T.R | Title | User | Personal Name | Date | Lines |
---|
160.1 | The MOS Transistor 17-AUG-92 - 21-AUG-92 | SHARE::STARVASKI | | Wed Jul 01 1992 11:34 | 67 |
160.2 | Characterization of Materials on the Nanometer Scale - 25-AUG-92 | SHARE::STARVASKI | | Wed Aug 12 1992 15:16 | 72 |
160.3 | Interconnect & Delay Testing - 25-SEP-92 | SHARE::STARVASKI | | Fri Sep 11 1992 10:57 | 65 |
160.4 | Electromigration Lifetime at 100 MHZ - 14-OCT-92 | SHARE::STARVASKI | | Fri Sep 18 1992 12:34 | 62 |
160.5 | 200-1200MHz CMOS Techniques | SHARE::STARVASKI | | Thu Jan 14 1993 15:24 | 57 |
160.6 | VLSI THERMAL ISSUES | SHARE::STARVASKI | | Wed Feb 17 1993 10:37 | 95 |
160.7 | designing with the 21064 | PUPIL::STARVASKI | | Thu May 06 1993 15:30 | 233 |
160.8 | Reliability, VLSI Specific - call for details | SHARE::STARVASKI | | Tue Jun 01 1993 12:30 | 110 |
160.9 | MOS Transistor, Operation and Modeling | SHARE::STARVASKI | | Tue Jul 06 1993 17:11 | 98 |
160.10 | Chip Packaging | SHARE::STARVASKI | | Tue Aug 24 1993 12:08 | 78 |
160.11 | M.I.T. Microsystems Tech. Lab. Lectures | SHARE::STARVASKI | | Fri Oct 22 1993 14:26 | 76 |
160.12 | MTL Lecture Series: L.C. Kimerling | SHARE::STARVASKI | | Wed Nov 03 1993 14:15 | 87 |
160.13 | MTL Lecture Series: James Chung | SHARE::STARVASKI | | Tue Nov 16 1993 09:11 | 64 |
160.14 | MTL Lecture Series: Jacob White | SHARE::STARVASKI | | Tue Nov 30 1993 14:03 | 61 |
160.15 | MTL Lecture Series: Charles Sodini | SHARE::STARVASKI | | Wed Dec 08 1993 10:40 | 63 |
160.16 | MTL Lecture Series: Rafael Reif | SHARE::STARVASKI | | Fri Jan 21 1994 08:54 | 52 |
160.17 | FET Modeling | SHARE::STARVASKI | | Fri Jan 21 1994 08:55 | 57 |
160.18 | re: .-2 | DANGER::INGRAHAM | Andy | Fri Jan 21 1994 12:44 | 2 |
160.19 | better late than... | SHARE::STARVASKI | | Mon Jan 24 1994 12:08 | 10 |
160.20 | Reliability: Electromigration | SHARE::STARVASKI | | Wed Mar 02 1994 15:04 | 85 |
160.21 | Packaging: Rheology Measurements | SHARE::STARVASKI | | Fri Jun 24 1994 14:08 | 46 |
160.22 | X-Ray Lithography | SHARE::STARVASKI | | Wed Jul 13 1994 11:56 | 74 |
160.23 | Electrical Test Data | SHARE::STARVASKI | | Wed Jul 13 1994 15:35 | 121 |
160.24 | Spatial Extent of Point Defect Interactions in Si | SHARE::STARVASKI | | Tue Aug 02 1994 11:37 | 61 |
160.25 | Dielectric Metrology | SHARE::STARVASKI | | Tue Aug 02 1994 11:41 | 47 |
160.26 | MCS Technology Appraisal | SHARE::STARVASKI | | Wed Aug 03 1994 10:56 | 65 |
160.28 | Implantation & it's Implications on Oxide | SHARE::STARVASKI | | Mon Aug 15 1994 12:14 | 56 |
160.29 | Dobberpuhl on Low Power/High Performance | SHARE::STARVASKI | | Mon Aug 15 1994 13:52 | 55 |
160.30 | TFT's | SHARE::STARVASKI | | Tue Aug 16 1994 09:11 | 69 |
160.31 | Packaging | SHARE::STARVASKI | | Wed Sep 14 1994 14:15 | 73 |
160.32 | SEG Series | SHARE::STARVASKI | | Thu Sep 15 1994 12:30 | 29 |
160.33 | Interferometry | SHARE::STARVASKI | | Fri Sep 16 1994 15:36 | 75 |
160.34 | SOI Models | SHARE::STARVASKI | | Thu Sep 22 1994 10:36 | 53 |
160.35 | UC Berkeley studies on Power | SHARE::STARVASKI | | Fri Sep 23 1994 10:54 | 103 |
160.36 | Plastic Packaging | SHARE::STARVASKI | | Fri Oct 07 1994 14:05 | 53 |
160.37 | Desktop Serial Bus | SHARE::STARVASKI | | Mon Oct 10 1994 17:15 | 50 |
160.38 | Seg Series #3: Rich Witek | SHARE::STARVASKI | | Thu Oct 13 1994 16:04 | 40 |
160.39 | INTERNAL USE ONLY | SHARE::STARVASKI | | Thu Oct 13 1994 16:07 | 8 |
160.40 | Manufacturing: Statistics | SHARE::STARVASKI | | Wed Oct 19 1994 12:30 | 50 |
160.41 | ETE (including Seminars) is now on the web | SHARE::STARVASKI | | Tue Oct 25 1994 12:01 | 12 |
160.42 | Witek Postponed | SHARE::STARVASKI | | Wed Nov 02 1994 12:30 | 10 |
160.43 | Packaging: Viscoelasticity | SHARE::STARVASKI | | Fri Nov 11 1994 09:25 | 47 |
160.44 | Manufacturing: Process Control | SHARE::STARVASKI | | Fri Nov 11 1994 09:25 | 166 |
160.45 | Packaging: Stress Measurements | SHARE::STARVASKI | | Fri Nov 11 1994 09:27 | 39 |
160.46 | Manufacturing: Limit of Detection | SHARE::STARVASKI | | Fri Nov 11 1994 09:28 | 66 |
160.47 | Interconnect Stress | SHARE::STARVASKI | | Mon Nov 21 1994 10:27 | 42 |
160.48 | Bill Grundmann 1/19/95 | SHARE::STARVASKI | | Tue Dec 20 1994 15:50 | 22 |
160.49 | CAD Tools | SHARE::STARVASKI | | Tue Jan 17 1995 13:18 | 41 |
160.50 | SEG Consultant: Rich Watson | SHARE::STARVASKI | | Tue Jan 24 1995 13:36 | 52 |
