| Title: | SCO-LSI PACKAGE ENGINEERING NOTES FILE |
| Moderator: | PACKER::SYSTEM |
| Created: | Thu Dec 10 1987 |
| Last Modified: | Tue Oct 20 1992 |
| Last Successful Update: | Fri Jun 06 1997 |
| Number of topics: | 20 |
| Total number of notes: | 62 |
| T.R | Title | User | Personal Name | Date | Lines |
|---|---|---|---|---|---|
| 5.1 | HPTP | PACKER::GORMAN | Mon Feb 08 1988 21:28 | 12 | |
| 5.2 | more on the HPTP | ESKIMO::HAWKS | Tue Feb 09 1988 15:31 | 11 | |
| 5.3 | ILB ? Lead form ? Heatsink ? | EGAV01::CLAVELLE | Wed Feb 10 1988 04:36 | 10 | |
| 5.4 | One question 3 answers | PACKER::GORMAN | Thu Feb 11 1988 11:03 | 31 | |
| 5.5 | Heasink Ceramic interface? | GAOV08::CLAVELLE | Tue Feb 16 1988 09:39 | 11 | |
| 5.6 | heatsink/ceramic interface and attach | SALEM::JLONG | Thu Mar 10 1988 13:34 | 10 |