1
5 bin-2
5 bin-3
5 breakin
5 IO_MQC
5 IO_MQC
pre-read 5 12k ---> 5 IO_MQC post read and record, continue....
5 MECH_400 (400lbs)
5 MECH_400 (400lbs)
5 MECH_400 (400lbs)
450 MECH_30 (313lbs, 30 seconds)
------
TOTAL = 500
* TWO ASSIST ARE ALLOWED IN THE 500 WAFER MARATHON, IF A FAILURE
OCCURS, RE-START THE MARATHON AND CALL ME.
* PLEAS SEE BRIAN J. FOR MARATHON STATUS PASSDOWN, ONE DIGITAL
TECHNICIAN IS TO BE PRESENT DURING TEST.
(home phone 508 699-4905)
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| 63.145 | CMP PD | YIELD::TDYER | | Tue Feb 18 1997 16:38 | 27 |
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I N T E R O F F I C E M E M O
To: FAB6 CMP Date: 2/18/97
cc: Dennis Goodwin From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
**** I no longer have a long range pager ****
CMP.B1,2,3,4 - No issues.
CMP.A2 - Down for platen sweep out od spec at .060". Strasbaugh does have
anyone available today. This system is having a difficult time because
the frame supporting the gear box was damaged when the polisher was
dropped through the floor 2 years ago. Remove bolts and rebolt
transmission, re-check sweep. Bolt holes or bolt may require rework to
increase available adjustment distance.
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| 63.146 | CMP PD | YIELD::TDYER | | Wed Feb 19 1997 16:54 | 33 |
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I N T E R O F F I C E M E M O
To: FAB6 CMP Date: 2/19/97
cc: Dennis Goodwin From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
**** I no longer have a long range pager ****
CMP.B1 - Crash. It appears 1 wafer broke into very very small pieces during
one of the polish steps. The pieces were too small to be detected by
the wafer loss sensors. The tool continued to polish with the wafer
chips on the pad, these chips totally scratched the 3 remaining
product wafers. When the polisher attempted pad lift off, it errored
for vacuum. Speedfam reps cleaning up tools, replacing carriers,
pads and investigating possible cause.
CMP.B,2,3,4 - No issues.
CMP.A2 - Down for platen sweep out of spec at .060". The 1st 5/8" of the
6 bolts have been turned down to the minor ID of the threads. This
allow more lateral adjustment. JP and JS are bolting transmission back
in at this time. Sweep will be set to +/- .001" front to back and
leveled side to side with precision machinist level. Spindle will
need realignment.
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| 63.147 | CMP PD | YIELD::TDYER | | Fri Feb 21 1997 16:44 | 33 |
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I N T E R O F F I C E M E M O
To: FAB6 CMP Date: 2/21/97
cc: Dennis Goodwin From: Timothy P. Dyer
Dept: Equipment Engineering
Ext: 5072
Node: SCOMAN::TDyer
Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
CMP PASSDOWN
-----------------------------------------------------------------------------
**** I no longer have a long range pager ****
CMP.D1-7 - System has arrived in tack and is being stored in the passthrough
until Monday when it will be placed on the pedestals.
CMP.C1-7 - Slurry pump lines ruptured twice on sc-112 lines, filter may be
clog or TOO small u rating. BW is on it.
CMP.B1 - Crash. The root cause of the last two crashes was due to a bad slurry
pump, ie reduced slurry flow. Additionally, wafer detect was disabled
for reasons unknown, it has been turned back on.
CMP.B4 - The slurry to B4 from the MEGA system has been turned on. There are
still some minor problems with the mix unit and dosimeter. We do not
have confidence in the current batches and will wait until the issues
are resolved on Monday before starting process qual.
|