160.51 | COURSE: The MOS Transistor | SHARE::STARVASKI | | Mon Feb 06 1995 13:27 | 89 |
160.52 | Witek on ARM | SHARE::STARVASKI | | Tue Feb 07 1995 11:20 | 40 |
160.53 | CAD | SHARE::STARVASKI | | Wed Feb 08 1995 13:33 | 54 |
160.54 | EV5's pin interface: Anil Jain | SHARE::STARVASKI | | Fri Feb 10 1995 11:09 | 58 |
160.55 | Hornbach on Strategies | SHARE::STARVASKI | | Tue Feb 14 1995 10:48 | 44 |
160.56 | Processing: Wafer coat | SHARE::STARVASKI | | Fri Feb 17 1995 09:34 | 40 |
160.57 | Sites on Alpha Bandwith | SHARE::STARVASKI | | Wed Mar 01 1995 12:48 | 66 |
160.58 | Branch Predicting | SHARE::STARVASKI | | Thu Mar 02 1995 14:36 | 70 |
160.59 | flip chip | SHARE::STARVASKI | | Mon Mar 06 1995 11:43 | 37 |
160.60 | | ATLANT::SCHMIDT | E&RT -- Embedded and RealTime Engineering | Mon Mar 06 1995 14:13 | 4 |
160.61 | w/out specifics... | SHARE::STARVASKI | | Mon Mar 06 1995 14:51 | 4 |
160.62 | SEG CONSULTANT GEOF LOWNEY ON COMPILIERS | SHARE::STARVASKI | | Tue Mar 14 1995 15:24 | 36 |
160.63 | Flip Chip gets bumped | SHARE::TSS | | Wed Mar 15 1995 10:16 | 11 |
160.64 | Instruction Level Parallelism | SHARE::STARVASKI | | Wed Mar 29 1995 15:11 | 95 |
160.65 | Low-Current/Voltage MOS Modeling | SHARE::STARVASKI | | Thu Mar 30 1995 11:12 | 42 |
160.66 | Neural Network Research at Mitsubishi | SHARE::STARVASKI | | Tue Apr 04 1995 11:42 | 50 |
160.67 | Arch/Compiler Perf. Eval. | SHARE::STARVASKI | | Thu Apr 06 1995 10:43 | 54 |
160.68 | Sematech Assignee Presentation | SHARE::STARVASKI | | Tue Apr 18 1995 14:27 | 53 |
160.69 | MANUFACTURING COURSE | SHARE::STARVASKI | | Wed Apr 19 1995 14:58 | 142 |
160.70 | Electromigration | SHARE::STARVASKI | | Tue May 02 1995 16:59 | 70 |
160.71 | Manufacturing: Process Simulation | SHARE::STARVASKI | | Mon May 08 1995 15:03 | 51 |
160.72 | Packaging: SEMATECH activities | SHARE::STARVASKI | | Wed May 10 1995 13:06 | 56 |
160.73 | | SHARE::TSS | | Wed May 17 1995 12:18 | 84 |
160.74 | Simultaneous Multithreading (HOT TOPIC! /p) | SHARE::STARVASKI | | Wed May 31 1995 15:48 | 72 |
160.75 | Dielectric Breakdown | SHARE::STARVASKI | | Fri Jun 16 1995 10:39 | 57 |
160.76 | On Chip Interconnect | SHARE::STARVASKI | | Fri Jun 30 1995 12:15 | 30 |
160.77 | A bit long, yes? | WRKSYS::INGRAHAM | Andy | Sun Jul 02 1995 12:20 | 1 |
160.78 | | PUPIL::STARVASKI | | Wed Jul 05 1995 11:03 | 5 |
160.79 | Chip Cooling | SHARE::STARVASKI | | Mon Jul 24 1995 11:54 | 59 |
160.80 | Packaging Alternative: Tiled Silicon | PUPIL::STARVASKI | | Wed Aug 09 1995 13:47 | 71 |
160.81 | PACKAGING RESEARCH AT SRC | SHARE::STARVASKI | | Fri Aug 11 1995 12:31 | 46 |
160.82 | Prefetching Strategies | SHARE::STARVASKI | | Fri Aug 18 1995 10:39 | 78 |
160.83 | Ed Burdick on CAD 07-SEP-95 | SHARE::BISHOP | | Thu Aug 31 1995 10:24 | 75 |
160.84 | Alpha Product Family Update | SHARE::STARVASKI | | Tue Sep 12 1995 14:39 | 64 |
160.85 | Course on Electrical Test Data from Fab | SHARE::STARVASKI | | Fri Sep 15 1995 17:16 | 127 |
160.87 | Or is my view through the prism jaundiced? | ATLANT::SCHMIDT | See http://atlant2.zko.dec.com/ | Fri Sep 22 1995 13:09 | 3 |
160.88 | MICA - DECwindows version of ALL-IN-1? | VELI::KORKKO | Veli K�rkk� @FNO, 879-5512, GPS FNO | Fri Sep 22 1995 15:58 | 6 |
160.89 | Call it TRAX or JUPITER? | WIBBIN::NOYCE | EV5 issues 4 instructions per meter | Fri Sep 22 1995 16:22 | 4 |
160.90 | | STAR::CROLL | | Mon Sep 25 1995 10:23 | 4 |
160.91 | SEG Series: The MICA Project | SHARE::STARVASKI | | Tue Sep 26 1995 13:30 | 53 |
160.92 | Branch Prediction | SHARE::TSS | | Mon Oct 09 1995 10:59 | 46 |
160.93 | | MOVIES::ROBLES | Russell Robles, EDO 13 | Tue Oct 10 1995 05:47 | 3 |
160.94 | Yes, they are usually taped | SUBPAC::FARICELLI | | Tue Oct 10 1995 06:36 | 5 |
160.95 | | MOVIES::ROBLES | Russell Robles, EDO 13 | Tue Oct 10 1995 10:44 | 3 |
160.96 | Taping | SHARE::STARVASKI | | Thu Oct 12 1995 12:08 | 10 |
160.97 | Multiprocessing | SHARE::TSS | | Mon Oct 16 1995 11:00 | 49 |
160.98 | REGISTER ALLOCATION | SHARE::STARVASKI | | Mon Oct 23 1995 09:02 | 58 |
160.99 | VLIW's - The TINKER Project at NCSU | SHARE::STARVASKI | | Tue Oct 24 1995 09:45 | 62 |
160.100 | Low Power Techniques | SHARE::STARVASKI | | Fri Nov 03 1995 13:38 | 112 |
160.101 | COURSE: Manufacturing Process/Back End | SHARE::STARVASKI | | Mon Nov 06 1995 13:35 | 144 |
160.102 | Manufacturing: Etch | SHARE::STARVASKI | | Wed Nov 08 1995 16:03 | 30 |
160.103 | The GNU C Compiler | SHARE::STARVASKI | | Fri Nov 10 1995 09:13 | 55 |
160.104 | DRAM DATA DUMP | SHARE::STARVASKI | | Mon Nov 20 1995 14:32 | 55 |
160.105 | Low Power Design | SHARE::STARVASKI | | Tue Jan 16 1996 09:04 | 90 |
160.107 | SPEC article | QUABBI::"nikhil" | R.S. Nikhil | Tue Jan 23 1996 18:22 | 31 |
160.108 | Linux Symposium | SHARE::STARVASKI | | Thu Jan 25 1996 13:15 | 110 |
160.109 | E-Test Course (Reposted with new date/time) | SHARE::STARVASKI | | Thu Feb 08 1996 14:02 | 126 |
160.110 | Branch Prediction | SHARE::STARVASKI | | Mon Feb 12 1996 16:23 | 48 |
160.111 | Lab Analysis: Nitride | SHARE::STARVASKI | | Tue Feb 20 1996 09:49 | 44 |
160.112 | Course Announcement: Intro to Material Science | SHARE::STARVASKI | | Wed Feb 21 1996 11:06 | 78 |
160.113 | RE: Last | SHARE::TSS | | Wed Feb 21 1996 14:14 | 9 |
160.114 | Source Level Debuging of Optimized Code | SHARE::STARVASKI | | Tue Mar 19 1996 14:15 | 54 |
160.115 | Prediction in Micro-architecture | SHARE::STARVASKI | | Wed Mar 20 1996 09:25 | 66 |
160.116 | Phase Lock Loops | SHARE::STARVASKI | | Wed Mar 20 1996 09:27 | 113 |
160.117 | Device Analysis | SHARE::STARVASKI | | Thu Mar 21 1996 09:03 | 67 |
160.118 | Event Monitoring | SHARE::STARVASKI | | Thu Mar 28 1996 14:40 | 86 |
160.119 | Seminar Reference | SHARE::STARVASKI | | Fri Mar 29 1996 11:56 | 6 |
160.120 | Array restructuring for Cache Locality | SHARE::STARVASKI | | Fri Mar 29 1996 11:58 | 56 |
160.121 | | SHARE::STARVASKI | | Tue Apr 16 1996 09:58 | 6 |
160.122 | Modeling of Electromigration | SHARE::STARVASKI | | Fri May 03 1996 12:33 | 52 |
160.123 | Reliability: Mechanical stress | SHARE::STARVASKI | | Fri May 03 1996 14:45 | 50 |
160.124 | Jet Vapor Deposition | SHARE::STARVASKI | | Fri May 17 1996 11:48 | 104 |
160.125 | Processing: Contamination | SHARE::STARVASKI | | Thu May 30 1996 17:06 | 57 |
160.126 | Processing: Contaminants in Wet Cleans | SHARE::STARVASKI | | Fri May 31 1996 15:03 | 104 |
160.127 | WTI Curriculum Announcement | SHARE::STARVASKI | | Fri May 31 1996 15:23 | 43 |
160.128 | Program Profiling | SHARE::TSS | | Tue Jun 18 1996 16:04 | 55 |
160.129 | Processing: Particle detection | SHARE::TSS | | Thu Jul 11 1996 09:20 | 60 |
160.130 | Reliability: Electromigration | SHARE::TSS | | Fri Jul 12 1996 15:28 | 84 |
160.131 | COURSE: IDDQ Testing | SHARE::TSS | | Tue Sep 03 1996 15:30 | 78 |
160.132 | | ATLANT::SCHMIDT | See http://atlant2.zko.dec.com/ | Tue Sep 03 1996 15:41 | 5 |
160.133 | How about Iddq? (http://www-micrel.deis.unibo.it/aei/vol8num2/dalpasso.html | RICKS::PHIPPS | DTN 225.4959 | Tue Sep 03 1996 19:01 | 24 |
160.134 | | ATLANT::SCHMIDT | See http://atlant2.zko.dec.com/ | Tue Sep 03 1996 21:51 | 5 |
160.135 | Half-Adder | SHARE::STARVASKI | | Fri Sep 13 1996 11:39 | 75 |
160.136 | Customer's Views: BBN on Alpha | SHARE::TSS | | Fri Sep 13 1996 14:33 | 44 |
160.137 | Memory System Design for Dynamic Scheduling | SHARE::STARVASKI | | Mon Dec 30 1996 10:15 | 69 |
160.138 | Synthesis: Sequential Optimization | SHARE::STARVASKI | | Fri Jan 10 1997 10:45 | 67 |
160.139 | Synthesis: Low Power considerations | SHARE::STARVASKI | | Mon Jan 13 1997 09:05 | 62 |
160.140 | EV6 Overview | SHARE::STARVASKI | | Mon Jan 13 1997 12:56 | 54 |
160.141 | ISSCC comes to HLO | SHARE::STARVASKI | | Wed Jan 15 1997 14:44 | 202 |
160.142 | Reliability: Charged Device Models | SHARE::STARVASKI | | Wed Jan 22 1997 08:54 | 77 |
160.143 | Compilers: Out-of-Core Parallel Programs | SHARE::STARVASKI | | Thu Jan 23 1997 16:09 | 65 |
160.144 | 3D Graphics | SHARE::STARVASKI | | Mon Feb 03 1997 09:21 | 47 |
| Title 3D Graphics: A Technology Comes of Age
Instructor Lynn Thorsen-Jensen
Date 10-FEB-97 - 10-FEB-97
Time 1:30 - 3:30
Location Cafe Annex HLO2-2/N4
ARGO to Austin
Videotapes will be available in HLO, Palo Alto and
Austin libraries.
Course Number 73C03-HA
Registration No Registration required
ABSTRACT Three-dimensional graphics make use of the
widest bandwidth available between humans and computing
systems: our eyes.
With the advent of consumer-level awareness of 3D graphics,
the emphasis on the technology at the low-end has brought
out a wide array of vendors, movers-and-shakers, and
markets that threaten to topple the king-of-the graphics
hill, Silicon Graphics. What does this mean to the
technical market? Are there still opportunities for the
traditional graphics vendors? What does Digital stand to
gain or lose from the momentum building in this area?
This two-hour presentation starts with 3D computer graphics
fundamentals, gives an overview of the development of the 3D
technology and markets, and ends with a discussion of
DIGITAL as a supplier of this technology.
ABOUT THE SPEAKER: Lynn Thorsen-Jensen is the Graphics Line
Manager for Graphics & Multimedia in the Workstation
Business Segment. She joined Digital in April of 1996,
bringing with her 14 years of 3D graphics expertise from
her years with Evans & Sutherland. Evans & Sutherland is
a high-performance computer graphics company based in
Salt Lake City, Utah. Her last position at E&S was
Director of Marketing, where she managed the marketing
resources, product management, PR, and marketing
communications for a line of high-performance 3D
graphics accelerators. She is well-known in the field
of computer graphics and has served on many industry-wide
panels.
|
160.145 | compcon comes to HLO | SHARE::STARVASKI | | Wed Feb 05 1997 16:06 | 78 |
|
TITLE: COMPCON '97 Presentations
SPEAKERS: Ray Hookway, Peter Bannon, Dan Leibholz
DATE: February 18th
TIME: 2:00pm - 3:30pm
ROOM: Cafe' Annex, HLO2
Overview:
Compcon is one of the country's preeminent computer technology conferences.
Sponsored by the IEEE's Computer Society it has been held annually since 1955.
This years compcon will be held from February 23rd through the 26th in San
Jose' California. DIGITAL is proud to have three papers being presented at
this year's conference by Engineers from Digital Semiconductor. The papers
complete a session entitled "DEC Alphas: Servers to Desktop". Individually
they are:
1. Digital FX!32: Running x86 Applications on Alpha NT
2. The Alpha 21164PC Microprocessor
3. The Alpha 21264: A 500 MHz Out-of-Order Execution Microprocessor
The seminar being held in Hudson on the 18th will feature these three
papers. It is a chance for those Digital employees not able to attend
compcon to hear the presentations as well as to give our speakers practice
in front of a friendly audience. The abstracts, in the order that they
will be presented in Hudson, follow. For more information on compcon
check out: http://www.compcon.org/
Title: Digital FX!32: Running x86 Applications on Alpha NT
Speaker: Ray Hookway
Abstract:
DIGITAL FX!32 is a unique combination of emulation and binary
translation which makes it so that any 32-bit program which runs on an
x86 system running Windows NT 4.0 will install and run on an Alpha
Windows NT 4.0 system. After translation, x86 applications run as fast
under DIGITAL FX!32 on a 500Mz Alpha system as on a 200Mz Pentium-Pro.
The emulator and its associated runtime provide for transparent
execution of x86 applications. The emulator uses translation results
when they are available and produces profile data which is used by the
translator. The translator provides native Alpha code for the portions
of an x86 application which have been previously executed. A server
manages the translation process for the user, making the overall
process completely transparent.
Title: The Alpha 21164PC Microprocessor
Speaker: Peter Bannon
Abstract:
The internal architecture of a 2000 MIPS/1000 MFLOPS (peak)
high-performance low cost CMOS Alpha micro-processor chip is
described. This implementation is derived from the Alpha 21164
microprocessor to reduce cost while maintaining high performance.
It contains a quad-issue super-scalar instruction unit, two
64-bit integer execution pipelines, and two 64-bit floating
point execution pipelines. The memory unit and bus interface
unit have been re-designed to provide a high performance memory
system using industry standard PC SRAM and DRAM components.
Title: The Alpha 21264: A 500 MHz Out-of-Order Execution Microprocessor
Speaker: Daniel Leibholz
Abstract:
The 21264 is a 500 MHz, Out-Of-Order, quad-fetch, six-way issue
microprocessor. The aggressive cycle-time of the 21264 in combination
with many architectural innovations, such as out-of-order and speculative
execution, enable this microprocessor to deliver an estimated 30 SpecInt95
and 50 SpecFp95 performance. In addition, the 21264 can sustain 5+
Gigabytes/sec of bandwidth to an L2 cache and 3+ Gigabytes/sec to
memory for high performance on memory-intensive applications.
|
160.146 | MOS T Course REGISTRATION REQUIRED | SHARE::STARVASKI | | Tue Feb 11 1997 10:04 | 90 |
|
--------------------------------------------------------------------------------
EDE Custom Courses Description
________________________________________________________________________________
Title CMOS Device Course for DIGITAL Semiconductor
Instructor Demitri Antoniadis
Date 17-MAR-97 - 04-APR-97
Time 2:00 - 5:00
Location Mt. Washington Conf HLO2-1/M10
Course Number 73CDC-HA
Registration Log into COURSES software on SHARE
Username is COURSES and password is EDUCATION.
Cancellation Please cancel prior to course start date
Note Course dates will be:
3/17, 3/19, 3/24, 3/25, 3/31, 4/2, 4/7,
and 4/9.
Time will be 2-5 pm.
Title: CMOS Device Course for DIGITAL Semiconductor
Prerequisites Some familiarity with basic semiconductor device physics.
E.g. course participants must have heard about electrons
and holes, about diodes and transistors and have seen
their simpified physical structure. It is not be assumed
that they understand device operation.
Audience Circuit designers that wish to know more about MOSFETs
the evolution of CMOS generations and what
is behind SPICE models such as MOS10 and 11, tech-
files and limitations.
Description The aim of this course is to provide a comprehensive
discussion on MOSFET operation and modeling so that
the compact models used in Spice and the technology
parameters and their variation can be appreciated.
Technology and physical constraints on MOSFET scaling and
associated MOSFET performance will be discussed.
Participants will experience hands-on the scaling constraints
through a comprehensive device design problem.
Model limitations and their range of validity will
be presented. Parasitic elements and their relation
to technology will be discussed. The charge control
point of view will be maintained throughout.
Outline Semiconductors, Contacts, and the PN Junction.
- Quick review of doping, depletion, junction capacitance,
internal electrostatic potential, and current flow
in semiconductors.
The Two-Terminal MOS Structure.
- Surface change components, accumulation, depletion,
inversion. Weak and strong inversion. C-Vs.
The Three-Terminal MOS Structure.
- Independent contact to the invesion layer. Substrate
bias effect.
The MOS Transistor, long-channel view.
- Qualitative model development. Weak, moderate, and
strong inversion. Vth, and Vth control by I/I.
MOS Transistors with Short and/or Narrow Channels.
- Charge sharing effect and its impact on Vth and
Idoff vs Leff and Vdd. Effect of velocity saturation
on Idsat vs Leff. The concept of device dimensions
and Vdd scaling with technology generations.
elected scaling-related topics.
- Vdd scaling and its effect on performance. tox scaling
effects on performance, Idoff and physical constraints.
Impact of poly OCV scaling. Cov scaling trends and
impact on circuits. Latchup.
"Unconventional" scaling issues.
- Energy minimization considerations. Very low voltage
operation concerns: OCV, temperature, subthreshold
behavior, Vth matching. SOI CMOS: Differences from bulk
and its impact at CMOS6 and beyond.
MOSFET dynamic operation - charge-control view.
- The MOSFET as a dissipative switch.
Intrinsic and parasitic charges and capacitances.
Quasi-static and non-quasi-static operation.
|
160.147 | Code Optimization | SHARE::STARVASKI | | Thu Feb 13 1997 11:01 | 28 |
|
EDE Employee Development and Education
TSS Technical Seminar Series
Title: Morph: An Environment for Platform-specific Optimization
Speaker: J. Bradley Chen, Harvard University
Date: Feb. 25th
Time: 10:00am - 12:00pm
Location: Mt. Washington
Abstract:
Modern high-performance microprocessors with their deep pipelines,
multi-level memory systems, and superscalar microarchitectures
provide ample opportunities for profile-driven, machine-specific
optimizations. Unfortunately, these opportunities often go
unexploited because of the complexity of applying profile-driven,
machine-specific optimizations. Morph is a unique compilation
and executable-rewriting environment that makes the aggressive
optimization of applications based on machine-specific
characteristics and user profile information practical. In this
talk I will describe our current Morph prototype for Digital UNIX.
Our results to date show that profile information can be collected
with negligible run-time overhead and that the resulting profiles
are of a sufficient quality to drive a code-layout optimization.
|
160.148 | Optimization in Machine SUIF | SHARE::STARVASKI | | Tue Feb 18 1997 11:22 | 47 |
|
EDE - Employee Development and Education
--------------------------------------------------------------------------------
EDE Technical Seminar Series Description
________________________________________________________________________________
Title Developing Optimization in Machine SUIF: A Work-in-progress
Speaker Michael D. Smith, Harvard University
Date 27-FEB-97 - 27-FEB-97
Time 10:00 - 12:00
Location Cafe Annex HLO2-2/N4
Course Number 73TSS-08
Registration Not required.
Title: Developing Optimizations in Machine SUIF:
A Work-in-progress Talk
Abstract:
Modern high-performance microprocessors with their
deep pipelines, multi-level memory systems, and
superscalar microarchitectures provide ample
opportunities for profile-driven, machine-specific
optimizations. In this talk, I describe our
Machine-SUIF extension of the Stanford SUIF compiler
system, which supports the development of these kinds
of optimizations. We are designing our compiler so
that we do not have to re-develop the code for individual
optimizations when we change platform targets. I introduce
Machine SUIF through the discussion of three on-going
research projects: a transformation for near-optimal
intra-procedural branch alignment; a code-placement
algorithm using temporal-ordering information; and a
library for building global instruction schedulers.
I present preliminary results for these optimizations
when targeting Digital Alpha microarchitectures.
SUIF = Stanford University Intermediate Format,
For More Info. check out: http://suif.stanford.edu/
--------------------------------------------------------------------------------
Engineering Training and Education
Supporting Digital Semiconductor
|
160.149 | For Digital Semi. employees only | SHARE::STARVASKI | | Fri Mar 14 1997 09:30 | 103 |
| +---------------------------+ TM
| | | | | | | |
| d | i | g | i | t | a | l | INTEROFFICE MEMORANDUM
| | | | | | | |
+---------------------------+
TO: HLO SITE DISTRIBUTION
FROM: Peter J. Starvaski
DEPT: Human Resources
EXT: 225-4701
LOC: HLO2-2/K12
ENET: SHARE::STARVASKI
SUBJECT: COURSE ANNOUNCEMENT:
"BASICS OF SUPPLY CHAIN MANAGEMENT"
APICS, an internationally renown organization specializing in the
mechanics of Supply Chain Management will be conducting a three day
course for Digital Semiconductor Employees on March 19th, 20th, and 21st.
This was designed as a closed course, however a limited number of seats
have become available. This course is not in our on-line database.
If you'd like to participate please send mail to SHARE::STARVASKI.
The program provides an overall understanding of the entire flow of
the supply chain, from forecasting techniques through distribution.
The eight modules that compose the program are detailed below.
OUTLINE:
Session 1--Introduction to Materials Management
This session has two primary goals. The first is to help the participant
understand the role of manufacturing in our economy and the basic types
of manufacturing processes. The second is to describe materials management
and to discuss the need for materials management.
Session 2--Forecasting
In this session, the participant will learn the factors influencing demand.
The participant will also learn basic principles of forecasting and learn the
sources of forecast error. In addition, participants will acquire an under-
standing of the principles of data collection.
Session 3--Master Planning
This session gives participants fundamental information about the purpose
and function of production planning and master production scheduling. Topics
covered in this session include manufacturing planning and control, making a
production plan, developing a make-to-stock production plan, resource
requirements planning, and developing a master production schedule.
Session 4-Material Requirements Planning
In this session, participants will learn the nature of demand and the use of
material requirements planning. They will learn the purposes and formats of
bills of material. Lead time and its components are also discussed in this
session.
Session 5-Capacity Management and Production Activity Control
This session has two purposes. The first is to provide a basic understanding
of capacity management, and the second is to provide a basic understanding
of the function and operation of production activity control. Participants
will learn how to determine rated or calculated capacity and will learn to
describe the basic techniques of scheduling.
Session 6--Inventory Fundamentals
In this session, methods of inventory management will be described, and
participants will learn the necessity for good inventory management and the
costs of ordering and carrying inventory. In addition, participants will
learn to perform a simple ABC inventory analysis.
Session 7-Inventory Management and Physical Distribution
This session provides a discussion of inventory management and introduces
physical distribution. Inventory management seeks to provide the required
level of customer service at minimum cost. Two basic questions of inventory
management are explored: how much to order and when to order. The session
also provides participants with an understanding of some elements of a
physical distribution system. The order point concept, the economic order
quantity, and service level are also discussed.
Session 8--Physical Distribution, Quality Management, and Purchasing
This session continues the discussion of physical distribution. The next
topic, quality management, is a series of problem detection and problem
solving techniques that help employees and management address the problems
associated with producing a perfect product every time. The session teaches
basic techniques for quality management, including Pareto analysis and
fishbone diagrams. The session concludes with a brief discussion of
purchasing .
Session 9--Just-in-Time Manufacturing
Just-in-Time is a philosophy that defines how a company organizes and oper-
ates its business. This session shows how Just-in-Time manufacturing is an
outcome of total quality management, basic industrial engineering practices,
inventory management, process design, and product design.
Brief Bio of the instructor:
Edward Kantor has over 30 years of experience in materials
management with various companies and has held positions in
training, supplier partnership development, systems implementation,
distribution, and materials management.
|
160.150 | Memory-Management Design | SHARE::STARVASKI | | Tue Mar 18 1997 15:34 | 52 |
|
TITLE: Software-Oriented Memory-Management Design
Speaker: Bruce Jacob, University of Michigan
Date: March 26th
Room: Mt. Washington Conf. Room, HLO2-1
Time: 10:00am - 12:00pm
ABSTRACT:
Software-Oriented Memory-Management Design
or
Virtual Memory in the Age of Cheap Memory
Bruce Jacob
Advanced Computer Architecture Lab
EECS Department, University of Michigan
This talk describes the memory-management design of the PUMA processor -- a
high clock-rate microprocessor in which a simple design is a prerequisite
for a fast clock and a short design cycle. Software-managed address
translation* is a design option that eliminates hardware support for address
translation, such as the translation lookaside buffer (TLB) found in nearly
every modern microarchitecture, and hardware page-table-walking state
machines found in the x86 and PowerPC architectures. Elimination of the
address translation hardware simplifies the chip design and removes a large,
fully-associative structure from the processor's critical path. We show that
software-managed address translation is just as efficient as hardware-managed
address translation, and it is much more flexible. Operating systems such as
OSF/1 and Mach charge between 0.10 and 0.28 cycles per instruction (CPI)
for address translation using dedicated memory-management hardware.
Software-managed translation requires 0.05 CPI. Mechanisms to support
such features as shared memory, superpages, sub-page protection, and sparse
address spaces can be defined completely in software, allowing much more
flexibility than in hardware-defined mechanisms.
* see <http://www.eecs.umich.edu/~blj/papers/HPCA-3.ps> for details
BIO:
Mr. Jacob received the A.B. in Mathematics from Harvard College, Cambridge,
in 1988, and the M.S. in Computer Science and Engineering from the University
of Michigan, Ann Arbor, in 1995. He is currently a doctoral candidate in
Computer Science and Engineering at the University of Michigan, where he is
conducting research in computer architecture and operating systems in the
Advanced Computer Architecture Lab. He has worked as a distributed system
architect and software engineer for the telecommunications startups Priority
Call Management and Boston Technology.
|
160.151 | Engineering Compilers | SHARE::STARVASKI | | Fri Mar 28 1997 13:20 | 48 |
|
--------------------------------------------------------------------------------
ETE Technical Seminar Series Description
________________________________________________________________________________
Title Engineering Compilers
Speaker Thomas Gross
Date 02-APR-97 - 02-APR-97
Time 10:00 - 12:00
Location Hall White Mist HLO2-2/J6
Course Number 74TSS-01
Registration Not required for most seminars. If registration
is required please log into COURSES software on SHARE
Username is COURSES and password is EDUCATION.
Description Optimizing and parallelizing compilers
have the reputation to be big and complex; the
development of a competitive compiler system
represents a major effort. The cmcc compiler
(Carnegie Mellon C Compiler) is an experiment
in compiler construction to challenge this view.
Through agressive code reuse- -- both internally
(reuse between different modules) and externally
(reuse between versions for different target
machines) -- a small team of graduate students
and faculty was able to build an optimizing
compiler. The key to reuse are the application
frameworks developed for global dataflow analysis,
code generation, register allocation, and
instruction scheduling.
This talk describes these frameworks and provides
some empirical evaluation might be extended to
cover difficult problems in the design of
parallelizing compilers. Using the Fx compiler
(for a dialect of High Performance Fortran) as
an example, I discuss how we may extend such a
compiler to deal with problems currently beyond
the scope of most parallelizing compilers,
e.g., programs with irregular reference patterns
or programs with dynamic tasking.
--------------------------------------------------------------------------------
Engineering Training and Education
Supporting Digital Semiconductor
|
160.152 | Register Allocation | SHARE::STARVASKI | | Fri Mar 28 1997 13:21 | 57 |
|
--------------------------------------------------------------------------------
ETE Technical Seminar Series Description
________________________________________________________________________________
Title Global Register Allocation Based on Graph Fusion
Speaker Guei-Yuan (Ken) Lueh
Date 08-APR-97 - 08-APR-97
Time 10:00 - 12:00
Location Mt. Washington HLO2-1/M10
Course Number 74TSS-02
Registration Not required for most seminars. If registration
is required please log into COURSES software on SHARE
Username is COURSES and password is EDUCATION.
Cancellation No Registration required
Description In the seminar, I present a novel register-
allocation that is fusion-based. Fusion-style
register allocation starts off with constructing
regions and applies graph fusion along control-flow
edges to combine the interference graphs of regions
into the interference graph for the whole function.
Graphs fusion integrates spilling, splitting, and color
binding in a seamless fashion. The delayed spilling
technique avoids making premature spilling decisions,
and maintaining the colorablity invariant splits live
ranges only when necessary. No color binding decisions
are ever made during graph fusion. More importantly,
fusion-style coloring is sensitive to the ordering of
control-flow edges that connect regions. Splitting is
unlikely to happen at high priority edges (frequently
executed) and likely to happen at low priority edges
(infrequently executed). As to fusion-style coloring,
the register-allocation problem becomes a problem of
determining the edge ordering and selecting regions.
Fusion-style coloring provides a nice framework for
register allocation which models various live-range
splitting approaches such allocation which models
various live-range splitting approaches such as the
Tera, SSA, PDG, and Multiflow approaches.
In my dissertation, I've shown that fusion-style
register allocation provides a framework that is
well-suited for region-based compilation and is
able to deal with the incurred register pressure
caused by scope expanding transformations such as
unrolling and inlining. In other words, fusion-style
coloring provides a solution to region-based compilation
so that register allocation is no longer an obstacle
to region based compilation.
--------------------------------------------------------------------------------
Engineering Training and Education
Supporting Digital Semiconductor
|
160.153 | CERB/Patents/Publications | SHARE::STARVASKI | | Wed Apr 02 1997 12:11 | 39 |
| ---------------------------------------------------------------------------
EDE Technical Seminar Series Description
---------------------------------------------------------------------------
Title: Technical Achievement at Digital Semiconductor
Speakers: Maurice Marks, Don Scott, Christina Pomiansky
Date: April 23rd, 1997
Time: 10:00am - 11:30
Location: Cafe' Annex, HLO2-2
Abstract:
The objective of this presentation is to promote a better understanding
of the Corporate and Digital Semiconductor procedures for recognizing
innovation and technical achievement. Specifically this presentation
will discuss the mechanics of the Consulting Engineering Review Board,
the procedures for Patents, Publications and Conferences as well as
recognition awards such as the Chairman's Award for Technical Acheive-
ment.
Intended Audience: Engineers in Digital Semiconductor who wish to
have a better understanding of the mechanics of the Consulting Eng-
ineer Review Board and it's components as well as Managers who are
in a position to reward individuals for technical achievement.
BRIEF OUTLINE:
Introduction - Christina Pomiansky
CERB - Maurice Marks
Patents/Publications - Don Scott
Questions and Answers - Christina, Maurice and Don
Employee Development and Education
Supporting Digital Semiconductor
|
160.154 | Path based Compilation | SHARE::STARVASKI | | Thu Apr 03 1997 15:42 | 37 |
|
Title: Path-based Compilation
Instructor: Cliff Young, Harvard University
Date: April 7th
Time: 10:00am - 12:00pm
Room: Mt. Washington Conf. Room HLO2-1
Abstract:
Many compilers use _profiles_ of user program runs to direct the
focus and degree of performance optimizations. Compilation systems
typically collect profiles by recording statistics at individual
points in the program text, e.g. branches, call sites, or memory
accesses. But optimizations based on individual sample points in
the program miss the larger picture of program behavior: how pieces
of the program relate to each other dynamically. By instrumenting
and collecting _path profiles_ of a program, we can perform more
sophisticated and accurate optimizations than classical point-wise
techniques have allowed.
In this talk, I discuss efficient path profiling techniques and
two applications of path profiles: static branch prediction and
global instruction scheduling. Path profiles can be collected with
overheads comparable to those of traditional pointwise profiling
techniques. Using path information, _static correlated branch
prediction_ exhibits better branch prediction accuracy and larger
performance improvements than previously thought possible for static
prediction techniques. _Superblock_ global instruction scheduling
can benefit from the increased precision of path profiles: path
profiles simplify superblock selection and accounting.
Path-based techniques apply to both hardware- and software- oriented
optimizations. Other fruitful areas for path-based methods include
instruction and data prefetching, predicated, and speculative
execution.
|
160.155 | Dataflow | SHARE::STARVASKI | | Thu Apr 03 1997 16:23 | 35 |
|
Title Dataflow Microprocessors
Speaker Prof. Bradley Kuszmaul
Date 10-APR-97 - 10-APR-97
Time 10:00 - 12:00
Location Mt Washington HLO2-1/M10
Course Number 74TSS-06
Registration Not required
Abstract: My new research direction at Yale is to
explore the hypothesis that explicit-dataflow
instruction-set architectures provide significant
advantages for high-performance microprocessors.
This talk presents preliminary work comparing
serial instruction-set architectures (RISC or CISC)
vs. dataflow in achieving high parallelism on serial
programs. I will describe several interesting dataflow
problems (and our progress at solving them), including
resource management, code-size blowup, and compiling
C programs for parallelism.
BIO: Bradley C. Kuszmaul received his Ph.D. from MIT in 1994,
and worked as a postdoctoral fellow at MIT for a year.
At MIT he participated in the Cilk project and worked
on two massively parallel chess programs: StarTech and
*Socrates. During his graduate student tenure he took
time off from MIT to serve as one of the principal
architects of the Connection Machine CM-5 at Thinking
Machines Corporation. Bradley joined the Yale University
Department of Computer Science in 1995.
--------------------------------------------------------------------------------
Engineering Training and Education
Supporting Digital Semiconductor
|
160.156 | REPOST, Register Allocation NEW TIME/ROOM | SHARE::STARVASKI | | Fri Apr 04 1997 14:16 | 57 |
|
--------------------------------------------------------------------------------
ETE Technical Seminar Series Description
________________________________________________________________________________
Title Global Register Allocation Based on Graph Fusion
Speaker Guei-Yuan (Ken) Lueh
Date 08-APR-97 - 08-APR-97
Time 1:00pm - 2:30pm
Location Ad Hoc Conf. Room, HLO2-3/J03
Course Number 74TSS-02
Registration Not required for most seminars. If registration
is required please log into COURSES software on SHARE
Username is COURSES and password is EDUCATION.
Cancellation No Registration required
Description In the seminar, I present a novel register-
allocation that is fusion-based. Fusion-style
register allocation starts off with constructing
regions and applies graph fusion along control-flow
edges to combine the interference graphs of regions
into the interference graph for the whole function.
Graphs fusion integrates spilling, splitting, and color
binding in a seamless fashion. The delayed spilling
technique avoids making premature spilling decisions,
and maintaining the colorablity invariant splits live
ranges only when necessary. No color binding decisions
are ever made during graph fusion. More importantly,
fusion-style coloring is sensitive to the ordering of
control-flow edges that connect regions. Splitting is
unlikely to happen at high priority edges (frequently
executed) and likely to happen at low priority edges
(infrequently executed). As to fusion-style coloring,
the register-allocation problem becomes a problem of
determining the edge ordering and selecting regions.
Fusion-style coloring provides a nice framework for
register allocation which models various live-range
splitting approaches such allocation which models
various live-range splitting approaches such as the
Tera, SSA, PDG, and Multiflow approaches.
In my dissertation, I've shown that fusion-style
register allocation provides a framework that is
well-suited for region-based compilation and is
able to deal with the incurred register pressure
caused by scope expanding transformations such as
unrolling and inlining. In other words, fusion-style
coloring provides a solution to region-based compilation
so that register allocation is no longer an obstacle
to region based compilation.
--------------------------------------------------------------------------------
Engineering Training and Education
Supporting Digital Semiconductor
|
160.157 | Postponed | SHARE::STARVASKI | | Tue Apr 08 1997 17:54 | 8 |
|
Please note that the seminar on Dataflow Microprocessors (Note
160.155) by Dr. Kuszmaul has been cancelled.
We are currently checking alternative dates and hope to reschedule
shortly.
/pjs
|
160.158 | Branch Prediction: Classification Schemes | SHARE::STARVASKI | | Thu Apr 24 1997 15:20 | 31 |
| TITLE: Branch Classification
Speaker: Po-Yung Chang
Date: April 28th
Location: Mt. Washington, HLO2-1
Time: 11:00am - 12:30pm
Abstract:
As the issue rate and pipeline depth increase for high performance
superscalar processors, the amount of speculative work issued for such
processors also increases. Because speculative work must be thrown
away in the event of a branch misprediction, wide-issue, deeply
pipelined processors must use extremely accurate branch predictors to
effectively exploit their performance potential.
Several mechanisms exist to address the problems posed by
branches; each of these mechanisms has its own sphere of relevance.
Our work in branch classification looks to identify a set of
mechanisms that will cover the needs of all branches and
to identify the appropriate mechanism to use for each branch.
This talk will present our work in branch classification.
It will describe various branch mechanisms, e.g. 2-level
branch predictors and loop predictors. It will also
describe various branch classification schemes, e.g. 2 bit counter
schemes and a branch filtering mechanism, to show how
branch classification can be used to improve branch prediction
accuracy.
|
160.159 | Dataflow Microprocessors | SHARE::STARVASKI | | Fri Apr 25 1997 15:58 | 36 |
|
Title Dataflow Microprocessors
Speaker Prof. Bradley Kuszmaul
Date May 13th
Time 10:00 - 12:00
Location Mt Washington HLO2-1/M10
Course Number 74TSS-06
Registration Not required
Abstract: My new research direction at Yale is to
explore the hypothesis that explicit-dataflow
instruction-set architectures provide significant
advantages for high-performance microprocessors.
This talk presents preliminary work comparing
serial instruction-set architectures (RISC or CISC)
vs. dataflow in achieving high parallelism on serial
programs. I will describe several interesting dataflow
problems (and our progress at solving them), including
resource management, code-size blowup, and compiling
C programs for parallelism.
BIO: Bradley C. Kuszmaul received his Ph.D. from MIT in 1994,
and worked as a postdoctoral fellow at MIT for a year.
At MIT he participated in the Cilk project and worked
on two massively parallel chess programs: StarTech and
*Socrates. During his graduate student tenure he took
time off from MIT to serve as one of the principal
architects of the Connection Machine CM-5 at Thinking
Machines Corporation. Bradley joined the Yale University
Department of Computer Science in 1995.
--------------------------------------------------------------------------------
Engineering Training and Education
Supporting Digital Semiconductor
|
160.160 | Metal Reliability | SHARE::STARVASKI | | Tue May 20 1997 12:13 | 43 |
|
ETE - Engineering Training and Education
--------------------------------------------------------------------------------
ETE Technical Seminar Series Description
________________________________________________________________________________
Title RELIABILITY AND STRENGTH OF METALLIZATIONS
Speaker G.L. Povirk, Yale University
Date 27-MAY-97 - 27-MAY-97
Time 10:00 - 12:00
Location Mt. Washtington HLO2-1/J10
Course Number 74TSS-09
Registration Not required for most seminars. If registration
is required please log into COURSES software on SHARE
Username is COURSES and password is EDUCATION.
Abstract: Two distinct aspects of metallization
reliability in microelectronic circuits will
be discussed. The first part of the presentation
will focus on finite element simulations of
electromigration and stress-driven diffusion
in metal interconnects. The numerical formulation
accounts for diffusion both along grain boundaries
and through the bulk. A polycrystaline line is
considered and the effects of diffusion along
individual grain boundaries and through the bulk
are each added seperately to the analysis.
The ultimate strength of the films was up to
three times that of bulk gold, with the thinnest
films exhibiting the greatest strength. In contrast,
the measured elastic modulus for the thin film
specimens was approximately the same as that
documented for bulk gold. The presentation
will conclude with plans for future work.
--------------------------------------------------------------------------------
Engineering Training and Education
Supporting Digital Semiconductor
|
160.161 | MIT/SLOAN SCHOOL: Process Improvement | SHARE::STARVASKI | | Thu May 22 1997 10:19 | 83 |
|
ETE - Engineering Training and Education
--------------------------------------------------------------------------------
ETE Technical Seminar Series Description
________________________________________________________________________________
Title The Improvement Paradox:Designing Sustainable Quality Progra
Speaker John D. Sterman, MIT
Date 02-JUN-97 - 02-JUN-97
Time 1:00 - 4:00
Location Mt. Washington Conf.HLO2-1/M10
Course Number 74TSS-11
Registration REGISTRATION IS REQUIRED
Abstract
Organizations today must constantly improve
their business processes in all functions and product
lines. To stimulate change and boost competitiveness,
companies have adopted a wide range of process
improvement methods including TQM, CQI, BPR, and so on.
Despite notable successes, there have been even more
failures. Even initially successful programs often
fail later. Management constantly searches for the
next magic bullet as program after program fails to
live up to expectations. For example, interest in
the Malcolm Baldrige National Quality Award is falling,
and press reports skeptical of TQM and reengineering
are common, despite the obvious successes of some
companies. Worse, many successful programs fail to
generate financial results or prevent significant
downsizing, leading to their abandonment:
the improvement paradox.
Why is it so difficult to design sustainable process
improvement programs? This presentation will describe
ongoing research at the MIT System Dynamics Group into
the causes of the improvement paradox in partnership
with leading firms in the electronics and automotive
industries. The focus is helping managers avoid
unanticipated consequences of improvement programs
arising from feedbacks between improvement efforts
and other stakeholders and organizations in the
firm, including feedbacks among quality programs,
manufacturing, product development, accounting
systems and performance metrics, customers,
competitor reactions, and the stock market.
To explore these dynamics we have developed system
dynamics simulation models, grounded in extensive
field study with several partner organizations.
I will present several case studies to illustrate
the issues. For example, one leading semiconductor
manufacturer pursued an aggressive process improvement
program to boost productivity and competitiveness.
The program was a dramatic success. Yield doubled,
cycle time was cut in half, and product defects fell
by a factor of ten. However, financial performance
worsened and the firm was forced into layoffs,
destroying morale and commitment to the improvement
program.
Improvement programs can present firms with a tradeoff
between short and long run effects. In the long run
they can increase productiv-ity, raise quality, and
lower costs. In the short run, these improvements
can create excess capacity, financial stress, and
pressures for layoffs that undercut commitment to
continuous improvement. I discuss policies
to deal with these side effects and effective
learning strategies for firms seeking to overcome
the improvement paradox.
John Sterman is the Standish Professor of Management
and the Director of the System Dynamics Group at MIT's
Sloan School of Management
--------------------------------------------------------------------------------
Engineering Training and Education
Supporting Digital Semiconductor
|